FR2980379A1 - Structure transductrice pour sonde transductrice et procedes de fabrication de celle-ci - Google Patents

Structure transductrice pour sonde transductrice et procedes de fabrication de celle-ci Download PDF

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Publication number
FR2980379A1
FR2980379A1 FR1258773A FR1258773A FR2980379A1 FR 2980379 A1 FR2980379 A1 FR 2980379A1 FR 1258773 A FR1258773 A FR 1258773A FR 1258773 A FR1258773 A FR 1258773A FR 2980379 A1 FR2980379 A1 FR 2980379A1
Authority
FR
France
Prior art keywords
transducer
columns
piezoelectric
substrate
piezoelectric transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
FR1258773A
Other languages
English (en)
French (fr)
Inventor
Matthew Harvey Krohn
Prabhjot Singh
Paul Aloysius Meyer
Wei Luo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of FR2980379A1 publication Critical patent/FR2980379A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
FR1258773A 2011-09-22 2012-09-19 Structure transductrice pour sonde transductrice et procedes de fabrication de celle-ci Ceased FR2980379A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/240,754 US8853918B2 (en) 2011-09-22 2011-09-22 Transducer structure for a transducer probe and methods of fabricating same

Publications (1)

Publication Number Publication Date
FR2980379A1 true FR2980379A1 (fr) 2013-03-29

Family

ID=47828053

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1258773A Ceased FR2980379A1 (fr) 2011-09-22 2012-09-19 Structure transductrice pour sonde transductrice et procedes de fabrication de celle-ci

Country Status (6)

Country Link
US (1) US8853918B2 (https=)
JP (1) JP6208933B2 (https=)
CN (1) CN103008218B (https=)
CA (1) CA2790266C (https=)
DE (1) DE102012108796B4 (https=)
FR (1) FR2980379A1 (https=)

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US10226234B2 (en) 2011-12-01 2019-03-12 Maui Imaging, Inc. Motion detection using ping-based and multiple aperture doppler ultrasound
US9282945B2 (en) * 2009-04-14 2016-03-15 Maui Imaging, Inc. Calibration of ultrasound probes
WO2012051308A2 (en) 2010-10-13 2012-04-19 Maui Imaging, Inc. Concave ultrasound transducers and 3d arrays
KR20140107648A (ko) 2011-12-29 2014-09-04 마우이 이미징, 인코포레이티드 임의의 경로들의 ｍ-모드 초음파 이미징
KR102134763B1 (ko) 2012-02-21 2020-07-16 마우이 이미징, 인코포레이티드 다중의 어퍼처 초음파를 사용한 물질 강성의 결정
EP2833791B1 (en) 2012-03-26 2022-12-21 Maui Imaging, Inc. Methods for improving ultrasound image quality by applying weighting factors
EP2883079B1 (en) 2012-08-10 2017-09-27 Maui Imaging, Inc. Calibration of multiple aperture ultrasound probes
EP3893022B1 (en) 2012-09-06 2025-02-12 Maui Imaging, Inc. Ultrasound imaging system memory architecture
CN103676827A (zh) 2012-09-06 2014-03-26 Ip音乐集团有限公司 用于远程控制音频设备的系统和方法
WO2014160291A1 (en) 2013-03-13 2014-10-02 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
DE102013213493A1 (de) * 2013-07-10 2015-01-15 Robert Bosch Gmbh Schallwandleranordnung
US9883848B2 (en) 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
EP3182900B1 (en) 2014-08-18 2019-09-25 Maui Imaging, Inc. Network-based ultrasound imaging system
CN105810258B (zh) * 2014-12-30 2018-11-02 中核武汉核电运行技术股份有限公司 一种用于压水堆燃料组件超声检查的探头及其制造工艺
WO2016160981A1 (en) 2015-03-30 2016-10-06 Maui Imaging, Inc. Ultrasound imaging systems and methods for detecting object motion
US10856846B2 (en) 2016-01-27 2020-12-08 Maui Imaging, Inc. Ultrasound imaging with sparse array probes
RU2649061C1 (ru) * 2016-12-22 2018-03-29 федеральное государственное бюджетное образовательное учреждение высшего образования "Национальный исследовательский университет "МЭИ" (ФГБОУ ВО "НИУ "МЭИ") Широкополосный ультразвуковой преобразователь
KR102394585B1 (ko) * 2017-12-19 2022-05-04 현대자동차 주식회사 음향센서 및 이의 제조방법
KR102721452B1 (ko) * 2019-03-29 2024-10-23 엘지디스플레이 주식회사 플렉서블 진동 모듈 및 이를 포함하는 표시 장치
EP4021650A4 (en) * 2019-08-28 2023-09-06 SCR Engineers Ltd FLUID ANALYSIS DEVICES
JP7724853B2 (ja) 2020-10-21 2025-08-18 マウイ イマギング，インコーポレーテッド 多数開口超音波を用いた組織の特徴付けのためのシステム及び方法
EP4236811A4 (en) 2020-11-02 2024-10-09 Maui Imaging, Inc. Systems and methods for improving ultrasound image quality
US12414474B2 (en) * 2021-10-21 2025-09-09 Baker Hughes Oilfield Operations Llc Methods of forming piezoelectric materials, piezoelectric devices, and associated tooling and systems
CN116293473B (zh) * 2022-12-08 2025-08-01 海鹰企业集团有限责任公司 一种改进型管道声纳湿端处理装置

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US4518889A (en) * 1982-09-22 1985-05-21 North American Philips Corporation Piezoelectric apodized ultrasound transducers
US4658176A (en) * 1984-07-25 1987-04-14 Hitachi, Ltd. Ultrasonic transducer using piezoelectric composite
US4828961A (en) * 1986-07-02 1989-05-09 W. R. Grace & Co.-Conn. Imaging process for forming ceramic electronic circuits
ATE120670T1 (de) * 1990-06-21 1995-04-15 Siemens Ag Verbund-ultraschallwandler und verfahren zur herstellung eines strukturierten bauelementes aus piezoelektrischer keramik.
US6117612A (en) 1995-04-24 2000-09-12 Regents Of The University Of Michigan Stereolithography resin for rapid prototyping of ceramics and metals
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JPH11112048A (ja) * 1997-10-02 1999-04-23 Seiko Epson Corp 圧電体素子、インクジェット式記録ヘッドおよびそれらの製造方法
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US7678054B2 (en) * 2003-01-23 2010-03-16 Hitachi Medical Corporation Ultrasonic probe and ultrasonic diagnosing device
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US7449821B2 (en) 2005-03-02 2008-11-11 Research Triangle Institute Piezoelectric micromachined ultrasonic transducer with air-backed cavities
JP4945801B2 (ja) * 2005-03-24 2012-06-06 株式会社村田製作所 圧電素子、及び圧電素子の製造方法
JPWO2006134754A1 (ja) * 2005-06-13 2009-01-08 佐口　隆之 治療用超音波発射装置
US7652410B2 (en) * 2006-08-01 2010-01-26 Insightec Ltd Ultrasound transducer with non-uniform elements
US20090199392A1 (en) * 2008-02-11 2009-08-13 General Electric Company Ultrasound transducer probes and system and method of manufacture
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Also Published As

Publication number Publication date
CN103008218B (zh) 2016-06-29
CA2790266C (en) 2019-11-26
DE102012108796B4 (de) 2021-03-04
JP2013068616A (ja) 2013-04-18
US20130076207A1 (en) 2013-03-28
US8853918B2 (en) 2014-10-07
CN103008218A (zh) 2013-04-03
CA2790266A1 (en) 2013-03-22
DE102012108796A1 (de) 2013-03-28
JP6208933B2 (ja) 2017-10-04

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