KR101950040B1 - 화학기계 연마층의 제조 방법 - Google Patents

화학기계 연마층의 제조 방법 Download PDF

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Publication number
KR101950040B1
KR101950040B1 KR1020120089274A KR20120089274A KR101950040B1 KR 101950040 B1 KR101950040 B1 KR 101950040B1 KR 1020120089274 A KR1020120089274 A KR 1020120089274A KR 20120089274 A KR20120089274 A KR 20120089274A KR 101950040 B1 KR101950040 B1 KR 101950040B1
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South Korea
Prior art keywords
mold cavity
axis
area
phase
nozzle opening
Prior art date
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KR1020120089274A
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English (en)
Korean (ko)
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KR20130020588A (ko
Inventor
캐쓸린 맥휴
제임스 티 머네인
조지 에이치 매클레인
듀런 에이 허트
로버트 에이 브래디
크리스토퍼 에이 영
제프리 비 밀러
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
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Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20130020588A publication Critical patent/KR20130020588A/ko
Application granted granted Critical
Publication of KR101950040B1 publication Critical patent/KR101950040B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020120089274A 2011-08-16 2012-08-16 화학기계 연마층의 제조 방법 Active KR101950040B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/210,432 2011-08-16
US13/210,432 US8444727B2 (en) 2011-08-16 2011-08-16 Method of manufacturing chemical mechanical polishing layers

Publications (2)

Publication Number Publication Date
KR20130020588A KR20130020588A (ko) 2013-02-27
KR101950040B1 true KR101950040B1 (ko) 2019-02-19

Family

ID=47625351

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120089274A Active KR101950040B1 (ko) 2011-08-16 2012-08-16 화학기계 연마층의 제조 방법

Country Status (7)

Country Link
US (1) US8444727B2 (https=)
JP (1) JP5900227B2 (https=)
KR (1) KR101950040B1 (https=)
CN (1) CN102950550B (https=)
DE (1) DE102012015942A1 (https=)
FR (1) FR2979070B1 (https=)
TW (1) TWI593510B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8709114B2 (en) * 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
KR101857435B1 (ko) * 2016-12-15 2018-05-15 한국생산기술연구원 다공성 구조체를 가진 정반 및 그것의 제작방법
CN108215028B (zh) * 2017-12-15 2019-12-31 湖北鼎龙控股股份有限公司 一种用于制备抛光垫的模具系统及其使用方法
CN110270940B (zh) * 2019-07-25 2020-09-25 湖北鼎汇微电子材料有限公司 抛光垫的连续浇注制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090053976A1 (en) 2005-02-18 2009-02-26 Roy Pradip K Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof
US20100068322A1 (en) 2000-04-06 2010-03-18 Conopco, Inc., D/B/A Unilever Process and apparatus for the production of a detergent bar

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DE1916330A1 (de) 1969-03-29 1970-10-08 Richard Zippel & Co Kg Farbspr Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen
DE2127582C3 (de) * 1971-06-03 1975-06-12 Krauss-Maffei Ag, 8000 Muenchen Verfahren zum Herstellen eines zellförmigen Gegenstandes aus polymeren! Kunststoff
US4158535A (en) 1977-01-25 1979-06-19 Olin Corporation Generation of polyurethane foam
US4687531A (en) * 1982-01-26 1987-08-18 Potoczky Joseph B Method for centrifugal spray molding of thin-walled structures
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
CA2197136A1 (en) * 1997-02-10 1998-08-10 Dave Cockle Plastic molding process and products produced thereby
ID24359A (id) * 1997-05-16 2000-07-13 Unilever Nv Proses untuk memproduksi suatu komposisi detergen
EP1268134A1 (en) * 1999-12-14 2003-01-02 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
JP4614406B2 (ja) * 2000-12-27 2011-01-19 東洋ゴム工業株式会社 半導体研磨用ポリウレタン発泡体を製造する方法
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
CN101134303A (zh) * 2006-08-30 2008-03-05 力晶半导体股份有限公司 抛光垫及其制造方法
US8118644B2 (en) * 2008-10-16 2012-02-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having integral identification feature
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
US7947098B2 (en) * 2009-04-27 2011-05-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects
US8552980B2 (en) 2009-04-30 2013-10-08 Gregory A. Shaver Computer input devices and associated computing devices, software, and methods

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100068322A1 (en) 2000-04-06 2010-03-18 Conopco, Inc., D/B/A Unilever Process and apparatus for the production of a detergent bar
US20090053976A1 (en) 2005-02-18 2009-02-26 Roy Pradip K Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof

Also Published As

Publication number Publication date
JP2013039663A (ja) 2013-02-28
JP5900227B2 (ja) 2016-04-06
FR2979070A1 (fr) 2013-02-22
CN102950550B (zh) 2015-10-28
CN102950550A (zh) 2013-03-06
DE102012015942A1 (de) 2013-02-21
US20130042536A1 (en) 2013-02-21
TWI593510B (zh) 2017-08-01
TW201318769A (zh) 2013-05-16
KR20130020588A (ko) 2013-02-27
US8444727B2 (en) 2013-05-21
FR2979070B1 (fr) 2016-02-05

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