KR102312490B1 - Test handler - Google Patents

Abstract

The present invention relates to a test handler supporting a test of a semiconductor device.
A test handler according to the present invention includes a test tray on which a semiconductor device can be mounted; a loading device for loading a semiconductor device onto the test tray; a pushing device for electrically connecting the semiconductor device to the tester by pushing the test tray and the semiconductor device on the test tray toward the tester; a support rail for supporting the test tray at the test position; a position compensator for correcting the position of the test tray supported by the support rail; a manipulator for manipulating the position compensator so that the position compensator can correct the position of the test tray; and an unloading device for unloading the semiconductor device from the test tray turned on from the test position to the unloading position. includes
According to the present invention, since the position of the test tray can be accurately corrected, the reliability of the operation can be improved, and damage to the semiconductor device or other components due to the bad operation can be prevented.

Description

test handler {TEST HANDLER}

The present invention relates to a test handler that supports testing of a semiconductor device by a tester.

The test handler is a device that supports semiconductor devices manufactured through a predetermined manufacturing process to be tested by a tester, classifies semiconductor devices according to test results, and loads them into customer trays.

1 is a conceptual plan view of a test handler 100 .

1 , the test handler 100 includes a test tray TT, a first hand 110 , a first chamber 120 , a test chamber 130 , a pushing device 140 , and a second chamber ( 150 ), and a second hand 160 .

In the test tray (TT), a plurality of inserts on which a semiconductor device can be seated are installed movably, as referenced in Korean Patent Application Laid-Open No. 10-2007-0088010, etc., and closed by a plurality of transfer devices (not shown). Cycle along path (C).

The first hand 110 loads semiconductor devices to be tested loaded on the customer tray CTn into the test tray TT at the first position P1. In this case, the first hand 110 functions as a loading device for loading semiconductor devices onto the test tray TT, and the first position P1 becomes a loading position.

The first chamber 120 is provided to preheat or precool the semiconductor devices loaded on the test tray TT transferred from the first position P1 according to the test environment condition.

The test chamber 130 is provided to test the semiconductor devices of the test tray TT that have been preheated or precooled in the first chamber 120 and then transferred to a test position (TP).

The pushing device 140 pushes the test tray TT at the test position TP in the test chamber 130 toward the tester TESTER coupled to the test chamber 130 and loads it into the insert of the test tray TT. The semiconductor devices are electrically connected to the test socket of the tester. As referenced in Korean Patent Laid-Open Publication No. 10-2013-0027664, the pushing device 140 includes a match plate 141 having a pusher for pressing a semiconductor device and a moving source that advances and retreats the match plate 141 toward the test tray TT. (142). In this configuration, the match plate 141 moves and matches with the test tray TT by the operation of the moving source 142 , and then the match plate 141 and the test tray TT move again, so that the test tray TT ) is electrically connected to the tester. At this time, the semiconductor element of the test tray TT is pressed toward the test socket by the pusher on the match plate 141 .

The second chamber 150 is provided to return the heated or cooled semiconductor devices loaded in the test tray TT transferred from the test chamber 130 to room temperature or close to room temperature.

The second hand 160 unloads the semiconductor devices loaded in the test tray TT on to the second position P2 by test grade and unloads them into the empty customer tray CTe. In this case, the second hand 160 functions as an unloading device for unloading semiconductor devices from the test tray TT, and the second position P2 becomes an unloading position.

In the test handler 100 having the above configuration, the test tray TT passes through the first position P1, the test position TP, and the second position P2, and then goes back to the first position P1 through a circulation path ( C) followed by circular movement.

And in the test handler newly proposed by the present applicant in recent years, the test tray TT may cyclically move in the reverse direction of the circulation path C according to the test mode. In this case, the roles of the first hand 110 and the second hand 160 , the first chamber 120 and the second chamber 150 are switched, and the second position P2 becomes the loading position and the first position (P1) becomes the unloading position.

Meanwhile, while the test tray TT is pushed toward the tester TESTER by the pushing device 140, in order to properly electrically connect the semiconductor element of the test tray TT and the test socket of the tester TESTER, the test tray ( TT) must be located exactly at the test position (TP). However, there are cases in which the test tray TT cannot be accurately positioned at the test position TP due to mechanical tolerances of the transfer device, wear due to continuous use, or operating shock. As such, when the position of the test tray TT is poor, mismatching between the match plate and the test tray TT and contact failure between the semiconductor device and the test socket may occur during the operation of the pushing device 140 pushing the test tray TT. Occurs. Accordingly, various components (inserts or test sockets or components constituting the inserts or test sockets, etc.) of the test handler 100 and the tester as well as the semiconductor device may be damaged.

Of course, there is a technology that detects whether the test tray (TT) is properly positioned at the test position (TP) by detecting the position of the test tray (TT) through the sensor, but the accuracy of the sensor is poor or the sensor malfunctions. In this case, it is exposed to the above-mentioned problems due to poor positioning. Therefore, in order to solve or prevent the problem of poor positioning of the test tray in terms of mechanism and control, techniques such as Korean Patent Application Laid-Open No. 10-2013-0074874 or Korean Patent Application Laid-Open No. 10-2013-059485 have been proposed. And the present invention was derived to further develop a technique for solving and coping with such a problem in the position of the test tray.

It is an object of the present invention to provide a technique capable of correcting the position of the test tray and accurately detecting the suitability of the position of the test tray.

The test handler according to the first aspect of the present invention for achieving the above object circulates a certain cyclic path leading to the loading position through a loading position, a test position, and an unloading position, and , a test tray on which a semiconductor device can be mounted; a loading device for loading a semiconductor device into the test tray when the test tray is in the loading position; a pushing device for electrically connecting the semiconductor device to the tester by pushing the test tray and the semiconductor device in the test tray to the tester side to the tester after the loading of the semiconductor device by the loading device is completed; a support rail for supporting the test tray at the test position; a position compensator for correcting the position of the test tray supported by the support rail; a manipulator for manipulating the position compensator so that the position compensator can correct the position of the test tray; and an unloading device for unloading the semiconductor device from the test tray brought to the unloading position from the test position after the test of the loaded semiconductor device is completed. wherein the pushing device comprises: a match plate matching the test tray and having a pusher for pressing the semiconductor device in the test tray toward the test socket side of the tester; and a moving source for advancing or retracting the match plate toward the test tray. includes

The position compensator moves with the movement of the test tray supported on the support rail by being installed on the support rail.

The test tray has a correction groove necessary for correcting the position of the test tray, and the position corrector includes: a pressing member pressed by the manipulator; a correction pin for correcting the position of the test tray by being inserted into the correction groove when the pressing member is operated by the manipulator; a first spring elastically supporting between the pressing member and the compensating pin; and a second spring for applying an elastic force to the compensating pin toward the pressing member. includes

The first spring has a greater elastic modulus than the second spring.

a detector capable of detecting whether a position of the test tray is defective by detecting whether the correction pin is moved; further includes

The position compensator is installed on the support rail and moves together with the movement of the test tray supported on the support rail, the test tray has a correction groove required to correct the position of the test tray, and the position compensator , a pressing member pressed by the manipulator; a correction pin for correcting the position of the test tray by being inserted into the correction groove when the pressing member is operated by the manipulator; a first spring elastically supporting between the pressing member and the compensating pin; and a second spring for applying an elastic force to the compensating pin toward the pressing member. Including, in the manipulator, when the position compensator moves together with the test tray, the face toward the pressing member is inclined so that the pressing member can be gradually pressed deeper according to the movement of the position compensator.

The correction groove is opened in a direction perpendicular to the direction in which the test tray moves by the pressing of the pushing device, and the test tray is moved by the pressing of the pushing device so that the correction pin can be inserted into the correction groove. It can advance and retreat in a direction perpendicular to the direction of movement.

The position compensator has a correction pin for correcting the position of the test tray while advancing and retreating in a direction perpendicular to the moving direction of the test tray by the pushing device, and the test tray has a correction groove into which the correction pin can be inserted. have

According to the present invention as described above, since the position of the test tray can be accurately corrected, the reliability of the operation can be improved, and there is a further enhanced effect of preventing damage to the semiconductor device or other parts due to the malfunctioning operation.

1 is a conceptual plan view of a general test handler.
2 is a schematic diagram of a test tray applied to a test handler according to the present invention.
3 is a schematic side cross-sectional view of a main part of a test handler according to the present invention.
FIG. 4 is a cross-sectional view of the position compensator of FIG. 3 .
FIG. 5 shows the state before the position compensator comes into contact with the manipulator as the match plate and the test tray meet as the pushing unit operates in the main part of FIG. 3 .
6 shows a state in which the pressing member is pressed by the inclined surface of the manipulator while the position compensator moves in the main portion of FIG. 3 .
7 shows a state in which the positions of the test trays are aligned by the position compensator.
8 shows a state in which the test tray and the tester are matched.
9 shows a state in which the correction pin of the position compensator and the correction groove of the test tray are largely displaced.
FIG. 10 shows an operating state of the position compensator in the state of FIG. 9 .

Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings, but overlapping descriptions will be omitted or compressed as much as possible for the sake of brevity of description.

The test handler according to the present invention includes a test tray (TT), a first hand 110 , a first chamber 120 , a test chamber 130 , a pushing device 140 , and a second chamber 150 as shown in FIG. 1 . , the second hand 160 has both. Therefore, in relation to the test tray (TT), the first hand 110, the first chamber 120, the test chamber 130, the pushing device 140, the second chamber 150, the second hand 160 is already Description of the previously described matters will be omitted.

In the present invention, as shown in FIG. 2 , a correction groove CS for correcting the position of the test tray TT is formed in the test tray TT. The correction groove CS is formed to be opened in a direction (refer to arrow b) perpendicular to the moving direction (refer to arrow a) of the test tray TT by the operation of the pushing device. The correction groove CS has a shape in which the upper portion thereof is widened in all directions, so that matching with the correction pin to be described later can be properly induced.

3 is a schematic side cross-sectional view of a main part of a test handler according to the present invention.

Referring to FIG. 3 , the test handler according to the present invention includes support rails 211 and 212 , a position corrector 220 , a manipulator 230 , a detector 240 , and a controller 250 .

The support rails 211 and 212 are configured in a general test handler, and support the test tray TT at the test position TP or guide the movement of the test tray TT moving in the circulation direction. To this end, the support rail has support grooves 211a and 212a for supporting or guiding the test tray TT. In addition, the support rails 211 and 212 are provided to be movable in the tester (TERSTER) side direction together with the test tray (TT) when the pushing device 140 pushes the test tray (TT) in the tester (TESTER) side direction.

The position corrector 220 is provided to correct the position of the test tray TT, and is installed on one side of the support rail 211 . Accordingly, the position corrector 220 moves together with the movement of the support rail 211 . As shown in FIG. 4 , the position compensator 220 includes a pressing member 221 , a correction pin 222 , a first spring 223 , a second spring 224 , a housing 225 and a sensing target 226 . includes

The pressing member 221 is pressed by the manipulator 230 and is provided to advance and retreat in a direction perpendicular to the moving direction of the test tray TT, which moves according to the operation of the pushing device 140 . The upper end of the pressing member 221 has a round shape in consideration of the contact with the manipulator 230 . Of course, furthermore, to reduce frictional contact with the manipulator 230 , it may be freely considered to provide a roller or a ball bearing on the upper end of the pressing member 221 .

The correction pin 222 corrects the position of the test tray TT while moving toward the test tray TT when the pressing member 221 is manipulated to be pressed by the manipulator 230 . To this end, the correction groove CS of the test tray TT is formed in a portion supported by the support rail 211 and is opened toward the correction pin 222 . The correction pin 222 has a shape in which the tip 222a of the portion inserted into the correction groove CS is gradually wider in diameter so as to perform a function for correcting the position of the test tray TT. have And when the test tray TT is moved by the operation of the pushing unit 140, the correction pin 222 can advance and retreat in a direction perpendicular to the moving direction (refer to arrow a) of the test tray TT (refer to arrow b). arranged to do Therefore, even if the position of the test tray TT is slightly shifted from the position, the position of the test tray TT can be accurately corrected while the correction pin 222 is inserted into the correction groove CS when the test tray TT is moved. have.

The first spring 223 elastically supports between the pressing member 221 and the correction pin 222 . Accordingly, one side of the pressing member 221 protrudes in the direction toward the manipulator 230 , and the other side of the correction pin 222 protrudes in the direction toward the test tray TT.

The second spring 224 is provided to apply an elastic force to the correction pin 222 in a direction toward the pressing member 221 .

For reference, the first spring 223 has a greater elastic modulus than the second spring 224 .

The housing 225 accommodates the first spring 223 and the second spring 224 , and a long hole LH having a long shape in the direction in which the correction pin 222 advances and retreats is formed on the side thereof.

One end of the sensing object 226 is coupled to the correction pin 222 , and the other end is installed to protrude to the outside of the housing 225 through the long hole LH. Accordingly, the sensing object 226 advances and retreats together while interlocking with the advance and retreat of the correction pin 222 .

For reference, in the present embodiment, it is expressed that only one correction groove CS is formed in the test tray TT, but a plurality of correction grooves may be formed depending on implementation. If a plurality of correction grooves are formed in the test tray, it is preferable that a plurality of position compensators are provided.

In addition, in the present invention, the correction groove CS is formed to open upwardly at the upper end of the test tray TT, but depending on implementation, the correction groove may be formed to open downwardly at the lower end of the test tray TT. have. This is because, when the test of the semiconductor devices is performed in a state in which the test tray TT is arranged in two upper and lower stages, a position compensator must be provided on the support rail that supports the lower end in the case of the test tray TT at the lower end. Of course, since the arbitrary test tray TT may be disposed on either the upper or lower side, it may be more preferable to form the correction groove at both the upper end and the lower end of the test tray TT.

The manipulator 230 is provided to manipulate the position corrector 220 so that the position corrector 220 can correct the position of the test tray TT. Such a manipulator 230 allows the position compensator 220 to gradually press the pressing member 221 deeper according to the movement of the position compensator 220 when the position compensator 220 moves together with the support rail 211 and the test tray TT. The surface facing the pressing member 221 is inclined. That is, the manipulator 230 in the present invention does not actively manipulate the position compensator 220, but passively presses the pressing member 221 depending on the movement of the position compensator 220 to control the position compensator 220. It is provided with a cam member that can be manipulated. In addition, in order to perform such a function, the manipulator 230 is fixedly installed unlike the position compensator 220 that moves together with the test tray TT. And a horizontal plane continues to the rear of the inclined plane of the manipulator 230 . In this embodiment, since the position compensator 220 is on the upper side of the test tray TT, it is expressed that the manipulator is provided above the position compensator 220, but as described above, the position compensator is provided on the lower side of the test tray. In this case, the manipulator should be provided below the position compensator.

The detector 240 is provided to detect whether the position of the test tray TT is defective by detecting whether the correction pin 222 is moved. In the present invention, the detector 240 detects whether the correction pin 222 is moved in an indirect manner. That is, the sensor 240 detects the movement of the correction pin 222 by detecting the sensing target 226 moving together with the correction pin 222 . However, depending on the implementation, any sensing method such as a method using a limit switch can be adopted as long as it can detect the movement of the correction pin 222 .

The controller 250 continuously operates the test handler based on the information detected by the detector 240 if the position of the test tray TT is good, and generates a jam if the position of the test tray TT is bad. make it

Next, the operation of the main part of the test handler according to the present invention will be described, but for clarity of explanation, an example of a state in which the test tray TT is vertical in the vertical direction will be described.

<Example of good operation>

When the test tray TT is positioned at the test position TP, as shown in FIG. 5 , the pushing unit 140 operates to start the first pressing step, so that the match plate 141 and the test tray TT meet. , the match plate 141 pushes the test tray TT rearward by the first pressing step of the pushing unit, and the test tray TT is pushed toward the tester TESTER.

Therefore, from the state of FIG. 5, the test tray TT, the support rail 211, and the position compensator 220 are moved to the rear in the direction of the tester (TESTER) side, and after moving by a predetermined moving distance, the first pressing step is performed. It ends. When the operation of the pushing unit 140 is stopped by the end of the first pressing step, the movement of the match plate 141 is also stopped. At this time, as the position compensator 220 moves backward by the first pressing step, the pressing member 221 moves along the inclined surface SS of the manipulator 230 as shown in FIG. 6, so the pressing member 221 is subjected to a downward force. Accordingly, the pressing member 221 and the first spring 223 move in the downward direction, and accordingly, the second spring 224, which has a smaller elastic modulus than the first spring 223 and is blocked from descent at the lower end, is compressed and corrected. The pin 222 is moved downward. At this time, the first spring 223 moves downward in an uncompressed state because the elastic modulus is greater than that of the second spring 224 . Then, even when the test tray TT is slightly deviated from the original position as in FIG. 7A , the correction pin 222 descends while correcting the position of the test tray TT and inserted into the correction groove CS. As a result, the position of the test tray TT is corrected to the correct position as shown in FIG. 7(b). At this time, the detector 240 detects the descent of the sensing object 226 descending together with the correction pin 222 , and the controller 250 allows the correction pin 222 to properly descend through the descent of the sensing object 226 . control to perform the second pressurization step. Therefore, the pushing unit 140 is re-operated following the state of FIG. 6 and the second pressing step is executed, so that the test tray TT and the tester TESTER are matched as shown in FIG. 8 . In the state of FIG. 8 , the semiconductor devices loaded on the test tray TT are tested. That is, in the state (b) of FIG. 7 , the match plate 141 and the test tray TT can be matched.

On the other hand, when the test is completed, the match plate 141 , the test tray TT, the support rail 211 , and the position corrector 220 move backward together by the reverse operation of the pushing device 140 . Accordingly, as the pressing force applied to the pressing member 221 of the position compensator 220 by the manipulator 230 is released, the correction pin 222, the first spring 223 and The pressing member 221 moves upward and returns to its original state.

<Example of jam occurrence>

As shown in FIG. 5 , when the match plate 141 and the test tray TT meet as the pushing unit 140 operates and the first pressing step is started, the match plate 141 pushes the test tray TT backward to perform the test. The tray TT is pushed toward the tester side.

Accordingly, the test tray TT, the support rail 211 and the position compensator 220 are moved to the rear in the direction toward the tester TESTER. At this time, since the pressing member 221 moves along the inclined surface SS of the manipulator 230 as shown in FIG. 6 while the position compensator 220 moves backward, the pressing member receives a downward pressing force. . However, as shown in FIG. 9 , when the degree of deviation of the test tray TT from the original position is large and the correction pin 222 and the correction groove CS are greatly displaced, the lower end of the correction pin 222 is separated from the test tray TT. In the state of being met, descent can no longer be made. Therefore, as shown in FIG. 10, the pressing member 221 is moved downward by the inclined surface SS of the manipulator 230, but at this time, only the first spring 223 is compressed, and the correction pin 222 is placed on the test tray ( TT) It is blocked by the upper surface of the upper part and cannot descend. Accordingly, the sensing target 226 cannot descend either, and the sensor 240 detects this. Accordingly, the controller 250 detects that the correction pin 222 has not been lowered and generates a jam instead of executing the second pressing step.

For reference, in FIG. 9 , when the lower end of the correction pin 222 comes into contact with the upper end of the test tray TT, the degree of descent of the correction pin 222 is exaggerated for a clear understanding. However, in reality, in a state in which the pressing force by the manipulator 230 is not applied to the pressing member 221 , the lower end of the correction pin 222 is only slightly spaced apart so as not to interfere with the left and right movement of the test tray TT. am. Therefore, in reality, even in the state of FIG. 9 , the degree of descent of the correction pin 222 is quite minute, and the deviation of the sensing target 226 corresponding to the sensor 240 is also very minute. The retardation 226 can be sufficiently detected.

On the other hand, when the present invention is viewed from another point of view, the position corrector 220 functions as a position selector for selecting the suitability for the position of the test tray TT supported by the support rail 211. can be known That is, the position compensator 220 is to be able to select whether the position of the test tray TT is appropriate or bad depending on the case where the correction pin 222 moves and the case where it does not move. Of course, the detector 240 ultimately detects whether the position of the test tray TT is defective by detecting whether the correction pin 222 is moved. In view of this function, the function of the manipulator 230 may be interpreted as operating the position selector so that the position selector can select the suitability for the position of the test tray TT. At this time, the correction pin 222 functions as a selection pin for selecting the suitability for the position of the test tray TT, and the correction groove CS of the test tray TT also functions as a selection groove into which the selection pin is inserted. do.

<References>

1. In general, for proper insertion and guidance of the test tray TT, the width of the support grooves 211a and 212a in the front-rear direction is slightly wider than the width in the front-rear direction of the test tray TT. In this case, the test tray TT can be supported by the support rails 211 and 212 in a state where the upper and lower ends do not match (slightly inclined state) or the left and right ends are slightly rotated with respect to the vertical line. .

However, in the present embodiment, since only one position corrector 220 has been described as an example, the position corrector 220 may be misunderstood as aligning only the left and right positions of the test tray TT. However, even when the test tray TT is in a position where the upper and lower ends do not match on a vertical line, the correction pin 222 is inserted into the correction groove CS to correctly align the upper and lower ends of the test tray TT. . In addition, as described above, when a plurality (two or more) of the position compensator 220 is provided side by side, the slightly rotated state of the test tray TT may also be correctly aligned, and more accurate identification and alignment of the positional defect state this could be possible

On the other hand, referring to the background art of Korean Patent Laid-Open No. 10-2012-0095736, there is proposed a technique for testing a semiconductor device on a single test tray while dividing it into two or more steps and moving it step-by-step, without testing the semiconductor device at once. In this case, the position of the test tray in the left and right direction is changed step by step. Therefore, in consideration of the case in which the loaded semiconductor devices are divided and tested in two or more stages, it is necessary to provide a plurality of correction grooves (or selection grooves) and correction pins (or selection pins) for correcting the position of the test tray at each stage. there is also

2. In addition, if the position compensator is provided on the lower side of the test tray, the test tray supported by the lower support rail can be lifted upward when the correction pin rises. Therefore, in this case, it may be preferable to provide a pressing member for pressing the test tray downward on the upper support rail. Here, the pressing member may include a spring and a roller receiving an elastic force downward by the spring.

3. In the above embodiment, the exaggeration of operation in the vertical test handler in which the test is performed in a state in which the test tray TT is vertical is described as an example. However, the present invention is naturally applicable to a horizontal test handler in which the test is performed in a state where the test tray TT is horizontal. Of course, the direction indication in each figure will be appropriately modified in the case of a horizontal test handler.

4. In the present embodiment, only one detector 240 is configured to detect the object 226, however, depending on the implementation, two detectors are configured so that the movement start position of the object 226 and good operation are determined. It may also be considered to detect the movement state of the correction pin 222 by detecting each movement end position referenced in the example.

5. Of course, sensing technology (hereinafter referred to as 'known technology') through a sensor presented in Korean Patent Application Laid-Open No. 10-2013-0074874 or Korean Patent Publication No. 10-2013-059485, etc. introduced in the background and a position corrector according to the present invention Alignment and detection technology through (position selector) may be applied together to the test handler, and only the alignment and detection technology through the position corrector (position selector) according to the present invention, except for known techniques, may be applied to the test handler.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have only been described with preferred examples of the present invention, the present invention is limited only to the above embodiments It should not be understood as being, and the scope of the present invention should be understood as the following claims and their equivalent concepts.

100: test handler
TT : test tray
CS : correction groove
110: first hand
140: pushing device
141: match plate 142: Lee Dong-won
160: second hand
211, 212: support rail
220: position corrector
221: pressing member 222: correction pin
223: first spring 224: second spring
230: manipulator
240: Detector
250: controller

Claims (8)

a test tray on which a semiconductor device can be seated, circulating a constant circulation path that goes through a loading position, a test position, and an unloading position and leads back to the loading position;
a loading device for loading a semiconductor device into the test tray when the test tray is in the loading position;
a pushing device for electrically connecting the semiconductor device to the tester by pushing the test tray and the semiconductor device in the test tray to the tester side to the tester after the loading of the semiconductor device by the loading device is completed;
a support rail for supporting the test tray at the test position;
a position compensator for correcting the position of the test tray supported by the support rail;
a manipulator for manipulating the position compensator so that the position compensator can correct the position of the test tray; and
an unloading device for unloading the semiconductor device from the test tray brought to the unloading position from the test position after the test of the loaded semiconductor device is completed; including,
The pushing device,
a match plate matching the test tray and having a pusher for pressing the semiconductor device in the test tray toward the test socket side of the tester; and
a moving source for advancing or retracting the match plate toward the test tray; characterized by comprising
test handler. According to claim 1,
The position compensator is installed on the support rail, characterized in that it moves together with the movement of the test tray supported on the support rail.
test handler. According to claim 1,
The test tray has a correction groove necessary to correct the position of the test tray,
The position corrector,
a pressing member pressed by the manipulator;
a correction pin for correcting the position of the test tray by being inserted into the correction groove when the pressing member is operated by the manipulator;
a first spring elastically supporting between the pressing member and the compensating pin; and
a second spring for applying an elastic force to the compensating pin toward the pressing member; characterized by comprising
test handler. 4. The method of claim 3,
The first spring is characterized in that the elastic modulus is greater than that of the second spring
test handler. 4. The method of claim 3,
a detector capable of detecting whether a position of the test tray is defective by detecting whether the correction pin is moved; characterized in that it further comprises
test handler. According to claim 1,
The position compensator moves with the movement of the test tray supported on the support rail by being installed on the support rail, and the test tray has a correction groove necessary to correct the position of the test tray,
The position corrector,
a pressing member pressed by the manipulator;
a correction pin for correcting the position of the test tray by being inserted into the correction groove when the pressing member is operated by the manipulator;
a first spring elastically supporting between the pressing member and the compensating pin; and
a second spring for applying an elastic force to the compensating pin toward the pressing member; including,
The manipulator is characterized in that when the position compensator moves together with the test tray, the surface facing the pressing member is inclined so that the pressing member can be gradually pressed deeper according to the movement of the position compensator.
test handler. 7. The method of claim 3 or 6,
The correction groove is opened in a direction perpendicular to the direction in which the test tray moves by the pressing of the pushing device,
The correction pin may be moved forward and backward in a direction perpendicular to the direction in which the test tray moves by pressing the pushing device so that it can be inserted into the correction groove.
test handler. According to claim 1,
The position compensator has a correction pin for correcting the position of the test tray while advancing and retreating in a direction perpendicular to the moving direction of the test tray by the pushing device;
The test tray is characterized in that it has a correction groove into which the correction pin can be inserted.
test handler.

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