CN103098207A - 具有热管理的堆叠半导体芯片设备 - Google Patents

具有热管理的堆叠半导体芯片设备 Download PDF

Info

Publication number
CN103098207A
CN103098207A CN2011800435900A CN201180043590A CN103098207A CN 103098207 A CN103098207 A CN 103098207A CN 2011800435900 A CN2011800435900 A CN 2011800435900A CN 201180043590 A CN201180043590 A CN 201180043590A CN 103098207 A CN103098207 A CN 103098207A
Authority
CN
China
Prior art keywords
semiconductor chip
circuit board
thermal management
management device
aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800435900A
Other languages
English (en)
Chinese (zh)
Inventor
贾迈尔·里法伊-艾哈迈德
布莱恩·布莱克
迈克尔·Z·苏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ATI Technologies ULC
Advanced Micro Devices Inc
Original Assignee
ATI Technologies ULC
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATI Technologies ULC, Advanced Micro Devices Inc filed Critical ATI Technologies ULC
Publication of CN103098207A publication Critical patent/CN103098207A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN2011800435900A 2010-09-24 2011-09-21 具有热管理的堆叠半导体芯片设备 Pending CN103098207A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/889,590 2010-09-24
US12/889,590 US8472190B2 (en) 2010-09-24 2010-09-24 Stacked semiconductor chip device with thermal management
PCT/US2011/052466 WO2012040271A1 (en) 2010-09-24 2011-09-21 Stacked semiconductor chip device with thermal management

Publications (1)

Publication Number Publication Date
CN103098207A true CN103098207A (zh) 2013-05-08

Family

ID=44741715

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800435900A Pending CN103098207A (zh) 2010-09-24 2011-09-21 具有热管理的堆叠半导体芯片设备

Country Status (6)

Country Link
US (1) US8472190B2 (https=)
EP (1) EP2619795A1 (https=)
JP (1) JP2013538012A (https=)
KR (1) KR20130102052A (https=)
CN (1) CN103098207A (https=)
WO (1) WO2012040271A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109075158A (zh) * 2016-04-12 2018-12-21 Mbda法国公司 设有多个互连的电子功能件的电子系统
CN110214373A (zh) * 2017-02-28 2019-09-06 华为技术有限公司 光电混合封装组件

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100956472B1 (ko) 2005-04-27 2010-05-07 에어 테스트 시스템즈 전자 장치들을 테스트하기 위한 장치
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
CN202276549U (zh) * 2011-09-26 2012-06-13 番禺得意精密电子工业有限公司 电连接组件
JP5167516B1 (ja) * 2011-11-30 2013-03-21 株式会社フジクラ 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体
US20130181359A1 (en) * 2012-01-13 2013-07-18 TW Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thinner Package on Package Structures
TWI508249B (zh) * 2012-04-02 2015-11-11 矽品精密工業股份有限公司 封裝件、半導體封裝結構及其製法
US20130308274A1 (en) * 2012-05-21 2013-11-21 Triquint Semiconductor, Inc. Thermal spreader having graduated thermal expansion parameters
US9209106B2 (en) * 2012-06-21 2015-12-08 Ati Technologies Ulc Thermal management circuit board for stacked semiconductor chip device
US9006908B2 (en) * 2012-08-01 2015-04-14 Marvell Israel (M.I.S.L) Ltd. Integrated circuit interposer and method of manufacturing the same
US9196575B1 (en) * 2013-02-04 2015-11-24 Altera Corporation Integrated circuit package with cavity in substrate
US9318464B2 (en) * 2013-05-21 2016-04-19 Advanced Micro Devices, Inc. Variable temperature solders for multi-chip module packaging and repackaging
US9653443B2 (en) * 2014-02-14 2017-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal performance structure for semiconductor packages and method of forming same
US9269700B2 (en) * 2014-03-31 2016-02-23 Micron Technology, Inc. Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods
US9391029B2 (en) * 2014-06-12 2016-07-12 Kabushiki Kaisha Toshiba Electronic device
US10553557B2 (en) 2014-11-05 2020-02-04 Infineon Technologies Austria Ag Electronic component, system and method
US10064287B2 (en) * 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
US10192846B2 (en) 2014-11-05 2019-01-29 Infineon Technologies Austria Ag Method of inserting an electronic component into a slot in a circuit board
KR101640341B1 (ko) * 2015-02-04 2016-07-15 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9996120B1 (en) * 2015-05-22 2018-06-12 EMC IP Holding Company LLC PCB module for increased connectivity
US9779940B2 (en) * 2015-07-01 2017-10-03 Zhuahai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Chip package
US9589920B2 (en) * 2015-07-01 2017-03-07 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Chip package
DE102015220676A1 (de) * 2015-10-22 2017-04-27 Zf Friedrichshafen Ag Leiterplatte und Anordnung mit einer Leiterplatte
US10854590B2 (en) * 2015-12-23 2020-12-01 Intel IP Corporation Semiconductor die package with more than one hanging die
TWI729056B (zh) 2016-01-08 2021-06-01 美商艾爾測試系統 測試器設備及測試微電子裝置的方法
US10121766B2 (en) * 2016-06-30 2018-11-06 Micron Technology, Inc. Package-on-package semiconductor device assemblies including one or more windows and related methods and packages
CN210692526U (zh) * 2016-08-31 2020-06-05 株式会社村田制作所 电路模块
US10797039B2 (en) * 2016-12-07 2020-10-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
US10062634B2 (en) * 2016-12-21 2018-08-28 Micron Technology, Inc. Semiconductor die assembly having heat spreader that extends through underlying interposer and related technology
EP4632390A3 (en) 2017-03-03 2026-01-14 AEHR Test Systems Electronics tester
US9899305B1 (en) * 2017-04-28 2018-02-20 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure
US10269678B1 (en) 2017-12-05 2019-04-23 Nxp Usa, Inc. Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
US11101145B2 (en) * 2018-08-14 2021-08-24 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material
US11152333B2 (en) * 2018-10-19 2021-10-19 Micron Technology, Inc. Semiconductor device packages with enhanced heat management and related systems
US10973114B2 (en) 2018-10-29 2021-04-06 L3 Technologies, Inc. Indium-based interface structures, apparatus, and methods for forming the same
CN111295045B (zh) * 2018-12-07 2023-08-04 台达电子工业股份有限公司 电源模块
US11553616B2 (en) * 2018-12-07 2023-01-10 Delta Electronics, Inc. Module with power device
US10943880B2 (en) 2019-05-16 2021-03-09 Advanced Micro Devices, Inc. Semiconductor chip with reduced pitch conductive pillars
KR102377811B1 (ko) 2019-08-09 2022-03-22 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
WO2021212426A1 (en) * 2020-04-23 2021-10-28 Hongfujin Precision Industry(Wuhan)Co., Ltd. Stacked circuit boards
US20210391301A1 (en) * 2020-06-10 2021-12-16 Intel Corporation High speed memory system integration
KR102812686B1 (ko) * 2020-06-22 2025-05-27 엘지이노텍 주식회사 통신 모듈
US11769752B2 (en) 2020-07-24 2023-09-26 Micron Technology, Inc. Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods
JP7510817B2 (ja) * 2020-08-25 2024-07-04 新光電気工業株式会社 半導体装置及びその製造方法
CN120254561B (zh) 2020-10-07 2026-03-03 雅赫测试系统公司 电子测试器
US20220197806A1 (en) * 2020-12-23 2022-06-23 Intel Corporation High speed memory system integration
US11625079B2 (en) * 2020-12-23 2023-04-11 Quanta Computer Inc. Staggered arrangement graphite heat sink for liquid cooling cold plate
JP7447785B2 (ja) * 2020-12-25 2024-03-12 株式会社デンソー 電子装置
US12262514B2 (en) * 2021-04-08 2025-03-25 International Business Machines Corporation Heat sinks with beyond-board fins
KR102945634B1 (ko) 2021-08-27 2026-03-27 삼성전자주식회사 반도체 패키지
CN114334944B (zh) * 2021-12-01 2025-10-03 长电科技管理有限公司 一种封装结构及制作方法
JP2026510132A (ja) 2022-10-31 2026-04-01 キョーセラ・エーブイエックス・コンポーネンツ・コーポレーション 多層コンデンサ
CN116053232A (zh) * 2022-12-20 2023-05-02 成都海光集成电路设计有限公司 一种电子封装、电子封装的制作方法及电子设备
JP2026501645A (ja) 2022-12-30 2026-01-16 エイアー テスト システムズ 電子試験器
US20240353634A1 (en) * 2023-04-20 2024-10-24 Ciena Corporation Managing relative thermal drift of carrier-mounted integrated circuits
US20250372585A1 (en) * 2023-06-09 2025-12-04 Advanced Micro Devices, Inc. Integrated system in package
US20250096051A1 (en) * 2023-09-20 2025-03-20 Qualcomm Incorporated Package comprising a substrate with cavity, and an integrated device located in the cavity of the substrate
DE102023131472A1 (de) * 2023-11-13 2025-05-15 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5567654A (en) * 1994-09-28 1996-10-22 International Business Machines Corporation Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
US5821762A (en) * 1994-02-28 1998-10-13 Mitsubishi Denki Kabushiki Kaisha Semiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrate
US6501164B1 (en) * 2001-06-26 2002-12-31 Siliconware Precision Industries Co., Ltd. Multi-chip semiconductor package with heat dissipating structure
JP2004207566A (ja) * 2002-12-26 2004-07-22 Seiko Instruments Inc 半導体装置、表示装置、及び、その製造方法
US20040217485A1 (en) * 2003-05-02 2004-11-04 Advanced Semiconductor Engineering Inc. Stacked flip chip package
CN1734756A (zh) * 2004-08-11 2006-02-15 索尼株式会社 电子回路装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5856911A (en) * 1996-11-12 1999-01-05 National Semiconductor Corporation Attachment assembly for integrated circuits
US6060777A (en) * 1998-07-21 2000-05-09 Intel Corporation Underside heat slug for ball grid array packages
US6853070B2 (en) * 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
TW502406B (en) * 2001-08-01 2002-09-11 Siliconware Precision Industries Co Ltd Ultra-thin package having stacked die
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
US6712621B2 (en) * 2002-01-23 2004-03-30 High Connection Density, Inc. Thermally enhanced interposer and method
US6861750B2 (en) * 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US6858932B2 (en) * 2002-02-07 2005-02-22 Freescale Semiconductor, Inc. Packaged semiconductor device and method of formation
US6906415B2 (en) 2002-06-27 2005-06-14 Micron Technology, Inc. Semiconductor device assemblies and packages including multiple semiconductor devices and methods
US7122906B2 (en) 2004-01-29 2006-10-17 Micron Technology, Inc. Die-wafer package and method of fabricating same
JP2007123457A (ja) * 2005-10-27 2007-05-17 Nec Electronics Corp 半導体モジュール
US7903425B2 (en) * 2006-06-27 2011-03-08 Lenovo (Singapore) Pte. Ltd. Integrated circuit chip thermal solution
US7646093B2 (en) * 2006-12-20 2010-01-12 Intel Corporation Thermal management of dies on a secondary side of a package
US20100181594A1 (en) * 2008-03-25 2010-07-22 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and cavity over post

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821762A (en) * 1994-02-28 1998-10-13 Mitsubishi Denki Kabushiki Kaisha Semiconductor device, production method therefor, method for testing semiconductor elements, test substrate for the method and method for producing the test substrate
US5567654A (en) * 1994-09-28 1996-10-22 International Business Machines Corporation Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
US6501164B1 (en) * 2001-06-26 2002-12-31 Siliconware Precision Industries Co., Ltd. Multi-chip semiconductor package with heat dissipating structure
JP2004207566A (ja) * 2002-12-26 2004-07-22 Seiko Instruments Inc 半導体装置、表示装置、及び、その製造方法
US20040217485A1 (en) * 2003-05-02 2004-11-04 Advanced Semiconductor Engineering Inc. Stacked flip chip package
CN1734756A (zh) * 2004-08-11 2006-02-15 索尼株式会社 电子回路装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109075158A (zh) * 2016-04-12 2018-12-21 Mbda法国公司 设有多个互连的电子功能件的电子系统
CN109075158B (zh) * 2016-04-12 2023-05-23 Mbda法国公司 设有多个互连的电子功能件的电子系统
CN110214373A (zh) * 2017-02-28 2019-09-06 华为技术有限公司 光电混合封装组件

Also Published As

Publication number Publication date
WO2012040271A1 (en) 2012-03-29
EP2619795A1 (en) 2013-07-31
KR20130102052A (ko) 2013-09-16
JP2013538012A (ja) 2013-10-07
US20120075807A1 (en) 2012-03-29
US8472190B2 (en) 2013-06-25

Similar Documents

Publication Publication Date Title
CN103098207A (zh) 具有热管理的堆叠半导体芯片设备
US8378471B2 (en) Semiconductor chip bump connection apparatus and method
KR100772604B1 (ko) 집적화된 전자 칩 및 상호접속 디바이스와 그 제조프로세스
JP5224845B2 (ja) 半導体装置の製造方法及び半導体装置
US6906417B2 (en) Ball grid array utilizing solder balls having a core material covered by a metal layer
TWI483357B (zh) 封裝結構
TWI614865B (zh) 用以與上ｉｃ封裝體耦合以形成封裝體疊加（ｐｏｐ）總成的下ｉｃ封裝體結構，以及包含如是下ｉｃ封裝體結構的封裝體疊加（ｐｏｐ）總成
US10211160B2 (en) Microelectronic assembly with redistribution structure formed on carrier
CN102326247B (zh) 用于集成电路的面对面(f2f)复合式结构
JP2008263197A (ja) 半導体チップを有する回路基板アセンブリ、これを利用する電気アセンブリ、及びこれを利用する情報処理システム
CN114144875A (zh) 具有顶侧存储器模块的ic封装
JP2015082576A (ja) 電子装置、電子機器及び電子装置の製造方法
JPH07170098A (ja) 電子部品の実装構造および実装方法
US7545028B2 (en) Solder ball assembly for a semiconductor device and method of fabricating same
US8546187B2 (en) Electronic part and method of manufacturing the same
TW201104767A (en) Semiconductor package with NSMD type solder mask and method for manufacturing the same
JP3847602B2 (ja) 積層型半導体装置及びその製造方法並びに半導体装置搭載マザーボード及び半導体装置搭載マザーボードの製造方法
JP2003069181A (ja) 電子機器装置及びその製造方法
JP2006210566A (ja) 半導体装置
TWI596678B (zh) 半導體封裝結構及其製作方法
JP5923943B2 (ja) 半導体装置及び電子装置
TWI527177B (zh) 晶片構件與晶片封裝體
TWI290814B (en) Method for repairing metal protection layers on electrical connecting pads of circuit boards
WO2016203927A1 (ja) 複合型半導体装置およびその製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130508