JP6208933B2 - トランスデューサプローブのためのトランスデューサ構造体およびその製造方法 - Google Patents
トランスデューサプローブのためのトランスデューサ構造体およびその製造方法 Download PDFInfo
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- JP6208933B2 JP6208933B2 JP2012205150A JP2012205150A JP6208933B2 JP 6208933 B2 JP6208933 B2 JP 6208933B2 JP 2012205150 A JP2012205150 A JP 2012205150A JP 2012205150 A JP2012205150 A JP 2012205150A JP 6208933 B2 JP6208933 B2 JP 6208933B2
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- 239000000523 sample Substances 0.000 title claims description 50
- 238000004519 manufacturing process Methods 0.000 title description 22
- 239000000758 substrate Substances 0.000 claims description 35
- 239000000463 material Substances 0.000 claims description 24
- 239000002131 composite material Substances 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 12
- 230000000737 periodic effect Effects 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 37
- 238000000034 method Methods 0.000 description 28
- 239000002002 slurry Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 230000001902 propagating effect Effects 0.000 description 7
- 238000002604 ultrasonography Methods 0.000 description 7
- 238000009826 distribution Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 239000011324 bead Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000002346 layers by function Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229920000620 organic polymer Polymers 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000004513 sizing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000012814 acoustic material Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- AGPAJGOIJDHGEX-UHFFFAOYSA-N bismuth oxygen(2-) scandium(3+) Chemical compound [O--].[O--].[O--].[Sc+3].[Bi+3] AGPAJGOIJDHGEX-UHFFFAOYSA-N 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- HEPLMSKRHVKCAQ-UHFFFAOYSA-N lead nickel Chemical compound [Ni].[Pb] HEPLMSKRHVKCAQ-UHFFFAOYSA-N 0.000 description 1
- JQJCSZOEVBFDKO-UHFFFAOYSA-N lead zinc Chemical compound [Zn].[Pb] JQJCSZOEVBFDKO-UHFFFAOYSA-N 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- ZBSCCQXBYNSKPV-UHFFFAOYSA-N oxolead;oxomagnesium;2,4,5-trioxa-1$l^{5},3$l^{5}-diniobabicyclo[1.1.1]pentane 1,3-dioxide Chemical compound [Mg]=O.[Pb]=O.[Pb]=O.[Pb]=O.O1[Nb]2(=O)O[Nb]1(=O)O2 ZBSCCQXBYNSKPV-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
- G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/09—Forming piezoelectric or electrostrictive materials
- H10N30/092—Forming composite materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
12 アレイ
14 トランスデューサ柱
16 基板
200 方法
18 機能層
202 機能層を形成する
204 複数の選択された領域を露光する
206 機能層の選択された領域を硬化する
208 機能層の未露光領域を除去する
210 トランスデューサ素子のアレイを分離する
212 トランスデューサ素子のアレイを焼結する
20 スラリシステム
22 スラリ
24 ディスペンサ
26 ビード
28 ブレード
30 変調器システム
32 コンピュータ
34 空間光変調器
36 光パターン
38 デジタルパターン
42 パターン
44 パターン
46 パターン
48 パターン
50 プローブ
52 非周期間隔
54 近位端
56 遠位端
58 本体
60 一様な形態
62 非直交形状
64 直径
66 高さ
68 ボイド
70 六角形形状
72 長さ
73 辺
74 高さ
76 非周期アレイ
78 トランスデューサ素子
79 トランスデューサ素子84の対
80 直径
81 群
82 直径
83 (トランスデューサ素子84間の)間隔
84 トランスデューサ素子
85 (トランスデューサ素子78とトランスデューサ素子84との間の)間隔
86 電極
88 面
92 充填材
Claims (8)
- 超音波プローブ(50)の構成において使用するための複合セラミックトランスデューサ構造体(10)であって、
基板(16)と、
前記基板(16)上に、前記基板(16)のX−Y平面上に設定されている複数の空間位置内に、制御可能に形成される複数の圧電トランスデューサ柱(14)であり、前記基板(16)のX−Y−Z平面内に画定されている複数の形状を含み、前記超音波プローブ(50)内のせん断波の最小化を促すように構成されている、圧電トランスデューサ柱(14)と、
を含み、
前記複数の圧電トランスデューサ柱(14)の少なくとも1つは、非均一な密度を有し、
前記複数の圧電トランスデューサ柱(14)の少なくとも1つは、前記複数の圧電トランスデューサのその他とは異なる密度を有する、
複合セラミックトランスデューサ構造体(10)。 - 前記複数の圧電トランスデューサ柱(14)のそれぞれは、光硬化性圧電セラミック材料を含む、請求項1に記載の複合セラミックトランスデューサ構造体(10)。
- 前記基板(16)の前記X−Y平面上に設定されている前記複数の空間位置は、1−3複合構造体(10)を含む、請求項1または2に記載の複合セラミックトランスデューサ構造体(10)。
- 前記基板(16)の前記X−Y平面内の前記複数の空間位置は、前記複数の圧電トランスデューサ柱(14)の非周期配列を含む、請求項1から3のいずれかに記載の複合セラミックトランスデューサ構造体(10)。
- 前記複数の圧電トランスデューサ柱(14)の少なくとも1つは、前記複数の圧電トランスデューサ柱(14)のその他とは異なる横断面積を有する、請求項1から4のいずれかに記載の複合セラミックトランスデューサ構造体(10)。
- 前記複数の圧電トランスデューサ柱(14)の少なくとも1つは、前記複数の圧電トランスデューサ柱(14)のその他とは異なる側面外形を有する、請求項1から5のいずれかに記載の複合セラミックトランスデューサ構造体(10)。
- 前記複数の圧電トランスデューサ柱(14)の少なくとも1つは、前記複数の圧電トランスデューサ柱(14)のその他とは異なる高さを有する、請求項1から6のいずれかに記載の複合セラミックトランスデューサ構造体(10)。
- 前記複数の圧電トランスデューサ柱(14)の少なくとも1つは、前記複数の圧電トランスデューサ柱(14)の隣接する圧電トランスデューサ柱(14)からの間隔が等距離でない、請求項1から7のいずれか記載の複合セラミックトランスデューサ構造体(10)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/240,754 | 2011-09-22 | ||
US13/240,754 US8853918B2 (en) | 2011-09-22 | 2011-09-22 | Transducer structure for a transducer probe and methods of fabricating same |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013068616A JP2013068616A (ja) | 2013-04-18 |
JP2013068616A5 JP2013068616A5 (ja) | 2015-11-05 |
JP6208933B2 true JP6208933B2 (ja) | 2017-10-04 |
Family
ID=47828053
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012205150A Expired - Fee Related JP6208933B2 (ja) | 2011-09-22 | 2012-09-19 | トランスデューサプローブのためのトランスデューサ構造体およびその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8853918B2 (ja) |
JP (1) | JP6208933B2 (ja) |
CN (1) | CN103008218B (ja) |
CA (1) | CA2790266C (ja) |
DE (1) | DE102012108796B4 (ja) |
FR (1) | FR2980379A1 (ja) |
Families Citing this family (19)
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US10226234B2 (en) | 2011-12-01 | 2019-03-12 | Maui Imaging, Inc. | Motion detection using ping-based and multiple aperture doppler ultrasound |
US9282945B2 (en) | 2009-04-14 | 2016-03-15 | Maui Imaging, Inc. | Calibration of ultrasound probes |
EP3563768A3 (en) | 2010-10-13 | 2020-02-12 | Maui Imaging, Inc. | Concave ultrasound transducers and 3d arrays |
WO2013101988A1 (en) | 2011-12-29 | 2013-07-04 | Maui Imaging, Inc. | M-mode ultrasound imaging of arbitrary paths |
CN107028623B (zh) | 2012-02-21 | 2020-09-01 | 毛伊图像公司 | 使用多孔超声确定材料刚度 |
KR102103137B1 (ko) | 2012-03-26 | 2020-04-22 | 마우이 이미징, 인코포레이티드 | 가중 인자들을 적용함으로써 초음파 이미지 품질을 향상시키는 시스템들 및 방법들 |
WO2014026185A1 (en) | 2012-08-10 | 2014-02-13 | Maui Imaging, Inc. | Calibration of multiple aperture ultrasound probes |
KR102176319B1 (ko) | 2012-08-21 | 2020-11-09 | 마우이 이미징, 인코포레이티드 | 초음파 이미징 시스템 메모리 아키텍처 |
WO2014160291A1 (en) | 2013-03-13 | 2014-10-02 | Maui Imaging, Inc. | Alignment of ultrasound transducer arrays and multiple aperture probe assembly |
DE102013213493A1 (de) * | 2013-07-10 | 2015-01-15 | Robert Bosch Gmbh | Schallwandleranordnung |
US9883848B2 (en) | 2013-09-13 | 2018-02-06 | Maui Imaging, Inc. | Ultrasound imaging using apparent point-source transmit transducer |
EP3182900B1 (en) | 2014-08-18 | 2019-09-25 | Maui Imaging, Inc. | Network-based ultrasound imaging system |
CN105810258B (zh) * | 2014-12-30 | 2018-11-02 | 中核武汉核电运行技术股份有限公司 | 一种用于压水堆燃料组件超声检查的探头及其制造工艺 |
CN108778530B (zh) | 2016-01-27 | 2021-07-27 | 毛伊图像公司 | 具有稀疏阵列探测器的超声成像 |
RU2649061C1 (ru) * | 2016-12-22 | 2018-03-29 | федеральное государственное бюджетное образовательное учреждение высшего образования "Национальный исследовательский университет "МЭИ" (ФГБОУ ВО "НИУ "МЭИ") | Широкополосный ультразвуковой преобразователь |
KR102394585B1 (ko) * | 2017-12-19 | 2022-05-04 | 현대자동차 주식회사 | 음향센서 및 이의 제조방법 |
KR20200114914A (ko) * | 2019-03-29 | 2020-10-07 | 엘지디스플레이 주식회사 | 플렉서블 진동 모듈 및 이를 포함하는 표시 장치 |
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-
2011
- 2011-09-22 US US13/240,754 patent/US8853918B2/en active Active
-
2012
- 2012-09-13 CA CA2790266A patent/CA2790266C/en not_active Expired - Fee Related
- 2012-09-18 DE DE102012108796.2A patent/DE102012108796B4/de not_active Expired - Fee Related
- 2012-09-19 JP JP2012205150A patent/JP6208933B2/ja not_active Expired - Fee Related
- 2012-09-19 FR FR1258773A patent/FR2980379A1/fr active Pending
- 2012-09-21 CN CN201210354044.5A patent/CN103008218B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE102012108796B4 (de) | 2021-03-04 |
US20130076207A1 (en) | 2013-03-28 |
FR2980379A1 (fr) | 2013-03-29 |
CA2790266A1 (en) | 2013-03-22 |
CA2790266C (en) | 2019-11-26 |
JP2013068616A (ja) | 2013-04-18 |
CN103008218B (zh) | 2016-06-29 |
US8853918B2 (en) | 2014-10-07 |
DE102012108796A1 (de) | 2013-03-28 |
CN103008218A (zh) | 2013-04-03 |
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