CN102918642A - 用于改善晶圆单一化的方法及装置 - Google Patents

用于改善晶圆单一化的方法及装置 Download PDF

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Publication number
CN102918642A
CN102918642A CN2011800171103A CN201180017110A CN102918642A CN 102918642 A CN102918642 A CN 102918642A CN 2011800171103 A CN2011800171103 A CN 2011800171103A CN 201180017110 A CN201180017110 A CN 201180017110A CN 102918642 A CN102918642 A CN 102918642A
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CN
China
Prior art keywords
radium
shine
substrate
described method
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800171103A
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English (en)
Chinese (zh)
Inventor
大迫康
奉曹
达瑞·芬恩
安德鲁·虎柏
詹姆士·欧布莱恩
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Irecto Science Industry Co ltd
Original Assignee
Irecto Science Industry Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irecto Science Industry Co ltd filed Critical Irecto Science Industry Co ltd
Publication of CN102918642A publication Critical patent/CN102918642A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
    • H10W10/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/16—Composite materials
    • B23K2103/166—Multilayered materials
    • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
CN2011800171103A 2010-04-02 2011-03-31 用于改善晶圆单一化的方法及装置 Pending CN102918642A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US32047610P 2010-04-02 2010-04-02
US61/320,476 2010-04-02
US13/076,238 US20110287607A1 (en) 2010-04-02 2011-03-30 Method and apparatus for improved wafer singulation
US13/076,238 2011-03-30
PCT/US2011/030765 WO2011123670A2 (en) 2010-04-02 2011-03-31 Method and apparatus for improved wafer singulation

Publications (1)

Publication Number Publication Date
CN102918642A true CN102918642A (zh) 2013-02-06

Family

ID=44712845

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800171103A Pending CN102918642A (zh) 2010-04-02 2011-03-31 用于改善晶圆单一化的方法及装置

Country Status (7)

Country Link
US (1) US20110287607A1 (https=)
EP (1) EP2553721A2 (https=)
JP (1) JP2013524520A (https=)
KR (1) KR20130014522A (https=)
CN (1) CN102918642A (https=)
TW (1) TW201206605A (https=)
WO (1) WO2011123670A2 (https=)

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US8921733B2 (en) 2003-08-11 2014-12-30 Raydiance, Inc. Methods and systems for trimming circuits
JP5473414B2 (ja) * 2009-06-10 2014-04-16 株式会社ディスコ レーザ加工装置
US20110287607A1 (en) * 2010-04-02 2011-11-24 Electro Scientific Industries, Inc. Method and apparatus for improved wafer singulation
EP2409808A1 (de) 2010-07-22 2012-01-25 Bystronic Laser AG Laserbearbeitungsmaschine
US8884184B2 (en) 2010-08-12 2014-11-11 Raydiance, Inc. Polymer tubing laser micromachining
US9120181B2 (en) * 2010-09-16 2015-09-01 Coherent, Inc. Singulation of layered materials using selectively variable laser output
US8361828B1 (en) * 2011-08-31 2013-01-29 Alta Devices, Inc. Aligned frontside backside laser dicing of semiconductor films
US10239160B2 (en) 2011-09-21 2019-03-26 Coherent, Inc. Systems and processes that singulate materials
US9492990B2 (en) * 2011-11-08 2016-11-15 Picosys Incorporated Room temperature glass-to-glass, glass-to-plastic and glass-to-ceramic/semiconductor bonding
SG193711A1 (en) * 2012-03-16 2013-10-30 Advanced Laser Separation Internat Alsi N V Method of singulating a thin semiconductor wafer
JP6000700B2 (ja) * 2012-07-10 2016-10-05 株式会社ディスコ レーザー加工方法
JP5983345B2 (ja) * 2012-11-20 2016-08-31 トヨタ自動車株式会社 車両用ルーフのレーザロウ付け方法
MX381438B (es) * 2012-11-30 2025-03-04 Twb Company Llc Metodo para formar una muesca de soldadura en una pieza de metal en hoja.
WO2014130830A1 (en) 2013-02-23 2014-08-28 Raydiance, Inc. Shaping of brittle materials with controlled surface and bulk properties
JP2015109408A (ja) * 2013-10-22 2015-06-11 マイクロン テクノロジー， インク． 複合チップ、半導体装置、及び半導体装置の製造方法
EP2883647B1 (de) 2013-12-12 2019-05-29 Bystronic Laser AG Verfahren zur Konfiguration einer Laserbearbeitungsvorrichtung
US10307867B2 (en) * 2014-11-05 2019-06-04 Asm Technology Singapore Pte Ltd Laser fiber array for singulating semiconductor wafers
DE102015212444B4 (de) * 2015-06-12 2025-01-30 Schuler Pressen Gmbh Verfahren zur Herstellung einer Blechplatine
US10549386B2 (en) * 2016-02-29 2020-02-04 Xerox Corporation Method for ablating openings in unsupported layers
JP6666173B2 (ja) * 2016-03-09 2020-03-13 株式会社ディスコ レーザー加工装置
KR20170140969A (ko) * 2016-06-14 2017-12-22 (주)제이티 반도체칩모듈의 제조방법
US10720360B2 (en) 2016-07-29 2020-07-21 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor die singulation and structures formed thereby
US10347534B2 (en) 2017-09-12 2019-07-09 Nxp B.V. Variable stealth laser dicing process
KR102158832B1 (ko) * 2018-11-20 2020-09-22 한화정밀기계 주식회사 웨이퍼 절단 방법 및 절단 장치
KR102174928B1 (ko) * 2019-02-01 2020-11-05 레이저쎌 주식회사 멀티 빔 레이저 디본딩 장치 및 방법
US20220399234A1 (en) * 2021-06-15 2022-12-15 Nxp B.V. Semiconductor die singulation
US20260040958A1 (en) * 2024-07-31 2026-02-05 Texas Instruments Incorporated Isolation for chip on lead device and manufacturing method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030006221A1 (en) * 2001-07-06 2003-01-09 Minghui Hong Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
TW578266B (en) * 2001-05-24 2004-03-01 Advanced Dicing Technologies L Dual laser cutting of wafers
JP2004186200A (ja) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 半導体チップの製造方法
JP2006080142A (ja) * 2004-09-07 2006-03-23 Hitachi Chem Co Ltd 接着シート付き半導体素子の製造方法、接着シート、及びダイシングテープ一体型接着シート

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US5552345A (en) * 1993-09-22 1996-09-03 Harris Corporation Die separation method for silicon on diamond circuit structures
US7129114B2 (en) * 2004-03-10 2006-10-31 Micron Technology, Inc. Methods relating to singulating semiconductor wafers and wafer scale assemblies
KR100648898B1 (ko) * 2005-08-18 2006-11-27 주식회사 젯텍 2개의 레이저를 이용한 웨이퍼의 분할방법 및 장치
JP2007081037A (ja) * 2005-09-13 2007-03-29 Disco Abrasive Syst Ltd デバイスおよびその製造方法
US8598490B2 (en) * 2008-03-31 2013-12-03 Electro Scientific Industries, Inc. Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
US8383984B2 (en) * 2010-04-02 2013-02-26 Electro Scientific Industries, Inc. Method and apparatus for laser singulation of brittle materials
US20110287607A1 (en) * 2010-04-02 2011-11-24 Electro Scientific Industries, Inc. Method and apparatus for improved wafer singulation
KR20120043933A (ko) * 2010-10-27 2012-05-07 삼성전자주식회사 반도체 장치의 제조방법
US8673741B2 (en) * 2011-06-24 2014-03-18 Electro Scientific Industries, Inc Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW578266B (en) * 2001-05-24 2004-03-01 Advanced Dicing Technologies L Dual laser cutting of wafers
US20030006221A1 (en) * 2001-07-06 2003-01-09 Minghui Hong Method and apparatus for cutting a multi-layer substrate by dual laser irradiation
JP2004186200A (ja) * 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 半導体チップの製造方法
JP2006080142A (ja) * 2004-09-07 2006-03-23 Hitachi Chem Co Ltd 接着シート付き半導体素子の製造方法、接着シート、及びダイシングテープ一体型接着シート

Also Published As

Publication number Publication date
JP2013524520A (ja) 2013-06-17
KR20130014522A (ko) 2013-02-07
EP2553721A2 (en) 2013-02-06
US20110287607A1 (en) 2011-11-24
WO2011123670A3 (en) 2012-01-12
TW201206605A (en) 2012-02-16
WO2011123670A2 (en) 2011-10-06

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Application publication date: 20130206