CN103144374A - 利用单方向碳纤维预浸料织物的复合材料及利用该复合材料的覆铜板层压板 - Google Patents

利用单方向碳纤维预浸料织物的复合材料及利用该复合材料的覆铜板层压板 Download PDF

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CN103144374A
CN103144374A CN2013100366367A CN201310036636A CN103144374A CN 103144374 A CN103144374 A CN 103144374A CN 2013100366367 A CN2013100366367 A CN 2013100366367A CN 201310036636 A CN201310036636 A CN 201310036636A CN 103144374 A CN103144374 A CN 103144374A
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carbon fiber
fiber prepreg
fabric
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赵演镐
赵文秀
金正喆
姜锡远
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Abstract

本发明涉及具有厚度薄、热膨胀系数低及热放出高等特性的复合材料的制造方法、通过该制造方法制造的复合材料及利用该复合材料的覆铜板层压板。根据本发明的利用单方向碳纤维预浸料织物的复合材料，利用通过包括如下步骤的方法制造的单方向碳纤维预浸料织物，该方法包括：制造单方向碳纤维预浸料的步骤；将制造的单方向碳纤维预浸料切断成一定宽幅的步骤；将切断成一定宽幅的单方向碳纤维预浸料织制成织物的步骤；及将织制的单方向碳纤维预浸料织物进行成型的步骤。本发明的复合材料具有更薄的厚度，且具有X、Y方向的热膨胀系数差异小的优点。

Description

利用单方向碳纤维预浸料织物的复合材料及利用该复合材料的覆铜板层压板
技术领域
本发明涉及具有厚度薄、热膨胀系数低及热放出高等特性的复合材料的制造方法、通过该制造方法制造的复合材料及利用该复合材料的覆铜板层压板；具体地，涉及利用单方向碳纤维（uni-directional carbon fiber）预浸料（prepreg）的复合材料的制造方法、利用该制造方法制造的复合材料及利用该复合材料的覆铜板层压板。
背景技术
广泛用作印刷电路板的覆铜的薄层积板-覆铜板层压板（Copper CladLaminate:CCL）通常具有在两个铜层之间形成绝缘层的结构。用作覆铜板层压板基础材料的绝缘层的素材-树脂虽然绝缘性优异，但是具有机械强度弱、随着温度的尺寸变化比金属大的缺点。
为了弥补树脂层的上述缺点，纸、玻璃纤维或无纺布成为用于增加树脂层的强度及减少随着温度的尺寸变化的补强基材。
覆铜板层压板可分为在玻璃纤维中浸渍环氧树脂的玻璃纤维/环氧树脂（Glass/Epoxy）覆铜板层压板、用于制造印刷电路板的纸/苯酚（Paper/Phenol）覆铜板层压板、具有2中以上的补强基材的复合（Composite）覆铜板层压板、在信息处理领域中所使用的利用具有低漏电率的补强基材的高频用覆铜板层压板及由柔韧性高的聚酯或聚酰亚胺薄膜和铜箔制成的柔性（Flexible）覆铜板层压板。
同便携式移动通信终端一样，人们对电子产品的移动性（portability）也产生了要求，因而随着对构成电子产品的印刷电路板（PCB;Printed CircuitBoard）的小型化、薄板化、高直接化，还要求高性能和功能。其结果是用于电子产品的印刷电路板中的元件包密度增加，安装的层数多层化，同时印刷电路板从单面变为双面。
通常使用的球栅阵列（BGA,Ball Grid Array）封装工艺、系统级封装（SiP,System in Package）及多芯片模块（MCM,Multi Chip Module）的情况都由于主板（Main Board）和子板（Sub Board）或芯（Chip）和芯相互之间的热膨胀系数（CTE;Coefficient of Thermal Expansion）的差异而可能发生翘曲（Warpage），结果芯和芯还有基板的连接上可能发生裂隙（Crack）。
即，通常使用的印刷电路板的热膨胀系数约为12-20ppm（半导体封装用FR-4、epoxy/玻璃纤维），而通过焊球（Solder Ball）安装于基板上的芯（半导体、硅片）的热膨胀系数为2-5ppm，由于在产品的使用时发生的热而导致焊球的疲劳寿命降低，同时基板水平膨胀而变形。尤其薄板产品时对热膨胀系数的敏感性大、取给或使用中对小小的外部冲击也敏感而产生不良，产品的可靠性降低。
为了消除印刷电路板和在其上安装的芯之间的热膨胀系数的差异引起的问题，现有技术中有韩国注册专利第847003号“用于印刷电路板的碳纤维补强材料”。在该现有技术中公开了，如图8所示，将横、竖相互织造的碳纤维布（Carbon Fiber Cloth）和碳纤维粉碎粒子中的一种或两种含浸在含有溶剂、催化剂、硬化剂及环氧树脂的聚合物（Polymer）溶体中，利用多个辊（roll）将其加工成所需的厚度后，在60-140℃下干燥而制造的用于印刷电路板的碳纤维补强材料。此外，该现有技术中还公开了，如图9所示，在用于印刷电路板的碳纤维补强材料的上下表面形成铜箔的覆铜板层压板。
但是这种利用碳纤维织物的印刷电路板用补强材料由于是织造碳纤维本身，而在减少厚度方面受限，且具有在织物中产生空隙（缝隙）的缺点。即，目前生产的最细的碳纤维为1K（这里“K”是指构成碳纤维的细丝的股数，是指1000股），由于由1000股的碳纤维细丝束（yarn）构成，织成织物时所织造的碳纤维织物的厚度具有限制，最薄的厚度为140μm左右。
此外，在织造碳纤维之后要在树脂中含浸而制作，即使再努力使得碳纤维织物的经丝和纬丝之间没有缝隙，在将树脂含浸时由于工序的张力而出现在经丝方向上的宽幅减少的现象以及由于树脂而使经丝和纬丝的宽幅减少而产生缝隙变大的问题，因此在印刷电路板通孔加工时，照射一定强度的激光而加工一定厚度的孔时，由于空隙（缝隙）而导致空隙部位和碳纤维部位的强度差异，从而形成不均匀的通孔。例如，为了加工存在碳纤维的部位而照射一定强度的激光时，空隙部位（只有树脂的部位）的加工过度而导致产生通孔的深度比所需的要深的问题，为了防止这一问题而照射弱强度的激光时，又产生存在碳纤维的部位达不到所需的深度而加工不足的问题。
此外，由于利用织物织造时发生的经丝和纬丝碳纤维的张力差异及树脂含浸工序中发生的张力问题，而导致产生X、Y轴的热膨胀系数差异的问题。
本发明是为了解决现有技术的上述问题而提出，具有以下目的。
现有技术
专利文献
专利文献1韩国注册专利第10-0847003号
发明内容
发明目的
本发明的目的在于提供利用单方向碳纤维预浸料织物而克服了现有技术所具有的受到的厚度限制的复合材料的制造方法。
本发明的另一目的在于，提供印刷电路板之外还用于计算机、通信仪器、控制机械、发电机、变压机、马达或配电板等多种电器或电子仪器中的具有低热膨胀系数和高热放出特性的复合材料的制造方法、通过该制造方法制造的复合材料及利用该复合材料的覆铜板层压板。
技术方案
根据本发明的利用单方向碳纤维预浸料织物的复合材料，利用通过包括如下步骤的方法制造的单方向碳纤维预浸料织物，该方法包括：制造单方向碳纤维预浸料的步骤；将制造的单方向碳纤维预浸料切断成一定宽幅的步骤；将切断成一定宽幅的单方向碳纤维预浸料织制成织物的步骤；及将织制的单方向碳纤维预浸料织物进行成型的步骤。
此时，用于单方向碳纤维预浸料的制造的碳纤维为1K、3K、6K、12K或24K碳纤维。
根据本发明的覆铜板层压板是通过制造单方向碳纤维预浸料，将制造的单方向碳纤维预浸料以一定宽幅切断，将以一定宽幅切断的单方向碳纤维预浸料织制成织物，并在织制的单方向碳纤维预浸料织物的上下表面层积铜箔一体成型。
根据本发明，由于利用了在制造单方向碳纤维预浸料之后将其织制的单方向碳纤维预浸料织物，相比织制碳纤维束的现有技术，具有更薄的厚度，且由于是将树脂含浸状态的预浸料进行织制，在织造状态下不需要单独的树脂含浸工序，因此能够防止含浸工序中发生的缝隙变大，且X、Y方向的张力差异不大，具有X、Y方向的热膨胀系数差异小的优点。
此外，相比以往使用的印刷电路板的元件，具有更低的热膨胀系数，由于碳纤维的高热传导率，而能够更快速地将印刷电路板中潜在的热量进行发散，起到热导体的功能，从而具有延长基板的寿命、防止热变形及延长产品寿命的效果。
还有，以往所使用的利用1K的最细碳纤维织造的织物为具有同一厚度的织物，在单方向碳纤维预浸料织物中可以使用价格低廉的12K纤维织造，因此就相同厚度的织物而言本发明更加经济。
附图说明
本发明中所附的以下附图仅是例示本发明的优选实施例，与本发明的详细说明一同起到帮助理解本发明技术思想的作用，本发明的范围并不由这些随附的附图所记载的事项所限定。
图1及图2分别是本发明的超薄板复合材料的制造工序及单方向碳纤维预浸料的制造工序。
图3是利用单方向碳纤维预浸料制造碳纤维单方向预浸料织物的制造工序的照片。
图4是碳纤维单方向预浸料织物的成型工序的照片。
图5是碳纤维织物和单方向碳纤维预浸料织物的织制方法的模拟图。
图6是为了确认碳纤维织物和单方向碳纤维预浸料织物的厚度的截面照片。
图7是为了确认现有技术的碳纤维织物和本发明的单方向碳纤维预浸料织物的空隙发生与否的照片。
图8是现有技术的印刷电路板用碳纤维补强材料的截面图。
图9是现有技术的利用印刷电路板用碳纤维补强材料的覆铜板层压板的截面图。
附图标记说明
11：热板
12：供给辊
13a、13b：辊
14：第一分离辊
15：第二供给辊
16a、16b：冷却辊
具体实施方式
以下参照本发明随附的附图中所示的实施例详细说明本发明，但是所示的实施例仅用于帮助理解本发明，本发明的范围不限于此。
图1及图2分别是本发明的超薄板复合材料的制造工序及单方向碳纤维预浸料的制造工序。
参照图1，根据本发明的复合材料的制造方法，包括：制造单方向碳纤维预浸料的步骤；将制造的单方向碳纤维预浸料以一定宽幅切断的步骤；将以一定宽幅切断的单方向碳纤维预浸料织制成织物的步骤；及将织制的单方向碳纤维预浸料织物进行成型的步骤。
为了制造本发明的复合材料，首先要制造单方向碳纤维预浸料。单方向碳纤维预浸料（Uni-directional Carborn Fiber Prepreg）为薄板状，可以通过将单方向碳纤维含浸在树脂中制造，具体过程如图2所示。
参照图2，为了制造单方向碳纤维预浸料，首先单方向碳纤维F和剥离纸R/P（Releasing Paper）通过经轴架（Creel）一同供给到热板11。剥离纸R/P是涂覆有相当于碳纤维中含浸的量的树脂的纸，可通过供给辊12供给。单方向碳纤维F可通过本领域公知的任意方法制造。树脂可以是本领域公知的例如环氧树脂、聚酯树脂、聚酰亚胺树脂或苯酚树脂等任意的树脂。含浸在碳纤维F的树脂根据需要可包含用于提高对铜箔的粘接力的硅烷偶合剂。通过热板11熔融的树脂通过一对辊13a,13b而含浸到单方向碳纤维F中。树脂含浸到碳纤维F就通过第一分离辊14除去异形膜P，新的异形膜P'通过第二供给辊15供给，且进行在冷却辊16a,16b中进行冷却的碳纤维预浸料工序。冷却辊16a,16b对碳纤维F中含浸的树脂进行冷却，与此同时施加一定压力将碳纤维F制成薄板状。通过上述工序制造单方向碳纤维预浸料PS，所制造的单方向碳纤维预浸料通过供给辊17供给，就同背面的异形膜P1一同卷到卷取辊R上。如图2中示出的单方向碳纤维预浸料的制造方法为示例性的，本发明并不限于此。
图3中示出利用如上所述的方法制造的单方向碳纤维预浸料制造碳纤维单方向预浸料织物（Carborn Uni-directional Prepreg Fabric）的工序。
参照图3，所制造的单方向碳纤维预浸料通过以下工序切断成一定宽幅。用于织制的单方向碳纤维预浸料的切断宽幅不受特别的限制，在本实施例中切断成10mm。此外，切断的单方向碳纤维预浸料的一幅以经丝方向、另外一幅以纬丝方向交叉放置，平织织制。
织制完成后，如图4所示，利用蒸压器（Autoclave）设备进行成型，成型完成即可制造得到本发明的超薄板复合材料。成型条件可根据树脂的种类变动，在本实施例中是在130℃温度、3kgf/cm2下成型1小时30分钟。另一方面，本实施例中虽然使用了蒸压器设备进行成型，但也可以使用本领域公知的其他方法进行成型。
利用通过上述方法将单方向碳纤维预浸料织制而成的碳纤维预浸料织物的复合材料是在织制碳纤维织物后含浸树脂，从而相比现有的补强材料具有厚度更薄的优点。即，为了制造以往的碳纤维织物需要用1K、3K、6K碳纤维织制，但是单方向碳纤维预浸料织物一般可以使用1K、3K、6K、12K及24K碳纤维制造。此外，单方向碳纤维预浸料织物能够最薄织造到50μm，这是碳纤维织物所具有厚度界限140μm的三分之一左右。
能够像上述一样得到比碳纤维织物薄的厚度的理由是在单方向碳纤维预浸料的制造工序中能够将碳纤维束铺宽开来，两种织制方法和由此得到的厚度差异通过图5的模拟图就能够容易的确认。图5中上图为碳纤维织物，下图为单方向碳纤维预浸料织物。
图6是为了确认碳纤维织物和单方向碳纤维预浸料织物的厚度的截面照片，可以确认相比上方的碳纤维织物，下方的单方向碳纤维预浸料织物的厚度薄很多。
图7是为了确认现有技术的碳纤维织物和本发明的单方向碳纤维预浸料织物的空隙发生与否的照片。在上方的碳纤维织物中可以看出碳纤维之间产生了空隙（缝隙）。产生空隙就上前述的那样在空隙中含浸的树脂中会产生气泡，在之后的用于与铜箔的结合而进行的高压按压过程中，由于水分的渗透而可能会发生短路
Figure BDA00002796876400081
且在通孔加工时，由于空隙而会发生复合材料的变形。可以确认在下方的根据本发明的单方向碳纤维预浸料织物中完全没有发生空隙。从而根据本发明能够消除由于空隙而引发的所有问题。
此外，单方向碳纤维预浸料织物是利用单方向碳纤维制作，因此能够比较容易地进行产品的厚度及单位重量的设计而制造，相比以往的碳纤维织物具有厚度和重量及价格方面的优点。
还有，利用单方向碳纤维预浸料织物制造的印刷电路板相比以往所使用的印刷电路板元件，具有更低的热膨胀系数，由于碳纤维的高热导率而能够快速发散印刷电路板中潜在的热量，还能起到热导体的功能，因此能够延长基板的寿命、防止热变形并能延长产品的寿命。
而且，以往的碳纤维织物由于其生产特性上的经丝和纬丝的张力差异，在X、Y方向的热膨胀系数存在差异，但是本发明的单方向碳纤维预浸料织物在制造单方向碳纤维预浸料之后织造，因此经丝和纬丝的张力差异比以往的碳纤维织物小。
另一方面，在通过如上所述的方法制造的单方向碳纤维预浸料织物的上下表面或其中的任一表面上层积铜箔，一体成型，从而制造覆铜板层压板。利用单方向碳纤维预浸料织物的覆铜板层压板20在单方向碳纤维预浸料中均匀形成树脂层，能够防止水分的发生，从而抑制短路的发生，且收缩和膨胀均匀，而提高了尺寸稳定性。
上面参照实施例进行了详细说明了本发明，但是本领域技术人员能够参照示出的实施例在不超过本发明的技术思想的范围内进行多种变型及修正。本发明的范围不限于这些变型及修正，而是由随附的权利要求书限定。

Claims (3)

1.利用单方向碳纤维预浸料织物的复合材料，其特征在于，该复合材料利用通过包括如下步骤的方法制造的单方向碳纤维预浸料织物，制造单方向碳纤维预浸料的步骤；将制造的单方向碳纤维预浸料切断成一定宽幅的步骤；将切断成一定宽幅的单方向碳纤维预浸料织制成织物的步骤；以及将织制的单方向碳纤维预浸料织物进行成型的步骤。
2.根据权利要求1所述的利用单方向碳纤维预浸料织物的复合材料，其中，用于制造所述单方向碳纤维预浸料的碳纤维为1K、3K、6K、12K或24K碳纤维。
3.覆铜板层压板，该覆铜板层压板包括在根据权利要求1所述的利用单方向碳纤维预浸料织物的复合材料的上下表面或其中任一表面上层积而一体成型的铜箔层。
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Application publication date: 20130612