CN103000796A - Method for installing light-emitting diode (LED) by utilizing asymmetrical conductive paste (ACP) - Google Patents
Method for installing light-emitting diode (LED) by utilizing asymmetrical conductive paste (ACP) Download PDFInfo
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- CN103000796A CN103000796A CN201210480492XA CN201210480492A CN103000796A CN 103000796 A CN103000796 A CN 103000796A CN 201210480492X A CN201210480492X A CN 201210480492XA CN 201210480492 A CN201210480492 A CN 201210480492A CN 103000796 A CN103000796 A CN 103000796A
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- acp
- led chip
- circuit board
- conductive glue
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Abstract
The invention discloses a method for installing a light-emitting diode (LED) by utilizing asymmetrical conductive paste (ACP). The method includes coating the ACP on a circuit board to be connected in abutting mode with an LED chip, aligning an anode welding disc and a cathode welding disc of the LED chip with two circuit conductors on the circuit board, bonding the LED chip to the ACP, conducting heat press bonding on two faces of the LED chip and the circuit board, connecting the LED chip and the circuit board by means of conductive beads in the ACP and heating the ACP while ensuring that pressure is applied to two faces of the LED chip and the circuit board to solidify the ACP. The method is low in production cost and small in product size and weight and has high actual application value.
Description
Technical field
The present invention relates to the LED lighting technical field, particularly a kind of method of utilizing asymmetric conductive glue (ACP) that LED is installed.
Background technology
LED (light-emitting diode) is a kind of brand-new semiconductor lighting technology, and in the last few years, a lot of fields that are applied in of LED had obtained development at full speed.Particularly compare with conventional light source, the LED illumination has the advantage of obvious energy-conserving and environment-protective, is the future trend in the fields such as room lighting, Landscape Lighting, car lighting.Along with the LED range of application is more and more extensive, the downward trend of its holistic cost also is more and more obvious.
Traditional LED technique adopts chip encapsulation technology always, and this need to could be used for illumination with LED through expensive processing such as spun gold routings, complex manufacturing, and cost is high, and volume is large.Therefore, need to reduce cost, could be with the LED popularization and application.
Summary of the invention
For this reason, the technical problem to be solved in the present invention is: how to simplify the production procedure of LED, reduce the production cost of LED, popularization and application LED lighting technology.For this reason, the present invention proposes a kind of method of utilizing asymmetric conductive glue (ACP) that LED is installed, can eliminate fully because the restriction of prior art and one or more problems that defective causes.
Additional advantages of the present invention, purpose and characteristic, a part will be elucidated in the following description, and another part will be significantly for those of ordinary skill in the art by the investigation to following explanation or acquire from enforcement of the present invention.Can realize and obtain the object of the invention and advantage by the structure of in the specification of literal and claims and accompanying drawing, pointing out especially.
The invention provides a kind of method of utilizing asymmetric conductive glue (ACP) that LED is installed, it is characterized in that, described method specifically may further comprise the steps:
Step 1 arranges respectively positive terminal pad and the negative terminal pad of LED at the two ends of led chip;
Wherein, described led chip is except comprising positive terminal pad and negative terminal pad, also comprise led chip positive electrode, led chip negative material and saphire substrate material, described led chip positive electrode is positioned at the below of described positive terminal pad, described led chip negative material is positioned at the below of described negative terminal pad, and described saphire substrate material is positioned at the bottom of described led chip.
Step 3 is coated asymmetric conductive glue (ACP) at the circuit board that will dock with led chip, and makes two circuit conductors on the described circuit board of described asymmetric conductive glue (ACP) covering;
Step 4 is alignd the positive terminal pad of described led chip and negative terminal pad respectively with two circuit conductors on the described circuit board, then described led chip is attached on the described asymmetric conductive glue (ACP);
Step 5 is exerted pressure to the two sides of described led chip and circuit board, by the conductive bead in the asymmetric conductive glue (ACP), with described led chip and circuit board conducting;
Step 6 when maintenance is exerted pressure to the two sides of described led chip and circuit board, to asymmetric conductive glue (ACP) heating, solidifies described asymmetric conductive glue (ACP).
According to one preferred embodiment of the present invention, described circuit conductor is copper or aluminium.
According to one preferred embodiment of the present invention, described circuit board is flexibility or hard circuit board.
According to one preferred embodiment of the present invention, described conductive bead is silver-plated bead, and the main component of described asymmetric conductive glue (ACP) is temperature catalysis glue, and has added silver-plated bead in temperature catalysis glue.
According to one preferred embodiment of the present invention, the diameter of described bead is 0.1 micron, and described asymmetric conductive glue (ACP) is liquid.
According to one preferred embodiment of the present invention, can be on the chip of producing with the method covering insulating material.
The present invention has the following advantages:
1, utilize asymmetric conductive glue (ACP), can be to led chip, disposablely dock simultaneously a plurality of welding, effectively increase speed of production.
2, can be mounted to led chip on the flexible material.
3, can be on the chip of producing with the method covering insulating material, thereby have high security.
4, production cost is low.
5, small product size is little, and is lightweight.
Description of drawings
Fig. 1 (a) is the front view according to the led chip of the embodiment of the invention.
Fig. 1 (b) is the cross section view according to the led chip of the embodiment of the invention.
Fig. 2 (a) is the structural profile schematic diagram according to the circuit board of the embodiment of the invention.
Fig. 2 (b) is the structure front face schematic diagram according to the circuit board of the embodiment of the invention.
Fig. 3 is for according to the schematic diagram embodiment of the invention, that led chip is attached to the asymmetric conductive glue (ACP) on the circuit board.
Fig. 4 is for according to the schematic diagram embodiment of the invention, that exerted pressure and heat in the two sides of led chip and circuit board.
Fig. 5 is the front view of the finished product that uses method of the present invention and make.
Embodiment
With reference to the accompanying drawings the present invention is described more fully, exemplary embodiment of the present invention wherein is described.
The present invention proposes a kind of method of utilizing asymmetric conductive glue (ACP) that LED is installed, described method specifically may further comprise the steps:
Step 1 arranges respectively positive terminal pad and the negative terminal pad of LED at the two ends of led chip.
Fig. 1 (a) is the front view of led chip used in the present invention.As shown in Figure 1, led chip 1 comprises positive terminal pad 11 and the negative terminal pad 12 that lays respectively at led chip 1 two ends.
Fig. 1 (b) shows the cross section view of led chip.Shown in Fig. 1 (b), led chip 1 is except comprising positive terminal pad 11 and negative terminal pad 12, also comprise led chip positive electrode 13, led chip negative material 14 and saphire substrate material 15, wherein, led chip positive electrode 13 is positioned at the below of positive terminal pad 11, led chip negative material 14 is positioned at the below of negative terminal pad 12, and saphire substrate material 15 is positioned at the bottom of led chip 1.
Fig. 2 (a) is the structural profile schematic diagram according to the circuit board of the embodiment of the invention.Fig. 2 (b) is the structure front face schematic diagram according to the circuit board of the embodiment of the invention.Shown in Fig. 2 (a) and 2 (b), circuit conductor 21 and circuit conductor 22 are set respectively on circuit board 2.Wherein, described circuit conductor 21 is corresponding with the positive terminal pad of led chip, and described circuit conductor 22 is corresponding with the negative terminal pad of led chip.According to the embodiment of the invention, by needle tubing asymmetric conductive glue (ACP) 23 is coated onto on the circuit board 2.
According to a preferred embodiment of the invention, described circuit conductor 21 and 22 is copper or aluminium.
According to a preferred embodiment of the invention, described circuit board 2 is flexibility or hard circuit board.
Step 3 is coated asymmetric conductive glue (ACP) at the circuit board that will dock with led chip, and makes two pads on the described circuit board of described asymmetric conductive glue (ACP) covering.
Asymmetric conductive glue of the present invention (ACP) is a kind of technology for smart tags.The main component of described asymmetric conductive glue (ACP) is temperature catalysis glue, and has added silver-plated bead in temperature catalysis glue, and preferred, the diameter of described bead is 0.1 micron, and described asymmetric conducting resinl is liquid.By asymmetric conductive glue (ACP) is exerted pressure, can make bead and upper lower conductor UNICOM, owing to laterally do not have pressure, so can not conduct electricity.The method that this conduction connects is fit to the processing of fine electronic device very much.
Return Fig. 2 (a) and Fig. 2 (b), 23 among Fig. 2 (a) and Fig. 2 (b) is asymmetric conductive glue (ACP).Can be found out by Fig. 2 (a) and Fig. 2 (b), asymmetric conductive glue (ACP) 23 has covered circuit conductor 21 and the circuit conductor 22 on the circuit board 2.
Step 4 is alignd the positive terminal pad of described led chip and negative terminal pad respectively with two circuit conductors on the described circuit board, then described led chip is attached on the described asymmetric conductive glue (ACP).
Fig. 3 shows the schematic diagram that led chip is attached to the asymmetric conductive glue (ACP) on the circuit board.As seen from Figure 3, the positive terminal pad of led chip 1 and negative terminal pad are alignd with two circuit conductors on the described circuit board 2 respectively, then led chip is attached on the described asymmetric conductive glue (ACP) 23, also just say, led chip 1 is by pasting described asymmetric conductive glue (ACP) 23, and described led chip 1 is installed on the described circuit board 2.
Step 5 is exerted pressure to the two sides of described led chip and circuit board, by the conductive bead in the asymmetric conductive glue (ACP), with described led chip and circuit board conducting.
The schematic diagram of Fig. 4 for being exerted pressure and heat in the two sides of led chip and circuit board.As shown in Figure 4, led chip 1 pastes on the circuit board 2 by asymmetric conductive glue (ACP) 23, and the circuit board 2 that is pasted with led chip 1 is placed on the platform body, then led chip 1 is exerted pressure.In one embodiment of this invention, institute's applied pressure is the 5kg/ square centimeter.
Step 6 when maintenance is exerted pressure to the two sides of described led chip and circuit board, to asymmetric conductive glue (ACP) heating, solidifies described asymmetric conductive glue (ACP).
Preferably, the temperature of heating is 150 degree.
So far, just finished the asymmetric conductive glue (ACP) of utilizing proposed by the invention whole flow processs of the method for LED have been installed.
Fig. 5 is the front view of the finished product that uses method of the present invention and make.Among Fig. 5, led chip 1 has been cured on the circuit board by asymmetric conductive glue (ACP).
According to a preferred embodiment of the invention, can be on the chip of producing with the method covering insulating material, thereby have high security.
Use the asymmetric conductive glue (ACP) of utilizing proposed by the invention that the method for LED is installed, effectively overcome existing LED encapsulation technology complex process, the shortcoming that cost is high, and can directly be installed to LED on the soft plastic material, for example, on high temperature fresh-keeping film or the high temperature insurance bag, can satisfy the safety requirements of anti-high pressure.In addition, the present invention utilizes asymmetric conductive glue (ACP), can be to led chip, disposablely dock simultaneously a plurality of welding, and effectively increase speed of production.Therefore, the present invention be a kind ofly can use in a large number, low-cost, fast automatic production method, have higher actual application value.
Above content is preferred embodiment of the present invention only, for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, and this description should not be construed as limitation of the present invention.
Claims (6)
1. a method of utilizing asymmetric conductive glue (ACP) that LED is installed is characterized in that, described method specifically may further comprise the steps:
Step 1 arranges respectively positive terminal pad and the negative terminal pad of LED at the two ends of led chip;
Wherein, described led chip is except comprising positive terminal pad and negative terminal pad, also comprise led chip positive electrode, led chip negative material and saphire substrate material, described led chip positive electrode is positioned at the below of described positive terminal pad, described led chip negative material is positioned at the below of described negative terminal pad, and described saphire substrate material is positioned at the bottom of described led chip.
Step 2 arranges two circuit conductors at the circuit board that docks with led chip, and described two circuit conductors are corresponding with positive terminal pad and the negative terminal pad of led chip respectively;
Step 3 is coated asymmetric conductive glue (ACP) at the circuit board that will dock with led chip, and makes two circuit conductors on the described circuit board of described asymmetric conductive glue (ACP) covering;
Step 4 is alignd the positive terminal pad of described led chip and negative terminal pad respectively with two circuit conductors on the described circuit board, then described led chip is attached on the described asymmetric conductive glue (ACP);
Step 5 is exerted pressure to the two sides of described led chip and circuit board, by the conductive bead in the asymmetric conductive glue (ACP), with described led chip and circuit board conducting;
Step 6 when maintenance is exerted pressure to the two sides of described led chip and circuit board, to asymmetric conductive glue (ACP) heating, solidifies described asymmetric conductive glue (ACP).
2. the method for utilizing asymmetric conductive glue (ACP) that LED is installed according to claim 1 is characterized in that, described circuit conductor is copper or aluminium.
3. the method for utilizing asymmetric conductive glue (ACP) that LED is installed according to claim 1 is characterized in that, described circuit board is flexibility or hard circuit board.
4. the method for utilizing asymmetric conductive glue (ACP) that LED is installed according to claim 1, it is characterized in that, described conductive bead is silver-plated bead, the main component of described asymmetric conductive glue (ACP) is temperature catalysis glue, and has added silver-plated bead in temperature catalysis glue.
5. the method for utilizing asymmetric conductive glue (ACP) that LED is installed according to claim 5 is characterized in that, the diameter of described silver-plated bead is 0.1 micron, and described asymmetric conductive glue (ACP) is liquid.
6. the described method of utilizing asymmetric conductive glue (ACP) that LED is installed of any one is characterized in that according to claim 1-6, can be on the chip of producing with the method covering insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210480492XA CN103000796A (en) | 2012-11-23 | 2012-11-23 | Method for installing light-emitting diode (LED) by utilizing asymmetrical conductive paste (ACP) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210480492XA CN103000796A (en) | 2012-11-23 | 2012-11-23 | Method for installing light-emitting diode (LED) by utilizing asymmetrical conductive paste (ACP) |
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| Publication Number | Publication Date |
|---|---|
| CN103000796A true CN103000796A (en) | 2013-03-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210480492XA Pending CN103000796A (en) | 2012-11-23 | 2012-11-23 | Method for installing light-emitting diode (LED) by utilizing asymmetrical conductive paste (ACP) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109254430A (en) * | 2018-11-12 | 2019-01-22 | 成都中电熊猫显示科技有限公司 | A kind of panel compression bonding method and compression bonding apparatus |
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| US20090242916A1 (en) * | 2008-03-27 | 2009-10-01 | Tsang-Lin Hsu | Method for packaging a light emitting device |
| TW201145620A (en) * | 2010-04-12 | 2011-12-16 | Sony Chemical & Inf Device | Method of manufacturing light-emitting device |
| CN102347436A (en) * | 2011-10-26 | 2012-02-08 | 晶科电子（广州）有限公司 | LED (Light-emitting Diode) device and wafer-level LED device as well as packaging structure of LED device and wafer-level LED device |
| CN102676082A (en) * | 2011-03-11 | 2012-09-19 | 艾普特佩克股份有限公司 | Fiber, fiber aggregate and adhesive having the same |
| CN102709438A (en) * | 2012-03-22 | 2012-10-03 | 浙江英特来光电科技有限公司 | Wireless packaging structure of high-power ceramic LED (Light-emitting Diode) |
-
2012
- 2012-11-23 CN CN201210480492XA patent/CN103000796A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090242916A1 (en) * | 2008-03-27 | 2009-10-01 | Tsang-Lin Hsu | Method for packaging a light emitting device |
| TW201145620A (en) * | 2010-04-12 | 2011-12-16 | Sony Chemical & Inf Device | Method of manufacturing light-emitting device |
| CN102676082A (en) * | 2011-03-11 | 2012-09-19 | 艾普特佩克股份有限公司 | Fiber, fiber aggregate and adhesive having the same |
| CN102347436A (en) * | 2011-10-26 | 2012-02-08 | 晶科电子（广州）有限公司 | LED (Light-emitting Diode) device and wafer-level LED device as well as packaging structure of LED device and wafer-level LED device |
| CN102709438A (en) * | 2012-03-22 | 2012-10-03 | 浙江英特来光电科技有限公司 | Wireless packaging structure of high-power ceramic LED (Light-emitting Diode) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109254430A (en) * | 2018-11-12 | 2019-01-22 | 成都中电熊猫显示科技有限公司 | A kind of panel compression bonding method and compression bonding apparatus |
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Application publication date: 20130327 |