CN103100779B - 焊球印刷机 - Google Patents
焊球印刷机 Download PDFInfo
- Publication number
- CN103100779B CN103100779B CN201210452191.6A CN201210452191A CN103100779B CN 103100779 B CN103100779 B CN 103100779B CN 201210452191 A CN201210452191 A CN 201210452191A CN 103100779 B CN103100779 B CN 103100779B
- Authority
- CN
- China
- Prior art keywords
- solder ball
- mask
- mentioned
- filling
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011248737A JP5808229B2 (ja) | 2011-11-14 | 2011-11-14 | ハンダボール印刷機 |
JP2011-248737 | 2011-11-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103100779A CN103100779A (zh) | 2013-05-15 |
CN103100779B true CN103100779B (zh) | 2015-06-03 |
Family
ID=48309163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210452191.6A Active CN103100779B (zh) | 2011-11-14 | 2012-11-13 | 焊球印刷机 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5808229B2 (zh) |
KR (1) | KR101328084B1 (zh) |
CN (1) | CN103100779B (zh) |
TW (1) | TWI516329B (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5948633B2 (ja) * | 2012-01-24 | 2016-07-06 | 京セラ株式会社 | 半田ボールの搭載方法 |
KR101550688B1 (ko) * | 2014-02-18 | 2015-09-07 | (주) 에스에스피 | 에어커텐을 이용한 솔더볼 공급장치 |
JP7279978B2 (ja) * | 2020-11-26 | 2023-05-23 | Aiメカテック株式会社 | 検査・リペア装置 |
JP7072919B2 (ja) * | 2020-11-26 | 2022-05-23 | Aiメカテック株式会社 | 基板処理装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3351420B2 (ja) * | 1991-09-02 | 2002-11-25 | 松下電器産業株式会社 | 塗布装置及び方法並びに印刷装置及び方法 |
CN101312136A (zh) * | 2007-05-21 | 2008-11-26 | 株式会社日立工业设备技术 | 焊球印刷装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148332A (ja) * | 1995-11-16 | 1997-06-06 | Ricoh Co Ltd | 微小粒子配列装置 |
JPH1034878A (ja) * | 1996-07-17 | 1998-02-10 | Saitama Nippon Denki Kk | クリームはんだ印刷スキージ装置及び印刷方法 |
JP2003069206A (ja) * | 2001-08-23 | 2003-03-07 | Hitachi Communication Technologies Ltd | 半田塗布装置 |
US20040003891A1 (en) * | 2002-07-02 | 2004-01-08 | Asm Assembly Automation Ltd. | Apparatus and method for application of adhesive substances to objects |
JP2005183423A (ja) | 2003-12-16 | 2005-07-07 | Hitachi Metals Ltd | 導電性ボールの供給装置および供給方法 |
US7472473B2 (en) * | 2006-04-26 | 2009-01-06 | Ibiden Co., Ltd. | Solder ball loading apparatus |
JP5141952B2 (ja) * | 2007-08-23 | 2013-02-13 | 澁谷工業株式会社 | 導電性ボールの搭載装置 |
JP2009272529A (ja) * | 2008-05-09 | 2009-11-19 | Ngk Spark Plug Co Ltd | 半田ボール搭載装置及び配線基板の製造方法 |
JP5299754B2 (ja) | 2008-09-03 | 2013-09-25 | アスリートFa株式会社 | 基板に導電性ボールを搭載する方法 |
JP4973633B2 (ja) * | 2008-09-24 | 2012-07-11 | 株式会社日立プラントテクノロジー | ハンダボール印刷装置 |
JP2010080783A (ja) * | 2008-09-26 | 2010-04-08 | Athlete Fa Kk | 基板に導電性ボールを搭載するための装置 |
JP5251699B2 (ja) | 2009-04-23 | 2013-07-31 | 株式会社日立プラントテクノロジー | ハンダボール印刷装置およびハンダボール印刷方法 |
-
2011
- 2011-11-14 JP JP2011248737A patent/JP5808229B2/ja active Active
-
2012
- 2012-11-06 TW TW101141143A patent/TWI516329B/zh active
- 2012-11-13 KR KR1020120127884A patent/KR101328084B1/ko active IP Right Grant
- 2012-11-13 CN CN201210452191.6A patent/CN103100779B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3351420B2 (ja) * | 1991-09-02 | 2002-11-25 | 松下電器産業株式会社 | 塗布装置及び方法並びに印刷装置及び方法 |
CN101312136A (zh) * | 2007-05-21 | 2008-11-26 | 株式会社日立工业设备技术 | 焊球印刷装置 |
Also Published As
Publication number | Publication date |
---|---|
JP5808229B2 (ja) | 2015-11-10 |
TWI516329B (zh) | 2016-01-11 |
CN103100779A (zh) | 2013-05-15 |
KR20130054161A (ko) | 2013-05-24 |
JP2013105889A (ja) | 2013-05-30 |
KR101328084B1 (ko) | 2013-11-13 |
TW201341101A (zh) | 2013-10-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: HITACHI,LTD. Free format text: FORMER OWNER: HITACHI PLANT TECHNOLOGIES LTD. Effective date: 20140115 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20140115 Address after: Tokyo, Japan Applicant after: Hitachi Ltd. Address before: Tokyo, Japan, Japan Applicant before: Hitachi Plant Technologies Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170111 Address after: Ibaraki Patentee after: Ai Meike Technology Co Ltd Address before: Tokyo, Japan Patentee before: Hitachi Ltd. |