CN102927469B

CN102927469B - Heat-dissipating light-emitting diode (LED) lamp

Info

Publication number: CN102927469B
Application number: CN201210427860.4A
Authority: CN
Inventors: 朱彦旭; 郭伟玲; 曹伟伟
Original assignee: Beijing University of Technology
Current assignee: Beijing University of Technology
Priority date: 2012-10-31
Filing date: 2012-10-31
Publication date: 2014-08-13
Anticipated expiration: 2032-10-31
Also published as: CN102927469A

Abstract

The invention provides a heat-dissipating light-emitting diode (LED) lamp and relates to the technical field of semiconductor photoelectronic devices. The heat-dissipating LED lamp comprises an LED chip (11), a metal substrate (12), a heat dissipation plate (13), a cooling fin (14), a U-shaped glass container (15), a heat conduction liquid (16) and insulating paste (23). Heat conduction liquid is filled in the U-shaped glass container on the light outlet side, and the insulating paste is isolated between the heat conduction liquid and the LED chip. According to the heat-dissipating LED lamp, the problem that heat dissipation of the light outlet side of the LED lamp is enough is effectively solved.

Description

The radiating lamp of LED

Technical field

The present invention relates to semiconductor photoelectronic device technical field, relate in particular to the radiating lamp of the radiating lamp LED of a kind of LED.

Background technology

Light emitting diode (Light-Emitting Diode, LED) is a kind of semiconductor subassembly.Multiplex as indicator lamp, demonstration light-emitting diode panel etc. at the beginning; Along with the appearance of white light LEDs, be also used as illumination.

In LED illuminator, determine the heat dissipation problem that it is luminous and decisive factor service life is chip, so the heat dissipation problem of LED light fixture is focal point always.The aluminum radiator structure of early application, utilizes multiple fin to make wave or pleated structure increases and the contact area of air, thereby reaches the object that reduces chip temperature.Along with the raising of LED chip power, heat production also increases, and aluminum radiator structure light fixture originally can not meet the demands.Occurred utilizing the high conductivity material manufactures such as heat pipe in order to improve heat-sinking capability, although the radiator structure of this type has reached the target of high heat-sinking capability, but the thing followed is the rising of cost, has limited its application.

Therefore, instantly need the urgent technical problem solving to be exactly: how can propose a kind of effective measures, to solve problems of the prior art.

Summary of the invention

Technical problem to be solved by this invention is to provide the radiating lamp of a kind of LED, effectively solves the LED light fixture bright dipping side not enough problem of dispelling the heat.

In order to solve the problems of the technologies described above, the invention provides the radiating lamp of a kind of LED, comprise LED chip (11), metal substrate (12), heat sink (13), fin (14), U-shaped glass container (15), conductive fluid (16) and insulating cement (23) are filled with conductive fluid in the U-shaped glass container tool of bright dipping side, have insulating cement isolation between conductive fluid and LED chip.

Further, metal substrate is settled LED chip one side parcel by described U-shaped glass container, with the seamless bonding of metal substrate.

Further, the insulating cement between described conductive fluid and LED chip, insulating cement only wraps up LED chip sidewall.

Further, described conductive fluid be methyl alcohol, ethanol and or heptane.

To sum up, the radiating lamp of LED provided by the present invention, efficiently solve the LED light fixture bright dipping side not enough problem of dispelling the heat, this radiator structure cost is lower simultaneously, this invention not only adopts traditional heat sink and fin heat dissipation channel in survey backlight, heat transfer pathway and the heat loss through convection passage of conductive fluid in bright dipping side is also passed through glass container, increased area of dissipation and radiating efficiency simultaneously.

Brief description of the drawings

Fig. 1 is the structural representation of the radiating lamp of a kind of LED of the present invention;

Fig. 2 is LED chip and metal substrate top view in the present invention;

Fig. 3 is the structural representation of the radiating lamp in embodiments of the invention 2;

Fig. 4 is the structural representation of the radiating lamp in embodiments of the invention 3.

Detailed description of the invention

Below in conjunction with the drawings and specific embodiments, the present invention is further detailed explanation.

Referring to Fig. 1, for the structural representation of the radiating lamp of a kind of LED of the present invention, specifically comprise LED chip (11), metal substrate (12), heat sink (13), fin (14), U-shaped glass container (15), conductive fluid (16) and insulating cement (23), wherein, metal substrate backlight side with LED chip and heat sink are by heat-conducting glue close contact, and heat sink and fin are overall structure; Metal substrate bright dipping side with the seamless bonding of U-shaped glass container, in this concept, glass container can change its shape according to actual needs, adapts to actual needs with this; LED chip sidewall scribbles glass container inside and is filled with transparent conductive fluid, and this transparent conductive fluid can be methyl alcohol, ethanol, heptane and other transparent and safe conductive fluid.Between conductive fluid and LED chip, scribble insulating cement, insulating cement only wraps up LED chip sidewall, does not cover LED exiting surface, to prevent that LED metal electrode from contacting with conductive fluid, and does not have insulating cement between LED chip and metal substrate.When LED work, so heat heat is passed to conductive fluid because bright dipping side is filled with conductive fluid chip, in U-shaped glass container, form convection current simultaneously.Like this, backlight side and bright dipping side are dispelled the heat simultaneously, and radiating efficiency is higher.So this radiator structure not only has the heat dissipation channel of the fin heat radiation by contacting with metal substrate, also there is heat transmission and the thermal convection current passage of bright dipping side conductive fluid simultaneously.

Make brief description for this programme and accompanying drawing, in accompanying drawing 1, LED chip-11, metal substrate-12, heat sink-13, fin-14, U-shaped glass container-15, conductive fluid-16,2LED chip and metal substrate top view; In accompanying drawing 2, LED chip-21, metal substrate-22, insulating cement-23, in accompanying drawing 3, LED chip-31, metal substrate-32, heat sink-33, U-shaped glass container-34, conductive fluid-35; In accompanying drawing 4, LED chip-41, metal substrate-42, heat sink-43, fin-44, U-shaped glass container-45, conductive fluid-46.

Embodiment 1:

Taking ethanol as conductive fluid, refer to accompanying drawing 1, be the cross-sectional view of this radiator structure.As follows with concrete structure:

1, LED chip is placed on metal substrate according to common process.

2, smear insulating cement in LED chip sidewall, thereby protect chip sidewall and prevent that metal electrode from contacting with conductive fluid.

3, the survey backlight of the metal substrate with LED chip and heat sink, by material bondings such as heat-conducting glues, guarantee that with this two fully contacts.

4, heat sink and fin are overall structure, and this has guaranteed carrying out smoothly of hot transmission.

5, U-shaped glass container parcel LED chip, and with the seamless bonding of metal substrate, prevent that conductive fluid from flowing out; Glass container can be made difformity according to actual needs, to meet actual needs.

6, in, fill ethanol as conductive fluid.

Embodiment 2:

Taking heptane as conductive fluid, refer to accompanying drawing 3, be the cross-sectional view of this radiating lamp.As follows with concrete structure:

1, LED chip is placed on metal substrate according to common process.

3, the survey backlight of the metal substrate with LED chip is connected by materials such as heat-conducting glues with heat sink, guarantees that with this two fully contacts.

4, U-shaped glass container parcel LED chip, and with the seamless bonding of metal substrate, prevent that conductive fluid from flowing out; Glass container can be made difformity according to actual needs, to meet actual needs.

5, in, fill heptane as conductive fluid.

Embodiment 3:

Taking ethanol as conductive fluid, adjust glass container shape, refer to accompanying drawing 4, be the cross-sectional view of this radiating lamp.As follows with concrete structure:

1, LED chip is placed on metal substrate according to common process.

5, interior ethanol alkane is as conductive fluid.

Further supplementary notes, in this programme conductive fluid adopt methyl alcohol, ethanol and or heptane, can adopt in actual applications freon, the conductive fluid of the similar transparent and insulation such as acetone.

Similarly, the U-shaped glass container described in scheme can repack other shapes according to actual needs into, for example V-arrangement shape, or other are irregularly shaped.

Above the radiating lamp of LED provided by the present invention is described in detail, applied specific case herein principle of the present invention and embodiment are set forth, the explanation of above embodiment is just for helping to understand method of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.

Claims

1. the radiating lamp of a LED, comprise LED chip (11), metal substrate (12), heat sink (13), fin (14), U-shaped glass container (15), conductive fluid (16) and insulating cement (23), it is characterized in that, in the U-shaped glass container tool of bright dipping side, be filled with conductive fluid, between conductive fluid and LED chip, there is insulating cement isolation;

Metal substrate is settled LED chip one side parcel by described U-shaped glass container, with the seamless bonding of metal substrate.

2. the radiating lamp of LED according to claim 1, is characterized in that, the insulating cement between described conductive fluid and LED chip, and insulating cement only wraps up LED chip sidewall.

3. the radiating lamp of LED according to claim 1, is characterized in that, described conductive fluid be methyl alcohol, ethanol and or heptane.