CN103872225B - 一种带微镜结构的led照明用发光薄膜及其制备方法 - Google Patents
一种带微镜结构的led照明用发光薄膜及其制备方法 Download PDFInfo
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- CN103872225B CN103872225B CN201410102887.5A CN201410102887A CN103872225B CN 103872225 B CN103872225 B CN 103872225B CN 201410102887 A CN201410102887 A CN 201410102887A CN 103872225 B CN103872225 B CN 103872225B
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
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CN201410102887.5A CN103872225B (zh) | 2014-03-19 | 2014-03-19 | 一种带微镜结构的led照明用发光薄膜及其制备方法 |
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CN201410102887.5A CN103872225B (zh) | 2014-03-19 | 2014-03-19 | 一种带微镜结构的led照明用发光薄膜及其制备方法 |
Publications (2)
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CN103872225A CN103872225A (zh) | 2014-06-18 |
CN103872225B true CN103872225B (zh) | 2016-09-07 |
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CN201410102887.5A Expired - Fee Related CN103872225B (zh) | 2014-03-19 | 2014-03-19 | 一种带微镜结构的led照明用发光薄膜及其制备方法 |
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Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104175578A (zh) * | 2014-07-08 | 2014-12-03 | 华南师范大学 | 一种led荧光粉预制膜的制造方法 |
CN104576896A (zh) * | 2014-12-16 | 2015-04-29 | 江门市赛宁灯饰有限公司 | 一种led荧光胶 |
EP3088945B1 (en) * | 2015-04-29 | 2017-08-30 | Ningbo Jiangbei Exciton New Material Technology Co., Ltd. | Fluorescent films having a particular color location and color gamut |
CN104793275A (zh) * | 2015-04-29 | 2015-07-22 | 宁波江北激智新材料有限公司 | 一种色度坐标和色域范围可调的荧光薄膜 |
CN105070816B (zh) * | 2015-07-20 | 2018-05-15 | 佛山市南海区联合广东新光源产业创新中心 | 一种led用荧光粉薄膜粉浆 |
JP2017191879A (ja) * | 2016-04-14 | 2017-10-19 | 株式会社小糸製作所 | 発光モジュール |
CN109841720A (zh) * | 2018-12-12 | 2019-06-04 | 华中科技大学鄂州工业技术研究院 | 一种白光led制备方法及白光led器件 |
CN111421929A (zh) * | 2020-04-13 | 2020-07-17 | 宁波勤邦新材料科技有限公司 | 一种光学增亮贴合基膜及其制备方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101443192A (zh) * | 2006-03-15 | 2009-05-27 | Lg伊诺特有限公司 | 光致发光板 |
CN101533882A (zh) * | 2009-04-20 | 2009-09-16 | 南京工业大学 | 一种白光led用荧光粉预制薄膜及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4122738B2 (ja) * | 2001-07-26 | 2008-07-23 | 松下電工株式会社 | 発光装置の製造方法 |
KR100703095B1 (ko) * | 2005-10-14 | 2007-04-06 | 삼성전기주식회사 | 하이 새그 렌즈 제조 방법 및 이 방법에 의해 제조한 하이새그 렌즈 |
US8242684B2 (en) * | 2010-09-27 | 2012-08-14 | Osram Sylvania Inc. | LED wavelength-converting plate with microlenses |
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2014
- 2014-03-19 CN CN201410102887.5A patent/CN103872225B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101443192A (zh) * | 2006-03-15 | 2009-05-27 | Lg伊诺特有限公司 | 光致发光板 |
CN101533882A (zh) * | 2009-04-20 | 2009-09-16 | 南京工业大学 | 一种白光led用荧光粉预制薄膜及其制备方法 |
Non-Patent Citations (1)
Title |
---|
微透镜阵列热压印应力与脱模温度研究;王伊卿等;《西安交通大学学报》;20130430;第47卷(第4期);第1-2页 * |
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Inventor after: Guan Rongfeng Inventor after: Xue Zhonghui Inventor after: Song Juan Inventor after: You Yajun Inventor after: Hou Guihua Inventor after: Xu Ning Inventor before: Guan Rongfeng Inventor before: Song Juan Inventor before: You Yajun Inventor before: Hou Guihua Inventor before: Xu Ning |
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