WO2010023993A1 - 発光装置及びその製造方法 - Google Patents
発光装置及びその製造方法 Download PDFInfo
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- WO2010023993A1 WO2010023993A1 PCT/JP2009/058091 JP2009058091W WO2010023993A1 WO 2010023993 A1 WO2010023993 A1 WO 2010023993A1 JP 2009058091 W JP2009058091 W JP 2009058091W WO 2010023993 A1 WO2010023993 A1 WO 2010023993A1
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- light emitting
- emitting device
- weir
- light
- substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- the present invention relates to a light emitting device in which a semiconductor light emitting element is covered with a wavelength conversion member and a method for manufacturing the same.
- Many conventional light-emitting devices have a structure in which a light-emitting element is arranged on a substrate and the light-emitting element is covered with a coating material containing a phosphor.
- a technique is adopted in which a phosphor is excited by light emitted from a light emitting element to generate light having a different wavelength by generating light having a different wavelength.
- the phosphor is mixed with a translucent resin, and is hardened after filling, coating, or coating around the light emitting element.
- Various methods such as the potting method of Patent Document 1, the dipping method of Patent Document 2, the metal mask method of Patent Document 3, and the mold forming method of Patent Document 4 have already been proposed.
- FIG. 4A is a schematic sectional view showing a sealing resin molding method disclosed in Patent Document 1 below.
- a light emitting element is attached to a substrate 101.
- the covering material 104 including the phosphor 103 is discharged from the thin tube 107 of the dropping device 108 and dropped into the cavity 106. After the dropping, the covering material 104 is cured, and the light emitting element 102 is covered with the covering layer 104 including the phosphor 103.
- the phosphor 103 is preliminarily blended with the coating material 104 by the potting method, and the surface tension of the coating material is applied when the dropped coating material is solidified. Since the shape changes depending on the viscosity, not only the dimensional accuracy is not good, but also the shape itself on the wall surface and the liquid level becomes unstable as shown in FIG. 4B. Moreover, it cannot be ignored that the substrate is inclined as shown in FIG. 4C. Therefore, even in the case where the same product is different depending on the location and the thickness of the coating from product to product, the thickness of the coating material 104 covering the light emitting element changes, which leads directly to a product defect. .
- Mold molding can increase the accuracy of thickness, position, dimensions, concentration, etc., compared to other means.
- 6A to 6C are schematic views showing a coating method by transfer molding (Patent Document 4).
- the transfer molding die 300 has a three-sheet structure.
- the lower mold 301 is provided with a cavity 302 into which a substrate is inserted.
- a cavity 304 for molding a coating layer is provided below the middle mold 303.
- a pot 306 for charging material is provided on the upper side of the middle mold, and the upper mold 305 has a structure in which the material charged in the pot 306 is injected under pressure.
- the substrate 311 on which the light emitting element 310 is mounted is stored in the cavity 302 of the lower mold 301.
- the covering material 313 including the phosphor 312 is charged in an appropriate amount in the pot 306 on the upper side of the middle mold 303.
- the coating material 313 is injected from the injection port 314 through the runner 315 and into the cavity 304 through the gate 316. The pressure is maintained at an appropriate time and temperature to cure the coating material and then remove from the mold.
- Patent Document 3 As a means for suppressing thickness variation, screen printing as shown in FIGS. 5A to 5F is known (Patent Document 3). This method is widely used because it is relatively simple and highly accurate, does not require a mold or molding apparatus, has little material loss, and is easily mass-produced.
- the periphery of the light emitting element 201 mounted on the light emitting device 200 is covered with a coating layer 207 containing a phosphor 202.
- the covering material 203 containing the phosphor 202 is supplied to the upper surface of the metal mask 204 having the cavity 206 opened in a predetermined shape, and is further filled in the cavity 206 while being extended by the squeegee 205.
- the covering material thus filled can be cured to form the covering layer 207 in a predetermined shape around the light emitting element 201 (FIGS. 5A and 5B).
- the screen printing method using a stencil or a metal mask cannot remove the stencil or the metal mask until the coating material is cured. If these are removed before curing as shown in FIG. 5C, the covering material flows and the shape cannot be maintained. Further, as shown in FIG. 5D, it is inevitable that a slight gap is generated between the stencil or the metal mask and the substrate surface, and the coating material may flow into the gap. Further, as shown in FIG. 5E, when the surface tension of the covering material and the interfacial tension with the stencil or metal mask are low, the covering material may also cover the upper surface of the stencil or metal mask.
- the covering material may be scratched or chipped as shown in FIG. 5F unless it is carefully removed.
- the coating material is lost.
- the stencil or the metal mask adheres to the covering material, and the releasing material becomes a serious problem such as damage to the covering material.
- the present invention provides a light emitting device with few defects and a high product yield and a method for manufacturing the same in order to solve the problems in manufacturing the screen printing method using the conventional stencil and metal mask.
- the light-emitting device of the present invention is a light-emitting device in which a semiconductor light-emitting element is mounted on a substrate, the light-emitting element is surrounded by a weir formed of an elastic resin, and includes a phosphor in a space inside the weir. A coating layer is formed.
- a method for manufacturing a light-emitting device is a method for manufacturing a light-emitting device in which a semiconductor light-emitting element is mounted on a substrate, the light-emitting element is surrounded by a weir formed of an elastic resin, and the stencil plate base material has a coating material.
- a stencil plate base material having an opening for filling and integrated with a weir formed of an elastic resin at a position opposite to the opening is aligned on the substrate on which the light emitting element is mounted, and fluorescent light is emitted from the opening.
- the coating material containing a body is filled, the coating material is cured to form a coating layer, the stencil plate base film is removed, and the weir is integrated with the coating layer on the substrate.
- the coating layer containing the fluorescent material is formed in a space surrounded by a weir formed of an elastic resin. Since the weir is in contact with the substrate of the light emitting device, a slight gap does not occur or even if it occurs, it is absorbed by the elastic resin weir. Therefore, when the space is filled with the coating material, the coating material does not flow between the substrate and the stencil plate base material.
- the stencil plate base material film can be removed immediately after the covering material is filled. Furthermore, even if the upper surface of the stencil plate substrate is covered with a coating material or the coating material overflows, the stencil plate substrate film can be removed without any problem. Since the coating layer is reliably formed in the space surrounded by the weirs, breakage or chipping of the coating layer can be avoided and the defect rate can be reduced. Furthermore, the strain at the time of curing of the coating layer is absorbed by the elastic resin weir, and a uniform coating layer can be formed.
- FIG. 1A is a sectional view showing a stencil used in the embodiment of the present invention
- FIG. 1B is a bottom view thereof.
- 2A to 2E are cross-sectional views showing a procedure for forming an embodiment of the present invention.
- 3A to 3E are cross-sectional views showing a procedure for forming a stencil used in the embodiment of the present invention
- FIGS. 3F to 3G are plan views of the obtained elastic body.
- 4A to 4C are cross-sectional views illustrating a conventional method of coating a light emitting element by potting.
- 5A to 5F are cross-sectional views illustrating a conventional method of coating a light emitting element by screen printing.
- 6A to 6C are cross-sectional views showing a conventional method of coating a light emitting element by mold molding.
- the light emitting device of the present invention covers a stencil plate base material on which a weir formed of an elastic resin in a predetermined shape and position in advance is placed on the substrate of the light emitting device, and the weir for forming a coating layer on the substrate. After forming a space and filling the space with a coating material, the stencil plate base film is removed. Thereby, the light emitting device with high uniformity of the phosphor layer and high product yield can be obtained.
- the weir formed of the elastic resin includes a phosphor and / or a light scattering material. This is because the same function as the covering material is exhibited.
- the weir formed of the elastic resin is preferably silicone rubber or gel. This is because silicone rubber or gel is excellent in heat resistance.
- a lens is further disposed outside the weir formed of the elastic resin. Thereby, the directivity of light can be controlled.
- the lens is preferably a silicone rubber or a resin because of its high heat resistance.
- the weir formed of elastic resin becomes a part of the light emitting device, it can be given the necessary characteristics in advance, assuming the function when completed. Specifically, it is possible to use a material having a very high light transmittance so as not to hinder the light transmittance, or a material having an adjusted refractive index. Or a fluorescent substance can also be mix
- FIGS. 1A-B and 2A-E embodiments of the present invention will be described with reference to FIGS. 1A-B and 2A-E.
- FIG. 1A is a cross-sectional view schematically showing a stencil plate substrate 705 of this embodiment, and FIG. 1B is a bottom view thereof.
- the stencil plate substrate 705 is formed by integrating one or more weirs 702 made of an elastic resin having a predetermined shape on a film 701 made of a thin and rigid material. The film 701 and the weir 702 are not bonded but are in close contact with each other and integrated.
- the stencil plate base 705 has an opening 703 for filling a space 704 surrounded by a weir 702 made of an elastic resin with a covering material.
- the shape of the weir opening can be any shape such as a circle, polygon, or ellipse.
- the shape is appropriate depending on the number and arrangement of light emitting elements.
- a square is suitable for uniformly covering the outer periphery. If circular, there is no direction and positioning is not necessary.
- FIGS. 2A to 2E are cross-sectional views illustrating the method for manufacturing the light emitting device according to the present embodiment.
- a circuit 402 having a predetermined conductive circuit is formed on the substrate 401 of the light emitting device 400.
- a light emitting element 403 is disposed, and a thin metal wire 404 is bonded to the surface of the light emitting element 403 and is electrically connected to the light emitting element.
- the mounting of the light emitting element 403 to the substrate 401 is performed using, for example, a die bonder machine. Connection to the circuit 402 on the substrate is performed by wire bonding with a thin metal wire 404 (FIG. 2A).
- the material of the substrate 401 is not particularly limited, but a printed substrate such as glass epoxy, polyimide, epoxy resin-impregnated aramid nonwoven fabric or ceramic can be used favorably.
- a printed substrate such as glass epoxy, polyimide, epoxy resin-impregnated aramid nonwoven fabric or ceramic
- Recent light emitting devices have high output and high calorific value and require more effective heat dissipation. Therefore, ceramic substrates using ceramic substrates, metal substrates typified by aluminum substrates, and metal oxides such as alumina are applied. Although it is desirable to use a board
- the type of the light emitting element 403 is not particularly limited.
- a semiconductor layer made of a group III nitride compound that is, a GaN-based, AlGaN-based, InGaN-based, InAlGa-based, or the like is stacked on an element substrate formed of sapphire.
- SiC, GaP, or the like can be used for the element substrate, but the element substrate is not limited thereto.
- the wavelength emitted by the light emitting element 403 varies from the ultraviolet region to the visible region, but is arbitrarily selected according to the purpose. For example, a desired emission color such as blue, red, or green is selected. A plurality of similar light emitting elements can be used. In addition, various light emission colors can be obtained by combining light-emitting elements having different light emission colors.
- a circuit 402 for mounting and connecting a light emitting element 403 and for connecting a light emitting device is formed.
- a good electrical conductor such as copper, phosphor bronze, iron or nickel is used, and the surface can be plated with a noble metal such as gold, silver, platinum or palladium.
- a space 422 for forming a coating layer on the weir 421, the light emitting element 403, and the substrate 401 is created (FIG. 2B).
- the covering material 424 containing the phosphor 423 is supplied to the upper surface of the film 426 of the stencil plate substrate 420 having the opening 425 having a predetermined shape, and is further filled in the space 422 while being extended by the squeegee 428 (FIG. 2C).
- the phosphor 423 is selected depending on the emission color emitted by the light emitting element 403 and the desired emission color of the light emitting device. For example, a blue light emitting element having a peak wavelength of about 0.45 ⁇ m can be mixed with light emitted from a phosphor that receives the light and emits light at a peak wavelength of about 0.57 ⁇ m to obtain white.
- the kind and amount of the phosphor 423 are not particularly limited, and a particulate phosphor can be used regardless of whether it is organic or inorganic.
- a particulate phosphor can be used regardless of whether it is organic or inorganic.
- Red, blue, yellow, and green light are selected from a combination of one or more.
- the amount of the phosphor to be blended in the coating material varies depending on the thickness with which the light emitting element is coated, but as an example, it is preferable to add in the range of 5 to 20% by mass with respect to 100% by mass of the coating.
- the covering material 424 is selected from a resinous composition having translucency.
- This resinous composition can be selected from thermoplastic and thermosetting, and acrylic, polycarbonate, urethane, methacrylic acid, silicone and the like can be used. Moreover, not only resin but rubber
- a light scattering material can be blended in the covering material for the purpose of adjusting directivity.
- the light scattering material include titanium oxide, aluminum oxide, and silicon oxide.
- the weir 421 is left and only the stencil plate base film 426 is removed (FIG. 2D). Since the covering material is filled in the space surrounded by the weirs, the shape is not impaired, and the stencil plate base film can be removed before curing. Of course, it may be after curing. Further, since only the stencil plate base film is removed, there is no problem of breakage of the coating layer and release of the coating material and the stencil plate base film.
- the covering material thus filled can be cured to form a covering layer 427 in a predetermined shape around the light emitting element 403.
- the coating layer 427 is obtained by curing the coating material 424 containing the phosphor 423.
- the weir formed of the elastic resin preferably also contains phosphor and / or light scattering material in the range of 5 to 20% by mass.
- a lens-like structure 407 can be installed in the light emitting device 400 (FIG. 2E).
- the lens-like structure 407 is made of silicone rubber or resin, and is directly molded on the substrate 401. Note that a lens-like structure obtained in advance by molding such as compression, transfer, and injection may be attached with an adhesive, an adhesive, or the like, or may be fixed with a mechanical fit.
- the property of the lens-like structure 407 may be glass, resin, or rubber, but it is desirable that the lens-like structure 407 be made of a silicone material in view of excellent light transmittance, heat resistance, and resistance to ultraviolet rays.
- the shape of the lenticular structure is adjusted by the directivity of light emitted from the light emitting device. Depending on the purpose of light collection, diffusion, etc., any shape such as concave, convex, Fresnel, spherical, aspherical surface is used.
- a plurality of lenses having substantially the same diameter as the light emitting elements may be provided for each individual light emitting element, or the plurality of light emitting elements may be covered with a single lens.
- the material of the stencil plate base material is not limited as long as the rigidity is maintained.
- Various kinds of metals such as stainless steel, aluminum, iron, copper, etc., or resins such as alloys, metal oxides, polycarbonates, polyesters, ceramics, graphite, silicone, etc. are conceivable.
- polyester is most preferable in view of its versatility, cost, and processability.
- PET polyethylene terephthalate
- the thickness of the PET film is preferably 0.1 mm to 0.5 mm. If it is thinner than 0.1 mm, rigidity cannot be maintained, and if it is thicker than 0.5 mm, processing becomes difficult.
- the size of the opening may be between the innermost circumference and the outermost circumference of the elastic body. If it is larger than the outermost periphery, the covering material overflows outside. Filling is possible even if it is smaller than the innermost circumference, but insufficient places occur.
- the material of the weir may be natural rubber, synthetic rubber, organic rubber or silicone rubber, or may be an elastic synthetic resin, but it is highly transparent considering that it becomes part of the light emitting device Silicone rubber having heat resistance, heat resistance and ultraviolet resistance is preferable.
- the type of silicone rubber may be any of dimethyl, vinylmethyl, phenyl, trifluoropropyl and the like.
- the vulcanization mechanism may be any of peroxide, addition, condensation, dealcoholization, deoxime, deacetic acid, etc., but addition is desirable in that there are few reaction byproducts.
- the elastic body is not necessarily transparent. For the purpose of adjusting the function of the light emitting device, a light scattering material and a phosphor may be blended.
- the inner side of the elastic body is set according to the size, quantity, arrangement, etc. of the light emitting element to be mounted.
- the inner wall of the elastic body is made about 0.2 to 1.0 mm larger than the outer periphery of the light emitting element so as not to interfere with the thin metal wire connected to the light emitting element.
- the outer side of the elastic body is similar to the inner side, and the difference between the inner side and the outer side is preferably 1 mm or more. If it is less than 1 mm, the strength cannot be maintained and the film is deformed.
- the thickness of the elastic body is adjusted by the filling amount of the phosphor and the emission color, and is preferably 0.5 to 3.0 mm. If it is thinner than 0.5 mm, it interferes with the light emitting element and the fine metal wire, and if it is thicker than 3.0 mm, the luminous efficiency is deteriorated.
- the stencil plate substrate is obtained as shown in FIGS. 3A-G.
- Liquid addition-curable silicone rubber 601 is sandwiched between polyester films 602, rolled with a rolling roll 603, and then heat-cured (FIG. 3A).
- unnecessary portions are removed to obtain a stencil plate substrate on which a weir 605 is placed on a polyester film 602 (FIGS. 3B-D).
- a polyester film is also punched on the inner periphery to form an opening 607, and the outer peripheral polyester film is left without being punched to form a stencil plate substrate 606 (FIG. 3E).
- the planar shape of the weir 605 made of an elastic body can be made freely by making the punching blade into a ring shape or a square shape (FIG. 3F-G).
- the opening 607 may be created in the process between FIGS. 3A and 3B.
- the weir can be formed by any other method such as compression molding, transfer molding, injection molding or extrusion molding.
- Example 1 A white thermosetting silicone rubber, FSG5760K1W (manufactured by Fuji Polymer Industries Co., Ltd.) was sandwiched between PET films having a thickness of 0.1 mm (product name “Lumirror” manufactured by Toray Industries, Inc.) and rolled to 0.95 mm with a rolling roll. The thickness includes the thickness of upper and lower lumirrors 0.1 mm + 0.1 mm. Immediately after rolling, it was cured by heating at 150 ° C. for 5 minutes with a heating / pressure press molding machine.
- the cured sheet was punched out together with the PET film, punched out with a mold (inner diameter 6.5 mm, outer diameter 8.0 mm), and formed into a ring-shaped weir shape having a thickness of 1.5 mm and a height of 0.75 mm.
- both the upper and lower PET films were punched on the inner diameter side, but only the upper PET film and silicone rubber were punched on the outer diameter.
- only the upper PET film 602 was peeled, and unnecessary rubber portions were removed to obtain a stencil plate base film with a ring-shaped weir.
- a stencil version of a coating material in which 10% by mass of a phosphor and YR450 (product name, manufactured by Intermatix, Inc., yellow phosphor) is incorporated into a thermosetting silicone rubber manufactured by Fuji Polymer Industries Co., Ltd., FSG3161K2C (manufactured by Fuji Polymer Industries Co., Ltd.) It supplied on the PET film of a base material, and filled it, then extending with a squeegee. After filling, only the PET film was peeled off, and heated for 30 minutes in a hot air circulating furnace at 150 ° C. to cure the coating material to obtain a coating layer. The thickness of the coating layer was 0.75 mm.
- the light emitting device was inserted into a transfer mold, and a hemispherical lens structure 407 having a diameter of 6 mm was integrally molded with the silicone rubber FSG3161K2C.
- the obtained light emitting device was able to reduce the defect rate without damage or chipping of the coating layer.
- a current was passed through the obtained light emitting device, and the color temperature was measured with CA-2000 manufactured by Konica Minolta. When a current of 100 mA was passed, white light having a color temperature of 4100K and color coordinates of X0.4 and Y0.45 was obtained.
- Example 2 A light emitting device was produced in the same manner as in Example 1 except that the phosphor concentration and the coating thickness of the coating layer were changed to Table 1 below. The obtained light emitting device was caused to emit light in the same manner as in Example 1, and the color temperature was measured. These conditions and results are shown in Table 1.
- the color temperature becomes high when the phosphor concentration is low, the amount required for coating must be increased, the influence of concentration change due to sedimentation is reduced, the consumption of material is increased, and It turned out that luminous efficiency worsens.
- the phosphor concentration is high, the color temperature is low, the amount required for coating can be reduced, it is assumed that the coating cannot be completed, the concentration is likely to change due to sedimentation, the material can be reduced, It has been found that the function of the phosphor decreases as the concentration increases. From the above, it was found that the phosphor concentration in the coating layer is preferably 5 to 20% by mass.
- Comparative Example 1 As a comparative example, an attempt was made to coat a light emitting element using a screen plate. However, when the screen plate was removed before curing, the coating layer flowed and the shape could not be maintained. In the case where the screen plate was left as it was after curing, the coating layer adhered to the screen plate and was damaged. Eventually, it was not possible to coat the light emitting element using a screen plate.
- the light emitting device manufacturing method and the light emitting device according to the present invention can be used for light sources such as illumination, display, and backlight.
Abstract
Description
白色の熱硬化シリコーンゴム、FSG5760K1W(富士高分子工業社製)を厚み0.1mmのPETフィルム(東レ社製製品名“ルミラー”)で上下をはさみ、圧延ロールで0.95mmに圧延した。前記厚みは、上下のルミラーの厚み0.1mm+0.1mmを含んでいる。圧延後、直ちに加熱・加圧プレス成型機により150℃で5分加熱し硬化させた。硬化したシートをPETフィルムごと打抜き、金型(内径6.5mm、外径8.0mm)で打抜き、厚さ1.5mm、高さ0.75mmのリング状の堰形状とした。このとき、内径側は上下のPETフィルムとも打抜くが、外径は上のPETフィルムとシリコーンゴムだけを打抜きした。次に上側のPETフィルム602のみ剥離し、さらに不要なゴム部を除去し、リング状の堰がついたステンシル版基材フィルムを得た。
被覆層の蛍光体濃度と被覆厚さを下記の表1とした以外は実施例1と同様に発光装置を作製した。得られた発光装置を実施例1と同じ方法で発光させ、色温度を測定した。これらの条件と結果を表1に示す。
比較例として、スクリーン版を使用して発光素子を被覆することを試みた。しかし、硬化前にスクリーン版を取り外すと、被覆層が流れてしまい形状を維持できなかった。硬化後までスクリーン版をそのままにしておいたものは、被覆層がスクリーン版に固着してしまい破損した。結局、スクリーン版を使用して発光素子を被覆することはできなかった。
101,208,311,401 基板
102,201,310,403 発光素子
103,202,312,423 蛍光体
104,203,313,424 被覆材
106,206 キャビティ
107 細管
108 シリンジ
204 メタルマスク
205,428 スキージ
207,427 被覆層
300 成型金型
301 下型
302 基板を挿入するキャビティ
303 中型
304 被覆層を成型する為のキャビティ
305 上型
306 ポット
314 注入口
315 ランナー
316 ゲート
109,209,402 電極
404 金属細線
407 レンズ状構造体
420,606,705 ステンシル
421,605,702 弾性体の堰
425,607,703 被覆材を充填するための開口部
426,701 基材フィルム
422,704 被覆層を成型する為の空間
601 液状付加型シリコーンゴム
602 ポリエステルフィルム
603 ロール
604 打抜き刃
Claims (14)
- 基板に半導体発光素子が搭載された発光装置であって、
前記発光素子は弾性樹脂で形成された堰で囲われており、
前記堰の内側の空間に蛍光体を含む被覆層が形成されていることを特徴とする発光装置。 - 前記弾性樹脂で形成された堰は、蛍光体及び/又は光散乱材を含む請求項1に記載の発光装置。
- 前記弾性樹脂で形成された堰は、シリコーン系ゴム又はゲルである請求項1又は2に記載の発光装置。
- 前記弾性樹脂で形成された堰の外側には、さらにレンズを配置した請求項1~3のいずれかに記載の発光装置。
- 前記レンズは、シリコーン系ゴム又はレジンである請求項4に記載の発光装置。
- 前記被覆層に配合する蛍光体の量は、被覆層に対して5~20質量%の範囲である請求項1又は2に記載の発光装置。
- 前記弾性樹脂で形成された堰の内面と前記発光素子の外周との間隙は0.2~1.0mmである請求項1,2,6のいずれかに記載の発光装置。
- 前記弾性樹脂で形成された堰の厚さは0.5~3.0mmであり、高さは0.5~3.0mmである請求項1,2,6,7のいずれかに記載の発光装置。
- 前記弾性樹脂で形成された堰も蛍光体及び/又は光散乱材を5~20質量%の範囲で含む請求項1,2,6~8のいずれかに記載の発光装置。
- 前記被覆層を構成するマトリックスは、シリコーンゴム状又はゲル状である請求項1又は6に記載の発光装置。
- 基板に半導体発光素子が搭載され、発光素子は弾性樹脂で形成された堰で囲われた発光装置の製造方法であって、
ステンシル版基材フィルムの一方の面に被覆材を充填する開口部を有し、他方の面の前記開口部の相対する位置に弾性樹脂で形成された堰が一体化されたステンシル版基材を前記発光素子搭載の基板上に位置合わせし、
前記開口部から蛍光体を含む被覆材を充填し、前記被覆材を硬化して被覆層を形成し、
前記ステンシル版基材フィルムを除去し、前記堰を基板上の被覆層と一体化することを特徴とする発光装置の製造方法。 - 前記ステンシル版基材フィルムがポリエステルフィルムである請求項11に記載の発光装置の製造方法。
- 前記ステンシル版基材は、下記の工程で製造する請求項11に記載の発光装置の製造方法。
(1)2枚の基材フィルムの間に熱硬化シリコーンゴム層を介在させ、圧延ロールで圧延し、加熱・加圧プレス成型機により加熱硬化させる。
(2)大径金型で一方の基材フィルムとシリコーンゴムを打抜きする。
(3)一方の基材フィルムを剥離し、堰となる部分以外の不要なゴム部を除去する。
(4)前記(1)工程と(2)工程の間で硬化したシートを小径金型で上下の基材フィルムを打抜くか、又は前記(3)工程の後で堰の基材フィルムを小径金型で打抜く。 - 前記被覆層の外側には、さらにシリコーンゴム又はレジンを含むレンズを直接成形する請求項11に記載の発光装置の製造方法。
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012084516A1 (de) * | 2010-12-21 | 2012-06-28 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement |
WO2012090867A1 (ja) * | 2010-12-28 | 2012-07-05 | コニカミノルタオプト株式会社 | 発光装置の製造方法 |
EP2610931A1 (en) * | 2011-12-28 | 2013-07-03 | Ledengin, Inc. | Deposition of phosphor on die top by stencil printing |
US9234801B2 (en) | 2013-03-15 | 2016-01-12 | Ledengin, Inc. | Manufacturing method for LED emitter with high color consistency |
US9482407B2 (en) | 2010-04-08 | 2016-11-01 | Ledengin, Inc. | Spot TIR lens system for small high-power emitter |
JP2018186288A (ja) * | 2014-11-04 | 2018-11-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 材料を表面に被着する方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005051194A (ja) * | 2003-01-10 | 2005-02-24 | Toyoda Gosei Co Ltd | 発光デバイス |
JP2007103494A (ja) * | 2005-09-30 | 2007-04-19 | Nichia Chem Ind Ltd | シリコーンゴム封止型発光装置、及び該発光装置の製造方法 |
JP2007266631A (ja) * | 2005-09-20 | 2007-10-11 | Matsushita Electric Works Ltd | 発光装置 |
JP2008027999A (ja) * | 2006-07-19 | 2008-02-07 | Matsushita Electric Ind Co Ltd | 発光装置の製造方法および発光装置 |
JP2008078657A (ja) * | 2006-09-20 | 2008-04-03 | Samsung Electro Mech Co Ltd | 多層印刷回路基板の製造方法、多層印刷回路基板及び真空印刷装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100621154B1 (ko) * | 2005-08-26 | 2006-09-07 | 서울반도체 주식회사 | 발광 다이오드 제조방법 |
-
2009
- 2009-04-23 MY MYPI20110871 patent/MY149763A/en unknown
- 2009-04-23 WO PCT/JP2009/058091 patent/WO2010023993A1/ja active Application Filing
- 2009-04-23 JP JP2010526591A patent/JP4773580B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005051194A (ja) * | 2003-01-10 | 2005-02-24 | Toyoda Gosei Co Ltd | 発光デバイス |
JP2007266631A (ja) * | 2005-09-20 | 2007-10-11 | Matsushita Electric Works Ltd | 発光装置 |
JP2007103494A (ja) * | 2005-09-30 | 2007-04-19 | Nichia Chem Ind Ltd | シリコーンゴム封止型発光装置、及び該発光装置の製造方法 |
JP2008027999A (ja) * | 2006-07-19 | 2008-02-07 | Matsushita Electric Ind Co Ltd | 発光装置の製造方法および発光装置 |
JP2008078657A (ja) * | 2006-09-20 | 2008-04-03 | Samsung Electro Mech Co Ltd | 多層印刷回路基板の製造方法、多層印刷回路基板及び真空印刷装置 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9482407B2 (en) | 2010-04-08 | 2016-11-01 | Ledengin, Inc. | Spot TIR lens system for small high-power emitter |
WO2012084516A1 (de) * | 2010-12-21 | 2012-06-28 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement |
US9281453B2 (en) | 2010-12-21 | 2016-03-08 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic component, and optoelectronic component |
WO2012090867A1 (ja) * | 2010-12-28 | 2012-07-05 | コニカミノルタオプト株式会社 | 発光装置の製造方法 |
JP5494830B2 (ja) * | 2010-12-28 | 2014-05-21 | コニカミノルタ株式会社 | 発光装置の製造方法 |
EP2610931A1 (en) * | 2011-12-28 | 2013-07-03 | Ledengin, Inc. | Deposition of phosphor on die top by stencil printing |
US8993358B2 (en) | 2011-12-28 | 2015-03-31 | Ledengin, Inc. | Deposition of phosphor on die top by stencil printing |
TWI568028B (zh) * | 2011-12-28 | 2017-01-21 | 硅谷光擎股份有限公司 | 藉由模板印刷將磷光質沉積於晶粒頂部之技術 |
US9234801B2 (en) | 2013-03-15 | 2016-01-12 | Ledengin, Inc. | Manufacturing method for LED emitter with high color consistency |
JP2018186288A (ja) * | 2014-11-04 | 2018-11-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 材料を表面に被着する方法 |
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