CN103008218B - 一种用于超声探头的构造中的复合陶瓷换能器结构 - Google Patents

一种用于超声探头的构造中的复合陶瓷换能器结构 Download PDF

Info

Publication number
CN103008218B
CN103008218B CN201210354044.5A CN201210354044A CN103008218B CN 103008218 B CN103008218 B CN 103008218B CN 201210354044 A CN201210354044 A CN 201210354044A CN 103008218 B CN103008218 B CN 103008218B
Authority
CN
China
Prior art keywords
transducer
posts
piezoelectric
substrate
columns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201210354044.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN103008218A (zh
Inventor
M.H.克罗恩
P.辛格
P.A.梅耶
骆巍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of CN103008218A publication Critical patent/CN103008218A/zh
Application granted granted Critical
Publication of CN103008218B publication Critical patent/CN103008218B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
CN201210354044.5A 2011-09-22 2012-09-21 一种用于超声探头的构造中的复合陶瓷换能器结构 Expired - Fee Related CN103008218B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/240754 2011-09-22
US13/240,754 2011-09-22
US13/240,754 US8853918B2 (en) 2011-09-22 2011-09-22 Transducer structure for a transducer probe and methods of fabricating same

Publications (2)

Publication Number Publication Date
CN103008218A CN103008218A (zh) 2013-04-03
CN103008218B true CN103008218B (zh) 2016-06-29

Family

ID=47828053

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210354044.5A Expired - Fee Related CN103008218B (zh) 2011-09-22 2012-09-21 一种用于超声探头的构造中的复合陶瓷换能器结构

Country Status (6)

Country Link
US (1) US8853918B2 (https=)
JP (1) JP6208933B2 (https=)
CN (1) CN103008218B (https=)
CA (1) CA2790266C (https=)
DE (1) DE102012108796B4 (https=)
FR (1) FR2980379A1 (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10226234B2 (en) 2011-12-01 2019-03-12 Maui Imaging, Inc. Motion detection using ping-based and multiple aperture doppler ultrasound
US9282945B2 (en) * 2009-04-14 2016-03-15 Maui Imaging, Inc. Calibration of ultrasound probes
WO2012051308A2 (en) 2010-10-13 2012-04-19 Maui Imaging, Inc. Concave ultrasound transducers and 3d arrays
KR20140107648A (ko) 2011-12-29 2014-09-04 마우이 이미징, 인코포레이티드 임의의 경로들의 ｍ-모드 초음파 이미징
KR102134763B1 (ko) 2012-02-21 2020-07-16 마우이 이미징, 인코포레이티드 다중의 어퍼처 초음파를 사용한 물질 강성의 결정
EP2833791B1 (en) 2012-03-26 2022-12-21 Maui Imaging, Inc. Methods for improving ultrasound image quality by applying weighting factors
EP2883079B1 (en) 2012-08-10 2017-09-27 Maui Imaging, Inc. Calibration of multiple aperture ultrasound probes
EP3893022B1 (en) 2012-09-06 2025-02-12 Maui Imaging, Inc. Ultrasound imaging system memory architecture
CN103676827A (zh) 2012-09-06 2014-03-26 Ip音乐集团有限公司 用于远程控制音频设备的系统和方法
WO2014160291A1 (en) 2013-03-13 2014-10-02 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
DE102013213493A1 (de) * 2013-07-10 2015-01-15 Robert Bosch Gmbh Schallwandleranordnung
US9883848B2 (en) 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
EP3182900B1 (en) 2014-08-18 2019-09-25 Maui Imaging, Inc. Network-based ultrasound imaging system
CN105810258B (zh) * 2014-12-30 2018-11-02 中核武汉核电运行技术股份有限公司 一种用于压水堆燃料组件超声检查的探头及其制造工艺
WO2016160981A1 (en) 2015-03-30 2016-10-06 Maui Imaging, Inc. Ultrasound imaging systems and methods for detecting object motion
US10856846B2 (en) 2016-01-27 2020-12-08 Maui Imaging, Inc. Ultrasound imaging with sparse array probes
RU2649061C1 (ru) * 2016-12-22 2018-03-29 федеральное государственное бюджетное образовательное учреждение высшего образования "Национальный исследовательский университет "МЭИ" (ФГБОУ ВО "НИУ "МЭИ") Широкополосный ультразвуковой преобразователь
KR102394585B1 (ko) * 2017-12-19 2022-05-04 현대자동차 주식회사 음향센서 및 이의 제조방법
KR102721452B1 (ko) * 2019-03-29 2024-10-23 엘지디스플레이 주식회사 플렉서블 진동 모듈 및 이를 포함하는 표시 장치
EP4021650A4 (en) * 2019-08-28 2023-09-06 SCR Engineers Ltd FLUID ANALYSIS DEVICES
JP7724853B2 (ja) 2020-10-21 2025-08-18 マウイ イマギング，インコーポレーテッド 多数開口超音波を用いた組織の特徴付けのためのシステム及び方法
EP4236811A4 (en) 2020-11-02 2024-10-09 Maui Imaging, Inc. Systems and methods for improving ultrasound image quality
US12414474B2 (en) * 2021-10-21 2025-09-09 Baker Hughes Oilfield Operations Llc Methods of forming piezoelectric materials, piezoelectric devices, and associated tooling and systems
CN116293473B (zh) * 2022-12-08 2025-08-01 海鹰企业集团有限责任公司 一种改进型管道声纳湿端处理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4518889A (en) * 1982-09-22 1985-05-21 North American Philips Corporation Piezoelectric apodized ultrasound transducers
CN101952052A (zh) * 2008-02-11 2011-01-19 通用电气公司 超声换能器探头及其制造系统和方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4658176A (en) * 1984-07-25 1987-04-14 Hitachi, Ltd. Ultrasonic transducer using piezoelectric composite
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
ATE120670T1 (de) * 1990-06-21 1995-04-15 Siemens Ag Verbund-ultraschallwandler und verfahren zur herstellung eines strukturierten bauelementes aus piezoelektrischer keramik.
US6117612A (en) 1995-04-24 2000-09-12 Regents Of The University Of Michigan Stereolithography resin for rapid prototyping of ceramics and metals
US5648942A (en) 1995-10-13 1997-07-15 Advanced Technology Laboratories, Inc. Acoustic backing with integral conductors for an ultrasonic transducer
JPH11112048A (ja) * 1997-10-02 1999-04-23 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
JP4234846B2 (ja) * 1999-05-12 2009-03-04 上田日本無線株式会社 複合圧電体及び角柱状圧電セラミック焼結体
JP2001326999A (ja) * 2000-05-18 2001-11-22 Olympus Optical Co Ltd 圧電構造体の加工方法および複合圧電体の製造方法
AU2001296428A1 (en) * 2000-09-27 2002-04-08 The Regents Of The University Of California Dynamic mask projection stereo micro lithography
US6571444B2 (en) * 2001-03-20 2003-06-03 Vermon Method of manufacturing an ultrasonic transducer
US6984922B1 (en) * 2002-07-22 2006-01-10 Matsushita Electric Industrial Co., Ltd. Composite piezoelectric transducer and method of fabricating the same
US7678054B2 (en) * 2003-01-23 2010-03-16 Hitachi Medical Corporation Ultrasonic probe and ultrasonic diagnosing device
JP2005342337A (ja) * 2004-06-04 2005-12-15 Matsushita Electric Ind Co Ltd 超音波探触子
US7449821B2 (en) 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
JP4945801B2 (ja) * 2005-03-24 2012-06-06 株式会社村田製作所 圧電素子、及び圧電素子の製造方法
JPWO2006134754A1 (ja) * 2005-06-13 2009-01-08 佐口　隆之 治療用超音波発射装置
US7652410B2 (en) * 2006-08-01 2010-01-26 Insightec Ltd Ultrasound transducer with non-uniform elements
US20090230823A1 (en) * 2008-03-13 2009-09-17 Leonid Kushculey Operation of patterned ultrasonic transducers
US8212456B1 (en) * 2009-08-19 2012-07-03 Sandia Corporation Method of making and ceramic articles with multiple regions of distinct density

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4518889A (en) * 1982-09-22 1985-05-21 North American Philips Corporation Piezoelectric apodized ultrasound transducers
CN101952052A (zh) * 2008-02-11 2011-01-19 通用电气公司 超声换能器探头及其制造系统和方法

Also Published As

Publication number Publication date
FR2980379A1 (fr) 2013-03-29
CA2790266C (en) 2019-11-26
DE102012108796B4 (de) 2021-03-04
JP2013068616A (ja) 2013-04-18
US20130076207A1 (en) 2013-03-28
US8853918B2 (en) 2014-10-07
CN103008218A (zh) 2013-04-03
CA2790266A1 (en) 2013-03-22
DE102012108796A1 (de) 2013-03-28
JP6208933B2 (ja) 2017-10-04

Similar Documents

Publication Publication Date Title
CN103008218B (zh) 一种用于超声探头的构造中的复合陶瓷换能器结构
CN101952052B (zh) 超声换能器探头及其制造系统和方法
US5164920A (en) Composite ultrasound transducer and method for manufacturing a structured component therefor of piezoelectric ceramic
TWI493983B (zh) A sound generator and an acoustic generating device using the same
US20070200460A1 (en) Composite piezoelectric apparatus and method
CN100376214C (zh) 复合压电体
CN111465455B (zh) 高频超声波换能器
JP2000050391A (ja) 超音波トランスデューサーおよびその製造方法
CN102959993A (zh) 超声波探头和超声波诊断装置
Liu et al. Micromachining techniques in developing high-frequency piezoelectric composite ultrasonic array transducers
WO2011033272A1 (en) Ultrasound transducer array
CN116833082A (zh) 一种柔性压电超声换能器及其制备方法
CN210401326U (zh) 超声换能器
CN110095532B (zh) 超声换能器以及超声换能器的制备方法
CN114300611B (zh) 一种大尺寸圆弧形1-3型压电复合材料制作方法
JP2004039836A (ja) 複合圧電体およびその製造方法
Demore et al. 1–3 piezocomposite design optimised for high frequency kerfless transducer arrays
JP2008005291A (ja) 音響整合層およびその製造方法、ならびに該音響整合層を含む超音波プローブ
CN103078600A (zh) 一种压电振子制备方法及应用该方法制备的压电振子
Hu et al. Enhanced element uniformity in high-frequency ultrasound arrays via randomized short-fiber 1–3 piezocomposite design
JP2005101748A (ja) 素子アレイの製造方法、及び、超音波トランスデューサアレイの製造方法
Chabok et al. Development of a digital micro-manufacturing process for high frequency ultrasound transducers
JP2004033829A (ja) バッキング製造方法及び超音波振動子
JP2006313977A (ja) 複合圧電材料およびその製造方法
JP3693546B2 (ja) 複合圧電体の製造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160629

Termination date: 20210921

CF01 Termination of patent right due to non-payment of annual fee