CN103128062B - Test handler and method for operating the same - Google Patents
Test handler and method for operating the same Download PDFInfo
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- CN103128062B CN103128062B CN201210500338.4A CN201210500338A CN103128062B CN 103128062 B CN103128062 B CN 103128062B CN 201210500338 A CN201210500338 A CN 201210500338A CN 103128062 B CN103128062 B CN 103128062B
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- test pallet
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The application discloses a test handler and a method for operating the same. A matching plate moves toward the test device in two stages. When motion of a test tray is not detected during first forward motion, the test is only executed, so that the test tray (especially an inserted member)can be prevented from being damaged and reliability of the test is raised.
Description
Technical field
The present invention relates to Test handler, this Test handler is supported in semiconductor device and is transported the test that produced semiconductor device is carried out of carrying out before.
Background technology
Test handler be support semiconductor device that test can be tested test machine to manufacture by pre-customized fabrication technique and before semiconductor device is loaded into object pallet according to test result by graduate semiconductor device device.
Fig. 1 is the conceptual view of the universal test separator 100 overlooked from above, and universal test separator 100 comprises according to Test handler of the present invention.With reference to Fig. 1, Test handler 100 comprise test pallet 110, load units 120, infusion chamber 130, test cabinet 140, pushing unit 150, for control pushing unit operation control module 160, remove infusion chamber 170 and unloading unit 180.
With reference to Fig. 2, in test pallet 110, can settle multiple inserts 111 of semiconductor D to be installed to be and can in to a certain degree, to move, and circulate along definite closed path C by multiple feed unit (not shown).
Load units 120 is loaded into the semiconductor device D of not test on the test pallet 110 that is positioned at " loaded " position LP.
Infusion chamber 130 is set to according to test environment conditions, the semiconductor device D loading the test pallet 110 being fed to from " loaded " position LP be preheated before semiconductor device D is tested or is pre-cooled.
Test cabinet 140 is set to support test, thus can in infusion chamber 130, preheat or pre-cooled after be fed to the semiconductor device D settling on the insert 111 of test pallet 110 of test position TP and test.
Pushing unit 150 is set to the test pallet 110 that is positioned at test position TP to promote towards the tester that docks (coupling) with test cabinet 140, so that the semiconductor device D being placed on insert 111 is electrically connected to tester.The present invention relates to pushing unit 150, will describe in more detail pushing unit 150 below.
Control module 160 is set to control the operation that is arranged on the drive source (for example, motor) in pushing unit 150.
The heating of loading the test pallet 110 that goes infusion chamber 170 to be set to recover to be fed to from test cabinet 140 or cooling semiconductor device.
Unloading unit 180 is sorted out the semiconductor device loading from the test pallet 110 that goes infusion chamber 170 to be fed to unloading position UP according to test grade, and semiconductor device is unloaded in empty object pallet.
As mentioned above, semiconductor device D is along passing through infusion chamber 130, test cabinet 140 from " loaded " position LP, going infusion chamber 170 and unloading position UP again to extend to the closed path C circulation of " loaded " position LP, and semiconductor device D is loaded on test pallet 110 simultaneously.
The Test handler 100 with the basic circulating path of test pallet is divided into two types: one is the following dock Test handler of head, another kind is side dock Test handler, test pallet 110 maintenance levels when the following dock Test handler of head allows the semiconductor device that loads tested, and side dock Test handler when allowing the semiconductor device that loads tested test pallet 110 keep vertically.Therefore, side dock Test handler 100 need to comprise one or two posture conversion unit, for the posture that is mounted with semi-conductive horizontal checkout pallet is transformed into vertical state, or the posture of vertical test pallet is transformed into level with unloading semiconductor device after tested.
Next, will pushing unit related to the present invention 150 be described in more detail.
Can find out from the schematic side elevation of Fig. 3, the general pushing unit 150 being arranged in conventional test handler 100 comprises matching disc 50 and drive source 60.
Matching disc 50 comprises multiple pushing units 51 and installing plate 52.
Pushing unit 51 comprises: pusher 51a, for supporting the semiconductor device D on the insert 111 that is placed in test pallet 110; Base 51b, with (in the face of pusher) Surface Contact of insert 111; And coupling pin 51c, being arranged in base 51b, the end that makes pusher 51a in the time that coupling pin 51c is inserted in the coupling hole 111a of formation in insert 111 accurately contacts with the semiconductor device D being placed on the loading groove 111b of insert 111.As a reference, a pushing unit 51 can comprise at least one pusher according to embodiment.For example, a pushing unit 51 can comprise two pusher 51a as shown in Figure 3 or only comprise a pusher.Pusher 51a and pedestal 51b can be integrally formed.
Multiple pushing units 51 are arranged in installing plate 52 with the form of matrix.
Drive source 60 can be servomotor or stepper motor (or cylinder), and make matching disc 50 move the test pallet 110 having moved so that matching disc 50 is attached on guide rail (track that simultaneously guides test pallet to move for supporting test pallet) (not shown), then towards tester push to test pallet, and promote to be placed in thus the semiconductor device D on the insert 111 of test pallet or support equably the semiconductor device D being promoted towards tester by test pallet.
As a reference, the spacing of having exaggerated between pushing unit 51, test pallet 110 and tester.Can be further arranged on matching disc 50 for the supporting rail of support mounting plate 52, in this case, can be thought that supporting rail promotes guide rail with towards tester push to test pallet 110.
Meanwhile, the most important technology part in Test handler is the part that electrically contacts between semiconductor device and tester.Therefore the test pallet, being fed in test cabinet need to be accurately fed to the desired location between matching disc and tester.Thus, need to be accurately controlled for the feed unit that test pallet is fed to test cabinet.
But the component wear causing due to the continuous use of equipment makes to be difficult to only to depend on feed unit test pallet is fed to exact position.Therefore, in most of the cases, Test handler comprises that detector is to detect the position that is fed to the Test handler in test cabinet.
Fig. 4 is that explanation is by the schematic referential view of technology that detects test pallet 110 positions for detection of the detector 190 of test pallet 110 positions.(as a reference, the detection that Fig. 4 shows the tram of the test pallet that is positioned at upper and lower sides makes the tram by detect the test pallet that is positioned at upper and lower sides simultaneously, and the test pallet that is positioned at upper and lower sides is tested.）
Two detect groove 111c-1 and 111c-2 at a distance of certain intervals be formed in test pallet 110, detector 190 comprises that first to fourth test section 191 to 194 is with recognition detection groove 111c.
If suppose that the detection groove 111c-1 and the 111c-2 that form in the test pallet 110 being fed in test cabinet 140 are identified as " 1 " by test section 191 to 194, and will detect groove 111c-1 and the non-existent state recognition of 111c-2 for " 0 ", the state of Fig. 4 can be read as " 1010 " (calling over of the 4th test section that is 194 by the first test section that is 191 from reference number to reference number).If suppose test pallet 110 in the state inside of Fig. 4 in correct position, in the time of the state of the test pallet 110 that is fed to test cabinet 140 in Fig. 4, detector 190 determines that test pallet 110 is fed to correct position, and then pushing unit 150 promotes to be positioned at semiconductor device D on test pallet 110 so that semiconductor device 110 electrically contacts with tester towards tester.As a reference, because all reading number instruction test pallets except " 1010 " depart from correct position, therefore produce error (simultaneously, the quantity of test section, read detect quantity, detection method, the error generation condition of reading number etc. of groove can be according to service condition and difference, and if necessary sensor of words can be used for detecting arrival precalculated position).
But, as mentioned above, even if detector 190 is provided, detects the width of groove 111c-1 and 111c-2 and need to guarantee to be identified by detector 190.And, need to guarantee that the width of the detection groove 111c-1 that is identified by this way and 111c-2 usually produces error in the process of the position of identification test pallet 110.That is to say, when detecting the width of groove 111c-1 and 111c-2 when too narrow, be difficult to detect detection groove 111c-1 and 111c-2, even if test pallet 110 is positioned at correct position, detection can not correctly be carried out, can produce error, therefore detect groove 111c-1 and 111c-2 and need to be formed and have for the detector 190 and detect necessary minimum widith.Thus, be present in accurate position even read detection pallet 110 by detector 190, but detect the error (in this article, the error of permission can be understood to the coupling pin with sharp end can be inserted into the error in scope in bullport) that pallet 110 also can depart from permission.
If test pallet 110 is fed to the position of departing from allowable error by this way, insert 111 is damaged so, and can cause defect generation at the operating period of pushing unit 150 pusher 51a, coupling pin 51c and the slot pin (for the pin that guiding mate between insert and test socket) that is arranged in the test socket (comprising terminal) of tester.
Summary of the invention
Therefore, the object of the invention is to solve the aforementioned problems in the prior, target of the present invention is to provide by making physical contact between matching disc and test pallet, the technology of the actual positional relationship between direct-detection matching disc and test pallet.
In order to realize this object, the method for operational testing separator is provided, the method comprises: load step, semiconductor device is loaded on the insert of the test pallet that is positioned at " loaded " position; First is fed to step, and the test pallet that has loaded semiconductor device in loading step is fed to test position; Tester contact procedure, by using matching disc that the test pallet that is fed to test position is attached to tester, thereby the semiconductor device and the tester that make to be loaded on insert electrically contact; Second is fed to step, if tester has completed the test to semiconductor device after tester contact procedure, test pallet is fed to unloading position; And unloading step, by semiconductor device from be fed to the insert unloading of test pallet of unloading position second is fed to step, wherein, tester contact procedure comprises: first moves forward step, operates drive source and makes matching disc move forward the first spacing towards described tester; Detecting step, detects in the time that matching disc moves forward the first spacing in first moves forward step, and whether test pallet moves towards described tester; Second moves forward step, if the movement of described test pallet do not detected in detecting step, again operate described drive source and make matching disc move forward the second spacing towards described tester, thus matching disc towards tester push to test pallet so that semiconductor device and tester electrically contact.
Preferably, tester contact procedure also comprises that alarm produces step, if the movement of test pallet detected in detecting step, produces alarm.
Whether the guide rail that is used for supporting test pallet by detection is moved to detect the movement of test pallet in the time of guiding test pallet mobile, thereby correctly carries out described detecting step.
In detecting step, the movement that detects test pallet by detecting the movement of mobile destination object associated with guide rail is more suitably.
According to a further aspect in the invention, provide the method for operational testing separator, the method comprises: load step, semiconductor device is loaded on the insert of the test pallet that is positioned at " loaded " position; First is fed to step, and the test pallet that has loaded semiconductor device in loading step is fed to test position; Tester contact procedure, by using matching disc that the test pallet that is fed to test position is attached to tester, thereby the semiconductor device and the tester that make to be loaded on insert electrically contact; Second is fed to step, if tester has completed the test to semiconductor device after tester contact procedure, test pallet is fed to unloading position; And unloading step, by semiconductor device from be fed to the insert unloading of test pallet of unloading position second is fed to step, wherein, tester contact procedure comprises: identification step, is inserted into the mutual alignment relation between the described coupling pin that mates hole during identification is present in coupling hole in test pallet and is arranged on described matching disc; Attach step, when the coupling hole in identification step is with the mutual alignment relation between pin of mating when correct (in the time that coupling pin can insert in coupling hole), by using matching disc that test pallet is attached to tester, thereby the semiconductor device and the tester that make to be placed on the insert of test pallet electrically contact.
Preferably, the method is fed between step and tester contact procedure and also comprises location confirmation step first, and whether identification test pallet is positioned at test position.
Simultaneously, according to another aspect of the invention, Test handler is provided, this Test handler comprises: test pallet, the predetermined circulating path that again extends to " loaded " position from " loaded " position via test position and unloading position, circulate, and there is insert, on insert, be mounted with semiconductor device; Load units is loaded into semiconductor device on the insert of test pallet in the time that test pallet is positioned at " loaded " position; Infusion chamber, be set to when load units complete load time preheat or the pre-cooled insert being placed on semiconductor device; Test cabinet, makes to electrically contact from semiconductor device and the tester of infusion chamber; Guide rail guides the movement of the test pallet that is fed to test cabinet simultaneously for supporting test pallet; Pushing unit, comprise matching disc and drive source, matching disc is set to be attached to tester by the test pallet of guide supporting so that the semiconductor device and the tester that are placed on insert electrically contact, and drive source provides matching disc that test pallet is attached to the required energy of tester; Whether detector, move forward to tester by the operation of drive source for detection of test pallet; Control module, be used for operating drive source, so that matching disc moves forward the first spacing towards tester, and confirm according to the detection of detector whether test pallet moves, if the movement of test pallet do not detected after confirming, control module operates drive source again so, makes matching disc be moved further the second spacing towards tester, to make matching disc towards tester push to test pallet so that the semiconductor device on insert and tester electrically contact; Remove infusion chamber, be returned to room temperature for the semiconductor device of self-test in future chamber; And unloading unit, for unloading from the semiconductor device that goes infusion chamber to be fed to the test pallet of unloading position.
Test handler also comprises destination object, and destination object is associatedly with guide rail mobile, and the movement of detector detected target object to be to detect the movement of guide rail, and detects thus the movement of test pallet.
Preferably, Test handler also comprises support and elastic component, and support is arranged on fixing metope, and one end of elastic component is fixed to support, and the other end of elastic component is fixed to destination object.
Brief description of the drawings
By the detailed description below in conjunction with accompanying drawing, above-mentioned and other objects, features and advantages of the present invention will be more apparent, in the accompanying drawings:
Fig. 1 is the concept plan view of universal test separator;
Fig. 2 is the explanatory view for the test pallet of universal test separator;
Fig. 3 is the explanatory view of the matching relationship between matching disc, test pallet and the tester for universal test separator is described;
Fig. 4 is the referential view of the identification of the position for test pallet is described;
Fig. 5 is according to the conceptual view of the Test handler of an embodiment of the invention;
Fig. 6 A is the conceptual side view of the major part of the Test handler of Fig. 5;
Fig. 6 B is the conceptual side view according to the major part of the Test handler of another embodiment;
Fig. 7 is that operation is according to the flow chart of the method for the Test handler of an embodiment of the invention; And
Fig. 8 A to Fig. 8 C is the referential view for the mode of operation of the Test handler of key diagram 5.
Detailed description of the invention
Hereinafter, describe with reference to the accompanying drawings illustrative embodiments of the present invention, wherein for object clearly, if possible will omit or description that compression repeats.
The description > of < device
Fig. 5 is according to the schematic diagram of the side dock Test handler 500 of an embodiment of the invention.
Comprise in test pallet 510, load units 520, infusion chamber 530, test cabinet 540, guide rail 550, the first detector 560, pushing unit 570, destination object 610(Fig. 5 not shown according to the Test handler 500 of present embodiment), not shown in support 620(Fig. 5), not shown in back-moving spring 630(Fig. 5), the second detector 640, control module 580, remove infusion chamber 590 and unloading unit 600.
In composed component, described test pallet 510, load units 520, infusion chamber 530, test cabinet 540, the first detector 560(in background technology part and served as the detector that background technology part is represented by reference number 190), remove infusion chamber 590 and unloading unit 600, their description will be omitted.
Next, with reference to the conceptual side view of the major part of Fig. 6 A, guide rail 550, destination object 610, support 620, back-moving spring 630, the second detector 640 and control module 580 are described.
Guide rail 550 is for supporting test pallet 510, and guiding is simultaneously fed to the movement of the test pallet 510 in test cabinet 540.
Destination object 610 is fixed to guide rail 550 associated with guide rail 550 mobile, is formed with and detects hole 611 in destination object 610.As a reference, although shown in Figure 6, the pusher P of destination object 610 and matching disc 571 is consistent with vertical line, and destination object 610 and pusher P depart from from vertical line.
Support 620 is arranged on arbitrarily fixing metope.
One side of back-moving spring 630 is fixed to support 620, and its opposite side is fixed to destination object 610, and back-moving spring 630 is done in order to allow guide rail 550 to be back to smoothly home position as elastic component.
The second detector 640 detects the movement of mobile destination object 610 associated with guide rail 550, thereby detects the movement of guide rail 550, and therefore detects the movement of test pallet 510.That is to say, whether the final test pallet 510 that detects of the second detector 640 moves forward towards tester by the operation of drive source 572.The second detector 640 can be for example according to the only no movement that carrys out detected target object 610 by being formed on detection hole 611 in destination object 610.
Although the movement of destination object 610 is in the present invention detected by detecting hole 611 by the second detector 640, and light receiver and light radiating portion is liftoff is arranged in the second detector 640, can use and reflect detector according to embodiment.And, as shown in Figure 6A, reflection detector can be arranged in support 620 with the movement of detected target object 610 not need to be in destination object 610 installation and measuring hole 611.
Meanwhile, although destination object 610 and pusher P are designed to depart from vertical line in Fig. 6, according to the type of the second detector 640 and position, destination object 610 and pusher P can be positioned on vertical line.
Control module 580 sequentially operates drive source 572 in two stages.First control module 580 in present embodiment operates drive source 572 so that matching disc 571 moves forward towards tester in the first stage, then confirm that the detection information transmitting from the second detector 640 is to confirm whether test pallet 510 moves forward towards tester, for example, if (movement of test pallet 510 do not detected, when light by detect hole or while detecting that destination object does not move), control module 580 again operates drive source 572 so that matching disc 571 is moved further the second spacing towards tester, thereby matching disc 571 electrically contacts towards tester push to test pallet 510 and the semiconductor device and the tester that make to be placed in the insert of test pallet 510.
The description > of < method
Flow chart below with reference to Fig. 7 A is described the method that operates above-mentioned Test handler 500.
1. load step <S710>
By load units 520, semiconductor device is loaded on the insert of the test pallet 510 that is positioned at " loaded " position LP place.
2. first be fed to step <S720>
By feed unit (not shown), the test pallet 510 that has loaded semiconductor device in step S710 is fed to the test position TP in test cabinet 540 via infusion chamber 530.Then, the test pallet 510 that is fed to test cabinet 540 from infusion chamber 530 is fed to along guide rail 550, and is supported by guide rail 550.
3. position probing step <S730>
If test pallet 510 is fed to test position TP, the first detector 560 just detects test pallet 510 and whether is positioned at desired position scope so.Here confirm by control module 580 information detecting.
4. tester contact procedure <S740>
If the test pallet 510 in confirmation definite test cabinet 540 is positioned at desired position scope, control module 580 operates drive source 572 so that matching disc 571 moves towards tester so, thus test pallet 510 is attached to tester so that the semiconductor device and the tester that are placed on the insert of test pallet 510 electrically contact.Step S740 relates to the present invention, and will be described in more detail.
A. first move forward step <S741>
As shown in the referential view of Fig. 8 A, control module 580 operates drive source 572 so that matching disc 571 moves forward the first spacing T towards tester
1.At this, the first spacing T
1for the end of the coupling pin 571a of matching disc 571 can insert in fact the distance in the coupling hole 511a of insert 511, and with reference to Fig. 8 b, the first spacing T
1even if be that coupling pin 571a can not be inserted in the coupling hole 511a of insert 511 and makes the distance of matching disc 571 towards tester push to test pallet 510 with the Surface Contact of insert 511, the insert 511 of test pallet 510 can not contact with the end of the slot pin SP of the test socket TS of tester side.But, as described in the background section, when for support mounting plate 52(Fig. 3) supporting rail (not shown) while being further arranged on matching disc 571, the guide rail 550 of the supporting rail push to test pallet 110 of configurable matching disc 571.In this case, the first spacing T
1need to be constrained to the short distance of distance guide rail 550 being promoted than the supporting rail of matching disc 571.This be because, if the distance that guide rail 550 moves is greater than the distance of supporting rail promotion guide rail 550, even if in the time that the coupling pin 571a of matching disc 571 inserts the coupling hole 511a of insert 511, supporting rail moves guide rail 550, can not realize the target of the measuring ability being described below so.
B. detecting step <S742>
Move forward the first spacing T at the matching disc 571 of Fig. 8 A or 8B
1state under the second detector 640 detect the movement of test pallet 510.At this, the movement of test pallet 510 is accompanied by the movement of the guide rail 550 that supports test pallet 510 and the movement of the destination object 610 associated with guide rail 550.Therefore,, by the movement of the second detector 640 detected target object 610, detect thus the movement of test pallet 510.Then, by the detection of confirming that light for example whether can performance objective object 610 by detection hole 611.
At this, determine the width that detects hole 611 according to the structure of equipment.This be because when the width that detects hole 611 too hour, even if also produce in the time that guide rail 550 moves to a certain degree the alarm being described below, but when detecting the width in hole 611 when too large, in fact test pallet 510 can not arrive the position of expectation, thereby even if in the time that guide rail 550 moves, also may not produce alarm.
In addition, in the time that whether such movement is as shown in Figure 6B confirmed according to destination object, consider actual aspect, assembling tolerance limit and issuable factor during operation, determine how the position of detector and the distance of destination object are set.
C. second move forward step <S743a>
If the movement of test pallet 510 do not detected in the state of Fig. 8 A in step S742, so again operate drive source 572 so that matching disc 571 further moves forward with reference to the second spacing T shown in Fig. 8 C towards tester
2thereby, matching disc 571 towards the complete push to test pallet 510 of tester so that the semiconductor device D and the tester that are placed on the insert 511 of test pallet 510 electrically contact.
At this, second move forward during the signal of the second detector 640 do not affect second and move forward.
D. alarm produces step <S743b>
If the movement of test pallet 510 detected in the state of Fig. 8 b in step S742, omit so the step corresponding with S743a and produce alarm.
If generation alarm, repairman analyzes the origin cause of formation of alarm and solves this origin cause of formation so, and then carries out the step that moves forward step S741 or first and be fed to step S720 since first.This can determine according to the step of again carrying out test after producing alarm based on the alarm origin cause of formation.And the origin cause of formation of alarm may be various, its detailed origin cause of formation is not discussed.(for example, abnormal, second detector of abnormal, first feed unit of the first detector abnormal etc.)
Simultaneously, in the time considering on the other hand step S740, step S741 and S742 can be constrained for a step, confirm the coupling hole 511a of insert 511 and the mutual alignment relation between pin 571a of mating of matching disc 571 of test pallet 510, and when coupling hole 511a with mate the mutual alignment relation of selling between 571a when correct, that is to say, when coupling pin 571a can insert coupling hole 511a, step S743a can be construed as attach step, with matching disc 571, test pallet 510 is attached to tester so that the semiconductor device D and the tester that are placed on the insert 511 of test pallet 510 electrically contact.
5. second be fed to step <S750>
If tester has completed the test to semiconductor device, by feed unit (not shown) by test pallet 510 via going infusion chamber 590 to be fed to unloading position UP.
6. unloading step <S760>
If test pallet 510 is positioned at unloading position UP, semiconductor device is offloaded to object pallet from the insert 511 of test pallet 510 so.
Meanwhile, tested and be released with the pressure of matching disc 571 push to test pallets 510 when tester, when test pallet 510 is back to the state of Fig. 8 A from the state of Fig. 6, guide rail 550 can return to home position smoothly by the restoring force of back-moving spring 630.
The description > of < embodiment
In the first embodiment, after the first feeder operation, detected the position of test pallet 510 by the first detector 560.But, in the second embodiment, after the first feeder operation, in the case of not needing to detect the position of the first detector 560, carry out first and move forward.This is because the first object moving forward is to check whether the first feeder operation is correctly carried out.Then,, in the second embodiment, with reference to Fig. 7 B, after first moves forward the detecting step S842 of step S841 and the second detector 640, detected the position of test pallet by the first detector 560.This allows to confirm again that position probing makes mistakes with the measuring ability that prevents the second detector 640.If measuring ability is no problem, consider reliability, the productivity ratio of equipment etc. of equipment, even if can determine that executing location detection does not need to determine that position probing also has no relations.
As discussed in embodiment, using time of the present invention, the position probing order of the first detector 560 can be according to user and difference, and the position of recognizing site detection can be according to the management of equipment and difference, and can not use the first detector.
In addition the application of the invention, the width of the position probing of correlation technique when the width of position probing can be greater than use location detection.That is to say, when after the first feeder operation in the first embodiment, executing location detects, be arranged on detection groove 111c-1 in test pallet 110 and the width of 111c-2 and be greater than existing width, can prevent because of the not error of the correct test pallet 110 detecting of too narrow and issuable the first detector 560 of its width.This is because the second detector 640 is confirmed whether to carry out the first feeder operation to arrive the additional functionality of the first exact position during moving forward.As a reference, according to correlation technique, detection width can non-constant width, because if detect the non-constant width of width of groove so that exceed the coupling pin 571a of matching disc 571 and when left/right range of tolerable variance that the coupling hole 511a of insert 511 is required, also can determine correct position.
According to the present invention, the first embodiment and the second embodiment are capable of being combined together to use.
According to the present invention, matching disc moves forward towards tester in two stages, test pallet mobile only do not detected during first moves forward time, carry out test, thereby can prevent from damaging test pallet (insert particularly) and improve testing reliability.
As mentioned above, although describe the present invention in detail with reference to embodiment and accompanying drawing, above-mentioned embodiment has only exemplarily illustrated the preferred embodiments of the present invention.Therefore, the invention is not restricted to these embodiments, scope of the present invention should be explained by claim and equivalency range thereof.
Claims (9)
1. the method for operational testing separator, comprising:
Load step, semiconductor device is loaded on the insert of the test pallet that is positioned at " loaded " position;
First is fed to step, and the described test pallet that has loaded described semiconductor device in described loading step is fed to test position;
Tester contact procedure, by using matching disc that the described test pallet that is fed to described test position is attached to described tester, thereby the described semiconductor device and the described tester that make to be loaded on described insert electrically contact;
Second is fed to step, if described tester has completed the test to described semiconductor device after described tester contact procedure, described test pallet is fed to unloading position; And
Unloading step, by described semiconductor device from be fed to the described insert unloading of described test pallet of described unloading position described second is fed to step,
Wherein, described tester contact procedure comprises:
First moves forward step, operates drive source and makes described matching disc move forward the first spacing towards described tester;
Detecting step, detects in the time that described matching disc moves forward the first spacing in described first moves forward step, and whether described test pallet moves towards described tester;
Second moves forward step, if the movement of described test pallet do not detected in described detecting step, again operate described drive source and make described matching disc move forward the second spacing towards described tester, thereby described matching disc promotes described test pallet so that described semiconductor device and described tester electrically contact towards described tester.
2. the method for claim 1, wherein described tester contact procedure also comprises that alarm produces step, if the movement of described test pallet detected in described detecting step, produces alarm.
3. whether the guide rail that is the method for claim 1, wherein used for supporting described test pallet by detection is moved to detect the movement of described test pallet in the time of the described test pallet of guiding mobile, thereby correctly carries out described detecting step.
4. method as claimed in claim 3, wherein, described detecting step detects the movement of described test pallet by detecting the movement of mobile destination object associated with described guide rail.
5. the method for operational testing separator, comprising:
Load step, semiconductor device is loaded on the insert of the test pallet that is positioned at " loaded " position;
First is fed to step, and the described test pallet that has loaded described semiconductor device in described loading step is fed to test position;
Tester contact procedure, by using matching disc that the described test pallet that is fed to described test position in described first is fed to step is attached to described tester, thereby the described semiconductor device and the tester that make to be loaded on described insert electrically contact;
Second is fed to step, if described tester has completed the test to described semiconductor device after described tester contact procedure, described test pallet is fed to unloading position;
Unloading step, by described semiconductor device from be fed to the described insert unloading of described test pallet of described unloading position described second is fed to step,
Wherein, described tester contact procedure comprises:
Identification step, is inserted into the mutual alignment relation between the described coupling pin that mates hole during identification is present in coupling hole in described test pallet and is arranged on described matching disc;
Attach step, when the described coupling hole in described identification step and describedly mate mutual alignment relation between pin when correct, by using described matching disc that described test pallet is attached to described tester, thereby the described semiconductor device and the described tester that make to be placed on the described insert of described test pallet electrically contact.
6. the method as described in claim 1 or 5, is fed between step and described tester contact procedure and also comprises location confirmation step described first, identifies described test pallet and whether is positioned at described test position.
7. Test handler, comprising:
Test pallet circulates, and has insert the predetermined circulating path that again extends to described " loaded " position from " loaded " position via test position and unloading position, on described insert, is mounted with semiconductor device;
Load units is loaded into described semiconductor device on the described insert of described test pallet in the time that described test pallet is positioned at described " loaded " position;
Infusion chamber, be set to when described load units complete load time preheat or the pre-cooled described insert being placed on described semiconductor device;
Test cabinet, makes to electrically contact with the tester that is docked to described test cabinet from the described semiconductor device of described infusion chamber;
Guide rail guides the movement of the described test pallet that is fed to described test cabinet simultaneously for supporting described test pallet;
Pushing unit, comprise matching disc and drive source, described matching disc is set to be attached to described tester by the described test pallet of described guide supporting so that the described semiconductor device and the described tester that are placed on described insert electrically contact, and described drive source provides described matching disc that described test pallet is attached to the required energy of described tester;
Whether detector, move forward to described tester by the operation of described drive source for detection of described test pallet;
Control module, be used for operating described drive source, so that described matching disc moves forward the first spacing towards described tester, and confirm according to the detection of described detector whether described test pallet moves, if the movement of described test pallet do not detected after confirming, so described control module operates described drive source again, make matching disc be moved further the second spacing towards described tester, to make described matching disc promote described test pallet so that the described semiconductor device on described insert and described tester electrically contact towards described tester;
Remove infusion chamber, for the described semiconductor device from described test cabinet is returned to room temperature; And
Unloading unit, for by from described semiconductor device unloading of removing the described test pallet that infusion chamber is fed to described unloading position.
8. Test handler as claimed in claim 7, also comprise destination object, described destination object is associatedly with described guide rail mobile, and described detector detects the movement of described destination object to detect the movement of described guide rail, and detects thus the movement of described test pallet.
9. Test handler as claimed in claim 8, also comprises support and elastic component, and described support is arranged on fixing metope, and one end of described elastic component is fixed to described support, and the other end of described elastic component is fixed to described destination object.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0125482 | 2011-11-29 | ||
| KR1020110125482A KR101664220B1 (en) | 2011-11-29 | 2011-11-29 | Test handler and method for operating the same |
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| Publication Number | Publication Date |
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| CN103128062A CN103128062A (en) | 2013-06-05 |
| CN103128062B true CN103128062B (en) | 2014-11-19 |
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| CN201210500338.4A Active CN103128062B (en) | 2011-11-29 | 2012-11-29 | Test handler and method for operating the same |
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| KR (1) | KR101664220B1 (en) |
| CN (1) | CN103128062B (en) |
| TW (2) | TWI491891B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106903066B (en) * | 2013-07-26 | 2019-06-21 | 泰克元有限公司 | The impeller component of matching disc for testing, sorting machine |
| KR102053081B1 (en) * | 2013-10-08 | 2019-12-06 | (주)테크윙 | Test handler |
| KR102053082B1 (en) * | 2014-02-17 | 2020-01-08 | (주)테크윙 | Handler for semiconductor device test and operating method thereof |
| KR102058443B1 (en) * | 2014-03-03 | 2020-02-07 | (주)테크윙 | Test handler and circulation method of test trays in test handler |
| KR102200697B1 (en) * | 2015-01-12 | 2021-01-12 | (주)테크윙 | Pushing apparatus for test handler |
| KR102341923B1 (en) * | 2015-02-17 | 2021-12-24 | (주)테크윙 | Test handler |
| KR102312490B1 (en) * | 2015-07-23 | 2021-10-15 | (주)테크윙 | Test handler |
| CN107464763A (en) * | 2016-06-03 | 2017-12-12 | 细美事有限公司 | For promoting the device of semiconductor packages |
| KR102664951B1 (en) * | 2016-09-09 | 2024-05-10 | (주)테크윙 | Handler for testing electronic devices |
| CN107807296B (en) * | 2016-09-09 | 2021-01-22 | 泰克元有限公司 | Sorting machine for testing electronic components |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101149415A (en) * | 2006-09-20 | 2008-03-26 | 未来产业株式会社 | Handler |
| CN201172044Y (en) * | 2008-03-04 | 2008-12-31 | 广东风华高新科技股份有限公司 | Test sorter |
| CN101470168A (en) * | 2007-12-28 | 2009-07-01 | 未来产业株式会社 | Test handler, method for loading and manufacturing packaged chips |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5290134A (en) * | 1991-12-03 | 1994-03-01 | Advantest Corporation | Pick and place for automatic test handler |
| TW446582B (en) * | 1997-05-13 | 2001-07-21 | You Hong Jun | Automatic multiple sorting apparatus for integrated circuit products |
| KR100395369B1 (en) * | 2001-10-23 | 2003-08-21 | 미래산업 주식회사 | Tray Inlet Apparatus in Handler for testing semiconductor |
| KR100802436B1 (en) * | 2006-01-16 | 2008-02-13 | 미래산업 주식회사 | Apparatus for contacting devices to test sockets in semiconductor test handler |
| KR100709114B1 (en) * | 2006-01-23 | 2007-04-18 | (주)테크윙 | Test handler |
| KR100687676B1 (en) * | 2006-02-10 | 2007-02-27 | (주)테크윙 | Test handler |
| KR100771475B1 (en) * | 2006-10-04 | 2007-10-30 | (주)테크윙 | Side-docking type test handler and apparatus for transferring test tray for the same |
| KR100894734B1 (en) * | 2007-04-18 | 2009-04-24 | 미래산업 주식회사 | A receiver of an electronic element and handler including the same |
| KR100899942B1 (en) * | 2007-05-31 | 2009-05-28 | 미래산업 주식회사 | Test Handler, Method of Manufacturing Semiconductor using the same, and Method of Trensfering Testtray |
| CN101430576B (en) * | 2007-11-05 | 2010-04-21 | 鸿富锦精密工业（深圳）有限公司 | Eye protection warning device and method |
| KR100950330B1 (en) * | 2008-06-10 | 2010-03-31 | (주)테크윙 | Test supporting method of test handler |
| KR101011688B1 (en) * | 2008-10-29 | 2011-01-31 | (주)테크윙 | Positioning apparatus for test tray of test handler |
| KR101505955B1 (en) * | 2009-11-17 | 2015-03-27 | (주)테크윙 | Opening apparatus for test handler |
-
2011
- 2011-11-29 KR KR1020110125482A patent/KR101664220B1/en active IP Right Grant
-
2012
- 2012-11-29 CN CN201210500338.4A patent/CN103128062B/en active Active
- 2012-11-29 TW TW101144859A patent/TWI491891B/en active
- 2012-11-29 TW TW103142096A patent/TWI554767B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101149415A (en) * | 2006-09-20 | 2008-03-26 | 未来产业株式会社 | Handler |
| CN101470168A (en) * | 2007-12-28 | 2009-07-01 | 未来产业株式会社 | Test handler, method for loading and manufacturing packaged chips |
| CN201172044Y (en) * | 2008-03-04 | 2008-12-31 | 广东风华高新科技股份有限公司 | Test sorter |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI491891B (en) | 2015-07-11 |
| KR101664220B1 (en) | 2016-10-11 |
| CN103128062A (en) | 2013-06-05 |
| TW201321772A (en) | 2013-06-01 |
| TW201510545A (en) | 2015-03-16 |
| TWI554767B (en) | 2016-10-21 |
| KR20130059485A (en) | 2013-06-07 |
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