CN102778460A - Method for detecting internal flaw of substrate - Google Patents

Method for detecting internal flaw of substrate Download PDF

Info

Publication number
CN102778460A
CN102778460A CN2012102698786A CN201210269878A CN102778460A CN 102778460 A CN102778460 A CN 102778460A CN 2012102698786 A CN2012102698786 A CN 2012102698786A CN 201210269878 A CN201210269878 A CN 201210269878A CN 102778460 A CN102778460 A CN 102778460A
Authority
CN
China
Prior art keywords
defective
matrix
detection
light
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012102698786A
Other languages
Chinese (zh)
Inventor
林晓峰
刘家朋
陈海峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Saint Gobain Glass France SAS
Original Assignee
Saint Gobain Glass France SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Glass France SAS filed Critical Saint Gobain Glass France SAS
Priority to CN2012102698786A priority Critical patent/CN102778460A/en
Publication of CN102778460A publication Critical patent/CN102778460A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

The invention provides a method for detecting internal flaw of a substrate. The method comprises the following steps of: scanning a detection area of the substrate by utilizing a first detection light beam provided by first detection equipment; judging whether flaw exists in the detection area or not by virtue of a detection device in the first detection equipment, and determining the position of the flaw if the flaw exists in the detection area; moving second detection equipment to a position corresponding to the flaw, scanning from a first surface of the substrate to a second surface of the substrate by utilizing a second detection light beam, so as to obtain light intensity information and optical length information of the flaw position in a direction vertical to the first and second surfaces; and judging the true and false of the flaw and the type of the flaw according to the light intensity information and the optical length information of the flaw position in the direction vertical to the first and second surfaces. The method provided by the invention can be used for not only improving the flaw detection accuracy, but also ensuring the integrality of flaw information.

Description

A kind of method that detects defective in the matrix
Technical field
The present invention relates to defect detecting technique, relate in particular to a kind of method that detects defective in the matrix.
Background technology
In existing residuite; Especially in the glass production process; Various reasons can cause defective to produce and exist; Major defect comprises cut, bubble and stain or the like, and defective how to discern glass automatically is that glass production enterprise carries out production run quality control and product quality inspection problem anxious to be solved.
At present, domestic many glass production enterprises also rely on the workman to discern the defective in the glass through eyes, and not only efficient is very low, and the method for defective is easy to generate error in the manual detection glass.In order to address the above problem; Adopting automated optical to detect (AOI) technology detects defective in the glass; Concrete grammar is: utilize detection light to be extended to the face light beam through cylindrical mirror; From seized thickness of glass side incident glass, in the glass or the defective of glass surface become scatterer such as bubble, cut etc., camera carries out the front and takes being placed on seized glass on the article carrying platform under computer control; Obtain clearly defect image and differentiate, provide flaw labeling and prompting by Computer Image Processing and identification software; If between said light source generator and cylindrical mirror, increase the optical scanning mechanism that constitutes by tilting mirror and f-θ lens; Detecting light is transformed into earlier along the scanning light beam of cylindrical mirror axis direction; Be launched into the face light beam through cylindrical mirror again and inject glass, then can carry out the depth of defect position Detection.
But existing automated optical detection technique is distinguished the accuracy of defect type high or can't effectively distinguish the type of defective at all.
Summary of the invention
The problem that the present invention solves provides a kind of method that detects defective in the matrix, improves the accuracy of distinguishing defect type.
For addressing the above problem, the present invention provides a kind of method that detects defective in the matrix, and said matrix has opposite first and second surface, comprising: adopt first checkout equipment to provide the first detection light beam that the surveyed area of matrix is scanned; Judge whether there is defective in the said surveyed area by the detection means in first checkout equipment, and if have defective in the said surveyed area, then confirm the position of defective; Second checkout equipment is moved to the position corresponding to defective, adopt the second detection light beam that matrix is scanned to obtain intensity signal and the optical length information on defective locations first surface to the second surface vertical direction from first surface to second surface; Judge the true and false of defective and the type of defective according to intensity signal on defective locations place first surface to the second surface vertical direction and optical length information.
Optional, judge whether exist the step of defective to comprise in the said surveyed area by the detection means in first checkout equipment: said first detects light beam is incident on the second surface and incidence point eye point one to one along optical detection path from the incidence point of the first surface of said matrix; According to the catoptrical intensity signal of each point on the said optical detection path, judge whether there is defective on the said optical detection path.
Optional, judge whether exist the step of defective to comprise in the said surveyed area by the detection means in first checkout equipment: said first detects light beam is incident on the second surface and incidence point eye point one to one along optical detection path from the incidence point of the first surface of said matrix; According to the intensity signal of the transmitted light of each point on the said optical detection path, judge whether there is defective on the said optical detection path.
Optional, adopt the light intensity of detecting device detection of reflected light or transmitted light to change to judge whether there is defective in the said surveyed area.
Optional, confirm the position of defective according to the coordinate of defective.
Optional, said detecting device is ccd video camera or cmos sensor.
Optional, the said first detection light beam is laser beam or LED light beam.
Optional, said matrix is the compound substance of glass, plastics, glass ceramics or above material.
Optional, intensity signal and the step of optical length information obtained on defective locations place first surface to the second surface vertical direction by second checkout equipment comprise: provide second to detect light beam and reference beam; Said second detects light beam is incident on the second surface and incidence point eye point one to one along optical detection path from the incidence point of the matrix first surface of defective locations, respectively with second detect the back-scattering light that the each point place produces on the optical detection path of light beam process set as this corresponding sample light beam; Gather the interference signal that each sample beam and said reference beam are interfered formation each other respectively, obtaining the intensity signal of the back-scattering light of each point on the optical detection path, and the optical length information between the each point on this optical detection path; For physical quantity in the refractive index of said detection light beam or several physical field, judge the type of said defective according to the optical length of the intensity signal of the back-scattering light of each point on the physical length of known affiliated optical detection path, the said optical detection path, said optical detection path and said matrix phase.
Optional, confirm the quantity of the physical interface on the optical detection path according to the intensity signal of the back-scattering light of the each point on the said optical detection path.
Optional, said optical length be said second detect the material that distributes in distance that light beam propagates along said optical detection path and the said distance with respect to said second detect the refractive index of light beam integration.
Optional, said second detection light beam and reference beam are that the single beam of light emitted forms through the light splitting part beam split.
Optional, said light source has the coherence, and light source power spectrum halfwidth is 10 nanometers ~ 100 nanometers.
Optional, said light source power spectrum halfwidth is greater than 10 nanometers.
Optional; Saidly gather the interference signal that each sample beam and said reference beam are interfered formation each other respectively; Obtaining the intensity signal of the back-scattering light of each point on the optical detection path, comprise with the step of the information of the optical length of this optical detection path: each sample beam is closed bundle with said reference beam respectively and is interfered each other in coupling unit.
Optional, obtaining the intensity signal of the back-scattering light of each point on the optical detection path and the optical length information of this optical detection path is to draw according to the image calculation that optical detection component obtains through calculation procedure.
Optional, said second detects light beam is produced by pointolite or line source.
Compared with prior art, technical scheme of the present invention has the following advantages:
Earlier the surveyed area of matrix is slightly gone on foot scanning, confirm the approximate location of defective through first checkout equipment; And then defective locations is accurately scanned with second checkout equipment; Second checkout equipment can accurately detect the intensity signal and the optical length information of defective locations; To judge the true and false and the type of defective; Said method had both improved the accuracy that detects defective, had also guaranteed the integrality of defect information.
Further; The interference signal of interfering formation each other through second each sample beam of checkout equipment collection and said reference beam; To obtain the intensity signal of the back-scattering light of each point on the optical detection path; According to said intensity signal, can judge whether there is defective on the said optical detection path; The intensity signal that has guaranteed interior each point of surveyed area of matrix is all gathered, and has guaranteed the integrality of defect information.
Optical length information between the each point that distributes on the said optical detection path of confirming according to the intensity signal of the back-scattering light of the each point that distributes on the said optical detection path can effectively be confirmed the type of defective, has improved the accuracy of differentiation defect type.
Further; When there are defective in the inside of the matrix in the said surveyed area scope and/or surface; Confirm the refractive index of defective for the optical length of the said defective that distributes on the refractive index of said detection light beam and the said optical detection path according to the physical length of said optical path, said matrix phase; According to the refractive index of defective can clear and definite defective particular type, improved the accuracy that detects defective.
Description of drawings
Fig. 1 is the schematic flow sheet that the embodiment of the invention detects defective in the matrix;
Fig. 2 is the first embodiment synoptic diagram that the present invention detects first checkout equipment of defective in the matrix;
Fig. 3 is that the present invention adopts first embodiment, first checkout equipment to detect the principle schematic of defective in the matrix;
Fig. 4 is the second embodiment synoptic diagram that the present invention detects first checkout equipment of defective in the matrix;
Fig. 5 is that the present invention adopts second embodiment, first checkout equipment to detect the principle schematic of defective in the matrix;
Fig. 6 is the synoptic diagram that the present invention detects second checkout equipment of defective in the matrix;
Fig. 7 is that the present invention adopts second checkout equipment to detect the first embodiment principle schematic of defective in the matrix;
Fig. 8 is that the present invention adopts second checkout equipment to detect the second embodiment principle schematic of defective in the matrix;
Fig. 9 is that the present invention's second checkout equipment adopts pointolite to detect the embodiment synoptic diagram of defective in the matrix;
Figure 10 is that the present invention's second checkout equipment adopts line source to detect the embodiment synoptic diagram of defective in the matrix;
Figure 11 is the glass image synoptic diagram with defective that adopts detection method of the present invention to obtain;
Figure 12 is first checkout equipment and the integrated synoptic diagram of second checkout equipment that the present invention detects defective in the matrix.
Embodiment
The existing human eye that adopts is usually observed to confirm that defective is positioned at the inner still surface of matrix (especially glass), if be positioned at the surface can be confirmed defective again through the touch of hand type; But the accuracy of this manual detection is low, and can not differentiate the type and the position of intramatrical defective.
The inventor is through discovering a kind of method that detects defective in the matrix, and said matrix has opposite first and second surface, and said detection step is as shown in Figure 1, comprising:
Execution in step S1, that adopts that first checkout equipment provides first detects light beam scanning the surveyed area of matrix;
Execution in step S2 judges whether there is defective in the said surveyed area by the detection means in first checkout equipment, and if have defective in the said surveyed area, then confirm the position of defective;
Execution in step S3; Second checkout equipment is moved to the position corresponding to defective, adopt the second detection light beam that matrix is scanned to obtain intensity signal and the optical length information on defective locations first surface to the second surface vertical direction from first surface to second surface;
Execution in step S4 judges the true and false of defective and the type of defective according to intensity signal on defective locations place first surface to the second surface vertical direction and optical length information.
In the above-described embodiment, earlier the surveyed area of matrix is slightly gone on foot scanning, confirm the approximate location of defective through first checkout equipment; And then with second checkout equipment defective locations is accurately scanned, second checkout equipment can accurately detect the intensity signal and the optical length information of defective locations, to judge the true and false and the type of defective.Carry out coarse scan by first checkout equipment, position analysis by second checkout equipment again, improved work efficiency; With second checkout equipment intensity signal of the back-scattering light that is produced of each point in the matrix is all gathered, guaranteed the integrality of defect information; Then, can tentatively distinguish the type of defective again according to the optical length information between the each point on the optical detection path, improve the accuracy of distinguishing defect type.
For make above-mentioned purpose of the present invention, feature and advantage can be more obviously understandable, below in conjunction with accompanying drawing specific embodiment of the present invention done detailed explanation.
Fig. 2 is the first embodiment synoptic diagram that the present invention detects first checkout equipment of defective in the matrix.As shown in Figure 2, first checkout equipment comprises: light source 20, detecting device 30 and display processing unit 50, said light source 20 places matrix 116 tops.
Said apparatus is following to the principle that matrix detects: at first, a matrix 116 as shown in Figure 3 need be provided, said matrix 116 has opposite first 116a and second surface 116b, and said first surface 116a goes up a plurality of incidence point 61a that distribute.Wherein, said first surface 116a and second surface 116b are the interphase of matrix 116 and external environment.
Then, combine Fig. 2,3 again, light source 20 emissions first detect light beam; First detects light beam is incident to second surface 116b from the incidence point 61a of said matrix 116 first surface 116a; The point that the wherein said first detection light beam is incident on the second surface 116b along each incidence point on the first surface 116a along corresponding optical detection path is defined as reflection spot 61b; First of incident detects light beam each point place reflection on optical detection path, the reflected light of generation; Detecting device 30 obtains the reflective light intensity signal, carries out optical imagery, after the reflective light intensity signal passes through opto-electronic conversion and signal processing and amplifying again, forms electric signal; Display processing unit 118 receives the electric signal of detecting device 30 transmission, after handling, forms image information.
In the present embodiment, said detecting device 30 is an image-pickup device, for example ccd video camera or cmos sensor.A detecting device 30 can be above matrix, set up in the testing process, also two image-pickup devices, the position that obtains defective through trigonometry can be above matrix, set up.Detecting transmitted light or catoptrical light intensity with detecting device changes and detects glass defect.
In the present embodiment, said light source 20 can be lasing light emitter or led light source.
In the present embodiment, said matrix 116 can be the compound substance of glass, plastics, glass ceramics or above material.Wherein, said matrix 116 is transparent with respect to detecting light beam, because the detection light beam of predetermined wavelength can directly penetrate matrix 116.
In the present embodiment, the first surface 116a and the second surface 116b of said matrix 116 roughly are parallel to each other, that is: first surface 116a can be parallel with second surface 116b, also can be that the extended line of first surface 116a and second surface 116b has angle.
Wherein, the first surface 116a of said matrix 116 can be identical medium with the external environment of said second surface 116b both sides, also can be different medium.If be same media, the external environment of first surface 116a and said second surface 116b both sides can be air or water or noncorrosive gases or non-corrosive liquid.If the medium that right and wrong are identical, the external environment of said first surface 116a one side can be to be air or water or noncorrosive gases or non-corrosive liquid; Second surface 116b contacts with plummer, and then the external environment of second surface one side is that material is the plummer of metal or plastics.
In the present embodiment, said display processing unit 50 also is connected with plummer, and control matrix 116 moves on the XY direction, makes first checkout equipment scanning whole matrix.
In the present embodiment, according to the difference of the first detection beam incident angle degree, optical detection path is also different; First detect light beam can from the incidence point 61a of first surface 116a along the optical detection path vertical incidence to second surface 116b, also can be from the incidence point 61a of first surface 116a along optical detection path angled being incident on the second surface 116b of tilting.
Fig. 4 is the second embodiment synoptic diagram that the present invention detects first checkout equipment of defective in the matrix.As shown in Figure 4, first checkout equipment comprises: light source 20, detecting device 30 and display processing unit 50, said light source 20 places matrix 116 belows.
Said apparatus is following to the principle that matrix detects: combine Fig. 4,5, light source 20 emissions first detect light beam; First detects light beam is incident to second surface 116b from the incidence point 61c of said matrix 116 second surface 116b; The point that the wherein said first detection light beam is incident on the second surface 116a along each incidence point on the second surface 116b along corresponding optical detection path is defined as transmission point 61d; First of incident detects light beam each point place transmission on optical detection path, the transmitted light of generation; Detecting device 30 obtains the transmitted light intensity signal, carries out optical imagery, after the transmitted light intensity signal passes through opto-electronic conversion and signal processing and amplifying again, forms electric signal; Display processing unit 118 receives the electric signal of detecting device 30 transmission, after handling, forms image information.
This embodiment is the different of light source institute placement location with the difference of first embodiment shown in Figure 2.
Using after Fig. 2, first checkout equipment shown in 4 scan the surveyed area of matrix; Judge by the detecting device in first checkout equipment 30 in the surveyed area of matrix 116 and whether have defective; And if have defective in the said surveyed area, then confirm the position of defective; Then second checkout equipment is directly moved to the position of defective.
Wherein the synoptic diagram of second checkout equipment is as shown in Figure 6, and second checkout equipment comprises: light source 100, light splitting part (coupling unit) 102, reference arm 106, sample arm 114, photoelectric detecting parts 110 and display processing unit 118.
Above-mentioned second checkout equipment is following to the principle that matrix detects: combine Fig. 6,7, second checkout equipment is moved to defective 119 positions, light source 100 emission single beams; Single beam gets into light splitting part 102, is divided into by light splitting part 102 and detects light beam and reference beam; After detection light beam and reference beam were exported from light splitting part 102, wherein said reference beam got in the reference arm 106, and sample beam gets in the sample arm 114; Reference beam focuses on through the lens combination 104 in the reference arm 106 earlier, and the reference beam after the focusing to reflecting element 108 backs are by the reflection of former road; Shine on tested matrix 116 defectives 119 zones after detecting light beam line focus lens combination 112; Said detection light beam is incident to second surface 116b from the incidence point 117a of the first surface 116a of defective 119 regional matrix 116; The point that wherein said detection light beam is incident on the second surface 116b along each incidence point on the first surface 116a along corresponding optical detection path is defined as reflection spot 117b, and the back-scattering light that produces with each point place on the optical detection path that detects the light beam process respectively is as this corresponding sample light beam; Sample beam that the each point place produces and reference beam close bundle and interfere each other in coupling unit 102, form interference light signal; Interference light signal is gathered by photoelectric detecting parts 110; Said interference light signal comprises the intensity signal of the back-scattering light of corresponding point on the optical detection path; Optical length information between the each point that can confirm to distribute on the said optical detection path according to the intensity signal of the back-scattering light of the each point that distributes on the said optical detection path; After interference light intensity signal process opto-electronic conversion and the signal processing and amplifying, form and interfere electric signal; After interfering electric signal to receive processing, form detected image by display processing unit 118.
In the present embodiment, the first surface 116a and the second surface 116b of said matrix 116 roughly are parallel to each other, that is: first surface 116a can be parallel with second surface 116b, also can be that the extended line of first surface 116a and second surface 116b has angle.
In the present embodiment, light intensity, the luminous energy of said detection light beam and reference beam are identical.
In the present embodiment, light source sends and can pass through collimating apparatus (like lens or lens combination) usually behind the light beam and collimate.
In the present embodiment, said light splitting part 102 is same parts with coupling unit 102.In addition, light splitting part and coupling unit also can be two independent device.Light splitting part (coupling unit) 102 can be fiber coupler or Amici prism or spectroscope group etc.
In the present embodiment, existing continuous miniaturization along with device, the transmission path of light beam can be realized through optical fiber; For example, the single beam that sends of light source 100 can be transmitted through the fiber in the coupling mechanism 102; Can input to sample arm 114 and reference arm 106 respectively through optical fiber from the detection light beam and the reference beam of coupling mechanism 102 outputs.
In the present embodiment, said detector 110 is cmos device or CCD device, interferes the interference light intensity signal of formation each other in order to gather sample beam and reference beam, and carries out optical imagery.After 110 pairs of interference light intensity signals of detector are gathered, further can convert the light intensity signal that collects into corresponding electric signal.
In the present embodiment, display processing unit 118 can be a computing machine, can comprise: signal acquisition process unit and display unit.After detector output had the electric signal of interference light intensity information, the signal acquisition process unit in the display processing unit 118 can carry out denoising to this electric signal and amplify, and treated then electric signal exports display unit to and carries out image demonstration and analysis.
In the present embodiment, according to the difference of beam incident angle degree, optical detection path is also different.As shown in Figure 7, as the matrix 116 first surface 116a that detect light beam vertical incidence to said defective 119 positions, then said detection light beam from the incidence point 117a of first surface 116a along optical detection path 118 vertical incidence to second surface 116b.
As shown in Figure 8, when detecting the matrix 116 first surface 116a that are incident to said defective 119 positions that light beam tilts, then said detection light beam is incident on the second surface 116b by respective angles along optical detection path 118 from the incidence point 117a of first surface 116a.
In the present embodiment, define the detection faces on two surfaces of corresponding connection according at least two optical paths between said matrix 116 first surface 116a and the second surface 116b.Wherein, press among Fig. 7 and to detect in light beam vertical incidence to the matrix 116, detect light beam and be incident to second surface 116b when going up from first surface 116a incidence point 117a along optical detection path, said optical detection path is also perpendicular to two surfaces; Define the detection faces on two surfaces of corresponding connection according at least two optical paths, then can define the detection faces, said detection faces and matrix 116 parallel sided that connect first surface 116a and second surface 116b.
By detecting being incident in the matrix 116 that light beam tilts among Fig. 8, detect light beam and be incident to second surface 116b when going up along optical detection path from first surface 116a incidence point 117a, said optical detection path also intersects with two surface tilt; Define the detection faces on two surfaces of corresponding connection according at least two optical paths, then can define the detection faces that connects first surface 116a and second surface 116b, said detection faces and matrix 116 sides have angle.
In addition, in the detection faces that defines in above-mentioned two kinds of detection modes, each detection faces is parallel to each other in each detection mode; Said incidence point 117a all is distributed on the boundary line between each detection faces and the first surface 116a.
Can obtain the detected image of this detection faces through processing to the intensity signal of the back-scattering light of each point on each optical detection path on the detection faces of above-mentioned definition.
In the present embodiment, the light source of said second checkout equipment 100 can be lasing light emitter or light emitting diode; Described lasing light emitter or light emitting diode are the wide spectrum light source, and the light beam of generation is coherence's light beam, and light source power spectrum halfwidth is 10 nanometers ~ 100 nanometers, and the optical system resolution of said this coherence light source of employing is 5 microns ~ 200 microns.Said lasing light emitter or light emitting diode can be line sources, also can be pointolites.
Concrete adopt that to obtain matrix image (is example with definition XZ detection faces) with pointolite as second checkout equipment of light source as shown in Figure 9; With the matrix shift position, to making from the luminous energy of pointolite outgoing the first incidence point a directly into the matrix first surface of the defective that is incident upon 119 regions; The single beam that pointolite sends detects light beam is incident to second surface along first optical detection path from the first incidence point a first reflection spot corresponding to the said first incidence point a after being become to detect light beam and reference beam by beam split; Detect light beam and all can produce backscattering from the first incidence point a along first optical detection path through matrix first surface, inside and second surface each point, the set of the back-scattering light that the each point place produces is as the first corresponding sample beam of this point; Each first sample beam and reference beam close bundle and interfere in coupling unit; First photodetector is gathered first interference light signal that each first sample beam and said reference beam are interfered formation each other respectively, and converts first interference light signal into corresponding first and interfere electric signal.Matrix is moved along directions X; To making light beam detect light beam is incident to second surface along second optical detection path from the second incidence point b second reflection spot directly into the second incidence point b of the matrix first surface that is incident upon defective 119 regions corresponding to the said second incidence point b from the pointolite outgoing; Detect light beam and all can produce backscattering from the second incidence point b along second optical detection path through matrix first surface, inside and second surface each point, the set of the back-scattering light that the each point place produces is as the second corresponding sample beam of this point; Each second sample beam and reference beam close bundle and interfere in coupling unit; Second photodetector is gathered second interference light signal that each second sample beam and said reference beam are interfered formation each other respectively, and converts second interference light signal into corresponding second and interfere electric signal.Adopt said method, matrix is constantly moved along directions X, obtain each point interference light signal on the corresponding optical detection path of each incidence point of defective 119 regions; First photodetector, second photodetector ... After the electric signal that will have interference light intensity information exported display processing unit to, display processing unit can carry out denoising to this electric signal and amplify, and carried out the detection faces image and show and analyze.
Concrete adopt that to obtain matrix image (is example with definition XZ detection faces) with line source as the pick-up unit of light source shown in figure 10; With matrix 116 shift positions, make luminous energy from the line source outgoing directly into each incidence point on the matrix first surface that is incident upon defective 119 regions; After the multiple beam that line source (can be to be made up of fiber array) sends is become relevant detection light beam and reference beam by beam split respectively; Each detects the light beam first incidence point a, the second incidence point b on the first surface in defective 119 zones simultaneously ... Be incident to second surface along corresponding optical detection path from first surface; Detect light beam from the first incidence point a, the second incidence point b ... All can produce backscattering along corresponding optical detection path through matrix first surface, inside and second surface each point place, the back-scattering light that the each point place produces is as this corresponding sample light beam; Each sample beam and reference beam close bundle and interfere in coupling unit; The first photodetector collection is corresponding optical detection path process matrix first surface, inside and the sample beam of second surface each point backscattering and first interference light signal that reference beam is interfered formation each other from first incidence point a edge, and converts first interference light signal into the corresponding first interference electric signal; Second interference light signal that the second photodetector collection is interfered formation from the second incidence point b along corresponding optical detection path through the sample beam of matrix first surface, inside and the reflection of second surface each point and reference beam each other, and convert second interference light signal into the corresponding second interference electric signal ... Obtain each point interference light signal on the corresponding optical detection path of each incidence point of defective 119 regions.First photodetector, second photodetector ... After the electric signal that will have interference light intensity information exported display processing unit to, display processing unit can carry out denoising to this electric signal and amplify, and carried out the detection faces image and show and analyze.
It is shown in figure 11 to adopt above-mentioned second checkout equipment to obtain in the defect area scan image of each detection faces, comprises the intensity signal of the back-scattering light of the each point that distributes on a plurality of optical detection path in the scan image of said detection faces; Can confirm the quantity of the physical interface on each optical detection path in the detection faces according to the intensity signal of the back-scattering light of the each point on the said optical detection path, judge matrix inside or surface and whether have defective.If there is defective in matrix inside, the quantity that then can find out the physical interface on the optical detection path from the scan image of detection faces is greater than 2.
If the intensity signal according to the back-scattering light of the each point that distributes on the optical detection path is confirmed to have defective on the said optical detection path; Continuation is with reference to Figure 11; According to the optical length of the intensity signal of the back-scattering light of each point on the physical length of known affiliated optical detection path, the said optical detection path, said optical detection path and said matrix phase refractive index, judge the type of said defective for said detection light beam.Concrete, in the detection faces scan image of Figure 11, preset line being set, through defective, said preset line is not as long as through defective, limit the position on the thickness direction of glass for said preset line.Will be vertical with preset line and distance setting that join between two parallel lines at defective edge be defective optical length b; Distance except that defective on same preset line direction is decided into glass optical length a+c (one of them can be 0 a or c).Wherein, the material that distributes in the said optical length distance that to be said detection light beam propagate along said optical detection path and the said distance is with respect to the integration of the refractive index of said detection light beam.
At first, can distinguish defective earlier roughly according to optical length information is solid or bubble.Answer the physical length (T of optical detection path when defective less than said matrix phase along the optical length sum on the optical detection path along optical length on the optical detection path and defective both sides matrix x) with matrix phase during for the refractive index that detects light beam long-pending: a+b+c<t x* n x, judge that said defective is a bubble.
When defective along the optical length sum of the said optical detection path in edge of the optical length of said optical detection path and defective both sides matrix greater than the physical length of said optical detection path and matrix phase during for the amassing of the refractive index of said detection light beam: a+b+c>T x* n x, judge that said defective is solid defects (calculus).
Specifically be example with glass, according to formula:
Figure BDA00001958401100141
The physical length T of common glass GlassKnown, optical length is the material that distributes in the distance that detects light beam and propagate along said optical detection path and the said distance integration with respect to the refractive index of said detection light beam, the refractive index n of glass GlassBe known.Therefore, calculate n through formula Defect, can classify to defective more accurately.For example: n Defect=1.837, the composition that this solid defects is described is a calcium oxide; n Defect=2.16, the composition that this solid defects is described is a chromite; And if n Defect=1, composition is an air in the description defect, is bubble.
In the present embodiment, the physical length of said optical detection path (physical length of respective regions matrix) can be measured through testing tools such as vernier caliper or thicknessmeters.
In the present embodiment, said matrix phase also is known for the refractive index of said detection light beam, can consult the refraction counting rate meter according to the wavelength that detects light beam, the material of matrix, can obtain the refractive index of matrix.
After optical length information between the each point that distributes on each optical detection path on through detection faces or refractive index confirmed that defective is bubble, the intensity signal of back-scattering light that again can be through the each point that distributes on the optical detection path on the images displayed was confirmed the switching type of bubble.
Removing first checkout equipment and second checkout equipment shown in the foregoing description can independently be provided with; Also have other embodiment; Shown in figure 12, first checkout equipment and second checkout equipment are integrated, two equipment common light source 400 and detecting device 300 and display processing unit 500.
Though the present invention discloses as above, the present invention is defined in this.Any those skilled in the art are not breaking away from the spirit and scope of the present invention, all can do various changes and modification, so protection scope of the present invention should be as the criterion with claim institute restricted portion.

Claims (17)

1. method that detects defective in the matrix, said matrix has opposite first and second surface, it is characterized in that, and the method for defective comprises in the said detection matrix:
Adopt first checkout equipment to provide the first detection light beam that the surveyed area of matrix is scanned;
Judge whether there is defective in the said surveyed area by the detection means in first checkout equipment, and if have defective in the said surveyed area, then confirm the position of defective;
Second checkout equipment is moved to the position corresponding to defective, adopt the second detection light beam that matrix is scanned to obtain intensity signal and the optical length information on defective locations first surface to the second surface vertical direction from first surface to second surface;
Judge the true and false of defective and the type of defective according to intensity signal on defective locations place first surface to the second surface vertical direction and optical length information.
2. according to the method for defective in the said detection matrix of claim 1; It is characterized in that judge whether exist the step of defective to comprise in the said surveyed area by the detection means in first checkout equipment: said first detects light beam is incident on the second surface and incidence point eye point one to one along optical detection path from the incidence point of the first surface of said matrix;
According to the catoptrical intensity signal of each point on the said optical detection path, judge whether there is defective on the said optical detection path.
3. according to the method for defective in the said detection matrix of claim 1; It is characterized in that judge whether exist the step of defective to comprise in the said surveyed area by the detection means in first checkout equipment: said first detects light beam is incident on the second surface and incidence point eye point one to one along optical detection path from the incidence point of the first surface of said matrix;
According to the intensity signal of the transmitted light of each point on the said optical detection path, judge whether there is defective on the said optical detection path.
4. according to the method for defective in claim 2 or the 3 said detection matrix, it is characterized in that adopt the light intensity of detecting device detection of reflected light or transmitted light to change to judge whether there is defective in the said surveyed area.
5. according to the method for defective in the said detection matrix of claim 1, it is characterized in that, confirm the position of defective according to the coordinate of defective.
6. according to the method for defective in the said detection matrix of claim 4, it is characterized in that said detecting device is ccd video camera or cmos sensor.
7. according to the method for defective in each said detection matrix of claim 1 to 3, it is characterized in that the said first detection light beam is laser beam or LED light beam.
8. according to the method for defective in the said detection matrix of claim 1, it is characterized in that said matrix is the compound substance of glass, plastics, glass ceramics or above material.
9. according to the method for defective in the said detection matrix of claim 1, it is characterized in that intensity signal and the step of optical length information obtained on defective locations place first surface to the second surface vertical direction by second checkout equipment comprise:
Provide second to detect light beam and reference beam;
Said second detects light beam is incident on the second surface and incidence point eye point one to one along optical detection path from the incidence point of the matrix first surface of defective locations, respectively with second detect the back-scattering light that the each point place produces on the optical detection path of light beam process set as this corresponding sample light beam;
Gather the interference signal that each sample beam and said reference beam are interfered formation each other respectively, obtaining the intensity signal of the back-scattering light of each point on the optical detection path, and the optical length information between the each point on this optical detection path;
For physical quantity in the refractive index of said detection light beam or several physical field, judge the type of said defective according to the optical length of the intensity signal of the back-scattering light of each point on the physical length of known affiliated optical detection path, the said optical detection path, said optical detection path and said matrix phase.
10. according to the method for defective in the said detection matrix of claim 9, it is characterized in that, confirm the quantity of the physical interface on the optical detection path according to the intensity signal of the back-scattering light of the each point on the said optical detection path.
11. method according to defective in the said detection matrix of claim 9; It is characterized in that, said optical length be said second detect the material that distributes in distance that light beam propagates along said optical detection path and the said distance with respect to said second detect the refractive index of light beam integration.
12. the method according to defective in the said detection matrix of claim 9 is characterized in that, said second detection light beam and reference beam are that the single beam of light emitted forms through the light splitting part beam split.
13. the method according to defective in the said detection matrix of claim 12 is characterized in that said light source has the coherence, light source power spectrum halfwidth is 10 nanometers ~ 100 nanometers.
14. the method according to defective in the said detection matrix of claim 13 is characterized in that, said light source power spectrum halfwidth is greater than 10 nanometers.
15. method according to defective in the said detection matrix of claim 9; It is characterized in that; Saidly gather the interference signal that each sample beam and said reference beam are interfered formation each other respectively; Obtaining the intensity signal of the back-scattering light of each point on the optical detection path, comprise with the step of the information of the optical length of this optical detection path: each sample beam is closed bundle with said reference beam respectively and is interfered each other in coupling unit.
16. method according to defective in the said detection matrix of claim 9; It is characterized in that obtaining the intensity signal of the back-scattering light of each point on the optical detection path and the optical length information of this optical detection path is to draw according to the image calculation that optical detection component obtains through calculation procedure.
17. the method according to defective in the said detection matrix of claim 1 is characterized in that, said second detects light beam is produced by pointolite or line source.
CN2012102698786A 2012-07-31 2012-07-31 Method for detecting internal flaw of substrate Pending CN102778460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012102698786A CN102778460A (en) 2012-07-31 2012-07-31 Method for detecting internal flaw of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012102698786A CN102778460A (en) 2012-07-31 2012-07-31 Method for detecting internal flaw of substrate

Publications (1)

Publication Number Publication Date
CN102778460A true CN102778460A (en) 2012-11-14

Family

ID=47123442

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012102698786A Pending CN102778460A (en) 2012-07-31 2012-07-31 Method for detecting internal flaw of substrate

Country Status (1)

Country Link
CN (1) CN102778460A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013091584A1 (en) * 2011-12-20 2013-06-27 法国圣戈班玻璃公司 Method and device for detecting defects in substrate
CN103676234A (en) * 2013-11-29 2014-03-26 合肥京东方光电科技有限公司 Detection device, array substrate detection system and array substrate detection method
CN104022053A (en) * 2014-05-20 2014-09-03 京东方科技集团股份有限公司 Detection equipment of vacuum chamber for film formation and vacuum chamber detection method
CN104502363A (en) * 2014-12-30 2015-04-08 湘潭大学 Sapphire microdefect nondestructive testing device
CN106292009A (en) * 2016-09-12 2017-01-04 成都中光电科技有限公司 Distinguish defect in glass substrate A face or the inspection technique in B face
CN107907548A (en) * 2017-11-23 2018-04-13 南通大学 A kind of raw silk shade detection device
WO2018120312A1 (en) * 2016-12-28 2018-07-05 武汉华星光电技术有限公司 Flexible substrate detection method, detection system and detection device
CN108896516A (en) * 2018-05-19 2018-11-27 芜湖新利德玻璃制品有限公司 A kind of organic glass crazing detection device based on light transmittance
CN109530270A (en) * 2018-11-10 2019-03-29 东莞理工学院 A kind of online vision detection system for facial mask production line
CN109977808A (en) * 2019-03-11 2019-07-05 北京工业大学 A kind of wafer surface defects mode detection and analysis method
WO2020001633A1 (en) * 2018-06-29 2020-01-02 上海微电子装备(集团)股份有限公司 Defect inspection apparatus and defect inspection method
CN111213029A (en) * 2018-09-27 2020-05-29 合刃科技(深圳)有限公司 Method, device and system for detecting defects of transparent/semitransparent material
CN111307819A (en) * 2020-03-16 2020-06-19 上海华力微电子有限公司 Wafer edge defect detection system and method
WO2020156296A1 (en) * 2019-01-29 2020-08-06 Saint-Gobain Glass France Measuring method and device for measuring thickness of substrate
WO2021052463A1 (en) * 2019-09-20 2021-03-25 深圳中科飞测科技股份有限公司 Detection system and detection method
CN114062390A (en) * 2020-07-31 2022-02-18 觉芯电子(无锡)有限公司 Gap detection method and device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000321167A (en) * 1999-05-10 2000-11-24 Hitachi Cable Ltd Method for detecting foreign object in optical fiber
CN1948955A (en) * 2005-10-12 2007-04-18 奥林巴斯株式会社 Substrate inspection apparatus
JP2007171145A (en) * 2005-12-26 2007-07-05 Canon Inc Inspection device and method
CN101175986A (en) * 2005-04-06 2008-05-07 康宁股份有限公司 Glass inspection systems and methods for using same
CN102112865A (en) * 2008-08-05 2011-06-29 原子能与替代能源委员会 Contactless method of measuring density of porous material, using refractive index of porous material obtained by optical coherence tomography

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000321167A (en) * 1999-05-10 2000-11-24 Hitachi Cable Ltd Method for detecting foreign object in optical fiber
CN101175986A (en) * 2005-04-06 2008-05-07 康宁股份有限公司 Glass inspection systems and methods for using same
CN1948955A (en) * 2005-10-12 2007-04-18 奥林巴斯株式会社 Substrate inspection apparatus
JP2007171145A (en) * 2005-12-26 2007-07-05 Canon Inc Inspection device and method
CN102112865A (en) * 2008-08-05 2011-06-29 原子能与替代能源委员会 Contactless method of measuring density of porous material, using refractive index of porous material obtained by optical coherence tomography

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
李建民等: "气泡的远场干涉分析及应用", 《光学学报》 *

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013091584A1 (en) * 2011-12-20 2013-06-27 法国圣戈班玻璃公司 Method and device for detecting defects in substrate
CN103676234A (en) * 2013-11-29 2014-03-26 合肥京东方光电科技有限公司 Detection device, array substrate detection system and array substrate detection method
CN103676234B (en) * 2013-11-29 2016-06-01 合肥京东方光电科技有限公司 A kind of detection device, array substrate detection system and method thereof
CN104022053B (en) * 2014-05-20 2017-11-14 京东方科技集团股份有限公司 A kind of vacuum chamber detection device and vacuum chamber detection method for film forming
CN104022053A (en) * 2014-05-20 2014-09-03 京东方科技集团股份有限公司 Detection equipment of vacuum chamber for film formation and vacuum chamber detection method
CN104502363A (en) * 2014-12-30 2015-04-08 湘潭大学 Sapphire microdefect nondestructive testing device
CN106292009A (en) * 2016-09-12 2017-01-04 成都中光电科技有限公司 Distinguish defect in glass substrate A face or the inspection technique in B face
WO2018120312A1 (en) * 2016-12-28 2018-07-05 武汉华星光电技术有限公司 Flexible substrate detection method, detection system and detection device
US10530992B2 (en) 2016-12-28 2020-01-07 Wuhan China Star Optoelectronics Technology Co., Ltd Detection method, detection system, and detection device for flexible substrate
CN107907548A (en) * 2017-11-23 2018-04-13 南通大学 A kind of raw silk shade detection device
CN108896516A (en) * 2018-05-19 2018-11-27 芜湖新利德玻璃制品有限公司 A kind of organic glass crazing detection device based on light transmittance
WO2020001633A1 (en) * 2018-06-29 2020-01-02 上海微电子装备(集团)股份有限公司 Defect inspection apparatus and defect inspection method
CN111213029A (en) * 2018-09-27 2020-05-29 合刃科技(深圳)有限公司 Method, device and system for detecting defects of transparent/semitransparent material
CN109530270A (en) * 2018-11-10 2019-03-29 东莞理工学院 A kind of online vision detection system for facial mask production line
WO2020156296A1 (en) * 2019-01-29 2020-08-06 Saint-Gobain Glass France Measuring method and device for measuring thickness of substrate
CN109977808A (en) * 2019-03-11 2019-07-05 北京工业大学 A kind of wafer surface defects mode detection and analysis method
CN109977808B (en) * 2019-03-11 2020-10-27 北京工业大学 Wafer surface defect mode detection and analysis method
WO2021052463A1 (en) * 2019-09-20 2021-03-25 深圳中科飞测科技股份有限公司 Detection system and detection method
CN111307819A (en) * 2020-03-16 2020-06-19 上海华力微电子有限公司 Wafer edge defect detection system and method
CN111307819B (en) * 2020-03-16 2024-03-08 上海华力微电子有限公司 Wafer edge defect detection system and method
CN114062390A (en) * 2020-07-31 2022-02-18 觉芯电子(无锡)有限公司 Gap detection method and device

Similar Documents

Publication Publication Date Title
CN102778460A (en) Method for detecting internal flaw of substrate
CN101175986B (en) Glass inspection systems and methods for using same
CN201803699U (en) Device for measuring relative position of specular reflection surface
CN102818528B (en) Apparatus and method for inspecting an object with increased depth of field
CN106643581A (en) Glass flatness detector and detection method
WO2013091584A1 (en) Method and device for detecting defects in substrate
JP2004101530A (en) Confocal displacement sensor
CN106931888A (en) A kind of double light path type laser displacement sensor
KR20160102244A (en) Non-imaging coherent line scanner systems and methods for optical inspection
CN105675615B (en) A kind of high speed large range high resolution rate imaging system
CN102359814B (en) Three-dimensional laser motion attitude measuring system and method
KR100900618B1 (en) Surface measurement apparatus
CN111964580B (en) Device and method for detecting position and angle of film based on optical lever
JP4864734B2 (en) Optical displacement sensor and displacement measuring apparatus using the same
JPH02278103A (en) Method and device for three-dimensionally inspecting printed circuit substrate
CN110763135A (en) High-precision laser interferometer
KR100878425B1 (en) Surface measurement apparatus
CN111458293A (en) Object surface detection device and silicon wafer detection device
CN112857263A (en) Oblique illumination type color confocal measurement system and detection method
KR101146922B1 (en) Optical detection module for Wafer inspection
CN210570480U (en) Laser interferometer for improving measurement precision
CN105372265A (en) Optical measuring apparatus and method for measuring patterned sapphire substrate
CN205826560U (en) A kind of optics device for fast detecting of spherome surface slight flaws
CN211292558U (en) Multi-lens optical fiber type OCT three-dimensional depth detection device
CN217586244U (en) Imaging type detecting device for front and back of ultra-small curvature plano-convex lens or plano-concave lens

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20121114