CN102950550B - 制备化学机械抛光层的方法 - Google Patents

制备化学机械抛光层的方法 Download PDF

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Publication number
CN102950550B
CN102950550B CN201210290726.4A CN201210290726A CN102950550B CN 102950550 B CN102950550 B CN 102950550B CN 201210290726 A CN201210290726 A CN 201210290726A CN 102950550 B CN102950550 B CN 102950550B
Authority
CN
China
Prior art keywords
mold cavity
area
annular
axis
phase
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201210290726.4A
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English (en)
Chinese (zh)
Other versions
CN102950550A (zh
Inventor
K·麦克休
J·T·默南
G·H·麦克莱恩
D·A·赫特
R·A·布雷迪
C·A·扬
J·B·米勒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROHM AND HAAS ELECTRONIC MATER filed Critical ROHM AND HAAS ELECTRONIC MATER
Publication of CN102950550A publication Critical patent/CN102950550A/zh
Application granted granted Critical
Publication of CN102950550B publication Critical patent/CN102950550B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201210290726.4A 2011-08-16 2012-08-15 制备化学机械抛光层的方法 Active CN102950550B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/210,432 2011-08-16
US13/210,432 US8444727B2 (en) 2011-08-16 2011-08-16 Method of manufacturing chemical mechanical polishing layers

Publications (2)

Publication Number Publication Date
CN102950550A CN102950550A (zh) 2013-03-06
CN102950550B true CN102950550B (zh) 2015-10-28

Family

ID=47625351

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201210290726.4A Active CN102950550B (zh) 2011-08-16 2012-08-15 制备化学机械抛光层的方法

Country Status (7)

Country Link
US (1) US8444727B2 (https=)
JP (1) JP5900227B2 (https=)
KR (1) KR101950040B1 (https=)
CN (1) CN102950550B (https=)
DE (1) DE102012015942A1 (https=)
FR (1) FR2979070B1 (https=)
TW (1) TWI593510B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8709114B2 (en) * 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
KR101857435B1 (ko) * 2016-12-15 2018-05-15 한국생산기술연구원 다공성 구조체를 가진 정반 및 그것의 제작방법
CN108215028B (zh) * 2017-12-15 2019-12-31 湖北鼎龙控股股份有限公司 一种用于制备抛光垫的模具系统及其使用方法
CN110270940B (zh) * 2019-07-25 2020-09-25 湖北鼎汇微电子材料有限公司 抛光垫的连续浇注制造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1781669A (zh) * 2004-11-23 2006-06-07 罗门哈斯电子材料Cmp控股股份有限公司 减少了条纹的化学机械抛光垫的制备方法
CN101134303A (zh) * 2006-08-30 2008-03-05 力晶半导体股份有限公司 抛光垫及其制造方法
CN101870093A (zh) * 2009-04-27 2010-10-27 罗门哈斯电子材料Cmp控股股份有限公司 制造气体夹杂物缺陷减少的化学机械抛光垫抛光层的方法

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DE1916330A1 (de) 1969-03-29 1970-10-08 Richard Zippel & Co Kg Farbspr Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen
DE2127582C3 (de) * 1971-06-03 1975-06-12 Krauss-Maffei Ag, 8000 Muenchen Verfahren zum Herstellen eines zellförmigen Gegenstandes aus polymeren! Kunststoff
US4158535A (en) 1977-01-25 1979-06-19 Olin Corporation Generation of polyurethane foam
US4687531A (en) * 1982-01-26 1987-08-18 Potoczky Joseph B Method for centrifugal spray molding of thin-walled structures
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
CA2197136A1 (en) * 1997-02-10 1998-08-10 Dave Cockle Plastic molding process and products produced thereby
ID24359A (id) * 1997-05-16 2000-07-13 Unilever Nv Proses untuk memproduksi suatu komposisi detergen
EP1268134A1 (en) * 1999-12-14 2003-01-02 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
GB0008553D0 (en) * 2000-04-06 2000-05-24 Unilever Plc Process and apparatus for the production of a detergent bar
JP4614406B2 (ja) * 2000-12-27 2011-01-19 東洋ゴム工業株式会社 半導体研磨用ポリウレタン発泡体を製造する方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
US8552980B2 (en) 2009-04-30 2013-10-08 Gregory A. Shaver Computer input devices and associated computing devices, software, and methods

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1781669A (zh) * 2004-11-23 2006-06-07 罗门哈斯电子材料Cmp控股股份有限公司 减少了条纹的化学机械抛光垫的制备方法
CN101134303A (zh) * 2006-08-30 2008-03-05 力晶半导体股份有限公司 抛光垫及其制造方法
CN101870093A (zh) * 2009-04-27 2010-10-27 罗门哈斯电子材料Cmp控股股份有限公司 制造气体夹杂物缺陷减少的化学机械抛光垫抛光层的方法

Also Published As

Publication number Publication date
JP2013039663A (ja) 2013-02-28
JP5900227B2 (ja) 2016-04-06
FR2979070A1 (fr) 2013-02-22
CN102950550A (zh) 2013-03-06
DE102012015942A1 (de) 2013-02-21
KR101950040B1 (ko) 2019-02-19
US20130042536A1 (en) 2013-02-21
TWI593510B (zh) 2017-08-01
TW201318769A (zh) 2013-05-16
KR20130020588A (ko) 2013-02-27
US8444727B2 (en) 2013-05-21
FR2979070B1 (fr) 2016-02-05

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C53 Correction of patent of invention or patent application
CB03 Change of inventor or designer information

Inventor after: K. McHugh

Inventor after: Murnane James T

Inventor after: G.H. McLean

Inventor after: DURRON A. HUTT

Inventor after: R.A. Brady

Inventor after: Young Christopher A.

Inventor after: J.B. Miller

Inventor before: K. McHugh

Inventor before: Murnane James T

Inventor before: G.H. McLean

Inventor before: DURRON A. HUTT

Inventor before: R.A. Brady

Inventor before: Young Christopher A.

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: MCHUGH K. MONAN J. T. MACLANE G. H. DURRON A. HUTT BRADY R. A. YOUNG C. A. TO: MCHUGH K. MONAN J. T. MACLANE G. H. DURRON A. HUTT BRADY R. A. YOUNG C. A. J MILLER B.

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: Delaware, USA

Patentee after: DuPont Electronic Materials Holdings Co.,Ltd.

Country or region after: U.S.A.

Address before: Delaware, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, Inc.

Country or region before: U.S.A.