JP6208933B2 - トランスデューサプローブのためのトランスデューサ構造体およびその製造方法 - Google Patents

トランスデューサプローブのためのトランスデューサ構造体およびその製造方法 Download PDF

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Publication number
JP6208933B2
JP6208933B2 JP2012205150A JP2012205150A JP6208933B2 JP 6208933 B2 JP6208933 B2 JP 6208933B2 JP 2012205150 A JP2012205150 A JP 2012205150A JP 2012205150 A JP2012205150 A JP 2012205150A JP 6208933 B2 JP6208933 B2 JP 6208933B2
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Japan
Prior art keywords
transducer
columns
piezoelectric
substrate
array
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Expired - Fee Related
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JP2012205150A
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English (en)
Japanese (ja)
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JP2013068616A5 (https=
JP2013068616A (ja
Inventor
マシュー・ハーヴェイ・クローン
プラブジョット・シン
ポール・アロイシウス・メイヤー
ウェイ・ルオ
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General Electric Co
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General Electric Co
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2437—Piezoelectric probes
    • G01N29/245—Ceramic probes, e.g. lead zirconate titanate [PZT] probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/09—Forming piezoelectric or electrostrictive materials
    • H10N30/092—Forming composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/85—Piezoelectric or electrostrictive active materials
    • H10N30/852—Composite materials, e.g. having 1-3 or 2-2 type connectivity
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49005—Acoustic transducer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP2012205150A 2011-09-22 2012-09-19 トランスデューサプローブのためのトランスデューサ構造体およびその製造方法 Expired - Fee Related JP6208933B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/240,754 2011-09-22
US13/240,754 US8853918B2 (en) 2011-09-22 2011-09-22 Transducer structure for a transducer probe and methods of fabricating same

Publications (3)

Publication Number Publication Date
JP2013068616A JP2013068616A (ja) 2013-04-18
JP2013068616A5 JP2013068616A5 (https=) 2015-11-05
JP6208933B2 true JP6208933B2 (ja) 2017-10-04

Family

ID=47828053

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012205150A Expired - Fee Related JP6208933B2 (ja) 2011-09-22 2012-09-19 トランスデューサプローブのためのトランスデューサ構造体およびその製造方法

Country Status (6)

Country Link
US (1) US8853918B2 (https=)
JP (1) JP6208933B2 (https=)
CN (1) CN103008218B (https=)
CA (1) CA2790266C (https=)
DE (1) DE102012108796B4 (https=)
FR (1) FR2980379A1 (https=)

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US10226234B2 (en) 2011-12-01 2019-03-12 Maui Imaging, Inc. Motion detection using ping-based and multiple aperture doppler ultrasound
US9282945B2 (en) * 2009-04-14 2016-03-15 Maui Imaging, Inc. Calibration of ultrasound probes
WO2012051308A2 (en) 2010-10-13 2012-04-19 Maui Imaging, Inc. Concave ultrasound transducers and 3d arrays
KR20140107648A (ko) 2011-12-29 2014-09-04 마우이 이미징, 인코포레이티드 임의의 경로들의 ｍ-모드 초음파 이미징
KR102134763B1 (ko) 2012-02-21 2020-07-16 마우이 이미징, 인코포레이티드 다중의 어퍼처 초음파를 사용한 물질 강성의 결정
EP2833791B1 (en) 2012-03-26 2022-12-21 Maui Imaging, Inc. Methods for improving ultrasound image quality by applying weighting factors
EP2883079B1 (en) 2012-08-10 2017-09-27 Maui Imaging, Inc. Calibration of multiple aperture ultrasound probes
EP3893022B1 (en) 2012-09-06 2025-02-12 Maui Imaging, Inc. Ultrasound imaging system memory architecture
CN103676827A (zh) 2012-09-06 2014-03-26 Ip音乐集团有限公司 用于远程控制音频设备的系统和方法
WO2014160291A1 (en) 2013-03-13 2014-10-02 Maui Imaging, Inc. Alignment of ultrasound transducer arrays and multiple aperture probe assembly
DE102013213493A1 (de) * 2013-07-10 2015-01-15 Robert Bosch Gmbh Schallwandleranordnung
US9883848B2 (en) 2013-09-13 2018-02-06 Maui Imaging, Inc. Ultrasound imaging using apparent point-source transmit transducer
EP3182900B1 (en) 2014-08-18 2019-09-25 Maui Imaging, Inc. Network-based ultrasound imaging system
CN105810258B (zh) * 2014-12-30 2018-11-02 中核武汉核电运行技术股份有限公司 一种用于压水堆燃料组件超声检查的探头及其制造工艺
WO2016160981A1 (en) 2015-03-30 2016-10-06 Maui Imaging, Inc. Ultrasound imaging systems and methods for detecting object motion
US10856846B2 (en) 2016-01-27 2020-12-08 Maui Imaging, Inc. Ultrasound imaging with sparse array probes
RU2649061C1 (ru) * 2016-12-22 2018-03-29 федеральное государственное бюджетное образовательное учреждение высшего образования "Национальный исследовательский университет "МЭИ" (ФГБОУ ВО "НИУ "МЭИ") Широкополосный ультразвуковой преобразователь
KR102394585B1 (ko) * 2017-12-19 2022-05-04 현대자동차 주식회사 음향센서 및 이의 제조방법
KR102721452B1 (ko) * 2019-03-29 2024-10-23 엘지디스플레이 주식회사 플렉서블 진동 모듈 및 이를 포함하는 표시 장치
EP4021650A4 (en) * 2019-08-28 2023-09-06 SCR Engineers Ltd FLUID ANALYSIS DEVICES
JP7724853B2 (ja) 2020-10-21 2025-08-18 マウイ イマギング，インコーポレーテッド 多数開口超音波を用いた組織の特徴付けのためのシステム及び方法
EP4236811A4 (en) 2020-11-02 2024-10-09 Maui Imaging, Inc. Systems and methods for improving ultrasound image quality
US12414474B2 (en) * 2021-10-21 2025-09-09 Baker Hughes Oilfield Operations Llc Methods of forming piezoelectric materials, piezoelectric devices, and associated tooling and systems
CN116293473B (zh) * 2022-12-08 2025-08-01 海鹰企业集团有限责任公司 一种改进型管道声纳湿端处理装置

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Also Published As

Publication number Publication date
FR2980379A1 (fr) 2013-03-29
CN103008218B (zh) 2016-06-29
CA2790266C (en) 2019-11-26
DE102012108796B4 (de) 2021-03-04
JP2013068616A (ja) 2013-04-18
US20130076207A1 (en) 2013-03-28
US8853918B2 (en) 2014-10-07
CN103008218A (zh) 2013-04-03
CA2790266A1 (en) 2013-03-22
DE102012108796A1 (de) 2013-03-28

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