KR101152578B1 - Apparatus for depositing Organic material and organic material depositing system using the same and depositing method thereof - Google Patents

Abstract

The present invention enables the deposition process for the second substrate to be performed simultaneously with the substrate transfer and alignment process for the first substrate in the chamber, thereby reducing the loss of organic materials consumed during the substrate transfer and alignment process. It provides organic material deposition apparatus and deposition method that can maximize material efficiency and minimize process tack time.
An organic material deposition apparatus according to an embodiment of the present invention, the chamber is divided into a first substrate deposition region and the second substrate deposition region; An organic vapor deposition source which moves in a first direction in the first or second substrate deposition region and injects organic particles onto the first substrate or the second substrate; And a second moving means for rotating the organic material deposition source in the second direction so that the organic material deposition source is positioned in the first or second substrate deposition region, respectively.

Description

Apparatus for depositing Organic material and organic material depositing system using the same and depositing method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic material deposition apparatus, and more particularly, to an organic material deposition apparatus capable of performing a deposition process on a second substrate at the same time as performing a substrate transfer and alignment process on a first substrate, and an organic material deposition having the same. It relates to a system and a deposition method.

The organic light emitting display device is a self-luminous display device, and has attracted attention as a next generation display device because of its advantages of having a wide viewing angle, excellent contrast, and fast response speed.

The organic electroluminescent device provided in the organic electroluminescent display device is composed of first and second electrodes (anode and cathode electrodes) facing each other and an intermediate layer formed between the electrodes, and various layers may be provided in the intermediate layer. Examples thereof include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer or an electron injection layer.

In the case of organic electroluminescent devices, these intermediate layers are organic thin films formed of organic material.

In manufacturing the organic electroluminescent device having the above configuration, the organic thin films or electrodes such as the hole injection layer, the hole transport layer, the light emitting layer, the electron transport layer or the electron injection layer formed on the substrate is deposited using a deposition apparatus ( by the method of deposition).

The deposition method is generally implemented by mounting a substrate in a vacuum chamber and then heating a heating vessel containing the material to be deposited to evaporate or sublimate the material to be deposited therein. That is, a shadow mask having an opening of a pattern to be formed is aligned in front of a substrate, and an organic thin film or the like is deposited on the substrate by evaporating or subliming an organic material on the substrate.

In order to perform such a deposition process, a process of transferring a substrate in a chamber, an alignment process of accurately placing a shadow mask on the substrate, and the like must be performed first. In the case of the conventional deposition apparatus and the deposition method, the substrate During the transfer and mask alignment it was not possible to proceed with the deposition process. That is, as the substrate transfer and mask alignment process and the deposition process are performed separately, there is a disadvantage in that the tack time is increased.

In addition, according to the conventional deposition equipment and deposition method, since the organic material must be continuously evaporated or sublimed through the deposition source while the substrate transfer and mask alignment is being performed, there is a disadvantage that the organic material material is lost .

The present invention enables the deposition process for the second substrate to be performed simultaneously with the substrate transfer and alignment process for the first substrate in the chamber, thereby reducing the loss of organic materials consumed during the substrate transfer and alignment process. The purpose of the present invention is to provide an organic material deposition apparatus and a deposition method capable of maximizing material efficiency and minimizing process tack time.

In addition, by maximizing the space utilization by optimizing the size of the chamber by implementing the direction in which the deposition source moves to perform deposition on each substrate and the direction in which the deposition source moves to deposit other substrates, An object of the present invention is to provide an organic material deposition system having more process chambers in the same space as compared to the organic material deposition system.

In order to achieve the above object, the organic material deposition apparatus according to the embodiment of the present invention, the chamber is divided into a first substrate deposition region and the second substrate deposition region; An organic vapor deposition source which moves in the first or second substrate deposition region and injects organic particles onto the first substrate or the second substrate; First moving means for rotating the organic material deposition source in the first direction so that the organic material deposition source is located in the first or second substrate deposition region, respectively.

The apparatus may further include second moving means for reciprocating the organic material deposition source in the second direction in the first or second substrate deposition region, respectively.

In addition, the first substrate aligning portion is located in the first substrate deposition region to align the first substrate transferred from the outside; A second substrate aligning unit is disposed in the second substrate deposition region to align the second substrate transferred from the outside.

In addition, the first substrate deposition region and the second substrate deposition region are arranged adjacent to the first direction, the organic material deposition source is implemented as a linear deposition source.

In addition, the body of the chamber is implemented in the shape of a polygonal tubular shape, the length of the first surface adjacent to the first moving means is longer than the length of the second surface corresponding to the first surface, the second surface of the chamber body It is the surface where the transfer and conveyance of a board | substrate are performed.

In addition, the organic material deposition method according to an embodiment of the present invention, the first substrate is transferred to the first substrate deposition region in the chamber, and the alignment process for the transferred first substrate is performed; Performing a deposition process of the first substrate by moving a deposition source within the first substrate deposition region when the alignment of the first substrate is completed; Performing a deposition process of the first substrate and simultaneously transferring a second substrate to a second substrate deposition region in the chamber, and performing an alignment process on the transferred second substrate; When the deposition of the first substrate and the alignment of the second substrate are completed, the deposition source is rotated in the first direction and positioned in the second substrate deposition region; And moving the deposition source in the second substrate deposition region to perform the deposition process of the second substrate.

The method may further include performing a deposition process on the second substrate and simultaneously transferring a new first substrate to the first substrate deposition region in the chamber, and performing an alignment process.

In addition, the organic material deposition apparatus according to another embodiment of the present invention, the chamber is divided into a first substrate deposition region, the atmospheric region and the second substrate deposition region; A first substrate aligning unit positioned in the first substrate deposition region to align the first substrate transferred from the outside; A second substrate aligning unit positioned in the second substrate deposition region to align the second substrate transferred from the outside; At least one organic material deposition source for injecting organic material particles onto the first substrate or the second substrate; It is configured to include a transport means for moving the organic material deposition source in the first direction.

Further, a deposition source accommodating part for accommodating the organic material deposition source is further included, and an angle limiting plate is formed on an upper outer wall of the deposition source accommodating part.

In addition, the first substrate deposition region, the atmospheric region and the second substrate deposition region are arranged in a line in the first direction.

In addition, the organic material deposition method according to another embodiment of the present invention comprises the steps of placing the organic material deposition source on the atmospheric region of the chamber after the first substrate or the second substrate is transferred into the chamber and before the alignment process is completed; ; After the alignment process for the first substrate is completed, the organic material deposition source located on the atmospheric region of the chamber is moved to the first substrate deposition region where the first substrate is located and the deposition on the first substrate is performed. Wow; After the deposition process on the first substrate is completed, the organic material deposition source is moved back to the atmospheric region of the chamber; After the alignment process is completed for the second substrate, the organic material deposition source located on the atmospheric region of the chamber is moved to the second substrate deposition region where the second substrate is located to perform deposition on the second substrate. Included.

The method may further include performing an alignment process on the second substrate or the first substrate while simultaneously performing the deposition process on the first substrate or the second substrate.

In addition, the first substrate or the second substrate on which the deposition is completed is further conveyed to the outside, and a new first substrate or the second substrate is further included in the transfer to the chamber.

In addition, the organic material deposition system according to an embodiment of the present invention, a plurality of organic material deposition apparatus; A transfer chamber connecting the plurality of organic material deposition apparatuses in common; A load lock chamber for loading and / or unloading substrates introduced into the organic material deposition apparatuses through the transfer chamber is included. The plurality of organic material deposition apparatuses may perform deposition on at least two substrates. In addition, a first organic vapor deposition apparatus for performing deposition and alignment of the remaining substrates while performing deposition on any one of the at least two substrates is included.

In addition, the plurality of organic material deposition apparatuses include a second organic material deposition apparatus that sequentially performs a transfer, alignment, and deposition process for one substrate.

According to the present invention, it is possible to perform the deposition process for the second substrate and the substrate transfer and alignment process for the first substrate in the same process chamber, thereby consuming organic substrate It has the advantage of maximizing material efficiency by minimizing material loss and minimizing process tack time.

In addition, it is possible to perform a deposition process for two substrates using one deposition source in the process chamber, and thus, there is an advantage in that the deposition line can be optimized.

In addition, by maximizing the space utilization by optimizing the size of the process chamber, it is possible to have more process chambers in the same space as compared to the conventional, and to maximize productivity through the parallel deposition process for a plurality of substrates There is an advantage that it can.

1 is a cross-sectional view schematically showing the configuration of an organic material deposition apparatus according to a first embodiment of the present invention.
2A to 2D are diagrams illustrating an organic material deposition method according to a first embodiment of the present invention.
3 is a cross-sectional view schematically showing the configuration of an organic material deposition apparatus according to a second embodiment of the present invention.
4A to 4D are diagrams illustrating an organic material deposition method according to a second embodiment of the present invention.
Figure 5 is a block diagram schematically showing an organic material deposition system equipped with an organic material deposition apparatus according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings.

1 is a cross-sectional view schematically showing the configuration of an organic material deposition apparatus according to a first embodiment of the present invention.

1, the organic material deposition apparatus according to the first embodiment of the present invention, the chamber 100 is divided into a first substrate deposition region, the atmospheric region and the second substrate deposition region; A first substrate alignment unit 200 positioned in the first substrate deposition region to align the first substrate 110 transferred from the outside; A second substrate aligning unit (210) positioned in the second substrate deposition region to align the second substrate (110 ') transferred from the outside; At least one organic material deposition source (300) for injecting organic material particles onto the first substrate (110) or the second substrate (110 '); A deposition source accommodating part 400 accommodating the organic material deposition source 300; Moving means 500 for moving the evaporation source receiving portion in a first direction (for example horizontal direction) is included.

In this case, the first substrate deposition region, the atmospheric region and the second substrate deposition region are arranged in a line in the first direction as shown.

Here, the chamber 100 is configured to maintain a vacuum inside the vacuum pump (not shown).

In addition, in the embodiment illustrated in FIG. 1, two organic material deposition sources 300 are accommodated in the deposition source accommodating part 400, and an angle limiting plate 410 is disposed on the upper outer wall of the deposition source accommodating part 400. It is formed, through which serves to limit the radial direction of the organic material injected from the organic material deposition source 300.

In addition, the moving means 500 serves to move the deposition source accommodating part 400 in the first direction (horizontal direction), and the deposition source accommodating part 400 is initially in the atmosphere of the chamber 100. When the alignment of the first substrate 110 is completed by the first substrate alignment unit 200 after being controlled to be located in the region, the deposition source accommodating unit 400 is moved to the first substrate deposition region. The deposition process of the first substrate 110 is performed.

Subsequently, when the alignment of the second substrate 110 ′ is completed by the second substrate alignment unit 210, the deposition source accommodating unit 400 is moved to the second substrate deposition region so that the second substrate 110 ′ is aligned. To perform the deposition process.

That is, the transfer and align process of the second substrate 110 'is performed while the deposition process of the first substrate 110 is performed, and conversely, the deposition process of the second substrate 110' is performed. Since the substrate 110 is transferred and aligned, the process tack time can be significantly reduced, and in the conventional case, the material efficiency can be maximized by reducing the loss of organic materials consumed during substrate transfer and alignment. do.

Such moving means 500 is preferably implemented to control the moving speed of the organic material deposition source 300 according to the process conditions to be suitable for use in the chamber 100 is maintained in a vacuum, which is a ball screw And a motor (not shown) for rotating the ball screw, and a guide (not shown) for guiding the deposition source accommodating part 400 may be included. However, this is only one embodiment, and may be implemented to drive at a constant speed using a linear motor (not shown) in another embodiment.

In addition, a shadow mask 120 is disposed on the front surfaces of the first and second substrates 110 and 110 ′, that is, between the organic material deposition source 300 and the substrate.

Therefore, the organic material evaporated from the organic material deposition source 300 is deposited on the substrates 110 and 110 'while passing through the shadow mask 120 so that an organic film having a predetermined shape is formed on the substrate.

Meanwhile, the organic material deposition source 300 accommodates the organic material to be deposited on the substrates 110 and 110 ′ in the chamber 200, heats and evaporates the accommodated organic material, and then sprays the organic material onto the substrate to form the organic material on the substrate. A film is formed and the organic material deposition source 300 may be implemented as a linear source or a point source.

However, in the case of the point deposition source, it is difficult to deposit organic materials in a large area, and in order to deposit a large area, a plurality of point deposition sources should be arranged. In this case, it is difficult to control a plurality of point deposition sources. Therefore, in the embodiment of the present invention, the organic material deposition source 300 is preferably implemented as a linear deposition source.

2A to 2D are diagrams illustrating an organic material deposition method according to a first embodiment of the present invention, which describes the deposition method by the organic material deposition apparatus shown in FIG. 1.

First, as illustrated in FIG. 2A, after the first substrate 110 or the second substrate 110 ′ is transferred into the chamber 100, and before the alignment process is completed, the organic material deposition source 300 is deposited. The original accommodating part 400 is located on the waiting area, which is the central part of the chamber 100.

Although the organic material is continuously sprayed from the organic material deposition source 300 even when positioned on the atmospheric region, the organic material deposition source 300 is formed by the angle limiting plate 410 provided on the upper outer wall of the deposition source accommodating part 400. The organic material sprayed from) is not deposited on the first substrate 110 or the second substrate 110 ′ where the alignment process is not completed.

That is, in the embodiment of the present invention, by providing the angle limiting plate 410 on the upper outer wall of the deposition source receiving unit 400, it is possible to remove the blocking film provided in the conventional deposition apparatus.

In this case, the blocking film is provided in a conventional deposition apparatus, and is formed between the substrate and the deposition source to prevent organic matter from being deposited on the substrate during the alignment process of the substrate.

Thereafter, when the first substrate 110 is aligned by the first substrate alignment unit 200, as illustrated in FIG. 2B, the deposition source accommodating unit 400 positioned on the standby region of the chamber 100 is moved. The means 500 moves to the first substrate deposition region in which the first substrate 110 is located, and thus performs a deposition process in the first substrate deposition region.

However, in the exemplary embodiment of the present invention, the second substrate 110 ′ is transferred during the deposition process for the first substrate 110, and the transferred second substrate 110 ′ is frozen. The alignment process is performed by the part 210.

In this case, the transfer of the substrate into the chamber 100 is implemented by a robot arm (not shown) provided in a transfer chamber (not shown) connected to the chamber 100 in the cluster type deposition system. The transfer chamber and robotic arm are shown in the deposition system of FIG. 5 described below.

That is, while the deposition process is performed on the first substrate 110, the transfer and alignment process on the second substrate 110 ′ is performed.

Next, when the deposition process for the first substrate 110 is completed, the deposition source receiving unit 400 is moved back to the standby region of the chamber 100 by the moving means 500 as shown in FIG. 2C. The first substrate 110, which has been deposited, is transferred to the outside, and the new first substrate is transferred into the chamber.

At this time, the transfer of the substrate is implemented by a robot arm (not shown) provided in the transfer chamber (not shown) described above.

After the alignment of the second substrate 110 ′ is completed, as illustrated in FIG. 2D, the deposition source accommodating part 400, which is located on the atmospheric region of the chamber 100, may be moved by the moving means 500. The substrate 110 ′ moves to the second substrate deposition region where the substrate 110 ′ is located, and thus a deposition process is performed in the second substrate deposition region.

However, in the exemplary embodiment of the present invention, the first substrate 110 newly transferred into the chamber 100 at the same time as the deposition process for the second substrate 110 ′ is performed, the first substrate aligning unit 200 is provided. By the alignment process.

Then, when the deposition process for the second substrate 110 ′ is completed, the deposition source accommodating part 400 is moved back to the standby region of the chamber 100 by the moving means 500 as shown in FIG. 2A. The second substrate 110 ′ that is moved and the deposition is completed is transferred to the outside, and a new second substrate is transferred into the chamber.

According to the deposition method according to the embodiment of the present invention, the deposition process for the second substrate 110 ′ may be performed simultaneously with the substrate transfer and alignment process for the first substrate 110 in the same chamber. By doing so, it is possible to reduce the loss of organic materials consumed during the substrate transfer and alignment process to maximize the material efficiency and to minimize the process tack time.

1 and 2, the deposition source 300 moves in the first or second substrate deposition region in order to perform deposition on each substrate in the chamber 100, and deposits another substrate. Since the deposition source 300 moves from the first substrate deposition region to the second substrate deposition region (or the second substrate deposition region to the first substrate deposition region) in the same direction, the chamber 100 is spatially spaced. There is a problem in that the width must be considerably large in the direction in which deposition proceeds (first direction).

That is, when the deposition source 300 is moved to deposit the second substrate 110 ′ after the deposition on the first substrate 110 is completed, the first substrate 110 is moved in the first direction (horizontal direction) in the same manner as the deposition execution direction. Therefore, in order to perform deposition on the first substrate 110 and the second substrate 110 ′, it should be about two times larger in the first direction (horizontal direction) than in the conventional chamber.

Therefore, in another embodiment of the present invention by optimizing the size of the chamber by implementing a different direction in which the deposition source is moved to perform deposition on each substrate, and the direction of deposition source to deposit another substrate, I want to solve the problem.

3 is a cross-sectional view schematically showing the configuration of an organic material deposition apparatus according to a second embodiment of the present invention.

However, since the shadow mask, the deposition source, and the like are used in the same manner as in the first embodiment shown in FIG. 1, detailed descriptions thereof are omitted, and the same reference numerals are used for the same components for convenience.

Referring to FIG. 3, the organic material deposition apparatus according to the second embodiment of the present invention includes a chamber 100 having an interior divided into a first substrate deposition region A and a second substrate deposition region B; A first substrate alignment unit 200 positioned in the first substrate deposition region to align the first substrate 110 transferred from the outside; A second substrate aligning unit (210) positioned in the second substrate deposition region to align the second substrate (110 ') transferred from the outside; At least one organic material deposition source (300) for injecting organic material particles onto the first substrate (110) or the second substrate (110 '); A deposition source accommodating part 400 accommodating the organic material deposition source 300; First moving means (510) for rotating and moving the organic material deposition source in a first direction such that the organic material deposition source (300) is positioned in a first or second substrate deposition region, respectively; And a second moving means 520 for moving the deposition source accommodating part 400 in a second direction in the first or second substrate deposition region, respectively.

Here, the chamber 100 is configured to maintain a vacuum inside the vacuum pump (not shown).

In addition, the transfer and transfer of the substrate into the chamber 100 may be implemented by a robot arm (not shown) provided in a transfer chamber (not shown) connected to the chamber 100 in the cluster type deposition system. The transfer chamber and robotic arm are shown in the deposition system of FIG. 5 described below.

At this time, the first substrate deposition region (A) and the second substrate deposition region (B) are arranged side by side adjacent to each other in the first direction as shown, the substrate is performed in each deposition region (A, B) The deposition is performed by the reciprocating motion of the deposition source accommodating part 400 containing the deposition source 300 in the second direction by the second moving means 520.

In addition, when deposition of the first substrate 110 is completed in the first substrate deposition region A, the deposition source accommodating part 400 is rotated in the first direction by the first moving means 510 to move the second substrate. The second substrate 110 ′ is positioned in the deposition region B, and then reciprocates in the second direction by the second moving means 520 to deposit the second substrate 110 ′.

Likewise, when the deposition of the second substrate 110 ′ is completed in the second substrate deposition region B, the deposition source accommodating part 400 is rotated and moved in the first direction by the first moving means 510 to make the first substrate. Located in the deposition region A, the second transfer means 520 is reciprocated in the second direction to perform deposition of the newly inserted first substrate 110.

The first and second moving means (510, 520) is preferably implemented to control the moving speed of the organic material deposition source 300 according to the process conditions to be suitable for use in the chamber 100 is maintained in a vacuum, It is provided with a binding unit 512, 522 to be bonded to each substrate, and a ball screw (not shown) and a motor (not shown) for rotating the ball screw, for guiding the deposition source receiving unit 400 A guide (not shown) may be included and configured. However, this is only one embodiment, and may be implemented to drive at a constant speed using a linear motor (not shown) in another embodiment.

In the case of the embodiment described with reference to FIGS. 1 and 2 above, since the direction in which the deposition source moves to perform deposition on each substrate in the chamber is the same as the direction in which the deposition source moves to deposit another substrate, the chamber is spatially spaced. Although the width has a disadvantage in that it is about two times larger than the conventional chamber in the deposition progressing direction, in the case of the embodiment shown in FIG. 3, the direction in which the deposition source moves to perform deposition on each substrate (second direction) ) And the direction in which the evaporation source 300 moves (first direction) to deposit different substrates differently, so that the first substrate 110 in the same chamber is not required to greatly enlarge the space of the chamber 100. The deposition process for the second substrate 110 ′ may be performed at the same time as the substrate transfer and alignment process.

However, in the embodiment shown in Figure 3 for this purpose, as shown in the body of the chamber 100, the length of the first surface 102 to allow the first movement means 510 to rotate in the first direction ( L1 corresponds to the first surface 102, that is, is formed in a polygonal tubular shape longer than the length (L2) of the second surface 104 facing the first surface 102, through which the chamber Minimize the width of 100.

In the embodiment of Figure 3, the body of the chamber 100 is shown in the shape of a rectangular cylinder, which is an embodiment, the first surface 102 may be bent to implement a pentagonal tubular shape.

At this time, the first surface 102 is a surface adjacent to the first moving means 510, and the second surface 104 is opposite to the first surface 102, and the transfer and conveyance of the substrate is performed. It is a side. However, the second surface 104 is provided with an opening (not shown) so that the transfer and transfer of the substrate can be performed.

Hereinafter, the deposition method by the organic material deposition apparatus illustrated in FIG. 3 will be described in more detail with reference to FIGS. 4A to 4D.

Referring to FIG. 4A, first, the first substrate 110 is transferred into the chamber 100 through an opening (not shown) provided in the second surface 104 of the body of the chamber 100, and the first substrate alignment portion. The alignment process is performed by the reference numeral 200, and when the alignment of the first substrate 110 is completed, the deposition source accommodating part 400 may include the second moving means positioned in the first substrate deposition region A. By reciprocating in the second direction in the first substrate deposition region A by 520, the deposition process of the first substrate 110 is performed.

In addition, while the deposition process is performed on the first substrate 110, the second substrate 110 ′ is transferred into the chamber 100 through an opening (not shown) provided in the second surface 104. As shown in FIG. 4B, the alignment process is performed by the second substrate alignment unit 210.

In this case, the first substrate alignment unit 200 and the second substrate alignment unit 210 are positioned in the first substrate deposition region A and the second substrate deposition region B, respectively. Since it is the same as shown in 1, detailed description thereof will be omitted.

That is, in the exemplary embodiment of the present invention, the deposition and the alignment of the second substrate 110 ′ are performed at the same time as the deposition of the first substrate 110 is performed in the same chamber 100.

Next, when the deposition of the first substrate 110 and the alignment of the second substrate 110 ′ are completed, as illustrated in FIG. 4C, the deposition source accommodating part 400 may include the first moving means 510. The rotational movement in the first direction by () is positioned in the second substrate deposition region (B).

However, at the same time, the first substrate 110 on which deposition is completed is transferred to the outside, and a new first substrate 110 is transferred into the chamber 100.

According to the embodiment of the present invention, the deposition source accommodating part 400 in which the organic material deposition source 300 is mounted by the first moving means 510 is the second substrate deposition region in the first substrate deposition region A. FIG. By rotationally moving to (B), it is possible to significantly reduce the nubber of the chamber compared to the embodiment shown in FIGS. 1 and 2 above.

That is, as shown in the embodiment of the present invention, the length L1 of the first surface 102 is the length L2 of the second surface 104 such that the second movement means may rotate in the chamber 100. By using a longer polygonal tubular body, it maximizes space utilization.

After the deposition source accommodating part 400 is located in the second substrate deposition region B, the second substrate is moved by the second moving means 520 located in the second substrate deposition region B, as shown in FIG. 4D. By reciprocating in the second direction in the deposition region B, the deposition process of the second substrate 110 ′ is performed.

In addition, while the deposition process is performed on the second substrate 110 ′, the new first substrate 110 transferred into the chamber 100 may have a first substrate alignment portion 200 located in the first substrate deposition region A. FIG. The alignment process is performed by

That is, in the embodiment of the present invention, the deposition and the alignment of the first substrate 110 are performed at the same time as the deposition of the second substrate 110 'is performed in the same chamber.

Subsequently, when the deposition process for the second substrate 110 ′ is completed, the processes of FIGS. 4A to 4D are cyclically repeated to perform deposition or alignment on each substrate.

Figure 5 is a block diagram showing an embodiment of an organic material deposition system equipped with an organic material deposition apparatus according to an embodiment of the present invention.

However, the organic material deposition system illustrated in FIG. 5 is an example in which the organic material deposition apparatus illustrated in FIG. 3 is provided as a process chamber, and according to the embodiment of FIG. 3, the body of the chamber has a first surface. By implementing a polygonal tubular shape longer than two sides to maximize space utilization, it is possible to have more process chambers in the same space compared to the conventional organic material deposition system.

Referring to FIG. 5, the organic material deposition system 10 according to an exemplary embodiment of the present invention connects a plurality of process chambers 100 as an organic material deposition apparatus performing an organic material deposition process, and the plurality of process chambers in common. Transfer chamber 20 and load lock chambers 30 and 32 for loading and / or unloading substrates 110, 110 ′ and 110 ″ introduced into the process chamber through the transfer chamber. It consists of a cluster type.

In addition, a shadow mask unit 40 having a shadow mask used in the deposition process in the process chamber 100 may be further provided at one side of the transfer chamber 20.

The process chamber 100 is an organic vapor deposition apparatus where an organic material deposition process is performed, and process chambers 100a and 100b performing a deposition process on at least two substrates and a deposition process on one substrate. It is composed of process chambers 100c and 100d which perform a process to be performed.

That is, in the exemplary embodiment of FIG. 5, the first and second process chambers 100a and 100b perform a deposition process on two substrates, and a deposition process is performed on one substrate, and the deposition process is performed on the other substrates. As the process proceeds, the transfer and alignment processes are implemented.

In this case, the first and second process chambers 100a and 100b are implemented as the second embodiment of the organic material deposition apparatus described above with reference to FIGS. 3 and 4.

In addition, each of the third and fourth process chambers 100c and 100d sequentially performs an alignment and deposition process for one substrate.

That is, in the cluster type deposition system according to the embodiment of the present invention, the first and second process chambers 100a and 100b are formed in polygonal cylinders having different lengths of the first and second surfaces, and occupy an area that occupies. By significantly reducing the third and fourth process chambers (100c, 100d) can be further provided, there is an advantage to significantly improve the deposition yield compared to the conventional organic material deposition system.

Each of the process chambers 100 may deposit a separate organic material on a substrate, or may deposit the same organic material on a substrate.

As an example, in the embodiment shown in FIG. 5, the first organic material is deposited in the first process chamber 100a and the third process chamber 100c, and the second process chamber 100b and the fourth process chamber 100d. Deposit a second organic material.

Accordingly, the substrate on which the first organic material deposition is completed through the first process chamber 100a is transferred to the second process chamber 100b to further deposit the second organic material. Similarly, the first organic material is deposited through the third process chamber 100c. The substrate on which the organic material deposition is completed is transferred to the fourth process chamber 100d to further deposit the second organic material.

In addition, the transfer chamber 20 is connected to the aforementioned process chambers 100, the load lock chambers 30 and 32, and the shadow mask unit 40 through respective sidewall regions. At this time, each of the side wall areas is provided with a through portion 24 for entering and exiting the substrate.

That is, the transfer chamber 20 includes a body 22 having a transfer space for transferring a substrate and a pair of robot arms 26 and 26 'provided in the body, which is a load lock chamber 30. Transfers the substrate provided on the substrate to the process chamber 100 or transfers and transports the substrate on which the deposition is performed through the process chamber 100 to another process chamber 100 or the load lock chamber 32. In this case, the load lock chamber serves to load and / or unload the substrates 110, 110 ′, 110 ″ introduced into the process chamber as described above.

In addition, in the embodiment of the present invention, at least two robot arms 26 and 26 ′ provided in the body 22 of the transfer chamber are provided, and through this, a process chamber for simultaneously performing deposition processes on at least two substrates ( The second substrate may be transferred to the process chamber 100 during the deposition process on the first substrate.

The operation of the organic material deposition system according to the embodiment of the present invention having the above configuration will be briefly described as follows.

First, when a plurality of substrates are transferred to the first load lock chamber 30 from an external transfer device (not shown), the first load lock chamber 30 loads the transferred substrates.

When the loading of the substrates is completed, the door (not shown) of the first load lock chamber 30 is closed to make the first load lock chamber 30 in a vacuum state, and then the first robot arm of the transfer chamber 20. The first substrate 110 of the substrates is transferred to the first process chamber 100a through the transfer chamber using the reference numeral 26.

However, the process in the first process chamber 100a and the second process chamber 100b is the same as the deposition process of the organic material deposition apparatus described above with reference to FIGS. 3 and 4, which will be briefly described as follows.

The first substrate 110 transferred to the first process chamber 100a is aligned in the first process chamber 100a, and when the alignment is completed, the deposition process on the first substrate 110 is performed. . That is, the first organic material is deposited on the first substrate 110.

In addition, while the first substrate 110 is introduced into the first process chamber 100a, the second substrate 110 ′ of the plurality of substrates loaded in the first load lock chamber 30 is the second robot arm 26. ') Is transferred to the first process chamber 100a while the deposition process on the first substrate 110 is performed.

That is, when the deposition process is performed on the first substrate 110 through the first process chamber 100a, the transfer and alignment of the second substrate 110 'is simultaneously performed in the first process chamber 100a. After the alignment process is completed, the deposition process for the second substrate 110 ′ is performed.

In addition, while the alignment process is performed on the second substrate 110 ′, the first substrate 110 on which deposition is completed is transferred to the second process chamber 100b by the first robot arm 26 ′. . Accordingly, the first substrate 110 is aligned in the second process chamber 100b, and when the alignment is completed, an additional deposition process on the first substrate 110 is performed. That is, the second organic material is deposited on the first substrate 110.

In addition, after the first substrate 110 is introduced into the second process chamber 100b, the second substrate 110 ′ in which deposition is completed in the first process chamber 100 a is then performed on the second robot arm 26 ′. ) Is transferred to the second process chamber 100b during the deposition process on the first substrate 110.

That is, the deposition process for the first substrate 110 is performed through the second process chamber 100b, and the transfer and alignment of the second substrate 110 'is performed in the second process chamber 100b. .

As a result, when the deposition process for the first and second organic materials on the first substrate 110 and the second substrate 110 'is completed, the first substrate 110 and the second substrate 110' are continuously connected to the robot arm. Transported to the second load lock chamber 32 by the unloading

The first or second robot arm 26, 26 ′ then moves the third substrate 110 ″ of the substrates loaded from the first load lock chamber 30 through the transfer chamber 20 into a third process chamber ( After transferring to 100c), the third substrate 110 ″ is aligned in the third process chamber 100c, and when the alignment is completed, a deposition process is performed on the third substrate 110 ″. That is, the first organic material is deposited on the third substrate 110 ″.

In addition, when the deposition process for the third substrate 110 "is completed, the robot arm transfers the third substrate 110" to the fourth process chamber 100d, whereby the third substrate 110 ". Is aligned in the fourth process chamber 100d, and when the alignment is completed, an additional deposition process for the third substrate 110 "is performed. That is, the second organic material is deposited on the third substrate 110 ″.

Subsequently, when the deposition process for the first and second organic materials on the third substrate 110 "is completed, the third substrate 110" is transferred to the second load lock chamber 32 by the robot arm and unloaded, respectively. .

At this time, the deposition process for the third substrate 110 ″, that is, the deposition process performed in the third and fourth deposition chambers 100c and 100d may be performed on the first substrate 110 and the second substrate 110 ′. It may be implemented simultaneously with the deposition process for.

As a result, according to the organic material deposition system 10 according to the embodiment of the present invention, by performing the deposition process for three substrates in parallel, it is possible to eliminate the waiting time in each process chamber to increase or maximize productivity There is an advantage.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: organic material deposition system 20: transfer chamber
30, 32: load lock chamber 40: shadow mask unit
100: process chamber 110, 110 ': the first substrate, the second substrate
120: shadow mask 200: first substrate alignment portion
210: second substrate alignment unit 300: organic material deposition source
400: evaporation source storage unit 410: angle limiting plate
500: moving means 510, 520: first moving means, second moving means

Claims (20)

A chamber in which the interior is divided into a first substrate deposition region and a second substrate deposition region;
An organic vapor deposition source which moves in the first or second substrate deposition region and injects organic particles onto the first substrate or the second substrate;
First moving means for rotating the organic material deposition source in a first direction such that the organic material deposition source is positioned in a first or second substrate deposition region, respectively;
Second moving means for reciprocating the organic material deposition source in a second direction in the first or second substrate deposition region, respectively;
The direction in which the organic material deposition source moves to perform deposition on the first or second substrate (second direction) and the direction in which the organic material deposition source moves to deposit another substrate (first direction) are different from each other. Organic deposition device, characterized in that implemented.
delete The method of claim 1,
A first substrate aligning unit positioned in the first substrate deposition region to align the first substrate transferred from the outside;
And a second substrate aligning portion positioned in the second substrate deposition region to align the second substrate transferred from the outside. The method of claim 1,
And the first substrate deposition region and the second substrate deposition region are arranged adjacent to each other along the first direction. The method of claim 1,
The organic material deposition apparatus is characterized in that the organic material deposition apparatus is implemented as a linear deposition source. The method of claim 1,
The body of the chamber is an organic material deposition apparatus, characterized in that the length of the first surface adjacent to the first moving means is implemented in the shape of a polygonal cylinder longer than the length of the second surface corresponding to the first surface. The method according to claim 6,
And a second surface of the chamber body is a surface on which a substrate is transferred and conveyed. Transferring the first substrate to the first substrate deposition region in the chamber, and performing an alignment process on the transferred first substrate;
Performing a deposition process of the first substrate by moving a deposition source within the first substrate deposition region when the alignment of the first substrate is completed;
Performing a deposition process of the first substrate and simultaneously transferring a second substrate to a second substrate deposition region in the chamber, and performing an alignment process on the transferred second substrate;
When the deposition of the first substrate and the alignment of the second substrate are completed, the deposition source is rotated in the first direction and positioned in the second substrate deposition region;
And depositing the second substrate by moving the deposition source in the second substrate deposition region. The method of claim 8,
And performing a deposition process on the second substrate and simultaneously transferring a new first substrate to the first substrate deposition region in the chamber, and performing an alignment process. delete delete delete delete delete delete A plurality of organic material deposition apparatuses;
A transfer chamber connecting the plurality of organic material deposition apparatuses in common;
Includes a load lock chamber for loading and / or unloading the substrate that is introduced into the organic material deposition apparatus through the transfer chamber,
In the plurality of organic material deposition apparatus,
A first organic vapor deposition apparatus for performing deposition on at least two substrates, performing deposition on any one of the at least two substrates, and transferring and aligning the remaining substrates;
The first organic vapor deposition apparatus,
A chamber in which the interior is divided into a first substrate deposition region and a second substrate deposition region;
An organic vapor deposition source which moves in the first or second substrate deposition region and injects organic particles onto the first substrate or the second substrate;
First moving means for rotating the organic material deposition source in a first direction such that the organic material deposition source is positioned in a first or second substrate deposition region, respectively;
Second moving means for reciprocating the organic material deposition source in a second direction in the first or second substrate deposition region, respectively;
The direction in which the organic material deposition source moves to perform deposition on the first or second substrate (second direction) and the direction in which the organic material deposition source moves to deposit another substrate (first direction) are different from each other. Organic deposition system, characterized in that implemented. 17. The method of claim 16,
The organic material deposition system of claim 1, wherein the organic material deposition apparatus includes a second organic material deposition apparatus that sequentially performs a transfer, alignment, and deposition process for one substrate. delete 17. The method of claim 16,
The body of the chamber is an organic material deposition system, characterized in that the length of the first surface adjacent to the first moving means is implemented in the shape of a polygonal cylinder longer than the length of the second surface corresponding to the first surface. The method of claim 19,
And a second surface of the chamber body is a surface on which a substrate is transferred and conveyed.

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