CN103025085B - 针对双面铝基板的沉铜方法 - Google Patents
针对双面铝基板的沉铜方法 Download PDFInfo
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- CN103025085B CN103025085B CN201210526829.6A CN201210526829A CN103025085B CN 103025085 B CN103025085 B CN 103025085B CN 201210526829 A CN201210526829 A CN 201210526829A CN 103025085 B CN103025085 B CN 103025085B
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- Prior art keywords
- aluminium sheet
- copper
- heavy copper
- hole
- resin material
- Prior art date
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 99
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 99
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 239000010949 copper Substances 0.000 title claims abstract description 56
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 56
- 239000000758 substrate Substances 0.000 title claims abstract description 14
- 238000000151 deposition Methods 0.000 title abstract 5
- 239000011889 copper foil Substances 0.000 claims abstract description 41
- 239000007788 liquid Substances 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 239000004411 aluminium Substances 0.000 claims description 90
- 239000000463 material Substances 0.000 claims description 39
- 239000011347 resin Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 37
- 239000000565 sealant Substances 0.000 claims description 19
- 229910000831 Steel Inorganic materials 0.000 claims description 16
- 239000010959 steel Substances 0.000 claims description 16
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 238000005553 drilling Methods 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 abstract description 3
- 230000008021 deposition Effects 0.000 abstract 3
- 239000003814 drug Substances 0.000 description 29
- 230000003628 erosive effect Effects 0.000 description 10
- 239000002699 waste material Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 3
- 238000004382 potting Methods 0.000 description 2
- 238000010079 rubber tapping Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 finally Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011505 plaster Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210526829.6A CN103025085B (zh) | 2012-12-10 | 2012-12-10 | 针对双面铝基板的沉铜方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210526829.6A CN103025085B (zh) | 2012-12-10 | 2012-12-10 | 针对双面铝基板的沉铜方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103025085A CN103025085A (zh) | 2013-04-03 |
| CN103025085B true CN103025085B (zh) | 2015-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210526829.6A Active CN103025085B (zh) | 2012-12-10 | 2012-12-10 | 针对双面铝基板的沉铜方法 |
Country Status (1)
| Country | Link |
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| CN (1) | CN103025085B (zh) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103517565A (zh) * | 2013-10-17 | 2014-01-15 | 景旺电子科技(龙川)有限公司 | 一种铝基板沉铜板电封边的方法 |
| CN105472861B (zh) * | 2014-09-05 | 2018-05-29 | 深南电路有限公司 | 一种印制电路板散热过孔制造的方法及印制电路板 |
| CN105555064A (zh) * | 2015-12-03 | 2016-05-04 | 东莞康源电子有限公司 | 基于铝基板封边的pcb板制造工艺 |
| CN112687781A (zh) * | 2020-12-22 | 2021-04-20 | 珠海市沃德科技有限公司 | 用于cob封装的led镜面灯板加工方法 |
| CN113286435A (zh) * | 2021-05-25 | 2021-08-20 | 胜宏科技（惠州）股份有限公司 | 一种铝板孔内镀铜的方法 |
| CN114222442B (zh) * | 2021-11-04 | 2023-06-02 | 景旺电子科技(龙川)有限公司 | 基于控制铝基板侧蚀的电路板制作工艺 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05283832A (ja) * | 1992-03-30 | 1993-10-29 | Hitachi Chem Co Ltd | 端面保護膜を含む金属ベース基板及びその製造方法 |
| JP2006319145A (ja) * | 2005-05-13 | 2006-11-24 | Furukawa Electric Co Ltd:The | メタルコア回路基板 |
| CN101998777A (zh) * | 2010-11-10 | 2011-03-30 | 广东依顿电子科技股份有限公司 | 金属铝基印制线路板层间导通制作方法 |
| CN102316679B (zh) * | 2011-09-16 | 2012-10-24 | 深圳市万泰伟业科技有限公司 | 双面铝基电路板制作方法 |
| CN102387660B (zh) * | 2011-10-31 | 2014-08-06 | 深圳市景旺电子股份有限公司 | 一种金属基pcb板及其制造方法 |
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2012
- 2012-12-10 CN CN201210526829.6A patent/CN103025085B/zh active Active
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| Publication number | Publication date |
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| CN103025085A (zh) | 2013-04-03 |
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Denomination of invention: Copper deposition method for double-faced aluminum substrate Effective date of registration: 20181026 Granted publication date: 20150715 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: 2018510000108 |
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Date of cancellation: 20201125 Granted publication date: 20150715 Pledgee: China Postal Savings Bank Limited by Share Ltd. Suining Sui branch Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: 2018510000108 |
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Denomination of invention: Copper deposition method for double sided aluminum substrate Effective date of registration: 20210127 Granted publication date: 20150715 Pledgee: Suining branch of Bank of China Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2021980000674 |
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Denomination of invention: Copper deposition method for double-sided aluminum substrate Effective date of registration: 20220402 Granted publication date: 20150715 Pledgee: Suining Fengfa Modern Agricultural Financing Guarantee Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980003717 |
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