CN102927469A - Heat-dissipating light-emitting diode (LED) lamp - Google Patents
Heat-dissipating light-emitting diode (LED) lamp Download PDFInfo
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- CN102927469A CN102927469A CN2012104278604A CN201210427860A CN102927469A CN 102927469 A CN102927469 A CN 102927469A CN 2012104278604 A CN2012104278604 A CN 2012104278604A CN 201210427860 A CN201210427860 A CN 201210427860A CN 102927469 A CN102927469 A CN 102927469A
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Abstract
The invention provides a heat-dissipating light-emitting diode (LED) lamp and relates to the technical field of semiconductor photoelectronic devices. The heat-dissipating LED lamp comprises an LED chip (11), a metal substrate (12), a heat dissipation plate (13), a cooling fin (14), a U-shaped glass container (15), a heat conduction liquid (16) and insulating paste (23). Heat conduction liquid is filled in the U-shaped glass container on the light outlet side, and the insulating paste is isolated between the heat conduction liquid and the LED chip. According to the heat-dissipating LED lamp, the problem that heat dissipation of the light outlet side of the LED lamp is enough is effectively solved.
Description
Technical field
The present invention relates to the semiconductor photoelectronic device technical field, relate in particular to the radiating lamp of the radiating lamp LED of a kind of LED.
Background technology
Light emitting diode (Light-Emitting Diode, LED) is a kind of semiconductor subassembly.Multiplex as indicator lamp, demonstration light-emitting diode panel etc. at the beginning; Along with the appearance of white light LEDs, also be used as illumination.
In the LED illuminator, determine the heat dissipation problem that it is luminous and decisive factor service life is chip, so the heat dissipation problem of LED light fixture is focal point always.The aluminum radiator structure of early application utilizes a plurality of fin to make wave or pleated structure increases and the contact area of air, thereby reaches the purpose that reduces chip temperature.Along with the raising of led chip power, heat production also increases, and aluminum radiator structure light fixture originally can not meet the demands.The high conductivity material manufacturings such as heat pipe occurred utilizing in order to improve heat-sinking capability, although the radiator structure of this type has reached the target of high heat-sinking capability, but the thing followed is the rising of cost, has limited its application.
Therefore, instantly need a urgent technical problem that solves to be exactly: how can propose a kind of effective measures, to solve problems of the prior art.
Summary of the invention
Technical problem to be solved by this invention provides the radiating lamp of a kind of LED, effectively solves the not enough problem of LED light fixture bright dipping side heat radiation.
In order to solve the problems of the technologies described above, the invention provides the radiating lamp of a kind of LED, comprise led chip (11), metal substrate (12), heat sink (13), fin (14), U-shaped glass container (15), conductive fluid (16) and insulating cement (23) are filled with conductive fluid in the U-shaped glass container tool of bright dipping side, have the insulating cement isolation between conductive fluid and the led chip.
Further, described U-shaped glass container is settled led chip one side parcel with metal substrate, with the seamless bonding of metal substrate.
Further, the insulating cement between described conductive fluid and the led chip, insulating cement only wrap up the led chip sidewall.
Further, described conductive fluid be methyl alcohol, ethanol and or heptane.
To sum up, the radiating lamp of LED provided by the present invention, efficiently solve the not enough problem of LED light fixture bright dipping side heat radiation, this radiator structure cost is lower simultaneously, this invention is not only adopted traditional heat sink and fin heat dissipation channel in survey backlight, also pass through simultaneously heat transfer pathway and the heat loss through convection passage of conductive fluid in the glass container in the bright dipping side, increased area of dissipation and radiating efficiency.
Description of drawings
Fig. 1 is the structural representation of the radiating lamp of a kind of LED of the present invention;
Fig. 2 is led chip and metal substrate top view among the present invention;
Fig. 3 is the structural representation of the radiating lamp in the embodiments of the invention 2;
Fig. 4 is the structural representation of the radiating lamp in the embodiments of the invention 3.
The specific embodiment
The present invention is further detailed explanation below in conjunction with the drawings and specific embodiments.
Referring to Fig. 1, structural representation for the radiating lamp of a kind of LED of the present invention, specifically comprise led chip (11), metal substrate (12), heat sink (13), fin (14), U-shaped glass container (15), conductive fluid (16) and insulating cement (23), wherein, metal substrate backlight side and heat sink with led chip pass through the heat-conducting glue close contact, and heat sink and fin are overall structure; Metal substrate bright dipping side then with the seamless bonding of U-shaped glass container, glass container can change its shape according to actual needs in this concept, adapts to actual needs with this; The led chip sidewall scribbles glass container inside and is filled with transparent conductive fluid, and this transparent conductive fluid can be methyl alcohol, ethanol, heptane and other transparent and safe conductive fluid.Scribble insulating cement between conductive fluid and the led chip, insulating cement only wraps up the led chip sidewall, does not cover the LED exiting surface, contacts with conductive fluid to prevent the LED metal electrode, and do not have insulating cement between led chip and metal substrate.During LED work, so because the bright dipping side is filled with the conductive fluid chip heat heat is passed to conductive fluid, in the U-shaped glass container, form convection current simultaneously.Like this, backlight side and bright dipping side are dispelled the heat simultaneously, and radiating efficiency is higher.So, this radiator structure not only have by with the heat dissipation channel of the contacted fin of metal substrate heat radiation, also have simultaneously heat transmission and the thermal convection current passage of bright dipping side conductive fluid.
Briefly bright for this programme and accompanying drawing work, in the accompanying drawing 1, led chip-11, metal substrate-12, heat sink-13, fin-14, U-shaped glass container-15, conductive fluid-16,2LED chip and metal substrate top view; In the accompanying drawing 2, led chip-21, metal substrate-22, insulating cement-23, in the accompanying drawing 3, led chip-31, metal substrate-32, heat sink-33, U-shaped glass container-34, conductive fluid-35; In the accompanying drawing 4, led chip-41, metal substrate-42, heat sink-43, fin-44, U-shaped glass container-45, conductive fluid-46.
Embodiment 1:
Take ethanol as conductive fluid, see accompanying drawing 1 for details, be the cross-sectional view of this radiator structure.As follows with concrete structure:
1, led chip is placed on the metal substrate according to common process.
2, smear insulating cement in the led chip sidewall, thereby protect the chip sidewall and prevent that metal electrode from contacting with conductive fluid.
3, bond by materials such as heat-conducting glues with the survey backlight of the metal substrate of led chip and heat sink, guarantee that with this two fully contacts.
4, heat sink and fin are overall structure, and this has guaranteed carrying out smoothly of hot transmission.
5, U-shaped glass container parcel led chip, and with the seamless bonding of metal substrate, prevent that conductive fluid from flowing out; Glass container can be made difformity according to actual needs, to satisfy actual needs.
6, fill ethanol in as conductive fluid.
Embodiment 2:
Take heptane as conductive fluid, see accompanying drawing 3 for details, be the cross-sectional view of this radiating lamp.As follows with concrete structure:
1, led chip is placed on the metal substrate according to common process.
2, smear insulating cement in the led chip sidewall, thereby protect the chip sidewall and prevent that metal electrode from contacting with conductive fluid.
3, be connected by materials such as heat-conducting glues with heat sink with the survey backlight of the metal substrate of led chip, guarantee that with this two fully contacts.
4, U-shaped glass container parcel led chip, and with the seamless bonding of metal substrate, prevent that conductive fluid from flowing out; Glass container can be made difformity according to actual needs, to satisfy actual needs.
5, fill heptane in as conductive fluid.
Embodiment 3:
Take ethanol as conductive fluid, adjust the glass container shape, see accompanying drawing 4 for details, be the cross-sectional view of this radiating lamp.As follows with concrete structure:
1, led chip is placed on the metal substrate according to common process.
2, smear insulating cement in the led chip sidewall, thereby protect the chip sidewall and prevent that metal electrode from contacting with conductive fluid.
3, be connected by materials such as heat-conducting glues with heat sink with the survey backlight of the metal substrate of led chip, guarantee that with this two fully contacts.
4, U-shaped glass container parcel led chip, and with the seamless bonding of metal substrate, prevent that conductive fluid from flowing out; Glass container can be made difformity according to actual needs, to satisfy actual needs.
5, interior ethanol alkane is as conductive fluid.
Further supplementary notes, in this programme conductive fluid adopt methyl alcohol, ethanol and or heptane, can adopt freon in actual applications, the conductive fluid of the similar transparent and insulation such as acetone.
Similarly, the U-shaped glass container described in the scheme can repack other shapes according to actual needs into, V-arrangement shape for example, or other are irregularly shaped.
More than the radiating lamp of LED provided by the present invention is described in detail, used specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention.
Claims (4)
1. the radiating lamp of a LED, comprise led chip (11), metal substrate (12), heat sink (13), fin (14), U-shaped glass container (15), conductive fluid (16) and insulating cement (23), it is characterized in that, in the U-shaped glass container tool of bright dipping side, be filled with conductive fluid, have the insulating cement isolation between conductive fluid and the led chip.
2. the radiating lamp of LED according to claim 1 is characterized in that, described U-shaped glass container is settled led chip one side parcel with metal substrate, with the seamless bonding of metal substrate.
3. the radiating lamp of LED according to claim 1 is characterized in that, the insulating cement between described conductive fluid and the led chip, insulating cement only wrap up the led chip sidewall.
4. the radiating lamp of LED according to claim 1 is characterized in that, described conductive fluid be methyl alcohol, ethanol and or heptane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210427860.4A CN102927469B (en) | 2012-10-31 | 2012-10-31 | Heat-dissipating light-emitting diode (LED) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210427860.4A CN102927469B (en) | 2012-10-31 | 2012-10-31 | Heat-dissipating light-emitting diode (LED) lamp |
Publications (2)
| Publication Number | Publication Date |
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| CN102927469A true CN102927469A (en) | 2013-02-13 |
| CN102927469B CN102927469B (en) | 2014-08-13 |
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| CN201210427860.4A Active CN102927469B (en) | 2012-10-31 | 2012-10-31 | Heat-dissipating light-emitting diode (LED) lamp |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003217337A (en) * | 2003-02-13 | 2003-07-31 | Kunio Miyazaki | Cooling device for light-collection device |
| CN101331358A (en) * | 2005-12-14 | 2008-12-24 | 皇家飞利浦电子股份有限公司 | Lighting device and method for manufacturing same |
| CN101655189A (en) * | 2009-07-16 | 2010-02-24 | 艾迪光电（杭州）有限公司 | Hollow liquid cooling LED bar-shaped lamp |
| WO2010056324A1 (en) * | 2008-11-12 | 2010-05-20 | Neos International, Llc | Device and method for cooling chips and leds |
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2012
- 2012-10-31 CN CN201210427860.4A patent/CN102927469B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003217337A (en) * | 2003-02-13 | 2003-07-31 | Kunio Miyazaki | Cooling device for light-collection device |
| CN101331358A (en) * | 2005-12-14 | 2008-12-24 | 皇家飞利浦电子股份有限公司 | Lighting device and method for manufacturing same |
| WO2010056324A1 (en) * | 2008-11-12 | 2010-05-20 | Neos International, Llc | Device and method for cooling chips and leds |
| CN101655189A (en) * | 2009-07-16 | 2010-02-24 | 艾迪光电（杭州）有限公司 | Hollow liquid cooling LED bar-shaped lamp |
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| Publication number | Publication date |
|---|---|
| CN102927469B (en) | 2014-08-13 |
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