1290814 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電路板電性連接墊表面之金屬 保護層修補方法，尤指一種對電路板表面之電性連接墊表 面的金屬保護層有缺陷之位置進行修補之方法。 【先前技術】 由於電子產業相關技術快速提昇，伴隨電子產品_小 化之趨勢，半導體封裝業者亦面臨著製程上許多關:處^、 其中’用於半導體封裝之基板表面即形成有多數例如由銅 材質所組成之導電線路，並由其加以延伸而成之電性連接 墊’以作為傳輸電子訊號或電源，同時，通f會在該電性 連接墊之外露表面形成有一如鎳/金（Ni/Au)之金屬保護-層’以有效提供其餘導電元件如金線、凸塊或焊球與晶片 或電路板之電性連接，亦可避免因外界環境之影響導致該 電性連接墊表面產生氧化層。 該電性連接塾可例如為半導體晶片與電路板之間以 電性連接之打線墊(wire bonding pad)，半導體覆晶剑 衣土反Fhp-dup package substrate )與晶片電性連接之^ 塊焊墊（B_p pad)，或被動元件與電路板之間電性連接之 表面Ά著墊（SMT pad)，封|基板與電路板作電性連接 球墊(Ball pad)等，於該電性連接墊表面形成之係如錄/金 2屬保護層，以提供包覆於該金屬保護層内之電性連接 ，一(通常為金屬銅）不易受外界環境影響而產生氧化，以 提面打線、凸塊、預焊錫或谭球等植設於電性連接塾表面 19525 5 !29〇8η 之電性連接品質。 ♦凊芩閱第1Α至1C圖，係為習知技藝中於一電路板之 包1'生連接墊表面形成金屬保護層之方法示意圖。為使其中 屬保護層正確形成於電性連接墊之表面，係在一完成 耵，製程而形成有圖案化之線路層12之電路板1表面上， 如第1A圖所示；利用印刷（pdnting)或塗佈（c〇atin幻形成 係士、、、彔漆之纟巴緣保護層l8(S〇lder Mask)於該電路板i之 _表面’且该電路板i表面之線路層12包含有複數個電性連 妾墊15並使该絕緣保護層丨8於該電性連接墊15處形成 有開孔18〇，以露出該電性連接墊15，如第1B圖所示； 俾t進仃鎳/金製程時，於外露出該絕緣保護層開孔180之 包陡連接墊15表面形成金屬保護層丨6，如第丨c圖所示。 一然而，為符合市場需求，半導體封裝之結構力求輕薄 、J 7半‘體晶片朝向小尺寸、高積集化（integrati〇n) 」°备展又作為晶片承載件（Chip carrier)之電路板佈 鲁有门⑴度之私性連接墊，使該承載於基板上之半導體曰 .片，路板形成良好且完整之電性連接，俾令高積集： ；之晶片運作自如，且完全發揮其功能及特性以縮小積體電 路(1C)面積’而具有高密度與多接腳化特性的球栅陣 (BGA)結構、覆晶型叫啊結構、晶片尺寸封裝（咖1290814 IX. Description of the Invention: [Technical Field] The present invention relates to a metal protective layer repairing method for a surface of an electrical connection pad of a circuit board, and more particularly to a metal protective layer for the surface of an electrical connection pad on a surface of a circuit board. The method of repairing the defective location. [Prior Art] Due to the rapid advancement of related technologies in the electronics industry, along with the trend of electronic products, the semiconductor package industry is also faced with many processes in the process: where the surface of the substrate used for semiconductor packaging is formed, for example, by An electrically conductive circuit composed of a copper material and an electrical connection pad extending therefrom for transmitting an electronic signal or a power source, and at the same time, a surface such as nickel/gold is formed on the exposed surface of the electrical connection pad. The metal protection layer of Ni/Au is effective to provide electrical connection between the remaining conductive components such as gold wires, bumps or solder balls and the wafer or circuit board, and also avoids the surface of the electrical connection pad due to the influence of the external environment. An oxide layer is produced. The electrical connection can be, for example, a wire bonding pad electrically connected between the semiconductor wafer and the circuit board, and a semiconductor chip-to-chip assembly. The pad (B_p pad), or the surface of the passive component and the circuit board is electrically connected to the surface (SMT pad), and the sealing substrate and the circuit board are electrically connected to the ball pad (Ball pad), etc., and the electrical connection is made. The surface of the pad is formed by a protective layer of gold/gold 2 to provide an electrical connection covering the metal protective layer. One (usually metallic copper) is not easily affected by the external environment and is oxidized to lift the surface. Bumps, pre-solders, or Tan balls are implanted on the surface of the electrical connection port 19525 5 !29〇8η. ♦ Referring to Figures 1 to 1C, a schematic diagram of a method of forming a metal protective layer on the surface of a package 1' of a circuit board in the prior art. In order to correctly form the protective layer on the surface of the electrical connection pad, on the surface of the circuit board 1 on which the patterned circuit layer 12 is formed after completion, as shown in FIG. 1A; using printing (pdnting) Or coating (c〇atin phantom forming, 彔 纟 纟 保护 保护 Mask Mask Mask Mask 于 于 于 于 于 于 于 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且 且There is a plurality of electrical connection pads 15 and the insulating protective layer 8 is formed with an opening 18 于 at the electrical connection pad 15 to expose the electrical connection pad 15 as shown in FIG. 1B; When the nickel/gold process is introduced, a metal protective layer 丨6 is formed on the surface of the steep connection pad 15 which exposes the insulating protective layer opening 180, as shown in the figure 丨c. However, in order to meet the market demand, the semiconductor package The structure is designed to be thin and light, and the J 7 semi-body wafer is oriented toward a small size and high integration. In addition, it is used as a chip carrier (Chip carrier). The board has a door (1) degree of private connection. Pad, so that the semiconductor rafter, the board, which is carried on the substrate, forms a good and complete electrical connection The high-density and multi-pinning ball grid array (BGA) structure and overlay Crystal type is called structure, wafer size package (Caf
ChiP如Pack吻）與多晶片模組（MCM，Multi Chip ’ Module)等封裝件已日漸成為封裝市場上的主流。Packages such as ChiP and Pack (MCM) have become the mainstream in the packaging market.
准在半導體晶片之積體電路製程已縮小至90nm，且 封裝尺寸亦不斷縮小至幾乎與晶片同大（約僅為晶片之U 6 19525 1290814 倍）時，如何開發可與半導體晶片搭配的細線路（FineHow to develop a fine circuit that can be matched with a semiconductor wafer when the integrated circuit process of the semiconductor wafer has been reduced to 90 nm and the package size is shrinking to almost the same size as the wafer (about U 6 19525 1290814 times the wafer) (Fine
..)鬲饴度與小孔控之電路板，無疑是積體電路（ic) 產業乃至其他相關電子產業進入下一世代技術之重要研發 課題。惟若欲將導線精度再繼續發展，相對於基板上電性 連接墊之尺寸面積與相鄰間距（p滅）亦需隨之縮減，導致 形成於該電性連接墊處之絕緣保護層開Π太小，致使金屬 保護層之金屬材料無法有效形成於該電性連接墊表面，使 得製程良率降低及製程成本增加。 因此，如何提出一矛重電性連接塾表面金屬保護層修補 方法，以解決習知電路板電性連接墊表面金屬保護層缺失 良率降低，製程成本增加之缺失，實已成爲 業界亟待克服之課題。 【發明内容】 鑒於上述習知技術之種種缺點，本發明之主要 :提：-種電路板電性連接墊表面之金屬保護層修補方 法，付以提升製程良率、降低製程成本。 接墊其他目的’本發明提供—種電路板電性每 接^面之金屬保護層修補方法，該方法係包括：提供至 電性連接墊之電路板，於該些電性連指 成有金屬㈣層’其中部份金屬保護層具有至少 ;缺陷：以㈣亥有缺陷之電性連接塾表面以微液滴 (m1Cr〇drOP)製程進行修補。 -中广無形成金屬保護層及她 '、 心屬保護層之材料係選自金、鎳、鈀、銀、 19525 7 129081.4 錫、鎳/鈀、鉻/鈦、鎳/金、鈀/金及鎳/|e/金所組成群组之 其中一者。 又該該電性連接墊係為打線墊（wire b〇nding pad)、凸..) The circuit board of the twist and small hole control is undoubtedly an important research and development project for the integrated circuit (ic) industry and other related electronics industries to enter the next generation of technology. However, if the accuracy of the wire is to be further developed, the size area and the adjacent pitch (p-off) of the electrical connection pad on the substrate also need to be reduced, resulting in the opening of the insulating protective layer formed on the electrical connection pad. Too small, the metal material of the metal protective layer can not be effectively formed on the surface of the electrical connection pad, so that the process yield is reduced and the process cost is increased. Therefore, how to propose a repair method for the surface metal protective layer of a spear heavy electrical connection to solve the problem of the lack of yield loss of the metal protective layer on the surface of the electrical connection pad of the conventional circuit board, and the lack of process cost increase has become an urgent need for the industry to overcome Question. SUMMARY OF THE INVENTION In view of the above disadvantages of the prior art, the main object of the present invention is to provide a method for repairing a metal protective layer on the surface of an electrical connection pad of a circuit board, thereby improving process yield and reducing process cost. Other purposes of the present invention, the present invention provides a method for repairing a metal protective layer for each surface of a circuit board, the method comprising: providing a circuit board to an electrical connection pad, wherein the electrical connection is made of metal (4) Layer 'Some of the metal protective layers have at least; defects: the surface of the electrical connection with (4) Hai defects is repaired by the micro-droplet (m1Cr〇drOP) process. - Zhongguang non-formed metal protective layer and her ', heart protective layer material is selected from gold, nickel, palladium, silver, 19525 7 129081.4 tin, nickel / palladium, chromium / titanium, nickel / gold, palladium / gold and One of the groups consisting of nickel/|e/gold. Moreover, the electrical connection pad is a wire b〇nding pad, convex
塊焊墊（Bump pad)、表面黏著墊（SMT pad)及焊球墊（BaUBump pad, surface mount pad (SMT pad) and solder ball pad (BaU
Pad )其中之一者。本發明主要係採用微液滴進行微沉積以 對電路板之電性連接墊上產生缺陷之金屬保護層進行修 補；因此，得於發現金屬保護層有缺陷時進行修補，進而 可大幅提升製程良率，同時亦使製程成本大幅降低。 ®【實施方式】 、以下係藉由特定的具體實施例說明本發明之實施方 式，熟悉此技藝之人士可由本說明書所揭示之内容輕易地 瞭解本發明之其他優點與功效。 請參閱第2A及2B圖，係為本發明之電性連接墊表面 之金屬保護層修補方法的流程步驟。 如第2A圖所示，首先提供一至少一表面形成有複數 #電性連接墊20之電路板2,該電性連接墊2〇、2〇,、2〇” 係可為打線墊（wire bonding pad)、凸塊焊墊（Bump…旬、 :表面黏著墊（SMTpad)或焊球，（Ballpad)，於該電路板2 表面形成有一絕緣保護層21，而該絕緣保護層2丨係具有 才夂數開孔21G以路出该電路板2表面之電性連接墊2〇、 20、20。該電性連接墊2〇上係形成有一金屬保護層Μ， 而該金屬保護層22係存在有缺陷，如該電路板2之3位置 上的電性連接墊20,表面的金屬保護層22ι形成不完全， 或如該電路板2之5位置上的電性連接塾2〇 ”無形成金屬 19525 8 1290814 保護層。 如第2B圖所示，於該電路板2表面之^位置處的 電性連接塾2〇,、2〇”表面以微液滴3 製程進 行化學反應而微沉積-金屬層，俾可在該電性連接塾2〇,、 ，表面形成金屬保護層22以進行修補，從而可提升製程 率’降低製程成本。上述金屬保護層之材料係選自金、 -j、把、銀、錫、鎳/纪、鉻/鈦、鎳/金、把/金及鎳/把/金 所組群組之其中一者。 ⑩〜上述之金屬保護層22若為單層金屬，該微液滴3進 IS二崎_ :若為兩層以上之金屬層，則該微液 人之掀化學沉積，俾以在該電性連接墊20表面 =雙以層之金屬保護層22，又Μ多層以上 類推以形成多層金屬層之金屬保護層22。 -理制二Π::中’係於該電路板製程（即電路板表面處 鏖積rij 後㈣微液滴製料行化學反應而微沉 •牙貝i屬層，以作金屬保護層之缺陷修補。 :護層電路板電性連接墊表面之金屬保 / 要係知用微液滴進行微沉積以h ，發明，可於發現全屬^t 丁修補，因此，透過本 料， 屬保護層有缺陷時採用本發明之方㈣ 该缺進行有效修補，而可大幅/對 製程成本大幅降低。 U良率’同％亦使 效，2實施例僅為例示性說明本發明之原理及其功 用於限制本發明。任何熟習此項技藝之人士均可 19525 9 1290814 在不違背本發明之精神及範嘴下，對上述實施例進行修 與變化。因此，本發明之權利保護範圍，應如後述之申終 專利範圍所列。 月 【圖式簡單說明】 第1A至1C圖，係為習知技藝中於一電路板之電性連 接㈣:面形成鎳/金金屬保護層之方法示意圖；以及Pad) One of them. The invention mainly adopts micro-droplet micro-deposition to repair the metal protective layer which is defective on the electrical connection pad of the circuit board; therefore, it can be repaired when the metal protective layer is found to be defective, thereby greatly improving the process yield. At the same time, the cost of the process is greatly reduced. ® [Embodiment] The following embodiments of the present invention are described by way of specific embodiments, and those skilled in the art can readily appreciate the other advantages and advantages of the present invention. Please refer to Figures 2A and 2B, which are process steps of the metal protective layer repairing method for the surface of the electrical connection pad of the present invention. As shown in FIG. 2A, a circuit board 2 having at least one surface formed with a plurality of electrical connection pads 20 is provided. The electrical connection pads 2, 2, 2, 2 can be wire bonding pads. Pad), bump pad (Bump..., surface mount pad (SMTpad) or solder ball, (Ballpad), an insulating protective layer 21 is formed on the surface of the circuit board 2, and the insulating protective layer 2 has a The plurality of openings 21G are provided to electrically connect the electrical connection pads 2, 20, and 20 of the surface of the circuit board 2. The electrical connection pads 2 are formed with a metal protective layer Μ, and the metal protective layer 22 is present. Defects, such as the electrical connection pads 20 at the position of the circuit board 2, the surface of the metal protective layer 22i is incomplete, or the electrical connection 位置2〇 at the position of the circuit board 2, 5" no metal 19525 8 1290814 Protective layer. As shown in Fig. 2B, the electrical connection 塾2〇, 2〇” on the surface of the board 2 is chemically reacted by microdroplet 3 process to form a metal layer.俾, in the electrical connection 塾2〇, , the surface forms a metal protective layer 22 for repair, thereby improving The process rate 'reduced process cost. The material of the above metal protective layer is selected from the group consisting of gold, -j, handle, silver, tin, nickel/ki, chrome/titanium, nickel/gold, handle/gold and nickel/handle/gold. One of the groups. 10~ If the metal protective layer 22 is a single-layer metal, the micro-droplet 3 enters the IS-sakis_: if it is a metal layer of two or more layers, the chemical deposition of the micro-liquid , in the surface of the electrical connection pad 20 = double layer of metal protection layer 22, and more than a plurality of layers of analogy to form a metal protection layer 22 of the multilayer metal layer. -Technology 2:: 'in the circuit The board process (that is, after the rij is accumulated on the surface of the board) (4) The microdroplet is chemically reacted to form a micro-sinking layer, which is used as a metal protective layer to repair the defect. : The surface of the protective circuit board electrical connection pad Metal protection / to know that micro-deposits for micro-deposition with h, the invention, can be found to be all repairs, therefore, through the material, the protective layer is defective when using the invention (4) Effective repair, but can greatly reduce / significantly reduce the cost of the process. U yield 'the same % is also effective, 2 examples are only illustrative The principles of the present invention and its functions are intended to be illustrative of the present invention. Any person skilled in the art can use the present invention to modify and modify the above embodiments without departing from the spirit and scope of the present invention. The scope of protection of rights shall be as listed in the scope of the patent application as described later. Month [Simple description of the drawings] Figures 1A to 1C are electrical connections in a circuit board in the prior art (4): surface formation of nickel/gold Schematic diagram of a method of metal protective layer;
第2 A及2B圖，係為本發明之電路板電性連接墊表面 之金屬保護層修補方法之流程圖。 【主要元件符號說明】2A and 2B are flow charts of a metal protective layer repairing method on the surface of the electrical connection pad of the circuit board of the present invention. [Main component symbol description]
1、2 1215、20、20,、20，， 16 、 22 、 221 18、21 180 、 210 a、b 電路板 線路層 11生連接墊 金屬保護層 絕緣保護層 開孔 微液滴 位置 10 195251, 2 1215, 20, 20, 20, 16, 16 , 221 18, 21 180 , 210 a, b circuit board circuit layer 11 raw connection pad metal protective layer insulating protective layer opening micro droplet position 10 19525