KR20130102052A - 열 관리를 갖춘 적층형 반도체 칩 장치 - Google Patents

열 관리를 갖춘 적층형 반도체 칩 장치 Download PDF

Info

Publication number
KR20130102052A
KR20130102052A KR1020137007014A KR20137007014A KR20130102052A KR 20130102052 A KR20130102052 A KR 20130102052A KR 1020137007014 A KR1020137007014 A KR 1020137007014A KR 20137007014 A KR20137007014 A KR 20137007014A KR 20130102052 A KR20130102052 A KR 20130102052A
Authority
KR
South Korea
Prior art keywords
semiconductor chip
thermal management
circuit board
opening
management device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020137007014A
Other languages
English (en)
Korean (ko)
Inventor
자말 레파이-아메드
브라이언 블랙
마이클 제트. 수
Original Assignee
에이티아이 테크놀로지스 유엘씨
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에이티아이 테크놀로지스 유엘씨, 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 에이티아이 테크놀로지스 유엘씨
Publication of KR20130102052A publication Critical patent/KR20130102052A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07252—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H10W72/227—Multiple bumps having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/288—Configurations of stacked chips characterised by arrangements for thermal management of the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020137007014A 2010-09-24 2011-09-21 열 관리를 갖춘 적층형 반도체 칩 장치 Ceased KR20130102052A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/889,590 2010-09-24
US12/889,590 US8472190B2 (en) 2010-09-24 2010-09-24 Stacked semiconductor chip device with thermal management
PCT/US2011/052466 WO2012040271A1 (en) 2010-09-24 2011-09-21 Stacked semiconductor chip device with thermal management

Publications (1)

Publication Number Publication Date
KR20130102052A true KR20130102052A (ko) 2013-09-16

Family

ID=44741715

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137007014A Ceased KR20130102052A (ko) 2010-09-24 2011-09-21 열 관리를 갖춘 적층형 반도체 칩 장치

Country Status (6)

Country Link
US (1) US8472190B2 (https=)
EP (1) EP2619795A1 (https=)
JP (1) JP2013538012A (https=)
KR (1) KR20130102052A (https=)
CN (1) CN103098207A (https=)
WO (1) WO2012040271A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113201A (ko) * 2014-03-31 2016-09-28 마이크론 테크놀로지, 인크 열성능 개선형 적층 반도체 다이 조립체 및 관련 시스템 및 방법
KR20190085176A (ko) * 2016-12-21 2019-07-17 마이크론 테크놀로지, 인크 밑에 놓인 인터포저를 통해 확장되는 히트 스프레더를 갖는 반도체 다이 조립체 및 관련 기술
US12431403B2 (en) 2021-08-27 2025-09-30 Samsung Electronics Co., Ltd. Semiconductor package including thermal interface material (TIM) layers on semiconductor chips

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100956472B1 (ko) 2005-04-27 2010-05-07 에어 테스트 시스템즈 전자 장치들을 테스트하기 위한 장치
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
CN202276549U (zh) * 2011-09-26 2012-06-13 番禺得意精密电子工业有限公司 电连接组件
JP5167516B1 (ja) * 2011-11-30 2013-03-21 株式会社フジクラ 部品内蔵基板及びその製造方法並びに部品内蔵基板実装体
US20130181359A1 (en) * 2012-01-13 2013-07-18 TW Semiconductor Manufacturing Company, Ltd. Methods and Apparatus for Thinner Package on Package Structures
TWI508249B (zh) * 2012-04-02 2015-11-11 矽品精密工業股份有限公司 封裝件、半導體封裝結構及其製法
US20130308274A1 (en) * 2012-05-21 2013-11-21 Triquint Semiconductor, Inc. Thermal spreader having graduated thermal expansion parameters
US9209106B2 (en) * 2012-06-21 2015-12-08 Ati Technologies Ulc Thermal management circuit board for stacked semiconductor chip device
US9006908B2 (en) * 2012-08-01 2015-04-14 Marvell Israel (M.I.S.L) Ltd. Integrated circuit interposer and method of manufacturing the same
US9196575B1 (en) * 2013-02-04 2015-11-24 Altera Corporation Integrated circuit package with cavity in substrate
US9318464B2 (en) * 2013-05-21 2016-04-19 Advanced Micro Devices, Inc. Variable temperature solders for multi-chip module packaging and repackaging
US9653443B2 (en) * 2014-02-14 2017-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal performance structure for semiconductor packages and method of forming same
US9391029B2 (en) * 2014-06-12 2016-07-12 Kabushiki Kaisha Toshiba Electronic device
US10553557B2 (en) 2014-11-05 2020-02-04 Infineon Technologies Austria Ag Electronic component, system and method
US10064287B2 (en) * 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
US10192846B2 (en) 2014-11-05 2019-01-29 Infineon Technologies Austria Ag Method of inserting an electronic component into a slot in a circuit board
KR101640341B1 (ko) * 2015-02-04 2016-07-15 앰코 테크놀로지 코리아 주식회사 반도체 패키지
US9996120B1 (en) * 2015-05-22 2018-06-12 EMC IP Holding Company LLC PCB module for increased connectivity
US9779940B2 (en) * 2015-07-01 2017-10-03 Zhuahai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Chip package
US9589920B2 (en) * 2015-07-01 2017-03-07 Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. Chip package
DE102015220676A1 (de) * 2015-10-22 2017-04-27 Zf Friedrichshafen Ag Leiterplatte und Anordnung mit einer Leiterplatte
US10854590B2 (en) * 2015-12-23 2020-12-01 Intel IP Corporation Semiconductor die package with more than one hanging die
TWI729056B (zh) 2016-01-08 2021-06-01 美商艾爾測試系統 測試器設備及測試微電子裝置的方法
FR3050073B1 (fr) * 2016-04-12 2018-05-04 Mbda France Systeme electronique pourvu d'une pluralite de fonctions electroniques interconnectees
US10121766B2 (en) * 2016-06-30 2018-11-06 Micron Technology, Inc. Package-on-package semiconductor device assemblies including one or more windows and related methods and packages
CN210692526U (zh) * 2016-08-31 2020-06-05 株式会社村田制作所 电路模块
US10797039B2 (en) * 2016-12-07 2020-10-06 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming a 3D interposer system-in-package module
WO2018157314A1 (zh) * 2017-02-28 2018-09-07 华为技术有限公司 光电混合封装组件
EP4632390A3 (en) 2017-03-03 2026-01-14 AEHR Test Systems Electronics tester
US9899305B1 (en) * 2017-04-28 2018-02-20 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor package structure
US10269678B1 (en) 2017-12-05 2019-04-23 Nxp Usa, Inc. Microelectronic components having integrated heat dissipation posts, systems including the same, and methods for the fabrication thereof
US11101145B2 (en) * 2018-08-14 2021-08-24 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor device with dummy micro bumps between stacking dies to improve flowability of underfill material
US11152333B2 (en) * 2018-10-19 2021-10-19 Micron Technology, Inc. Semiconductor device packages with enhanced heat management and related systems
US10973114B2 (en) 2018-10-29 2021-04-06 L3 Technologies, Inc. Indium-based interface structures, apparatus, and methods for forming the same
CN111295045B (zh) * 2018-12-07 2023-08-04 台达电子工业股份有限公司 电源模块
US11553616B2 (en) * 2018-12-07 2023-01-10 Delta Electronics, Inc. Module with power device
US10943880B2 (en) 2019-05-16 2021-03-09 Advanced Micro Devices, Inc. Semiconductor chip with reduced pitch conductive pillars
KR102377811B1 (ko) 2019-08-09 2022-03-22 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
WO2021212426A1 (en) * 2020-04-23 2021-10-28 Hongfujin Precision Industry(Wuhan)Co., Ltd. Stacked circuit boards
US20210391301A1 (en) * 2020-06-10 2021-12-16 Intel Corporation High speed memory system integration
KR102812686B1 (ko) * 2020-06-22 2025-05-27 엘지이노텍 주식회사 통신 모듈
US11769752B2 (en) 2020-07-24 2023-09-26 Micron Technology, Inc. Stacked semiconductor die assemblies with substrate heat sinks and associated systems and methods
JP7510817B2 (ja) * 2020-08-25 2024-07-04 新光電気工業株式会社 半導体装置及びその製造方法
CN120254561B (zh) 2020-10-07 2026-03-03 雅赫测试系统公司 电子测试器
US20220197806A1 (en) * 2020-12-23 2022-06-23 Intel Corporation High speed memory system integration
US11625079B2 (en) * 2020-12-23 2023-04-11 Quanta Computer Inc. Staggered arrangement graphite heat sink for liquid cooling cold plate
JP7447785B2 (ja) * 2020-12-25 2024-03-12 株式会社デンソー 電子装置
US12262514B2 (en) * 2021-04-08 2025-03-25 International Business Machines Corporation Heat sinks with beyond-board fins
CN114334944B (zh) * 2021-12-01 2025-10-03 长电科技管理有限公司 一种封装结构及制作方法
JP2026510132A (ja) 2022-10-31 2026-04-01 キョーセラ・エーブイエックス・コンポーネンツ・コーポレーション 多層コンデンサ
CN116053232A (zh) * 2022-12-20 2023-05-02 成都海光集成电路设计有限公司 一种电子封装、电子封装的制作方法及电子设备
JP2026501645A (ja) 2022-12-30 2026-01-16 エイアー テスト システムズ 電子試験器
US20240353634A1 (en) * 2023-04-20 2024-10-24 Ciena Corporation Managing relative thermal drift of carrier-mounted integrated circuits
US20250372585A1 (en) * 2023-06-09 2025-12-04 Advanced Micro Devices, Inc. Integrated system in package
US20250096051A1 (en) * 2023-09-20 2025-03-20 Qualcomm Incorporated Package comprising a substrate with cavity, and an integrated device located in the cavity of the substrate
DE102023131472A1 (de) * 2023-11-13 2025-05-15 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3288840B2 (ja) * 1994-02-28 2002-06-04 三菱電機株式会社 半導体装置およびその製造方法
US5567654A (en) * 1994-09-28 1996-10-22 International Business Machines Corporation Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
US5856911A (en) * 1996-11-12 1999-01-05 National Semiconductor Corporation Attachment assembly for integrated circuits
US6060777A (en) * 1998-07-21 2000-05-09 Intel Corporation Underside heat slug for ball grid array packages
US6853070B2 (en) * 2001-02-15 2005-02-08 Broadcom Corporation Die-down ball grid array package with die-attached heat spreader and method for making the same
TW502417B (en) 2001-06-26 2002-09-11 Siliconware Precision Industries Co Ltd Chip-embedded-type semiconductor package with high heat dissipation
TW502406B (en) * 2001-08-01 2002-09-11 Siliconware Precision Industries Co Ltd Ultra-thin package having stacked die
US6580611B1 (en) * 2001-12-21 2003-06-17 Intel Corporation Dual-sided heat removal system
US6712621B2 (en) * 2002-01-23 2004-03-30 High Connection Density, Inc. Thermally enhanced interposer and method
US6861750B2 (en) * 2002-02-01 2005-03-01 Broadcom Corporation Ball grid array package with multiple interposers
US6858932B2 (en) * 2002-02-07 2005-02-22 Freescale Semiconductor, Inc. Packaged semiconductor device and method of formation
US6906415B2 (en) 2002-06-27 2005-06-14 Micron Technology, Inc. Semiconductor device assemblies and packages including multiple semiconductor devices and methods
JP3967263B2 (ja) * 2002-12-26 2007-08-29 セイコーインスツル株式会社 半導体装置及び表示装置
TWI225299B (en) 2003-05-02 2004-12-11 Advanced Semiconductor Eng Stacked flip chip package
US7122906B2 (en) 2004-01-29 2006-10-17 Micron Technology, Inc. Die-wafer package and method of fabricating same
JP4148201B2 (ja) * 2004-08-11 2008-09-10 ソニー株式会社 電子回路装置
JP2007123457A (ja) * 2005-10-27 2007-05-17 Nec Electronics Corp 半導体モジュール
US7903425B2 (en) * 2006-06-27 2011-03-08 Lenovo (Singapore) Pte. Ltd. Integrated circuit chip thermal solution
US7646093B2 (en) * 2006-12-20 2010-01-12 Intel Corporation Thermal management of dies on a secondary side of a package
US20100181594A1 (en) * 2008-03-25 2010-07-22 Lin Charles W C Semiconductor chip assembly with post/base heat spreader and cavity over post

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160113201A (ko) * 2014-03-31 2016-09-28 마이크론 테크놀로지, 인크 열성능 개선형 적층 반도체 다이 조립체 및 관련 시스템 및 방법
KR20190085176A (ko) * 2016-12-21 2019-07-17 마이크론 테크놀로지, 인크 밑에 놓인 인터포저를 통해 확장되는 히트 스프레더를 갖는 반도체 다이 조립체 및 관련 기술
US12431403B2 (en) 2021-08-27 2025-09-30 Samsung Electronics Co., Ltd. Semiconductor package including thermal interface material (TIM) layers on semiconductor chips

Also Published As

Publication number Publication date
WO2012040271A1 (en) 2012-03-29
EP2619795A1 (en) 2013-07-31
CN103098207A (zh) 2013-05-08
JP2013538012A (ja) 2013-10-07
US20120075807A1 (en) 2012-03-29
US8472190B2 (en) 2013-06-25

Similar Documents

Publication Publication Date Title
US8472190B2 (en) Stacked semiconductor chip device with thermal management
US10804204B2 (en) Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
US6864165B1 (en) Method of fabricating integrated electronic chip with an interconnect device
US8378471B2 (en) Semiconductor chip bump connection apparatus and method
CN102867800B (zh) 将功能芯片连接至封装件以形成层叠封装件
US5222014A (en) Three-dimensional multi-chip pad array carrier
CN104851842B (zh) 包括嵌入式表面安装器件的半导体器件及其形成方法
US8704353B2 (en) Thermal management of stacked semiconductor chips with electrically non-functional interconnects
TWI911259B (zh) 半導體系統封裝及其製造方法
CN102376667A (zh) 封装装置及其制造方法
US7545028B2 (en) Solder ball assembly for a semiconductor device and method of fabricating same
CN110784994B (zh) 印刷电路板结构及其制造方法
US8546187B2 (en) Electronic part and method of manufacturing the same
US20230197595A1 (en) Multi-chip high memory bandwidth configuration
JP5923943B2 (ja) 半導体装置及び電子装置
CN121218436A (zh) 基板、半导体器件及制作方法
HK1004352B (en) Stackable three-dimensional multiple chip semiconductor device and method for making the same

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
A302 Request for accelerated examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000