TWI568028B - 藉由模板印刷將磷光質沉積於晶粒頂部之技術 - Google Patents

藉由模板印刷將磷光質沉積於晶粒頂部之技術 Download PDF

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Publication number
TWI568028B
TWI568028B TW101149315A TW101149315A TWI568028B TW I568028 B TWI568028 B TW I568028B TW 101149315 A TW101149315 A TW 101149315A TW 101149315 A TW101149315 A TW 101149315A TW I568028 B TWI568028 B TW I568028B
Authority
TW
Taiwan
Prior art keywords
template
phosphor
led dies
stencil
led
Prior art date
Application number
TW101149315A
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English (en)
Chinese (zh)
Other versions
TW201334233A (zh
Inventor
梅澤群
閻先濤
Original Assignee
硅谷光擎股份有限公司
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Application filed by 硅谷光擎股份有限公司 filed Critical 硅谷光擎股份有限公司
Publication of TW201334233A publication Critical patent/TW201334233A/zh
Application granted granted Critical
Publication of TWI568028B publication Critical patent/TWI568028B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

Landscapes

  • Led Device Packages (AREA)
  • Coating Apparatus (AREA)
TW101149315A 2011-12-28 2012-12-22 藉由模板印刷將磷光質沉積於晶粒頂部之技術 TWI568028B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/338,912 US8993358B2 (en) 2011-12-28 2011-12-28 Deposition of phosphor on die top by stencil printing

Publications (2)

Publication Number Publication Date
TW201334233A TW201334233A (zh) 2013-08-16
TWI568028B true TWI568028B (zh) 2017-01-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW101149315A TWI568028B (zh) 2011-12-28 2012-12-22 藉由模板印刷將磷光質沉積於晶粒頂部之技術

Country Status (5)

Country Link
US (1) US8993358B2 (enExample)
EP (1) EP2610931B1 (enExample)
JP (1) JP2013140965A (enExample)
CN (1) CN103199182B (enExample)
TW (1) TWI568028B (enExample)

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TWI735525B (zh) * 2016-01-31 2021-08-11 美商天工方案公司 用於封裝應用之濺鍍系統及方法
CN106271167B (zh) * 2016-09-26 2019-03-29 京东方科技集团股份有限公司 一种金属掩膜板焊接贴合器件及其焊接方法
US10274164B2 (en) * 2016-10-21 2019-04-30 Signify Holding B.V. Lighting device comprising a plurality of different light sources with similar off-state appearance
US10854794B2 (en) 2017-12-20 2020-12-01 Lumileds Llc Monolithic LED array structure
CN111490038B (zh) * 2019-01-25 2022-04-05 蚌埠三颐半导体有限公司 Led封装的制备方法和led封装
CN113130515A (zh) * 2019-12-31 2021-07-16 格科微电子（上海）有限公司 光学指纹器件的制造方法
CN113270430B (zh) * 2020-02-17 2025-07-22 格科微电子（上海）有限公司 光学指纹器件中形成红外截止滤光膜的方法
JP7502636B2 (ja) * 2020-09-29 2024-06-19 日亜化学工業株式会社 発光装置の製造方法及び発光装置
KR20240042288A (ko) * 2022-09-23 2024-04-02 삼성디스플레이 주식회사 마스크 장치 및 마스크 장치를 이용한 레진의 도포 방법

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US8330176B2 (en) * 2007-02-13 2012-12-11 3M Innovative Properties Company LED devices having lenses and methods of making same
US20080290351A1 (en) * 2007-05-24 2008-11-27 Shuichi Ajiki Semiconductor light emitting apparatus
JP2008294224A (ja) * 2007-05-24 2008-12-04 Stanley Electric Co Ltd 半導体発光装置
WO2010023993A1 (ja) * 2008-08-27 2010-03-04 富士高分子工業株式会社 発光装置及びその製造方法

Also Published As

Publication number Publication date
US8993358B2 (en) 2015-03-31
CN103199182B (zh) 2017-12-05
CN103199182A (zh) 2013-07-10
JP2013140965A (ja) 2013-07-18
TW201334233A (zh) 2013-08-16
US20130168703A1 (en) 2013-07-04
EP2610931A1 (en) 2013-07-03
EP2610931B1 (en) 2018-11-28

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