CN103107132A - Apparatus for manufacturing flat panel display - Google Patents
Apparatus for manufacturing flat panel display Download PDFInfo
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- CN103107132A CN103107132A CN2012104482447A CN201210448244A CN103107132A CN 103107132 A CN103107132 A CN 103107132A CN 2012104482447 A CN2012104482447 A CN 2012104482447A CN 201210448244 A CN201210448244 A CN 201210448244A CN 103107132 A CN103107132 A CN 103107132A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 184
- 230000033001 locomotion Effects 0.000 claims abstract description 29
- 238000000034 method Methods 0.000 claims description 162
- 230000032258 transport Effects 0.000 claims description 30
- 238000001704 evaporation Methods 0.000 claims description 6
- 230000008020 evaporation Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000007789 gas Substances 0.000 description 11
- 238000000151 deposition Methods 0.000 description 7
- 238000005137 deposition process Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 2
- 206010013786 Dry skin Diseases 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/54—Apparatus specially adapted for continuous coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Robotics (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses an apparatus for manufacturing a flat panel display. The apparatus comprises a plurality of processing chambers, transfer chambers, loading chambers, and unloading chambers. Internal spaces are formed in the plurality of processing chambers, at least two substrates are processed in the internal space. The transfer chambers are arranged among the plurality of processing chambers along a first direction, and the transfer chamber comprises a transfer robot, the transfer robot supplies an unprocessed substrate to the processing chamber in linear reciprocating motion along a second direction perpendicular to the first direction or transporting from the processing chamber a processed substrate. The loading chambers are connected to one side of the transfer chambers and accommodate the substrate to be supplied to the transfer chambers. The unloading chambers are connected to the other sides of the transfer chambers and accommodate the substrate transported from the transfer chambers. The transfer robots control the substrates to be sequentially supplied to the processing chambers or transported from the processing chambers in linear reciprocating motion along the second direction.
Description
Technical field
The present invention relates to a kind of equipment for the manufacture of flat-panel monitor, and more particularly, relate to a kind of organic film and can be deposited on for the equipment for the manufacture of flat-panel monitor on the flat board of organic light emitting display.
Background technology
In the technique of making flat-panel monitor (FPD), repeatedly repeat such as the processing substrate technique that is used for the depositing technics of deposition film on substrate; Photoetching process; Etch process; For cleaning procedures such as the washing of removing the residue that produces in described technique, dryings; Various process of surface treatment; Etc..Each technique is carried out in process chamber (process chamber, PM).
This process chamber consists of troop (cluster) together with the transfer chamber.In generally trooping, a plurality of process chambers are connected to a transfer chamber.In other words, this is trooped and generally includes: process chamber, carry out processing substrate technique in this process chamber; And the transfer chamber, the substrate of having processed from the process chamber transmission by this transfer chamber.
Simultaneously, have a kind of flat board for organic light emitting display (organic light emitting display, OLED) device, this flat board is as wherein a kind of flat board that can manufacture routine with aforementioned structure and troop.Organic light emitting display is to use the self-emitting display of following principle: when electric current flows in fluorescence or phosphorescence organic film, in electronics and hole in organic layer in conjunction with the time emit beam.Along with the wide-scale distribution of nearest smart phone, be used for increasing with the use of the flat board of the organic light emitting display of low-power operation.Therefore, improve the increase in demand of the productivity ratio of the flat board that is used for organic light emitting display.
When make being used for organic light emitting display dull and stereotyped, the depositing technics of deposit organic film is necessary on substrate.For carrying out depositing technics, must carry out in advance substrate and be delivered to the technique in process chamber, technique that mask aligns with substrate etc.Yet conventional manufacturing equipment can not carry out this depositing technics when transferring substrates and alignment mask.In other words, because depositing technics carries out respectively with the technique of transferring substrates and the technique of the mask that aligns, there is the problem of whole process time increase.
Summary of the invention
Therefore, the present invention is used for solving foregoing problems, and an aspect of of the present present invention provides a kind of equipment for the manufacture of flat-panel monitor, one of them process chamber holds two substrates, therefore a substrate is passed and aligns when another substrate carries out depositing technics, thereby is minimized in the overall process time of deposit organic film on substrate.
According to an aspect of the present invention, provide a kind of equipment for the manufacture of flat-panel monitor, this equipment comprises: a plurality of process chambers that are formed with the inner space, process at least two substrates in described inner space; The transfer chamber, this transfer chamber is arranged between described a plurality of process chamber along first direction, and described transfer chamber comprises transfer robot, and this transfer robot is being supplied with untreated substrate described process chamber or transporting the substrate of having processed from described process chamber along perpendicular to the second direction straight reciprocating motion of described first direction the time; Load the chamber, this loading chamber is connected to a side of described transfer chamber and holds the substrate that will supply with described transfer chamber; And relief chamber, this relief chamber is connected to the opposite side of described transfer chamber and holds the substrate that transports from described transfer chamber, described transfer robot is controlled described substrate and is sequentially supplied with described process chamber or transport from described process chamber along described second direction straight reciprocating motion the time, and in described process chamber, a substrate is subject to processing the deposit of gas, and is passed and another substrate that aligns along described second direction simultaneously.
Process chamber can comprise: body member, and this body member has the inner space, and this inner space comprises the second area of first area and contiguous described first area, and described body member opens to be communicated with described transfer chamber in a side; Support unit, this support unit are arranged on respectively in described first area and described second area, are delivered to the substrate of described body member to support and to align; Deposit source, this deposit source are arranged in the inner space of described body member and will process gas and be ejected on substrate; Driver element, the described deposit of this drive unit drives source is along described second direction straight reciprocating motion; And controller, this controller is controlled described driver element, to drive the reciprocating motion between described first area and described second area of described deposit source.
described controller can be controlled described driver element, process the technique of a substrate and process the technique of another substrate along described second direction in described second area when described second area moves described deposit source and returns to described initial position when the initial position along described second direction from described first area moves described deposit source in described first area with repetition, and after the substrate of the substrate of described first area and described second area is all processed, described transfer robot can transport the substrate of having processed from described first area and described second area, and new substrate is supplied with described first area and described second area.
described controller can be controlled described driver element, with the technique that repeats substrate in described first area is processed in described deposit source when described second direction sequentially moves to described first area and described second area and the substrate in described second area and the substrate in described second area is processed in described deposit source when described second direction sequentially moves to described second area and described first area and the technique of the substrate in described first area, and after the substrate in processing described first area and during the substrate in processing described second area, described transfer robot can transport from described first area the substrate of having processed and new substrate is supplied with described first area, then after the substrate in processing described second area and during the substrate in processing described first area, described transfer robot can transport the substrate of having processed and new substrate is supplied with described second area from described second area.
Described transfer robot can be by described transfer chamber with first process chamber of substrate from the described a plurality of process chambers of described loading chamber supply, the substrate that to complete processing by described transfer chamber in described the first process chamber transports and supplies with the second process chamber described a plurality of process chamber from described the first process chamber, and transports described relief chamber by described transfer chamber will complete processing in described the second process chamber substrate from described the second process chamber.
Described deposit source can comprise one or more evaporation source that corresponds respectively to one or more materials of while deposit.
Described deposit source can be arranged as a plurality of and spaced apart along described second direction.
Described a plurality of process chamber can be spaced apart from each other and be arranged in the cross side of described transfer chamber along described second direction.
Described transfer chamber can comprise two transfer robot, and described transfer robot can be spaced apart from each other and be arranged to along the second direction straight reciprocating motion along first direction.
Description of drawings
By reference to the accompanying drawings from following description to exemplary embodiment, above-mentioned and/or other side of the present invention will become apparent and be more readily understood, wherein:
Fig. 1 is the schematically illustrated plane graph for the manufacture of the equipment of flat-panel monitor according to exemplary embodiment;
Fig. 2 is the end view that illustrates for the manufacture of the inside of the process chamber in the equipment of the flat-panel monitor of Fig. 1;
Fig. 3 illustrates the outside for the manufacture of the process chamber in the equipment of the flat-panel monitor of Fig. 1;
Fig. 4 a-Fig. 4 g is illustrated in for the manufacture of the technique in sequence of transferring substrates when treatment substrate in the equipment of the flat-panel monitor of Fig. 1;
Another example of process chamber in the equipment of the schematically illustrated flat-panel monitor for the manufacture of Fig. 1 of Fig. 5;
Fig. 6 is the schematically illustrated plane graph for the manufacture of the equipment of flat-panel monitor according to another exemplary embodiment of the present invention; And
Fig. 7 is the schematically illustrated plane graph for the manufacture of the equipment of flat-panel monitor according to exemplary embodiment of the present invention.
Embodiment
Below, describe exemplary embodiment according to the equipment for the manufacture of flat-panel monitor of the present invention in detail with reference to accompanying drawing.
Fig. 1 is the schematically illustrated plane graph for the manufacture of the equipment of flat-panel monitor according to exemplary embodiment, Fig. 2 is the end view that illustrates for the manufacture of the inside of the process chamber in the equipment of the flat-panel monitor of Fig. 1, Fig. 3 illustrates the outside for the manufacture of the process chamber in the equipment of the flat-panel monitor of Fig. 1, Fig. 4 a-Fig. 4 g is illustrated in for the manufacture of the technique in sequence of transferring substrates when treatment substrate in the equipment of the flat-panel monitor of Fig. 1, and another example of the process chamber in the equipment of the schematically illustrated flat-panel monitor for the manufacture of Fig. 1 of Fig. 5.
With reference to figure 1-Fig. 5, comprise process chamber 110, transfer chamber 120, load chamber 130 and relief chamber 140 according to the equipment 100 for the manufacture of flat board of embodiment, can carry out the deposition process of organic film therein for the flat board that is used for organic light emitting display.
Loading chamber 130 is connected to a side of transfer chamber 120 and holds and will supply with the untreated substrate 10 of transfer chamber 120.The inner space that loads chamber 130 holds a plurality of substrates 10, and the treatment process that will carry out in process chamber 110 does not also put on this a plurality of substrates 10, and these a plurality of substrates 10 are in standby condition in loading chamber 130.
According to embodiments of the invention, process for the manufacture of 110 pairs of at least two substrates 10 of process chamber of the equipment 100 of flat-panel monitor.And process chamber 110 is set to supply with and transport at least two substrates 10 along first direction L1, makes processing gas can be deposited on a substrate 10, can transmit and another substrate 10 that aligns along the second direction L2 perpendicular to first direction L1 simultaneously.For this purpose, process chamber 110 runs through and is formed with at least two openings 115, and each opening 115 can pass to substrate 10 greatly.
With reference to figure 2 and 3, process chamber 110 comprises body member 111, support unit 112, deposit source 113, driver element 114 and controller (not shown).
If if having many spaces or exist deposit source 113 to stop the space of certain hour sections between support unit 112, because the size of process chamber 110 is increased to large space the same as this space, production cost may increase, and because the processing delay of substrate and driver element 114 drive the same long time of time that this space is passed in deposit source 113, the time for the treatment of substrate cost may increase.On the contrary, according to exemplary embodiment of the present invention, the space that there is no waste for the manufacture of the process chamber 110 of the equipment 100 of flat-panel monitor between support unit 112, make deposit source 113 can be between first area A and second area B fast moving, therefore realize processing fast the deposition process of gas.
With reference to figure 2, single deposit source 113 is placed in the inner space of body member 111, but is not limited to this.Alternatively, as shown in Figure 5, a plurality of deposits source 113 can be placed in process chamber 110 ' and be spaced apart along second direction L2.Therefore corresponding deposit source 113 increases at same time inject process gas the amount that is injected in the processing gas in process chamber 110 ', thereby shortens the time of deposition process cost.
And, each deposit source 113 can comprise one or more evaporation sources (evaporation sources) 113a, these one or more evaporation source 113a hold respectively one or more materials, in order in process chamber 110 ', one or more materials are deposited on substrate 10 simultaneously.The material that sprays from corresponding evaporation source 113a mixes to consist of processing gas.
Controller is controlled driver element 114, to drive the reciprocating motion between first area A and second area B of deposit source 113.Controller is controlled driver element 114, with after a substrate 10 is processed by deposit source 113 in the A of first area, stop ground deposit source 113 is moved to second area B, and after another substrate 10 is processed by deposit source 113 in second area B, stop ground deposit source 113 is turned back to first area A.Therefore, controller can be processed two substrates 10 rapidly, and there is no time of delay when moving between first area A and second area B by driver element 114 in deposit source 113.
With reference to figure 1, transfer chamber 120 comprises transfer robot 123, and this transfer robot 123 is along second direction straight reciprocating motion and transferring substrates 10, and transfer robot 123 comprises transfer unit 121 and robot arm 122.
Robot arm 122 is rotatably connected to transfer unit 121 on transfer unit 121, and along first direction L1, substrate 10 is supplied with process chambers 110 or 110 transport substrate 10 along first direction L1 from process chamber.In substrate 10 was placed in state on the top of robot arm 122, robot arm 122 sliding motions were to supply with substrate 10 process chambers 110 or to transport substrate 10 from process chamber 110.By the transfer chamber 120 with this structure, substrate 10 can be processed simultaneously, supply with and transport in process chamber 110.
The below will describe the method by controller and transfer robot 123 treatment substrates 10.
According to exemplary embodiment, controller is controlled driver element 114, to repeat the processing technique of a substrate 10 when the initial position along second direction L2 from first area A moves deposit source 113 in the A of first area and process the technique of another substrate 10 along second direction L2 in second area B when second area B moves deposit source 113 and returns to initial position.Here, the initial position of first area A refers to the position of the sidewall of the contiguous process chamber 110 in the A of first area, with the position as the deposit of beginning substrate 10 in the A of first area.
At this moment, after the substrate of the substrate of first area A and second area B was all processed, transfer robot 123 transported from first area A and second area B the substrate 10 of having processed, and new substrate is supplied with first area A and second area B.After the processing of completing all substrates 10, the substrate 10 processed of order transport supply with new substrate 10.
According to another exemplary embodiment, controller is controlled driver element 114, the substrate in processing second area B with the technique of the substrate in repeating to process first area A when deposit source 113 sequentially moves to first area A and second area B along second direction L2 and the substrate in second area B and when deposit source 113 sequentially moves to second area B and first area A along second direction L2 and the technique of the substrate in the A of first area.
At this moment, after the substrate of transfer robot 123 in processing first area A, transport the substrate 10 of having processed and new substrate 10 is supplied with first area A from first area A, process simultaneously the substrate in second area B, then after the substrate in processing second area B, transport the substrate 10 of having processed and new substrate 10 is supplied with second area B from second area B, processing simultaneously the substrate in the A of first area.
Carry out simultaneously as follows processing and the transmission of substrate, namely a substrate 10 is completed and process and supply with new substrate 10 when being processed another substrate 10, make the quantity of the substrate that time per unit processes can be more than the quantity that is arranged on the substrate of processing for the manufacture of the process chamber in the legacy equipment of flat-panel monitor, thereby boost productivity.
By this structure, with reference to Fig. 1-Fig. 5, operation for the manufacture of the equipment 100 of flat-panel monitor is described according to an embodiment of the invention.If the substrate 10b in the first area A of process chamber 110 completes processing by deposit source 113 as shown in Fig. 4 a, be placed on the untreated substrate 10a that loads in chamber 130 and be delivered to process chamber 110 by transfer robot 123 as shown in Fig. 4 b.The substrate 10b that completes processing in the A of first area outwards transports by transfer robot 123, and processed substrate 10a is positioned in the support unit 112 of first area A.Support unit 112 and mask alignment make from the deposit source that the 113 processing gases that eject can be deposited on substrate 10 equably.Simultaneously, deposit source 113 moves quickly into second area B by driver element 114 and sprays the processing gas that will be deposited on substrate 10 when the straight reciprocating motion in second area B.In addition, as shown in Fig. 4 c and Fig. 4 d, transfer robot 123 is delivered to relief chamber 140 in order to it is transported with substrate 10.
As Fig. 4 e to as shown in Fig. 4 g, transfer robot 123 moves to and loads chamber 130 and when substrate 10b processes, substrate 10a is delivered to second area B in second area B, transport the substrate 10b that completes processing in second area B, and need supply with second area B by substrate 10a to be processed.In other words, deposit source 113 treatment substrate 10a continuously during reciprocating motion between first area A and second area B, and be placed on the substrate 10a that loads in chamber 130 and alternately supply with first area A and the second area B of process chamber 110 by transfer robot 123.These operations constantly repeat.
In this exemplary embodiment, the substrate 10 of processing in process chamber 110 is passed to relief chamber 140, but is not limited to this.Alternatively, the substrate 10 of processing in a process chamber 110 is passed to another process chamber 110 and processes in another process chamber 110, then is passed to relief chamber 140.
In other words, substrate 10 by the first process chamber 110(of transfer chamber 120 from load chamber 130 a plurality of process chambers 110 of supply for example, be placed on the process chamber on the right side of transfer chamber), and the substrate 10 of completing processing in the first process chamber 110 transports and by the second process chamber 110(transfer chamber's 120 a plurality of process chambers 110 of supply for example, is placed on the process chamber in the left side of transfer chamber from the first process chamber 110).Then, the substrate 10 of completing processing in the second process chamber 110 transports relief chamber 140 by transfer chamber 120 from the second process chamber 110.
As mentioned above, in the equipment 100 for the manufacture of flat-panel monitor according to an embodiment of the invention, in case substrate 10 is completed processing, deposit source 113 does not just lingeringly move to second area B from first area A, and process continuously another substrate 10 in second area B, thereby shorten the processing time and boost productivity.
And, as mentioned above, in the equipment 100 for the manufacture of flat-panel monitor according to an embodiment of the invention, two support units 112 are arranged to stay less space between them, also can minimize even make process chamber 110 hold two substrates 10, therefore reduce the manufacturing cost of process chamber 110.
Simultaneously, with reference to figure 6, comprise a plurality of process chambers 110 according to the equipment 200 for the manufacture of flat-panel monitor of another exemplary embodiment, these a plurality of process chambers 110 are arranged in the cross side of transfer chamber 120 and are spaced apart from each other along second direction L2.By this structure, can process more substrates in the unit interval, so productivity ratio can improve further than the productivity ratio for the manufacture of the equipment 100 of Fig. 1 of flat-panel monitor.
In the situation that there are a plurality of process chamber 110a, transfer chamber 120 can comprise two transfer robot 123 as shown in Figure 7, and transfer robot 123 is spaced apart from each other and is arranged to the straight reciprocating motion along second direction L2 along first direction L1.
In the equipment for the manufacture of flat-panel monitor according to an embodiment of the invention, carry out simultaneously processing and the transmission of substrate, and time per unit can process more substrates, thereby boost productivity.
And, in the equipment for the manufacture of flat-panel monitor according to an embodiment of the invention, two zones for the treatment of substrate in process chamber are located adjacent one another, make the size of process chamber to minimize, thereby reduce the overall size of equipment, and distance and the time in transmission deposit source can reduce, thereby shorten total processing time.
In addition, in the equipment for the manufacture of flat-panel monitor according to an embodiment of the invention, even a plurality of process chambers are in a row arranged, also can be arranged on the transfer robot of straight reciprocating motion between process chamber, make the quantity of process chamber and the various combinations of layout to construct according to the inner case of factory.
Although illustrated and described several exemplary embodiments of the present invention, it will be understood by those skilled in the art that, in the situation that do not depart from principle of the present invention and spirit, can make change to these embodiment, scope of the present invention limits in claims and their equivalent.
Claims (9)
1. equipment for the manufacture of flat-panel monitor, this equipment comprises:
A plurality of process chambers that are formed with the inner space are processed at least two substrates in described inner space;
The transfer chamber, this transfer chamber is arranged between described a plurality of process chamber along first direction, and described transfer chamber comprises transfer robot, and this transfer robot is being supplied with untreated substrate described process chamber or transporting the substrate of having processed from described process chamber along perpendicular to the second direction straight reciprocating motion of described first direction the time;
Load the chamber, this loading chamber is connected to a side of described transfer chamber and holds the substrate that will supply with described transfer chamber; And
Relief chamber, this relief chamber are connected to the opposite side of described transfer chamber and hold the substrate that transports from described transfer chamber,
Described transfer robot is controlled described substrate and is sequentially supplied with described process chamber or transport from described process chamber along described second direction straight reciprocating motion the time, and
In described process chamber, a substrate is subject to processing the deposit of gas, and simultaneously along described second direction transmission and another substrate that aligns.
2. equipment according to claim 1, wherein, described process chamber comprises:
Body member, this body member has the inner space, and this inner space comprises the second area of first area and contiguous described first area, and described body member opens to be communicated with described transfer chamber in a side;
Support unit, this support unit are arranged on respectively in described first area and described second area, are delivered to the substrate of described body member to support and to align;
Deposit source, this deposit source are arranged in the described inner space of described body member and will process gas and be ejected on substrate;
Driver element, the described deposit of this drive unit drives source is along described second direction straight reciprocating motion; And
Controller, this controller is controlled described driver element, to drive the reciprocating motion between described first area and described second area of described deposit source.
3. equipment according to claim 2, wherein, described controller is controlled described driver element, process the technique of a substrate and process the technique of another substrate along described second direction in described second area when described second area moves described deposit source and returns to described initial position when the initial position along described second direction from described first area moves described deposit source in described first area with repetition, and
After the described substrate of the described substrate of described first area and described second area is all processed, described transfer robot transports from described first area and described second area the substrate of having processed, and new substrate is supplied with described first area and described second area.
4. equipment according to claim 2, wherein, described controller is controlled described driver element, with the technique that repeats described substrate in described first area is processed in described deposit source when described second direction sequentially moves to described first area and described second area and the described substrate in described second area and the described substrate in described second area is processed in described deposit source when described second direction sequentially moves to described second area and described first area and the technique of the described substrate in described first area, and
After described substrate in processing described first area and during the described substrate in processing described second area, described transfer robot transports the substrate of having processed and new substrate is supplied with described first area from described first area, then after the described substrate in processing described second area and during the described substrate in processing described first area, described transfer robot transports the substrate processed and the described second area of substrate supply that will be new from described second area.
5. equipment according to claim 1, wherein, described transfer robot is supplied with substrate the first process chamber described a plurality of process chambers from described loading chamber by described transfer chamber, the substrate that to complete processing by described transfer chamber in described the first process chamber transports and supplies with the second process chamber described a plurality of process chamber from described the first process chamber, and transports described relief chamber by described transfer chamber will complete processing in described the second process chamber substrate from described the second process chamber.
6. equipment according to claim 2, wherein, described deposit source comprises one or more evaporation source that corresponds respectively to one or more materials of while deposit.
7. equipment according to claim 6, wherein, described deposit source is arranged as a plurality of and is spaced apart along described second direction.
8. equipment according to claim 1, wherein, described a plurality of process chambers are spaced apart from each other and are arranged in the cross side of described transfer chamber along described second direction.
9. equipment according to claim 8, wherein, described transfer chamber comprises two transfer robot, and
Described transfer robot is spaced apart from each other and is arranged to along described second direction straight reciprocating motion along described first direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110117311A KR101293024B1 (en) | 2011-11-11 | 2011-11-11 | Apparatus for Manufacturing Flat panel display |
| KR10-2011-0117311 | 2011-11-11 |
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| CN103107132A true CN103107132A (en) | 2013-05-15 |
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| CN2012104482447A Pending CN103107132A (en) | 2011-11-11 | 2012-11-09 | Apparatus for manufacturing flat panel display |
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| JP (1) | JP2013104131A (en) |
| KR (1) | KR101293024B1 (en) |
| CN (1) | CN103107132A (en) |
| TW (1) | TW201318942A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103789732A (en) * | 2014-02-13 | 2014-05-14 | 上海和辉光电有限公司 | Evaporator and evaporation method |
| CN111041424A (en) * | 2018-10-15 | 2020-04-21 | 佳能特机株式会社 | Film forming apparatus and method, and system and method for manufacturing organic EL panel |
| CN112623700A (en) * | 2020-12-04 | 2021-04-09 | 深圳市韩安特科技有限公司 | Display screen maintenance equipment |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102150452B1 (en) * | 2014-03-31 | 2020-09-01 | 주식회사 선익시스템 | Cluster type deposition apparatus |
| JP2016117915A (en) * | 2014-12-18 | 2016-06-30 | キヤノントッキ株式会社 | Device and method of vapor deposition |
| TWI643799B (en) * | 2017-12-01 | 2018-12-11 | 瑩耀科技股份有限公司 | Semiconductors transfer system |
| CN113493097B (en) * | 2021-08-06 | 2023-05-02 | 超捷半导体设备(深圳)有限公司 | Substrate loading and unloading device, substrate loading method and substrate unloading method |
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- 2012-10-26 JP JP2012237278A patent/JP2013104131A/en active Pending
- 2012-11-07 TW TW101141229A patent/TW201318942A/en unknown
- 2012-11-09 CN CN2012104482447A patent/CN103107132A/en active Pending
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| CN1357910A (en) * | 2000-12-11 | 2002-07-10 | 矽品精密工业股份有限公司 | Substrate-type semiconductor device packing method without glue overflow |
| CN101667630A (en) * | 2008-09-04 | 2010-03-10 | 株式会社日立高新技术 | Organic EL apparatus manufacturing installation and production method thereof as well as film-forming device and film-forming method |
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| CN103789732A (en) * | 2014-02-13 | 2014-05-14 | 上海和辉光电有限公司 | Evaporator and evaporation method |
| CN111041424A (en) * | 2018-10-15 | 2020-04-21 | 佳能特机株式会社 | Film forming apparatus and method, and system and method for manufacturing organic EL panel |
| CN112623700A (en) * | 2020-12-04 | 2021-04-09 | 深圳市韩安特科技有限公司 | Display screen maintenance equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101293024B1 (en) | 2013-08-05 |
| KR20130052084A (en) | 2013-05-22 |
| TW201318942A (en) | 2013-05-16 |
| JP2013104131A (en) | 2013-05-30 |
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Application publication date: 20130515 |