TWI593510B - 製造化學機械研磨層之方法 - Google Patents

製造化學機械研磨層之方法 Download PDF

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Publication number
TWI593510B
TWI593510B TW101128395A TW101128395A TWI593510B TW I593510 B TWI593510 B TW I593510B TW 101128395 A TW101128395 A TW 101128395A TW 101128395 A TW101128395 A TW 101128395A TW I593510 B TWI593510 B TW I593510B
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TW
Taiwan
Prior art keywords
cavity
axis
nozzle opening
donut
region
Prior art date
Application number
TW101128395A
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English (en)
Chinese (zh)
Other versions
TW201318769A (zh
Inventor
凱薩林 麥克哈吉
詹姆士Ｔ 磨內
喬治Ｈ 麥克蘭
杜瑞Ａ 哈特
羅伯特Ａ 伯帝
克里斯多佛Ａ 楊
傑佛瑞 Ｂ 米勒
Original Assignee
羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW201318769A publication Critical patent/TW201318769A/zh
Application granted granted Critical
Publication of TWI593510B publication Critical patent/TWI593510B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0009—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using moulds or presses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW101128395A 2011-08-16 2012-08-07 製造化學機械研磨層之方法 TWI593510B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/210,432 US8444727B2 (en) 2011-08-16 2011-08-16 Method of manufacturing chemical mechanical polishing layers

Publications (2)

Publication Number Publication Date
TW201318769A TW201318769A (zh) 2013-05-16
TWI593510B true TWI593510B (zh) 2017-08-01

Family

ID=47625351

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101128395A TWI593510B (zh) 2011-08-16 2012-08-07 製造化學機械研磨層之方法

Country Status (7)

Country Link
US (1) US8444727B2 (https=)
JP (1) JP5900227B2 (https=)
KR (1) KR101950040B1 (https=)
CN (1) CN102950550B (https=)
DE (1) DE102012015942A1 (https=)
FR (1) FR2979070B1 (https=)
TW (1) TWI593510B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8709114B2 (en) * 2012-03-22 2014-04-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing chemical mechanical polishing layers
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US20150306731A1 (en) * 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US10722999B2 (en) * 2016-06-17 2020-07-28 Rohm And Haas Electronic Materials Cmp Holdings, Inc. High removal rate chemical mechanical polishing pads and methods of making
KR101857435B1 (ko) * 2016-12-15 2018-05-15 한국생산기술연구원 다공성 구조체를 가진 정반 및 그것의 제작방법
CN108215028B (zh) * 2017-12-15 2019-12-31 湖北鼎龙控股股份有限公司 一种用于制备抛光垫的模具系统及其使用方法
CN110270940B (zh) * 2019-07-25 2020-09-25 湖北鼎汇微电子材料有限公司 抛光垫的连续浇注制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090053976A1 (en) * 2005-02-18 2009-02-26 Roy Pradip K Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof
US20100068322A1 (en) * 2000-04-06 2010-03-18 Conopco, Inc., D/B/A Unilever Process and apparatus for the production of a detergent bar
TW201020066A (en) * 2008-10-16 2010-06-01 Rohm & Haas Elect Mat A chemical mechanical polishing pad having integral identification feature
TW201020068A (en) * 2008-10-17 2010-06-01 Rohm & Haas Elect Mat Chemical mechanical polishing pad having sealed window

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1916330A1 (de) 1969-03-29 1970-10-08 Richard Zippel & Co Kg Farbspr Anlage zur Herstellung von grossen oder kompliziert geformten Formteilen aus fluessigen Mehrkomponenten-Kunststoffen
DE2127582C3 (de) * 1971-06-03 1975-06-12 Krauss-Maffei Ag, 8000 Muenchen Verfahren zum Herstellen eines zellförmigen Gegenstandes aus polymeren! Kunststoff
US4158535A (en) 1977-01-25 1979-06-19 Olin Corporation Generation of polyurethane foam
US4687531A (en) * 1982-01-26 1987-08-18 Potoczky Joseph B Method for centrifugal spray molding of thin-walled structures
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
CA2197136A1 (en) * 1997-02-10 1998-08-10 Dave Cockle Plastic molding process and products produced thereby
ID24359A (id) * 1997-05-16 2000-07-13 Unilever Nv Proses untuk memproduksi suatu komposisi detergen
EP1268134A1 (en) * 1999-12-14 2003-01-02 Rodel Holdings, Inc. Method of manufacturing a polymer or polymer composite polishing pad
JP4614406B2 (ja) * 2000-12-27 2011-01-19 東洋ゴム工業株式会社 半導体研磨用ポリウレタン発泡体を製造する方法
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
CN101134303A (zh) * 2006-08-30 2008-03-05 力晶半导体股份有限公司 抛光垫及其制造方法
US7947098B2 (en) * 2009-04-27 2011-05-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for manufacturing chemical mechanical polishing pad polishing layers having reduced gas inclusion defects
US8552980B2 (en) 2009-04-30 2013-10-08 Gregory A. Shaver Computer input devices and associated computing devices, software, and methods

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100068322A1 (en) * 2000-04-06 2010-03-18 Conopco, Inc., D/B/A Unilever Process and apparatus for the production of a detergent bar
US20090053976A1 (en) * 2005-02-18 2009-02-26 Roy Pradip K Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof
TW201020066A (en) * 2008-10-16 2010-06-01 Rohm & Haas Elect Mat A chemical mechanical polishing pad having integral identification feature
TW201020068A (en) * 2008-10-17 2010-06-01 Rohm & Haas Elect Mat Chemical mechanical polishing pad having sealed window

Also Published As

Publication number Publication date
JP2013039663A (ja) 2013-02-28
JP5900227B2 (ja) 2016-04-06
FR2979070A1 (fr) 2013-02-22
CN102950550B (zh) 2015-10-28
CN102950550A (zh) 2013-03-06
DE102012015942A1 (de) 2013-02-21
KR101950040B1 (ko) 2019-02-19
US20130042536A1 (en) 2013-02-21
TW201318769A (zh) 2013-05-16
KR20130020588A (ko) 2013-02-27
US8444727B2 (en) 2013-05-21
FR2979070B1 (fr) 2016-02-05

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