CN103199182B - 通过漏版印刷在管芯顶部上沉积荧光剂 - Google Patents

通过漏版印刷在管芯顶部上沉积荧光剂 Download PDF

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Publication number
CN103199182B
CN103199182B CN201210575677.9A CN201210575677A CN103199182B CN 103199182 B CN103199182 B CN 103199182B CN 201210575677 A CN201210575677 A CN 201210575677A CN 103199182 B CN103199182 B CN 103199182B
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China
Prior art keywords
stencil
phosphor
containing material
template
led
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CN201210575677.9A
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Chinese (zh)
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CN103199182A (zh
Inventor
梅泽群
闫先涛
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Ledengin Inc
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Ledengin Inc
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Publication of CN103199182A publication Critical patent/CN103199182A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

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  • Led Device Packages (AREA)
  • Coating Apparatus (AREA)
CN201210575677.9A 2011-12-28 2012-12-26 通过漏版印刷在管芯顶部上沉积荧光剂 Active CN103199182B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/338,912 US8993358B2 (en) 2011-12-28 2011-12-28 Deposition of phosphor on die top by stencil printing
US13/338,912 2011-12-28

Publications (2)

Publication Number Publication Date
CN103199182A CN103199182A (zh) 2013-07-10
CN103199182B true CN103199182B (zh) 2017-12-05

Family

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Family Applications (1)

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CN201210575677.9A Active CN103199182B (zh) 2011-12-28 2012-12-26 通过漏版印刷在管芯顶部上沉积荧光剂

Country Status (5)

Country Link
US (1) US8993358B2 (enExample)
EP (1) EP2610931B1 (enExample)
JP (1) JP2013140965A (enExample)
CN (1) CN103199182B (enExample)
TW (1) TWI568028B (enExample)

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TWI735525B (zh) * 2016-01-31 2021-08-11 美商天工方案公司 用於封裝應用之濺鍍系統及方法
CN106271167B (zh) * 2016-09-26 2019-03-29 京东方科技集团股份有限公司 一种金属掩膜板焊接贴合器件及其焊接方法
US10274164B2 (en) * 2016-10-21 2019-04-30 Signify Holding B.V. Lighting device comprising a plurality of different light sources with similar off-state appearance
US10854794B2 (en) 2017-12-20 2020-12-01 Lumileds Llc Monolithic LED array structure
CN111490038B (zh) * 2019-01-25 2022-04-05 蚌埠三颐半导体有限公司 Led封装的制备方法和led封装
CN113130515A (zh) * 2019-12-31 2021-07-16 格科微电子（上海）有限公司 光学指纹器件的制造方法
CN113270430B (zh) * 2020-02-17 2025-07-22 格科微电子（上海）有限公司 光学指纹器件中形成红外截止滤光膜的方法
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Also Published As

Publication number Publication date
US8993358B2 (en) 2015-03-31
TWI568028B (zh) 2017-01-21
JP2013140965A (ja) 2013-07-18
EP2610931A1 (en) 2013-07-03
US20130168703A1 (en) 2013-07-04
CN103199182A (zh) 2013-07-10
TW201334233A (zh) 2013-08-16
EP2610931B1 (en) 2018-11-28

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