CN102316679B - 双面铝基电路板制作方法 - Google Patents
双面铝基电路板制作方法 Download PDFInfo
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- CN102316679B CN102316679B CN201110275598A CN201110275598A CN102316679B CN 102316679 B CN102316679 B CN 102316679B CN 201110275598 A CN201110275598 A CN 201110275598A CN 201110275598 A CN201110275598 A CN 201110275598A CN 102316679 B CN102316679 B CN 102316679B
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- aluminium base
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- copper foil
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CN201110275598A CN102316679B (zh) | 2011-09-16 | 2011-09-16 | 双面铝基电路板制作方法 |
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CN201110275598A CN102316679B (zh) | 2011-09-16 | 2011-09-16 | 双面铝基电路板制作方法 |
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CN102316679A CN102316679A (zh) | 2012-01-11 |
CN102316679B true CN102316679B (zh) | 2012-10-24 |
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CN201110275598A Expired - Fee Related CN102316679B (zh) | 2011-09-16 | 2011-09-16 | 双面铝基电路板制作方法 |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103025085B (zh) * | 2012-12-10 | 2015-07-15 | 四川海英电子科技有限公司 | 针对双面铝基板的沉铜方法 |
CN103945656A (zh) * | 2013-01-22 | 2014-07-23 | 深圳市万泰电路有限公司 | 一种有树脂塞孔及沉头孔的双面铝基板制作方法 |
CN104129119B (zh) * | 2014-07-15 | 2016-04-20 | 景旺电子科技(龙川)有限公司 | Pp边角料封边的铝基双面夹芯板及其制作方法 |
CN104812167A (zh) * | 2015-03-01 | 2015-07-29 | 四会富士电子科技有限公司 | 一种高信赖性双面铝基板及其生产方法 |
CN105128454B (zh) * | 2015-08-24 | 2017-01-04 | 浙江展邦电子科技有限公司 | 一种led灯具用的双面铝基覆铜板 |
CN107205319A (zh) * | 2017-06-23 | 2017-09-26 | 四会富士电子科技有限公司 | 一种大深槽双面铝基板的制作方法 |
CN107484356B (zh) * | 2017-08-01 | 2020-06-02 | 深圳明阳电路科技股份有限公司 | 一种厚铜夹心铝基板的制作方法 |
CN109451661B (zh) * | 2018-09-13 | 2021-09-21 | 镇江华印电路板有限公司 | 一种led铝基板曝光印刷工艺 |
CN111770649A (zh) * | 2020-06-29 | 2020-10-13 | 肇庆昌隆电子有限公司 | 一种含铝芯的多层线路板及其制作方法 |
CN112040659B (zh) * | 2020-09-03 | 2024-08-16 | 陕西卫宁电子材料有限公司 | 堵孔铝基覆铜板制备方法及堵孔铝基覆铜板 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2874329B2 (ja) * | 1990-11-05 | 1999-03-24 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
CN100556249C (zh) * | 2008-07-30 | 2009-10-28 | 惠州中京电子科技有限公司 | 印刷电路板塞孔工艺 |
CN101686607B (zh) * | 2008-09-22 | 2012-09-26 | 天津普林电路股份有限公司 | 可抑制翘曲的四层电路板 |
CN101697661B (zh) * | 2009-11-11 | 2011-05-11 | 深南电路有限公司 | Pcb板堵孔方法以及制作双面pcb板的方法 |
CN102036476B (zh) * | 2010-12-04 | 2012-07-18 | 鹤山东力电子科技有限公司 | 一种双面金属基线路板及其生产方法 |
CN102045949B (zh) * | 2011-01-14 | 2013-05-15 | 深圳市兴森快捷电路科技股份有限公司 | 刚挠结合印制电路板的制作方法 |
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Denomination of invention: Manufacture method for double-side aluminum circuit board Effective date of registration: 20131219 Granted publication date: 20121024 Pledgee: Shenzhen SME credit financing guarantee Group Co., Ltd. Pledgor: Shenzhen Wantai Weiye Technology Co., Ltd. Registration number: 2013990001002 |
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Date of cancellation: 20150123 Granted publication date: 20121024 Pledgee: Shenzhen SME credit financing guarantee Group Co., Ltd. Pledgor: Shenzhen Wantai Weiye Technology Co., Ltd. Registration number: 2013990001002 |
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Denomination of invention: Manufacture method for double-side aluminum circuit board Effective date of registration: 20150126 Granted publication date: 20121024 Pledgee: Shenzhen SME credit financing guarantee Group Co., Ltd. Pledgor: Shenzhen Wantai Weiye Technology Co., Ltd. Registration number: 2015990000065 |
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Application publication date: 20120111 Assignee: Shenzhen ViTek Printing Circuit Board Co., Ltd. Assignor: Shenzhen Wantai Weiye Technology Co., Ltd. Contract record no.: 2015440020195 Denomination of invention: Manufacture method for double-side aluminum circuit board Granted publication date: 20121024 License type: Exclusive License Record date: 20150602 |
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