FR2979070B1 - Procede de fabrication de couches de polissage chimico-mecanique - Google Patents
Procede de fabrication de couches de polissage chimico-mecaniqueInfo
- Publication number
- FR2979070B1 FR2979070B1 FR1257818A FR1257818A FR2979070B1 FR 2979070 B1 FR2979070 B1 FR 2979070B1 FR 1257818 A FR1257818 A FR 1257818A FR 1257818 A FR1257818 A FR 1257818A FR 2979070 B1 FR2979070 B1 FR 2979070B1
- Authority
- FR
- France
- Prior art keywords
- mechanical polishing
- chemical mechanical
- producing chemical
- polishing layers
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/210,432 US8444727B2 (en) | 2011-08-16 | 2011-08-16 | Method of manufacturing chemical mechanical polishing layers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2979070A1 FR2979070A1 (fr) | 2013-02-22 |
| FR2979070B1 true FR2979070B1 (fr) | 2016-02-05 |
Family
ID=47625351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR1257818A Expired - Fee Related FR2979070B1 (fr) | 2011-08-16 | 2012-08-16 | Procede de fabrication de couches de polissage chimico-mecanique |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8444727B2 (https=) |
| JP (1) | JP5900227B2 (https=) |
| KR (1) | KR101950040B1 (https=) |
| CN (1) | CN102950550B (https=) |
| DE (1) | DE102012015942A1 (https=) |
| FR (1) | FR2979070B1 (https=) |
| TW (1) | TWI593510B (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8709114B2 (en) * | 2012-03-22 | 2014-04-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing chemical mechanical polishing layers |
| US9034063B2 (en) * | 2012-09-27 | 2015-05-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method of manufacturing grooved chemical mechanical polishing layers |
| US20150306731A1 (en) * | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US10722999B2 (en) * | 2016-06-17 | 2020-07-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | High removal rate chemical mechanical polishing pads and methods of making |
| KR101857435B1 (ko) * | 2016-12-15 | 2018-05-15 | 한국생산기술연구원 | 다공성 구조체를 가진 정반 및 그것의 제작방법 |
| CN108215028B (zh) * | 2017-12-15 | 2019-12-31 | 湖北鼎龙控股股份有限公司 | 一种用于制备抛光垫的模具系统及其使用方法 |
| CN110270940B (zh) * | 2019-07-25 | 2020-09-25 | 湖北鼎汇微电子材料有限公司 | 抛光垫的连续浇注制造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1916330A1 (de) | 1969-03-29 | 1970-10-08 | Richard Zippel & Co Kg Farbspr | Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen |
| DE2127582C3 (de) * | 1971-06-03 | 1975-06-12 | Krauss-Maffei Ag, 8000 Muenchen | Verfahren zum Herstellen eines zellförmigen Gegenstandes aus polymeren! Kunststoff |
| US4158535A (en) | 1977-01-25 | 1979-06-19 | Olin Corporation | Generation of polyurethane foam |
| US4687531A (en) * | 1982-01-26 | 1987-08-18 | Potoczky Joseph B | Method for centrifugal spray molding of thin-walled structures |
| MY114512A (en) | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| CA2197136A1 (en) * | 1997-02-10 | 1998-08-10 | Dave Cockle | Plastic molding process and products produced thereby |
| ID24359A (id) * | 1997-05-16 | 2000-07-13 | Unilever Nv | Proses untuk memproduksi suatu komposisi detergen |
| EP1268134A1 (en) * | 1999-12-14 | 2003-01-02 | Rodel Holdings, Inc. | Method of manufacturing a polymer or polymer composite polishing pad |
| GB0008553D0 (en) * | 2000-04-06 | 2000-05-24 | Unilever Plc | Process and apparatus for the production of a detergent bar |
| JP4614406B2 (ja) * | 2000-12-27 | 2011-01-19 | 東洋ゴム工業株式会社 | 半導体研磨用ポリウレタン発泡体を製造する方法 |
| US20060108701A1 (en) * | 2004-11-23 | 2006-05-25 | Saikin Allan H | Method for forming a striation reduced chemical mechanical polishing pad |
| TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於cmp之特製拋光墊及其製造方法及其用途 |
| CN101134303A (zh) * | 2006-08-30 | 2008-03-05 | 力晶半导体股份有限公司 | 抛光垫及其制造方法 |
| US8118644B2 (en) * | 2008-10-16 | 2012-02-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having integral identification feature |
| US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
| US7947098B2 (en) * | 2009-04-27 | 2011-05-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects |
| US8552980B2 (en) | 2009-04-30 | 2013-10-08 | Gregory A. Shaver | Computer input devices and associated computing devices, software, and methods |
-
2011
- 2011-08-16 US US13/210,432 patent/US8444727B2/en active Active
-
2012
- 2012-08-03 JP JP2012173342A patent/JP5900227B2/ja active Active
- 2012-08-07 TW TW101128395A patent/TWI593510B/zh active
- 2012-08-10 DE DE102012015942A patent/DE102012015942A1/de not_active Withdrawn
- 2012-08-15 CN CN201210290726.4A patent/CN102950550B/zh active Active
- 2012-08-16 KR KR1020120089274A patent/KR101950040B1/ko active Active
- 2012-08-16 FR FR1257818A patent/FR2979070B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2013039663A (ja) | 2013-02-28 |
| JP5900227B2 (ja) | 2016-04-06 |
| FR2979070A1 (fr) | 2013-02-22 |
| CN102950550B (zh) | 2015-10-28 |
| CN102950550A (zh) | 2013-03-06 |
| DE102012015942A1 (de) | 2013-02-21 |
| KR101950040B1 (ko) | 2019-02-19 |
| US20130042536A1 (en) | 2013-02-21 |
| TWI593510B (zh) | 2017-08-01 |
| TW201318769A (zh) | 2013-05-16 |
| KR20130020588A (ko) | 2013-02-27 |
| US8444727B2 (en) | 2013-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| FR2981341B1 (fr) | Procede de fabrication de xerogels | |
| IL231667A0 (en) | Process aware metrology | |
| HUE056277T2 (hu) | Eljárás pórusos membránok elõállítására | |
| EP2782224A4 (en) | COIL METHOD | |
| EP2680983A4 (en) | METHOD FOR PRODUCING THIN FILMS FROM CRYSTAL DIAMONDS | |
| FR2943348B1 (fr) | Procede de fabrication de polyamide | |
| FR2979071B1 (fr) | Procede de polissage chimico-mecanique du cuivre | |
| FR2979069B1 (fr) | Procede de polissage chimico-mecanique du tungstene | |
| EP2843686A4 (en) | METHOD FOR PRODUCING A BONDED WAFERS | |
| FR2979070B1 (fr) | Procede de fabrication de couches de polissage chimico-mecanique | |
| EP2933036A4 (en) | SPIRAL SPRING PRODUCTION PROCESS | |
| IL232839A0 (en) | A process for the production of benzoxazinones | |
| PL2744772T3 (pl) | Sposób wytwarzania sewofluranu | |
| IL232838A0 (en) | Process for the production of triazinon-benzoxazinones | |
| GB2488894B (en) | Process for producing V-Coelenterazine compounds | |
| EP2543502A4 (en) | METHOD FOR PRODUCING TABLETS | |
| IL232837A0 (en) | A process for the production of amino-benzoxazinones converted in position 4 | |
| CO6990682A2 (es) | Procedimiento de fabricación de articulos tridimencionales flexibles | |
| SG10201602816XA (en) | B2f4 manufacturing process | |
| FR3017557B1 (fr) | Procede de fabrication de couches de polissage mecano-chimique | |
| FR2963349B1 (fr) | Procede de fabrication de polyamide | |
| PL2476684T3 (pl) | Sposób wytwarzania alkilofosforanów | |
| IL232840A (en) | Process for the production of aryloxyacetamides | |
| FR2959511B1 (fr) | Procede de fabrication de polyamide | |
| FR2994430B1 (fr) | Procede de production du difluoromethane |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 4 |
|
| PLFP | Fee payment |
Year of fee payment: 5 |
|
| PLFP | Fee payment |
Year of fee payment: 6 |
|
| PLFP | Fee payment |
Year of fee payment: 7 |
|
| PLFP | Fee payment |
Year of fee payment: 9 |
|
| PLFP | Fee payment |
Year of fee payment: 10 |
|
| PLFP | Fee payment |
Year of fee payment: 11 |
|
| ST | Notification of lapse |
Effective date: 20240405 |