CN103107132A - 用于制造平板显示器的设备 - Google Patents

用于制造平板显示器的设备 Download PDF

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Publication number
CN103107132A
CN103107132A CN2012104482447A CN201210448244A CN103107132A CN 103107132 A CN103107132 A CN 103107132A CN 2012104482447 A CN2012104482447 A CN 2012104482447A CN 201210448244 A CN201210448244 A CN 201210448244A CN 103107132 A CN103107132 A CN 103107132A
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CN
China
Prior art keywords
substrate
area
chamber
transfer
process chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012104482447A
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English (en)
Chinese (zh)
Inventor
李亨培
赵晃新
安祐正
宋基哲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SNU Precision Co Ltd
Original Assignee
SNU Precision Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SNU Precision Co Ltd filed Critical SNU Precision Co Ltd
Publication of CN103107132A publication Critical patent/CN103107132A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Robotics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
CN2012104482447A 2011-11-11 2012-11-09 用于制造平板显示器的设备 Pending CN103107132A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110117311A KR101293024B1 (ko) 2011-11-11 2011-11-11 평판패널 제조장치
KR10-2011-0117311 2011-11-11

Publications (1)

Publication Number Publication Date
CN103107132A true CN103107132A (zh) 2013-05-15

Family

ID=48314884

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012104482447A Pending CN103107132A (zh) 2011-11-11 2012-11-09 用于制造平板显示器的设备

Country Status (4)

Country Link
JP (1) JP2013104131A (ja)
KR (1) KR101293024B1 (ja)
CN (1) CN103107132A (ja)
TW (1) TW201318942A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103789732A (zh) * 2014-02-13 2014-05-14 上海和辉光电有限公司 蒸镀机以及蒸镀方法
CN111041424A (zh) * 2018-10-15 2020-04-21 佳能特机株式会社 成膜装置及方法、有机el面板的制造系统以及制造方法
CN112623700A (zh) * 2020-12-04 2021-04-09 深圳市韩安特科技有限公司 显示屏维修设备

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102150452B1 (ko) * 2014-03-31 2020-09-01 주식회사 선익시스템 클러스터형 증착장치
JP2016117915A (ja) * 2014-12-18 2016-06-30 キヤノントッキ株式会社 蒸着装置並びに蒸着方法
TWI643799B (zh) * 2017-12-01 2018-12-11 瑩耀科技股份有限公司 半導體輸送系統
CN113493097B (zh) * 2021-08-06 2023-05-02 超捷半导体设备(深圳)有限公司 基材的上下料装置及上料方法、下料方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1357910A (zh) * 2000-12-11 2002-07-10 矽品精密工业股份有限公司 可防止溢胶的基板式半导体装置封装方法
KR100493644B1 (ko) * 1996-09-11 2005-09-15 가부시끼가이샤 히다치 세이사꾸쇼 진공처리장치의운전방법
CN101667630A (zh) * 2008-09-04 2010-03-10 株式会社日立高新技术 有机el设备制造装置和其制造方法以及成膜装置和成膜方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4538650B2 (ja) * 2004-06-18 2010-09-08 京セラ株式会社 蒸着装置
KR100960768B1 (ko) * 2005-06-10 2010-06-01 어플라이드 머티어리얼스, 인코포레이티드 선형 진공 증착 시스템
WO2009109464A1 (en) * 2008-03-05 2009-09-11 Applied Materials Inc. Coating apparatus with rotation module
TW201408133A (zh) * 2008-09-04 2014-02-16 Hitachi High Tech Corp 有機電激發光裝置製造裝置及其製造方法以及成膜裝置及成膜方法
KR100980706B1 (ko) * 2008-09-19 2010-09-08 세메스 주식회사 기판 이송 장치, 이를 갖는 기판 처리 장치 및 이의 기판 이송 방법
JP5260212B2 (ja) * 2008-09-25 2013-08-14 株式会社日立ハイテクノロジーズ 成膜装置
JP5694679B2 (ja) * 2009-05-04 2015-04-01 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 有機物蒸着装置及び蒸着方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100493644B1 (ko) * 1996-09-11 2005-09-15 가부시끼가이샤 히다치 세이사꾸쇼 진공처리장치의운전방법
CN1357910A (zh) * 2000-12-11 2002-07-10 矽品精密工业股份有限公司 可防止溢胶的基板式半导体装置封装方法
CN101667630A (zh) * 2008-09-04 2010-03-10 株式会社日立高新技术 有机el设备制造装置和其制造方法以及成膜装置和成膜方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103789732A (zh) * 2014-02-13 2014-05-14 上海和辉光电有限公司 蒸镀机以及蒸镀方法
CN111041424A (zh) * 2018-10-15 2020-04-21 佳能特机株式会社 成膜装置及方法、有机el面板的制造系统以及制造方法
CN112623700A (zh) * 2020-12-04 2021-04-09 深圳市韩安特科技有限公司 显示屏维修设备

Also Published As

Publication number Publication date
KR101293024B1 (ko) 2013-08-05
TW201318942A (zh) 2013-05-16
KR20130052084A (ko) 2013-05-22
JP2013104131A (ja) 2013-05-30

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Application publication date: 20130515