CN103098182B - 利用扣环的基板边缘调节 - Google Patents

利用扣环的基板边缘调节 Download PDF

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Publication number
CN103098182B
CN103098182B CN201180044017.1A CN201180044017A CN103098182B CN 103098182 B CN103098182 B CN 103098182B CN 201180044017 A CN201180044017 A CN 201180044017A CN 103098182 B CN103098182 B CN 103098182B
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CN
China
Prior art keywords
internal ring
substrate
outer shroud
ring
carrier head
Prior art date
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CN201180044017.1A
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English (en)
Chinese (zh)
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CN103098182A (zh
Inventor
H·C·陈
S·C-C·徐
Y·袁
H·张
G·S·丹达瓦特
M·D·塞法堤
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Applied Materials Inc
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Applied Materials Inc
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Publication date
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Priority to CN201310170453.4A priority Critical patent/CN103252715B/zh
Publication of CN103098182A publication Critical patent/CN103098182A/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/067—Work supports, e.g. adjustable steadies radially supporting workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
CN201180044017.1A 2010-08-06 2011-08-05 利用扣环的基板边缘调节 Active CN103098182B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310170453.4A CN103252715B (zh) 2010-08-06 2011-08-05 内扣环和外扣环

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US37164410P 2010-08-06 2010-08-06
US61/371,644 2010-08-06
US201161479271P 2011-04-26 2011-04-26
US61/479,271 2011-04-26
PCT/US2011/046828 WO2012019144A2 (en) 2010-08-06 2011-08-05 Substrate edge tuning with retaining ring

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201310170453.4A Division CN103252715B (zh) 2010-08-06 2011-08-05 内扣环和外扣环

Publications (2)

Publication Number Publication Date
CN103098182A CN103098182A (zh) 2013-05-08
CN103098182B true CN103098182B (zh) 2016-11-02

Family

ID=45556486

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201310170453.4A Active CN103252715B (zh) 2010-08-06 2011-08-05 内扣环和外扣环
CN201180044017.1A Active CN103098182B (zh) 2010-08-06 2011-08-05 利用扣环的基板边缘调节

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201310170453.4A Active CN103252715B (zh) 2010-08-06 2011-08-05 内扣环和外扣环

Country Status (8)

Country Link
US (5) US20120034848A1 (enExample)
EP (2) EP3406402B1 (enExample)
JP (2) JP6073222B2 (enExample)
KR (3) KR101814185B1 (enExample)
CN (2) CN103252715B (enExample)
SG (2) SG10201506082UA (enExample)
TW (2) TWI574785B (enExample)
WO (1) WO2012019144A2 (enExample)

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CN103252715B (zh) 2010-08-06 2016-06-22 应用材料公司 内扣环和外扣环
US20130102152A1 (en) * 2011-10-20 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
JP5976522B2 (ja) 2012-05-31 2016-08-23 株式会社荏原製作所 研磨装置および研磨方法
US10702972B2 (en) 2012-05-31 2020-07-07 Ebara Corporation Polishing apparatus
US10532441B2 (en) 2012-11-30 2020-01-14 Applied Materials, Inc. Three-zone carrier head and flexible membrane
WO2014163735A1 (en) * 2013-03-13 2014-10-09 Applied Materials, Inc. Reinforcement ring for carrier head
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
KR102173323B1 (ko) * 2014-06-23 2020-11-04 삼성전자주식회사 캐리어 헤드, 화학적 기계식 연마 장치 및 웨이퍼 연마 방법
JP2016155188A (ja) * 2015-02-24 2016-09-01 株式会社荏原製作所 リテーナリング、基板保持装置、研磨装置およびリテーナリングのメンテナンス方法
US9488218B2 (en) 2015-03-30 2016-11-08 Honeywell International Inc. Pilot ring with controlled axial roll
JP6392193B2 (ja) * 2015-10-14 2018-09-19 株式会社荏原製作所 基板保持装置および基板研磨装置ならびに基板保持装置の製造方法
US10029346B2 (en) * 2015-10-16 2018-07-24 Applied Materials, Inc. External clamp ring for a chemical mechanical polishing carrier head
US10160091B2 (en) * 2015-11-16 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. CMP polishing head design for improving removal rate uniformity
WO2017171262A1 (ko) * 2016-04-01 2017-10-05 강준모 기판수용부재를 포함하는 화학기계적연마장치용 캐리어헤드
JP7021863B2 (ja) * 2017-03-30 2022-02-17 富士紡ホールディングス株式会社 保持具
CN109551365B (zh) * 2019-01-15 2023-12-08 合肥哈工普利世智能装备有限公司 等离子抛光夹持组件、等离子抛光机及其抛光方法
CN113573844B (zh) * 2019-02-28 2023-12-08 应用材料公司 用于化学机械抛光承载头的固定器
US11325223B2 (en) 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
US11511390B2 (en) 2019-08-30 2022-11-29 Applied Materials, Inc. Pivotable substrate retaining ring
WO2022005919A1 (en) 2020-06-29 2022-01-06 Applied Materials, Inc Polishing carrier head with multiple angular pressurizable zones
WO2022040459A1 (en) * 2020-08-21 2022-02-24 Applied Materials, Inc. Improved retaining ring design
US11440159B2 (en) * 2020-09-28 2022-09-13 Applied Materials, Inc. Edge load ring
US11623321B2 (en) * 2020-10-14 2023-04-11 Applied Materials, Inc. Polishing head retaining ring tilting moment control
JP7536601B2 (ja) * 2020-11-04 2024-08-20 株式会社荏原製作所 研磨ヘッドおよび研磨装置
US11660721B2 (en) * 2021-02-18 2023-05-30 Applied Materials, Inc. Dual loading retaining ring
KR102556166B1 (ko) 2022-01-28 2023-07-19 지앤에스건설 주식회사 플로팅 인테리어 계단 시공방법 및 그 방법으로 시공된 플로팅 인테리어 계단
US20230356354A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Compliant inner ring for a chemical mechanical polishing system
US20230356355A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Polishing head with local inner ring downforce control
US20230381915A1 (en) * 2022-05-27 2023-11-30 Applied Materials, Inc. Operation of clamping retainer for chemical mechanical polishing
KR102630907B1 (ko) 2022-08-24 2024-01-30 임형남 이중나선계단 다가구주택
US20250100105A1 (en) * 2023-09-27 2025-03-27 Applied Materials, Inc. Cmp inner ring in smart head
CN117484382A (zh) * 2023-11-14 2024-02-02 北京子牛亦东科技有限公司 一种用于化学机械研磨设备的研磨头的隔膜

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US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
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JP2008307674A (ja) * 2007-06-18 2008-12-25 Tokyo Seimitsu Co Ltd 分割加圧型リテーナリング

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Publication number Priority date Publication date Assignee Title
US6334810B1 (en) * 1999-04-10 2002-01-01 Samsung Electronics Co., Ltd. Chemical mechanical polishing apparatus and method of using the same
US6872130B1 (en) * 2001-12-28 2005-03-29 Applied Materials Inc. Carrier head with non-contact retainer
CN101293334A (zh) * 2006-11-22 2008-10-29 应用材料股份有限公司 用于研磨头的柔性膜
JP2008307674A (ja) * 2007-06-18 2008-12-25 Tokyo Seimitsu Co Ltd 分割加圧型リテーナリング

Also Published As

Publication number Publication date
US20180304441A1 (en) 2018-10-25
WO2012019144A3 (en) 2012-06-07
CN103098182A (zh) 2013-05-08
CN103252715B (zh) 2016-06-22
US20120034848A1 (en) 2012-02-09
KR101701870B1 (ko) 2017-02-02
JP6073222B2 (ja) 2017-02-01
US10022837B2 (en) 2018-07-17
WO2012019144A2 (en) 2012-02-09
KR20180004298A (ko) 2018-01-10
US20130149942A1 (en) 2013-06-13
TWI540021B (zh) 2016-07-01
EP2601677A2 (en) 2013-06-12
KR101814185B1 (ko) 2018-01-02
SG10201506082UA (en) 2015-09-29
TWI574785B (zh) 2017-03-21
KR20130093111A (ko) 2013-08-21
US20160082571A1 (en) 2016-03-24
KR101882708B1 (ko) 2018-07-27
SG187782A1 (en) 2013-03-28
EP3406402B1 (en) 2021-06-30
US11173579B2 (en) 2021-11-16
EP2601677A4 (en) 2015-05-27
US8840446B2 (en) 2014-09-23
US20120034849A1 (en) 2012-02-09
TW201221294A (en) 2012-06-01
JP2013536578A (ja) 2013-09-19
JP2013243373A (ja) 2013-12-05
TW201323153A (zh) 2013-06-16
EP2601677B1 (en) 2018-07-04
KR20130093618A (ko) 2013-08-22
EP3406402A1 (en) 2018-11-28
CN103252715A (zh) 2013-08-21
JP5924739B2 (ja) 2016-05-25
US8721391B2 (en) 2014-05-13

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