JP5900227B2 - ケミカルメカニカルポリッシング層の製造方法 - Google Patents

ケミカルメカニカルポリッシング層の製造方法 Download PDF

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Publication number
JP5900227B2
JP5900227B2 JP2012173342A JP2012173342A JP5900227B2 JP 5900227 B2 JP5900227 B2 JP 5900227B2 JP 2012173342 A JP2012173342 A JP 2012173342A JP 2012173342 A JP2012173342 A JP 2012173342A JP 5900227 B2 JP5900227 B2 JP 5900227B2
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Japan
Prior art keywords
mold cavity
axis
nozzle opening
region
donut
Prior art date
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Application number
JP2012173342A
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English (en)
Japanese (ja)
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JP2013039663A (ja
JP2013039663A5 (https=
Inventor
キャスリーン・マッキュー
ジェームズ・ティー．ムルナン
ジョージ・エイチ．マックレイン
デュロン・エイ．ハット
ロバート・エイ．ブレイディ
クリストファー・エイ．ヤング
ジェフリー・ビー．ミラー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
DuPont Electronic Materials Holding Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, DuPont Electronic Materials Holding Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2013039663A publication Critical patent/JP2013039663A/ja
Publication of JP2013039663A5 publication Critical patent/JP2013039663A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2012173342A 2011-08-16 2012-08-03 ケミカルメカニカルポリッシング層の製造方法 Active JP5900227B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/210,432 2011-08-16
US13/210,432 US8444727B2 (en) 2011-08-16 2011-08-16 Method of manufacturing chemical mechanical polishing layers

Publications (3)

Publication Number Publication Date
JP2013039663A JP2013039663A (ja) 2013-02-28
JP2013039663A5 JP2013039663A5 (https=) 2015-07-23
JP5900227B2 true JP5900227B2 (ja) 2016-04-06

Family

ID=47625351

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012173342A Active JP5900227B2 (ja) 2011-08-16 2012-08-03 ケミカルメカニカルポリッシング層の製造方法

Country Status (7)

Country Link
US (1) US8444727B2 (https=)
JP (1) JP5900227B2 (https=)
KR (1) KR101950040B1 (https=)
CN (1) CN102950550B (https=)
DE (1) DE102012015942A1 (https=)
FR (1) FR2979070B1 (https=)
TW (1) TWI593510B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8709114B2 (en) * 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
KR101857435B1 (ko) * 2016-12-15 2018-05-15 한국생산기술연구원 다공성 구조체를 가진 정반 및 그것의 제작방법
CN108215028B (zh) * 2017-12-15 2019-12-31 湖北鼎龙控股股份有限公司 一种用于制备抛光垫的模具系统及其使用方法
CN110270940B (zh) * 2019-07-25 2020-09-25 湖北鼎汇微电子材料有限公司 抛光垫的连续浇注制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1916330A1 (de) 1969-03-29 1970-10-08 Richard Zippel & Co Kg Farbspr Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen
DE2127582C3 (de) * 1971-06-03 1975-06-12 Krauss-Maffei Ag, 8000 Muenchen Verfahren zum Herstellen eines zellförmigen Gegenstandes aus polymeren! Kunststoff
US4158535A (en) 1977-01-25 1979-06-19 Olin Corporation Generation of polyurethane foam
US4687531A (en) * 1982-01-26 1987-08-18 Potoczky Joseph B Method for centrifugal spray molding of thin-walled structures
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
CA2197136A1 (en) * 1997-02-10 1998-08-10 Dave Cockle Plastic molding process and products produced thereby
ID24359A (id) * 1997-05-16 2000-07-13 Unilever Nv Proses untuk memproduksi suatu komposisi detergen
EP1268134A1 (en) * 1999-12-14 2003-01-02 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
GB0008553D0 (en) * 2000-04-06 2000-05-24 Unilever Plc Process and apparatus for the production of a detergent bar
JP4614406B2 (ja) * 2000-12-27 2011-01-19 東洋ゴム工業株式会社 半導体研磨用ポリウレタン発泡体を製造する方法
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
CN101134303A (zh) * 2006-08-30 2008-03-05 力晶半导体股份有限公司 抛光垫及其制造方法
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
US7947098B2 (en) * 2009-04-27 2011-05-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects
US8552980B2 (en) 2009-04-30 2013-10-08 Gregory A. Shaver Computer input devices and associated computing devices, software, and methods

Also Published As

Publication number Publication date
JP2013039663A (ja) 2013-02-28
FR2979070A1 (fr) 2013-02-22
CN102950550B (zh) 2015-10-28
CN102950550A (zh) 2013-03-06
DE102012015942A1 (de) 2013-02-21
KR101950040B1 (ko) 2019-02-19
US20130042536A1 (en) 2013-02-21
TWI593510B (zh) 2017-08-01
TW201318769A (zh) 2013-05-16
KR20130020588A (ko) 2013-02-27
US8444727B2 (en) 2013-05-21
FR2979070B1 (fr) 2016-02-05

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