CN103165803B - 发光元件安装用封装体、发光元件封装体及它们的制造方法 - Google Patents

发光元件安装用封装体、发光元件封装体及它们的制造方法 Download PDF

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Publication number
CN103165803B
CN103165803B CN201210543728.XA CN201210543728A CN103165803B CN 103165803 B CN103165803 B CN 103165803B CN 201210543728 A CN201210543728 A CN 201210543728A CN 103165803 B CN103165803 B CN 103165803B
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CN
China
Prior art keywords
light
alloy
distribution
emitting element
film plating
Prior art date
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CN201210543728.XA
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English (en)
Chinese (zh)
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CN103165803A (zh
Inventor
小林和贵
荒井直
木村康之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of CN103165803A publication Critical patent/CN103165803A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
CN201210543728.XA 2011-12-19 2012-12-14 发光元件安装用封装体、发光元件封装体及它们的制造方法 Active CN103165803B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011277736A JP5812845B2 (ja) 2011-12-19 2011-12-19 発光素子搭載用パッケージ及び発光素子パッケージ並びにそれらの製造方法
JP2011-277736 2011-12-19

Publications (2)

Publication Number Publication Date
CN103165803A CN103165803A (zh) 2013-06-19
CN103165803B true CN103165803B (zh) 2016-12-21

Family

ID=47357978

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210543728.XA Active CN103165803B (zh) 2011-12-19 2012-12-14 发光元件安装用封装体、发光元件封装体及它们的制造方法

Country Status (4)

Country Link
US (1) US8941139B2 (https=)
EP (1) EP2629591B1 (https=)
JP (1) JP5812845B2 (https=)
CN (1) CN103165803B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6203942B2 (ja) * 2014-04-04 2017-09-27 シャープ株式会社 発光装置用基板の製造方法、発光装置の製造方法、及び照明装置の製造方法
JP6361385B2 (ja) * 2014-09-04 2018-07-25 日亜化学工業株式会社 回路基板およびこれを用いた発光装置
JP6511762B2 (ja) * 2014-10-03 2019-05-15 三菱電機株式会社 発光素子実装基板
WO2017026093A1 (ja) 2015-08-10 2017-02-16 パナソニックＩｐマネジメント株式会社 発光装置及び半田接合体
KR102849643B1 (ko) 2016-12-23 2025-08-25 서울바이오시스 주식회사 반도체 발광 소자
JP7083736B2 (ja) * 2018-10-26 2022-06-13 株式会社ジャパンディスプレイ 表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100593964C (zh) * 2004-07-01 2010-03-10 日东电工株式会社 配线电路基板及配线电路基板的制造方法
CN102097422A (zh) * 2009-10-30 2011-06-15 东芝照明技术株式会社 发光装置、发光装置的制造方法以及照明装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6200451B1 (en) * 1996-03-22 2001-03-13 Macdermid, Incorporated Method for enhancing the solderability of a surface
JP4067802B2 (ja) 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
JP4527714B2 (ja) * 2003-02-07 2010-08-18 パナソニック株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
US7053421B2 (en) * 2003-12-15 2006-05-30 Lighthouse Technology Co., Ltd Light-emitting diode
JP2006196565A (ja) * 2005-01-12 2006-07-27 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
JP2006319074A (ja) 2005-05-12 2006-11-24 Mitsui Chemicals Inc Ｌｅｄ実装用基板およびその製造方法
JP4983347B2 (ja) * 2007-04-03 2012-07-25 ソニー株式会社 発光装置及び光源装置
KR101268725B1 (ko) 2008-09-30 2013-05-28 히타치가세이가부시끼가이샤 코트제, 이것을 사용한 광반도체 소자 탑재용 기판 및 광반도체 장치
JP2011014890A (ja) * 2009-06-02 2011-01-20 Mitsubishi Chemicals Corp 金属基板及び光源装置
JP5295010B2 (ja) * 2009-06-25 2013-09-18 京セラ株式会社 発光装置
US20110121326A1 (en) 2009-11-26 2011-05-26 Dsem Holdings Sdn. Bhd. Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100593964C (zh) * 2004-07-01 2010-03-10 日东电工株式会社 配线电路基板及配线电路基板的制造方法
CN102097422A (zh) * 2009-10-30 2011-06-15 东芝照明技术株式会社 发光装置、发光装置的制造方法以及照明装置

Also Published As

Publication number Publication date
JP5812845B2 (ja) 2015-11-17
JP2013128081A (ja) 2013-06-27
US8941139B2 (en) 2015-01-27
EP2629591B1 (en) 2015-04-01
US20130153945A1 (en) 2013-06-20
CN103165803A (zh) 2013-06-19
EP2629591A1 (en) 2013-08-21

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