CN103066184B - 配线基板、发光装置、以及配线基板的制造方法 - Google Patents

配线基板、发光装置、以及配线基板的制造方法 Download PDF

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Publication number
CN103066184B
CN103066184B CN201210430706.2A CN201210430706A CN103066184B CN 103066184 B CN103066184 B CN 103066184B CN 201210430706 A CN201210430706 A CN 201210430706A CN 103066184 B CN103066184 B CN 103066184B
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CN
China
Prior art keywords
layer
substrate
wiring
insulating layer
metal
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CN201210430706.2A
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English (en)
Chinese (zh)
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CN103066184A (zh
Inventor
清水浩
木村康之
荒井直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
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Shinko Electric Co Ltd
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Publication date
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Publication of CN103066184A publication Critical patent/CN103066184A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201210430706.2A 2011-10-24 2012-10-22 配线基板、发光装置、以及配线基板的制造方法 Active CN103066184B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011233288A JP5801685B2 (ja) 2011-10-24 2011-10-24 配線基板、発光装置及び配線基板の製造方法
JP2011-233288 2011-10-24

Publications (2)

Publication Number Publication Date
CN103066184A CN103066184A (zh) 2013-04-24
CN103066184B true CN103066184B (zh) 2017-03-29

Family

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Family Applications (1)

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CN201210430706.2A Active CN103066184B (zh) 2011-10-24 2012-10-22 配线基板、发光装置、以及配线基板的制造方法

Country Status (4)

Country Link
US (1) US9257354B2 (https=)
EP (1) EP2587533B1 (https=)
JP (1) JP5801685B2 (https=)
CN (1) CN103066184B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6068175B2 (ja) * 2013-02-12 2017-01-25 新光電気工業株式会社 配線基板、発光装置、配線基板の製造方法及び発光装置の製造方法
JP6111832B2 (ja) * 2013-05-06 2017-04-12 株式会社デンソー 多層基板およびこれを用いた電子装置、電子装置の製造方法
DE102013215350A1 (de) * 2013-08-05 2015-02-05 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen einer Beleuchtungsanordnung
JP5918809B2 (ja) * 2014-07-04 2016-05-18 株式会社イースタン 配線基板の製造方法および配線基板
CN104538532B (zh) * 2015-01-30 2017-09-15 矽照光电（厦门）有限公司 一种led封装方法
JP6974724B2 (ja) * 2018-03-08 2021-12-01 日亜化学工業株式会社 発光装置の製造方法
JP7100707B2 (ja) * 2018-08-28 2022-07-13 京セラ株式会社 配線基板および電子装置
KR102684757B1 (ko) 2019-08-22 2024-07-16 삼성디스플레이 주식회사 표시 장치
CN113972308B (zh) * 2020-07-24 2025-08-26 群创光电股份有限公司 电子基板以及电子装置
US11830833B2 (en) 2020-07-24 2023-11-28 Innolux Corporation Electronic substrate and electronic device
CN113690228B (zh) * 2021-08-05 2023-06-23 福建天电光电有限公司 集成式led发光器件及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011077886A1 (ja) * 2009-12-22 2011-06-30 国立大学法人九州工業大学 配線用電子部品及びその製造方法

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JPH07235618A (ja) 1994-02-25 1995-09-05 Mitsui Toatsu Chem Inc 多端子半導体パッケージ
JPH10270591A (ja) * 1997-03-21 1998-10-09 Nec Corp 半導体装置用パッケージおよびその製造方法
CN1222918C (zh) * 2001-08-27 2005-10-12 佳能株式会社 布线基板及使用该布线基板的图象显示装置
JP4067802B2 (ja) 2001-09-18 2008-03-26 松下電器産業株式会社 照明装置
JP2006518944A (ja) * 2003-02-25 2006-08-17 テッセラ，インコーポレイテッド バンプを有するボールグリッドアレー
DE10339770B4 (de) * 2003-08-27 2007-08-30 Infineon Technologies Ag Verfahren zum Herstellen einer FBGA-Anordnung
JP4856463B2 (ja) * 2005-10-17 2012-01-18 株式会社 日立ディスプレイズ 液晶表示装置
JP2007235618A (ja) 2006-03-01 2007-09-13 Nec Soft Ltd ユーザアカウント名の自動割当システム、その方法、ユーザアカウント名取得装置およびプログラム
JP5259095B2 (ja) * 2006-06-19 2013-08-07 新光電気工業株式会社 半導体装置
JP2009033088A (ja) * 2007-06-29 2009-02-12 Sharp Corp 半導体発光装置、その製造方法およびそれを用いたｌｅｄ照明装置
US20090001404A1 (en) * 2007-06-29 2009-01-01 Ohata Takafumi Semiconductor light emitting device, process for producing the same, and led illuminating apparatus using the same
JP4825784B2 (ja) 2007-12-13 2011-11-30 新光電気工業株式会社 半導体装置用パッケージおよびその製造方法
KR101067091B1 (ko) * 2010-03-31 2011-09-22 삼성전기주식회사 방열기판 및 그 제조방법
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Also Published As

Publication number Publication date
CN103066184A (zh) 2013-04-24
US9257354B2 (en) 2016-02-09
US20130099273A1 (en) 2013-04-25
EP2587533A1 (en) 2013-05-01
JP5801685B2 (ja) 2015-10-28
JP2013093386A (ja) 2013-05-16
EP2587533B1 (en) 2018-11-21

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