CN111213029A - Method, device and system for detecting defects of transparent/semitransparent material - Google Patents

Method, device and system for detecting defects of transparent/semitransparent material Download PDF

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CN111213029A
CN111213029A CN201880067020.7A CN201880067020A CN111213029A CN 111213029 A CN111213029 A CN 111213029A CN 201880067020 A CN201880067020 A CN 201880067020A CN 111213029 A CN111213029 A CN 111213029A
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sampling
sampling point
thickness information
material thickness
determining
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王星泽
闫静
舒远
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Heren Technology Shenzhen Co ltd
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Heren Technology Shenzhen Co ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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Abstract

A method of detecting defects in a transparent/translucent material, comprising: determining one or more sampling point positions according to a preset sampling configuration; controlling a coherent light source (10) to generate a coherent light beam to irradiate a sampling point, wherein the coherent light beam irradiates the position of the sampling point of the layered material to be detected during detection; interference image information of a reflected optical signal after the coherent light beam irradiates a material to be detected is collected through a photosensitive element (30); and calculating material thickness information corresponding to the position of the sampling point according to the interference image information, and determining the defect of the layered material to be detected according to the material thickness information. In addition, an apparatus for detecting the defects of the transparent/semitransparent material by using the method and a detection system for detecting the defects of the transparent/semitransparent material by using the method are also disclosed. The accuracy of detecting the thickness defect of the transparent/semitransparent laminar material can be improved.

Description

Method, device and system for detecting defects of transparent/semitransparent material Technical Field
The invention relates to the technical field of computers, in particular to a method, a device and a system for detecting defects of a transparent/semitransparent material.
Background
In the prior art, transparent/semitransparent laminated materials are usually adhered to the surface of some products by means of adhesion, electroplating, bonding and the like, for example, a process of coating a layer of glue or a layer of paint on the surface of the product is a glue coating and painting process, a process of bonding glass and silicone sheets on the surface of the product is a process of attaching films on the surface of the product or the surface of a display device is a process. The layered material attached to the surface of the product may cause the layered material attached to the surface of the product to have defects of over-thick and over-thin thickness in a partial area, or uneven overall surface due to the precision problem of the process, or have defects of bubbles in the layered material, and the defects directly affect the appearance and quality of the product, so the detection of the thickness defect of the transparent/semitransparent layered material is an essential link in the production process, and the detection of the thickness uniformity of the attached transparent/semitransparent layered material and the information of whether bubbles are contained in the transparent/semitransparent layered material needs to be performed.
One current method for detecting the thickness defect of a transparent/semitransparent layered material is manual detection under a fluorescent lamp. For example, in the gluing process, the defects of gluing are inspected in a sampling mode through manual visual observation, the efficiency is low, the omission factor is high, and the manual work can only detect the existence of the colloidal laminar material on the surface of the product, and the glue width, the glue amount, the glue thickness and the like cannot be detected.
In the prior art, another common detection method is a non-manual method, and a three-dimensional detection system based on a laser triangulation method is generally adopted in the non-manual detection method, and is used for detecting thickness information of a transparent laminar material and judging whether the surface of the transparent laminar material is uniform. The light beam emitted by the laser is condensed and then vertically enters the surface of the object to be measured to generate a light spot, and a part of scattered light of the light spot is imaged on a photosensitive surface of the photoelectric detector through the receiving lens. If the measured object moves along the laser optical axis or the surface changes to cause the incident light spot to move along the incident optical axis, the imaging point on the photoelectric detector correspondingly moves along with the incident light spot, and the thickness change of the colloid is determined according to the relation between the object images. That is, the thickness of the transparent layered material is detected by a laser ranging method, but this method requires a reference plane as a substrate.
However, the inventor of the present invention has found that, if the layered material attached to the surface of the product is an opaque material, the method can only obtain the surface profile information of the surface attachment layer of the product, and can only measure the undulation of the surface attachment layer based on the reference plane, but cannot obtain the specific height of the transparent layered material (it is possible that the surface attachment layer is flat and free of defects, but generally thicker or thinner, which still causes problems).
Disclosure of Invention
Therefore, in order to solve the technical problems that a reference plane substrate is needed in a transparent/semitransparent layered material thickness defect detection mode based on laser ranging in the prior art, and detection accuracy is poor due to the influence of colloid transparency, a method for detecting the defects of the transparent/semitransparent material is specially provided.
A method of detecting defects in a transparent/translucent material, comprising:
determining one or more sampling point positions according to a preset sampling configuration;
controlling a coherent light source to generate a coherent light beam to irradiate a sampling point, wherein the coherent light beam irradiates the position of the sampling point of the layered material to be detected during detection;
acquiring interference image information of an optical signal reflected after the coherent light beam irradiates a material to be detected through a photosensitive element;
and calculating material thickness information corresponding to the position of the sampling point according to the interference image information, and determining the defect of the layered material to be detected according to the material thickness information.
In one embodiment, determining one or more sampling point locations according to a preset sampling configuration comprises:
acquiring one or more sampling point positions defined in the sampling configuration;
or acquiring a scanning direction and a scanning length defined in the sampling configuration, and determining one or more sampling point positions according to the scanning direction and the scanning length, and a preset sampling interval or the sampling interval read in the sampling configuration;
or acquiring the scanning area position and size defined in the sampling configuration, and determining one or more sampling point positions according to the scanning area position and size, and a preset sampling interval or the sampling interval read in the sampling configuration.
In one embodiment, the determining the defect of the layered inspection material according to the material thickness information includes:
and acquiring material thickness information corresponding to the one or more sampling point positions respectively, calculating the variance of the material thickness information, and determining that the layered material to be detected has the defect of uneven surface layer according to the material thickness information under the condition that the variance is greater than or equal to a first threshold value.
In one embodiment, the method further comprises:
and under the condition that the variance is larger than or equal to a first threshold value, calculating the mean value of the material thickness information, searching the position of a sampling point of which the corresponding material thickness information deviates from the mean value and is larger than or equal to a second threshold value, and calibrating the position of the sampling point.
In one embodiment, the calculating material thickness information corresponding to the sampling point position according to the interference image information further includes:
calculating a plurality of material thickness information for a plurality of interference image information collected by the photosensitive element in the presence of a plurality of interference image fringes;
the determining the defect of the layered inspection material according to the material thickness information comprises:
determining the number of bubbles at corresponding sampling point positions according to the material thickness information,
or determining that the layered material to be detected has bubble defects at corresponding sampling point positions according to the thickness information of the materials.
In one embodiment, the coherent light source generates a coherent light beam having a wavelength of near infrared light.
In addition, the device for detecting the defects of the transparent/semitransparent material is provided aiming at the technical problems that a reference plane substrate is needed in a laser ranging-based transparent/semitransparent layered material thickness defect detection mode in the prior art, and the detection accuracy is poor due to the influence of colloid transparency.
An apparatus for detecting defects in a transparent/translucent material, comprising:
the scanning mode setting module is used for determining one or more sampling point positions according to preset sampling configuration;
the scanning control module is used for controlling the coherent light source to generate a coherent light beam to irradiate the sampling point, and the coherent light beam irradiates the position of the sampling point of the layered material to be detected during detection;
the signal receiving module is used for acquiring interference image information of the reflected optical signal after the coherent light beam irradiates the material to be detected through a photosensitive element;
and the signal processing module is used for calculating material thickness information corresponding to the position of the sampling point according to the interference image information and determining the defect of the layered material to be detected according to the material thickness information.
In one embodiment, the scan mode setting module is further configured to
Acquiring one or more sampling point positions defined in the sampling configuration;
or acquiring a scanning direction and a scanning length defined in the sampling configuration, and determining one or more sampling point positions according to the scanning direction and the scanning length, and a preset sampling interval or the sampling interval read in the sampling configuration;
or acquiring the scanning area position and size defined in the sampling configuration, and determining one or more sampling point positions according to the scanning area position and size, and a preset sampling interval or the sampling interval read in the sampling configuration.
In one embodiment, the signal processing module is further configured to obtain material thickness information corresponding to each of the one or more sampling point locations, calculate a variance of the material thickness information, and determine that the layered inspection material has a defect of uneven surface layer according to the material thickness information when the variance is greater than or equal to a first threshold.
In one embodiment, the signal processing module is further configured to calculate a plurality of material thickness information for a plurality of interference image information collected by the photosensitive element in the presence of a plurality of interference image fringes; the determining the defect of the layered inspection material according to the material thickness information comprises: and determining the number of bubbles at the corresponding sampling point positions according to the plurality of pieces of material thickness information, or determining that the bubble defect exists at the corresponding sampling point positions of the layered material to be detected according to the plurality of pieces of material thickness information.
In addition, the transparent/semitransparent material defect detection system is provided for solving the technical problems that a reference plane substrate is needed in a transparent/semitransparent layered material thickness defect detection mode based on laser ranging in the prior art, and detection accuracy is poor due to the influence of colloid transparency.
A transparent/translucent material defect detection system comprising:
a coherent light source for generating a coherent light beam;
the scanning device is connected with the coherent light source and used for determining one or more sampling point positions according to a preset sampling configuration and controlling the light outgoing direction of the coherent light source to scan the one or more sampling point positions;
the photosensitive element is used for collecting interference image information of an optical signal reflected after the coherent light beam irradiates a material to be detected;
and the processor is connected with the scanning device and the photosensitive element and used for calculating material thickness information corresponding to the position of the sampling point according to the interference image information and determining the defect of the layered material to be detected according to the material thickness information.
In one embodiment, the scanning device is further configured to:
acquiring one or more sampling point positions defined in the sampling configuration;
or acquiring a scanning direction and a scanning length defined in the sampling configuration, and determining one or more sampling point positions according to the scanning direction and the scanning length, and a preset sampling interval or the sampling interval read in the sampling configuration;
or acquiring the scanning area position and size defined in the sampling configuration, and determining one or more sampling point positions according to the scanning area position and size, and a preset sampling interval or the sampling interval read in the sampling configuration.
In one embodiment, the processor is further configured to obtain material thickness information corresponding to each of the one or more sampling point locations, calculate a variance of the material thickness information, and determine that the layered inspection material has a defect of uneven surface layer according to the material thickness information when the variance is greater than or equal to a first threshold.
In one embodiment, the processor is further configured to calculate a mean value of the material thickness information if the variance is greater than or equal to a first threshold, find a sampling point position where the corresponding material thickness information deviates from the mean value by greater than or equal to a second threshold, and calibrate the sampling point position.
In one embodiment, the processor is further configured to calculate a plurality of material thickness information for a plurality of interference image information collected by the photosensitive element in the presence of a plurality of interference image fringes; and determining the number of bubbles at the corresponding sampling point positions according to the plurality of pieces of material thickness information, or determining that the bubble defect exists at the corresponding sampling point positions of the layered material to be detected according to the plurality of pieces of material thickness information.
In one embodiment, the coherent light source is a near-infrared coherent light generator.
The embodiment of the invention has the following beneficial effects:
after the method and the device for detecting the defects of the transparent/semitransparent material and the defect detection system of the transparent/semitransparent material are adopted, the preset sampling points on the laminated detection material can be scanned by coherent light, after the laminated detection material is irradiated by the coherent light, reflected light can be generated on the gluing surface, the surface in contact with a substrate, impurities, bubbles, scattering phenomena and the like in gluing, the reflected light can generate interference phenomena due to the coherent light and is received by a photosensitive element, material thickness information (which can be a direct thickness value or a thickness reference value and can also be colloid section image information) corresponding to each sampling point is calculated by a processor according to the interference image information received by the photosensitive element, and whether the colloid at the sampling point has over-thickness, or over-thickness is judged by analyzing and comparing the material thickness information of each sampling point, Too thin, uneven, and the defects of adhesive leakage and the like. Compared with the laser ranging mode in the prior art, the method does not need to add a reference plane, and the detection accuracy is not affected by the precision of the reference plane, so that the accuracy is higher.
Meanwhile, the method and the device for detecting the defects of the transparent/semitransparent material and the system for detecting the defects of the transparent/semitransparent material can adopt a near-infrared coherent light source, and can also detect the opaque and semitransparent colloid through a photosensitive element aiming at a specific wavelength, so that the method has better applicability compared with a laser ranging mode in the prior art.
In addition, because the bubble exists at the sampling point, the interference phenomenon occurs for a plurality of times, the method and the device for detecting the defect of the transparent/semitransparent material and the defect detection system of the transparent/semitransparent material can simultaneously detect the bubble defect and the number of the bubbles in the layered material, and compared with the laser ranging mode in the prior art, the method has better applicability and more complete function.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Wherein:
FIG. 1 is a block diagram of a system architecture for a transparent/translucent material defect detection system in accordance with an embodiment of the present invention;
FIG. 2 is a schematic diagram illustrating a position of a sampling point in a point scanning manner according to an embodiment of the present invention;
FIG. 3 is a schematic diagram illustrating the position of a sampling point in a line scanning manner according to an embodiment of the present invention;
FIG. 4 is a schematic diagram illustrating the position of a sampling point in a surface scanning mode according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of an embodiment of the present invention based on equal-inclination interference;
FIG. 6 is a schematic diagram of an embodiment of the present invention based on equal-inclination interference;
FIG. 7 is a diagram illustrating a relationship between a signal distribution of an interference pattern and a colloid thickness according to an embodiment of the present invention;
FIG. 8 is a flow diagram of a method for detecting defects in a transparent/translucent material in one embodiment;
FIG. 9 is a schematic diagram of an apparatus for detecting defects in a transparent/translucent material in one embodiment;
FIG. 10 is a schematic diagram of a computer system for executing the method for detecting defects in a transparent/translucent material according to one embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The technical problem that a transparent/semitransparent material thickness defect detection mode based on laser ranging in the prior art needs a reference plane substrate and is affected by the transparency of an attached laminated material to cause poor detection accuracy is solved.
The transparent/translucent material defect detecting system proposed by the present invention can be realized as shown in fig. 1, and the system mainly comprises a coherent light source 10, a scanning device 20, a photosensitive element 30 and a processor 40 connected with the scanning device 20 and the photosensitive element 30. The coherent light source 10 is mainly used for generating coherent light, the scanning device 20 is mainly used for controlling the light emitting direction of the coherent light source 10 so as to scan, the photosensitive element 30 may be a CMOS photosensitive element or a multispectral or hyperspectral camera and may collect an interference image of coherent light with a specific frequency so as to avoid the influence of other natural light signals, the processor 40 may be a computer system and is connected to the coherent light source 10 to control the coherent light source 10 to be turned on or off or generate coherent light with a specified wavelength and intensity; the scanning device 20 is also connected to control the scanning strategy of the scanning device 20, and the scanning device 20 can be controlled to scan for a specific sampling point, or to perform line scanning, or to perform area scanning of the whole plane; and is also connected to the photosensitive element 30 to obtain the signal intensity distribution information of the interference image collected by the photosensitive element 30, so as to analyze whether the layered inspection material (a product inspection material with a transparent/semitransparent layered material attached to the surface, such as a product to be inspected with a surface coated with glue, a product to be inspected with a surface coated with glass and a silicone sheet, a product to be inspected with a surface coated with paint, etc., which is not described below) has defects according to the signal distribution information of the interference image at the sampling point.
In one embodiment, the coherent light source 10 and the photosensitive element 30 may be integrated in the scanning device 20 as a peripheral transparent/translucent layered material thickness defect detection product, the product is connected to an external computer system as the processor 40 through a predefined communication protocol or interface program via a unified controller, a software system in the processor controls the coherent light source 10 and the scanning device 20 to complete scanning of the layered material, and also receives signal intensity data of the interference image collected by the photosensitive element 30, and determines whether the layered material has defects by analyzing the signal intensity data of the corresponding scanning sampling points.
In another embodiment, the processor 40 may also be integrally mounted in the scanning device 20 to form an integral transparent/translucent layered material thickness defect detection product. The processor 40 may be implemented in hardware by integrating chips and memory in the scanning apparatus 20 and connecting buses accordingly.
In actual use, specifically, as shown in fig. 1, the layered inspection material may be naturally placed horizontally, the layered inspection material includes a substrate (i.e., the outer surface of the product to which the transparent/translucent layered material is attached) and the transparent/translucent layered material on the substrate, the scanning device 20 is aligned with the layered inspection material, and then the processor 40 controls the scanning device 20 to detect the layered inspection material.
The transparent/semitransparent material defect detection system can also be integrated on a conveyor belt of a production line of the gluing, attaching, paint spraying and surface bonding processes, when a layered detection material passes through the conveyor belt, the layered detection material on the conveyor belt can be automatically scanned by the transparent/semitransparent material defect detection system, and corresponding defect analysis data is fed back to prompt whether the processes of the production line of the gluing, attaching, paint spraying and surface bonding processes are in compliance or not.
Specifically, the transparent/translucent material defect detection system comprises:
the coherent light source 10 can divide the light wave (source wave) emitted from the light source into a set of several waves (light beams) by an optical device (interference device). Since these waves are from the same source wave, when the initial phase of the source wave is changed, the initial phases of the member waves are changed identically, so that the phase difference between them remains unchanged. At the same time, the polarization direction of each member wave is also identical to that of the source wave, and therefore, at the point of view, the polarization directions are also substantially the same. The general interference device can make the amplitudes of the member waves not very different. So that the resulting set of several beams is a coherent set of light.
In one embodiment, the coherent light source may employ a visible light coherent light generator, and for a transparent layered material attached to the surface of the product, the visible light generated by the visible light coherent light generator may not only be first reflected with a relatively high intensity on the surface of the transparent material (e.g., glass, silicone sheet, transparent colloid, etc.), but also be second reflected with a relatively high intensity on the contact surface between the transparent layered material and the substrate after being refracted into the transparent layered material, and the reflected light of the second reflection may be coherent light, which may generate an interference phenomenon, so as to be captured by the photosensitive material, and the information of the transparent material is confirmed by analyzing the interference fringes.
In another embodiment, the coherent light source may further employ a near-infrared coherent light generator, which is used for preventing interference of natural light to the photosensitive element, and for the attached partially opaque or translucent layered material, visible light cannot be refracted into the layered material, so that emission occurs on the surface of the layered material and the contact surface of the layered material and the substrate, while for the near-infrared coherent light generator, which is used for generating near-infrared coherent light, emission occurs on the surface of the layered material and the contact surface of the layered material and the substrate, so that an interference image can be generated on the photosensitive element, so that the transparent/translucent material defect detection system can also detect defects of the translucent layered material.
The scanning device 20 is connected to the coherent light source, and configured to determine one or more sampling point positions according to a preset sampling configuration, and control the light emitting direction of the coherent light source to scan the one or more sampling point positions.
The scanning device 20 is composed of a plurality of groups of reflectors, lenses and motors, a light path structure is formed inside the scanning device, and the light emitting direction of the light path can be changed by driving the motors to rotate the rotating angles of the reflectors, so that the optical scanning process of the layered material to be detected is realized.
In one embodiment, the scanning device 20 can be implemented by a Micro-Electro-Mechanical System (MEMS). The Micro-Electro-Mechanical System 30 (MEMS for short) mainly includes a sensor, a millimeter-scale mirror, an actuator (actuator), and a Micro-energy source, and the work flow is that the sensor uses the actuator (actuator, such as a Micro-motor) to drive a millimeter-scale mirror to irradiate a light beam to a material to be inspected, and the millimeter-scale mirror is driven to move a point irradiated by the light beam in XY directions of the material to be inspected (the Z direction is a depth direction), so as to complete rapid scanning of the material to be inspected. Because the volume of the MEMS is small, and the coherent light source 10 and the photosensitive element 30 can both use small-sized electronic components, the use of the MEMS as the scanning device 20 can greatly reduce the volume of the finished product of the transparent/translucent material defect detection system, thereby making a miniaturized portable transparent/translucent material defect detection system which can be held by hand.
The scanning mode of the scanning device 20 can be divided into three types of dot scanning, line scanning and area scanning.
Point scanning: the scanning device 20 is used to acquire one or more sampling point locations defined in the sampling configuration.
A plurality of sampling point positions may be defined on the surface plane of the layered material to be inspected in advance, and as shown in fig. 2, the sampling point positions may be defined at four corners of the surface of a square attached layered material, and the scanning device 20 may scan the 4 sampling point positions during scanning. After the scanning device 20 scans a certain sampling point, the photosensitive element 30 feeds back the signal intensity distribution data of the received interference image to the processor 40, and after the processor 40 analyzes the data, the processor 40 sends an instruction to the scanning device 20 to control the scanning device 20 to continue scanning to the next sampling point.
It should be noted that the data storage format of the sampling point position does not refer to the coordinates of the sampling point position on the layered detection material, and may be the relative position or light emitting direction of the light outlet of the scanning device 20, or the inclination position of the mirror in the scanning device 20. In one embodiment, the processor may control the photosensitive element to take a picture of the layered material, then define the sampling point locations in the picture, and then convert the sampling point locations into position information that can be recognized by the scanning device. In another embodiment, the scanning device may also be pre-configured with specific exit port movement positions, for example on a conveyor belt.
Line scanning: and acquiring the scanning direction and the scanning length defined in the sampling configuration, and determining one or more sampling point positions according to the scanning direction and the scanning length, and a preset sampling interval or the sampling interval read in the sampling configuration.
The scanning device can perform line scanning on one cross section of the layered material on the layered material by line scanning, as shown in fig. 3, the line scanning can be performed on four cross sections at four corners of a square annular layered material, the scanning device 20 performs scanning according to the extension direction of the cross section during scanning, scans a plurality of sampling points on the cross section during linear movement according to a preset sampling interval (i.e., resolution), for example, if the sampling interval is 0.1mm, a sampling point is set on the cross section every 0.1mm during linear scanning, and the layered material is scanned once every 0.1 mm.
Surface scanning: and acquiring the position and the size of a scanning area defined in the sampling configuration, and determining one or more sampling point positions according to the position and the size of the scanning area and a preset sampling interval or the sampling interval read in the sampling configuration.
The scanning device may perform surface scanning on the whole area on the surface of the layered material by surface scanning, as shown in fig. 4, the surface scanning may be performed on the whole surface plane attached with a square annular layered material, the sampling interval includes two definitions of a vertical resolution and a horizontal resolution, the vertical resolution is a line interval when the scanning device performs line-by-line scanning, and the horizontal resolution is an interval distance between two adjacent sampling points when the scanning device performs line-by-line scanning.
It should be noted that, in line scanning and surface scanning, the data storage form of the positions of the sampling points may not be the coordinates of specific sampling points, but defined by the scanning direction, length and sampling interval. The scanning device only needs to scan for a certain length according to a preset scanning direction, and then periodically scans the layered material to be detected according to a preset sampling interval in the scanning process, so that the specific position of a sampling point does not need to be recorded.
The photosensitive element 30 may be a photosensitive material such as a photoelectric sensor and an optical signal logic circuit, a CMOS or a CMOS-based camera, or a multispectral or hyperspectral camera, and is configured to collect interference image information of an optical signal reflected after the coherent light beam irradiates the material to be inspected.
Referring to fig. 5, after a coherent light beam irradiates a layered detection material, when there are few impurities in the layered detection material (which is also a common situation), energy of reflected light is mainly distributed on reflected light on the surface of the layered detection material and reflected light on the contact surface between the layered detection material and a substrate, the coherent light beam is reflected for the first time on the surface of the attached layered detection material, a part of the coherent light beam is refracted into a colloid, and then reflected for the second time on the contact surface between the layered detection material and the substrate, and reflected light reflected for the two times is subjected to equal inclination interference.
Referring to FIG. 6, the light ray a emitted from the light source S becomes two parallel coherent light rays a after being reflected by the upper and lower surfaces of the parallel thin films1And a2The interference occurs at a point P that converges through the lens to the focal plane. The refractive indexes of the film and the upper and lower media are respectively n1、n2And n3FIG. 3, the CD is perpendicular to the parallel coherent light a1And a2Since the optical paths from two points to the point P in CD are equal, the optical path difference δ between the parallel coherent light beams a1 and a2 due to different media is:
Figure PCTCN2018107860-APPB-000001
wherein h is the thickness of the parallel thin film, and the half-wave loss is not considered, then:
the conditions for constructive interference are: 2n of2hcosi2＝kλ，k＝1,2,3....n
The conditions for destructive interference are:
Figure PCTCN2018107860-APPB-000002
therefore, one incident light ray of the light source S finally forms a point P, and if the optical path difference is equal to the even multiple of the half wavelength, the point P is a bright point; if the optical path difference is equal to an odd multiple of the half wavelength, the point P is a dark point.
When analyzing the interference of all incident lights of the light source S, all the incident lights emitted from S are emitted to the parallel film in different directions, and the incident lights are divided into n groups of light beams, so that the incident angles (inclination angles) of all the light beams in each group of light beams to the parallel film are always the same, and the incident angles of the light beams in different groups are different, that is:
light beam group 1 2 3 … n
Angle of incidence x1 x2 x3 … xn
Wherein x isi≠xj，i≠j。
For the ith group of light beams, because the incident angles of all the light rays are xi, a conical surface with the main optical axis of the lens is formed after the light rays are reflected by the upper surface and the lower surface of the film, a circular ring is formed on the light screen positioned at the focal plane after the light rays are converged by the lens, the circular ring is formed by interference and superposition of coherent light, the thickness h of the film is a constant, the refractive index is also a constant, the optical path difference only depends on the incident angles, and therefore interference fringes formed by the convergence of points are circular rings. Meanwhile, because the inclination angles of the light beams of each group are different, the circular rings formed by the light beams are staggered, and because the optical path difference caused by the different inclination angles is different, the brightness of each group of light beams is changed along with the change of the inclination angles, so that interference images generated by interference of light rays in different directions emitted by the light source S passing through the parallel thin films form circular interference images with the brightness as the center of a circle on a focal plane.
In the present embodiment, as shown in fig. 1, a lens is disposed in the scanning device 20, and the parallel coherent light emitted from the coherent light source 10 is converged and vertically irradiates the surface of the layered material to be detected, so that a set of incident light beams with different tilt angles is generated, and since the incident point after convergence is small, the surface of the layered material where the sampling point is located can be considered as being approximately parallel, so that, by using the principle of equal-tilt interference, after the layered material to be detected is irradiated by the scanning device 20, a circular ring-shaped interference fringe of equal-tilt interference of a circular ring shape is obtained on the photosensitive element, and the interference fringe is related to the thickness of the sampling point at the irradiation position of the scanning device 20 (the interference distance is proportional to the optical path difference, and the optical path difference is proportional to the thickness of the incident point). As shown in fig. 7, the signal intensity peaks on the photosensitive element correspond to the thickness of the incident point.
In other embodiments, the principle of the equal-inclination interference is not limited, and the photosensitive element 30 may also receive a corresponding interference image based on the principle of other thin-film interference such as the equal-thickness interference, and analyze information of the interference fringes in the interference image.
And the processor 40 is connected with the scanning device and the photosensitive element and is used for calculating material thickness information corresponding to the position of the sampling point according to the interference image information and determining the defect of the layered material to be detected according to the material thickness information.
When the scanning device 20 scans the layered material to be inspected, a plurality of sampling points are scanned, and the processor 40 records the positions of the sampling points currently scanned by the scanning device 20, acquires the interference image information corresponding to the positions of the sampling points, which is acquired by the photosensitive element 30, and further calculates the material thickness information corresponding to the positions of the sampling points, so as to generate the corresponding relationship between the positions of the sampling points and the material thickness information of the positions of the sampling points.
The material thickness information can be the thickness value of the colloid at the sampling point or the reference value of the colloid thickness (directly replaced by the distance of the fringes in the interference image information), or can be a cross-sectional view of a certain scanning cross section in line scanning or surface scanning, wherein the cross-sectional view can clearly reflect the surface profile condition (changed based on the thickness of the laminated material) of the colloid at the scanning cross section.
Because the gluing, painting, glass attaching and silicone grease sheet bonding of the product surface are all the transparent/semitransparent laminar materials attached to the product surface, and the defect detection of the system for the transparent/semitransparent laminar materials similar to gluing, painting, glass attaching and silicone grease sheet bonding is based on the same working principle, for convenience of description, in the following embodiments, the gluing defect detection of the actual surface gluing product is taken as an example of the practical application of the system, and in the practical application, the system can detect the defects of various transparent/semitransparent laminar materials attached to the product surface in various modes such as gluing, painting, glass attaching, silicone grease sheet bonding and the like.
In one embodiment, since the material thickness information at the sampling point is in a direct proportion to the distance between the interference fringes of the interference image collected at the sampling point, the processor 40 may directly use the value of the distance as a quantization value to characterize the colloid thickness of the sampling point, and determine whether the colloid surface has large fluctuation or whether there is air bubbles in the colloid according to the colloid thicknesses of a plurality of sampling points. And the specific thickness value of the colloid at each sampling point does not need to be calculated. If the actual colloid thickness at the sampling point needs to be calculated, parameters such as the refractive index of the colloid, the wavelength of the coherent light source and the like need to be obtained in advance.
In one embodiment, the processor may compare the colloid thickness value at each sampling point with a preset reference value, and if the colloid thickness value is significantly smaller than the reference value, the coated glue at the sampling point has a defect of being too thin, and if the colloid thickness value is significantly larger than the reference value, the coated glue at the sampling point has a defect of being too thick.
And calculating the average value of the colloid thickness values of all the sampling points, wherein if the average value is obviously smaller than the reference value, the glued surface of the layered detection material has the defect of over-thin whole, and if the average value is obviously larger than the reference value, the glued surface of the layered detection material has the defect of over-thick whole.
In an embodiment, the processor is further configured to obtain material thickness information corresponding to each of the one or more sampling point locations, calculate a variance of the material thickness information, and determine that the layered inspection material has a defect of uneven surface layer according to the material thickness information when the variance is greater than or equal to a first threshold.
For example, if there are 6 sampling point positions, the corresponding material thickness information is:
sampling point 1 4.0
Sampling point 2 3.9
Sampling point 3 4.2
Sample point 4 2.8
Sampling point 5 4.0
Sampling point 6 3.9
The mean value is 3.8, the variance is 1.12, the variance is obviously large, and data analysis shows that the situation that the glue is obviously too thin exists at the position of a sampling point 4.
Further, the processor is further configured to calculate a mean value of the material thickness information when the variance is greater than or equal to a first threshold, find a sampling point position where the corresponding material thickness information deviates from the mean value by greater than or equal to a second threshold, and calibrate the sampling point position.
In the above example, the average value of the thickness of the colloid at the position of 6 sampling points is 3.8, and the thickness of the colloid at the position of 4 sampling points is 2.8 which is obviously smaller than the average value of 3.8, so that the processor can calibrate the position of 4 sampling points, and the gluing at the position is indicated to have the defect of recess.
In one embodiment, if the processor does not find an interference phenomenon in the received signal intensity distribution information of the interference image fed back by the photosensitive element, that is, does not find the interval information of the interference fringes, it is determined that the material thickness information at the position is 0, and the actual expression meaning is that no glue is applied at the position.
For example, if there are 6 sampling point positions, the corresponding material thickness information is:
sampling point 1 4.0
Sampling point 2 2.8
Sampling point 3 0
Sample point 4 0
Sampling point 5 3.1
Sampling point 6 3.9
It indicates that there is a fault in the application of glue at sample points 3 and 4 (glue break occurred during the application of glue) and that the two points are not applied with glue.
In one embodiment, the processor is further configured to calculate a plurality of material thickness information for a plurality of interference image information acquired by the photosensitive element in the presence of a plurality of interference image fringes; and determining the number of bubbles at the corresponding sampling point positions according to the plurality of pieces of material thickness information, or determining that the bubble defect exists at the corresponding sampling point positions of the layered material to be detected according to the plurality of pieces of material thickness information.
When 1 bubble exists at the sampling point position, the reflected light not only comprises the reflected light of the surface of the colloid and the reflected light of the contact surface of the colloid and the substrate, but also comprises the reflected light of the upper surface of the bubble and the reflected light of the lower surface of the bubble, and the reflected lights are subjected to equal inclination interference at the same time, so that more than one annular equal inclination interference fringe is received on the photosensitive element, and thus, the processor receives the past interference image information of the past interference image fed back by the photosensitive element, and thus, the processor can detect a plurality of colloid thicknesses at the sampling point position with the bubble. Similarly, when a plurality of bubbles exist at the sampling point, the upper surface and the lower surface of each bubble are reflected, so that the number of interference images of equal inclination interference is further increased, the processor can calculate material thickness information corresponding to the number of the bubbles, and according to the material thickness information, the processor can determine that the bubble defect exists at the sampling point on one hand and can determine the number of the bubbles according to the number of the calculated material thickness information on the other hand.
In summary, the transparent/translucent material defect detection system in this embodiment can detect the defects of the layered inspection material, such as glue width, glue thickness, glue breakage, glue overflow, air bubbles, glue piling, and the like, by analyzing the material thickness information.
In one embodiment, there is also provided a method of detecting defects in transparent/translucent materials, the method being implementable in dependence on a computer program executable on a computer system based on von neumann architecture, the computer system being the processor 40 of fig. 1, the processor 40 being a personal computer, a server device, a server cluster device, a laptop, a palm top computer, a tablet, a smartphone, or the like.
The processor 40 is externally connected with a scanning device 20 as shown in fig. 1, and the scanning device 20 is provided with a coherent light source 10 and a photosensitive element 30. The processor 40 controls the coherent light source 10 and the scanning device 20 by running the computer program, and receives data fed back from the photosensitive element 30. The coherent light source 10, the scanning device 20 and the photosensitive element 30 are connected to the processor 40 through a specific communication interface, and the computer program on the processor 40 can communicate with the firmware programs on the coherent light source 10, the scanning device 20 and the photosensitive element 30 through a predetermined computer instruction or communication protocol.
Specifically, as shown in fig. 8, the method for detecting the defect of the transparent/translucent material includes:
step S102: one or more sampling point positions are determined according to a preset sampling configuration.
Step S104: and controlling a coherent light source to generate a coherent light beam to irradiate the sampling point, wherein the coherent light beam irradiates the sampling point position of the layered material to be detected during detection.
Step S106: and acquiring interference image information of the reflected optical signal after the coherent light beam irradiates the material to be detected through a photosensitive element.
Step S108: and calculating material thickness information corresponding to the position of the sampling point according to the interference image information, and determining the defect of the layered material to be detected according to the material thickness information.
In one embodiment, one or more sampling point locations are determined according to a preset sampling configuration;
controlling a coherent light source to generate a coherent light beam to irradiate a sampling point, wherein the coherent light beam irradiates the position of the sampling point of the layered material to be detected during detection;
acquiring interference image information of an optical signal reflected after the coherent light beam irradiates a material to be detected through a photosensitive element;
and calculating material thickness information corresponding to the position of the sampling point according to the interference image information, and determining the defect of the layered material to be detected according to the material thickness information.
In one embodiment, determining one or more sampling point locations according to a preset sampling configuration comprises:
acquiring one or more sampling point positions defined in the sampling configuration;
or acquiring a scanning direction and a scanning length defined in the sampling configuration, and determining one or more sampling point positions according to the scanning direction and the scanning length, and a preset sampling interval or the sampling interval read in the sampling configuration;
or acquiring the scanning area position and size defined in the sampling configuration, and determining one or more sampling point positions according to the scanning area position and size, and a preset sampling interval or the sampling interval read in the sampling configuration.
In one embodiment, the determining the defect of the layered inspection material according to the material thickness information comprises:
and acquiring material thickness information corresponding to the one or more sampling point positions respectively, calculating the variance of the material thickness information, and determining that the layered material to be detected has the defect of uneven surface layer according to the material thickness information under the condition that the variance is greater than or equal to a first threshold value.
In one embodiment, the method further comprises:
and under the condition that the variance is larger than or equal to a first threshold value, calculating the mean value of the material thickness information, searching the position of a sampling point of which the corresponding material thickness information deviates from the mean value and is larger than or equal to a second threshold value, and calibrating the position of the sampling point.
In one embodiment, the calculating material thickness information corresponding to the sampling point position according to the interference image information further includes:
calculating a plurality of material thickness information for a plurality of interference image information collected by the photosensitive element in the presence of a plurality of interference image fringes;
the determining the defect of the layered inspection material according to the material thickness information comprises:
determining the number of bubbles at corresponding sampling point positions according to the material thickness information,
or determining that the layered material to be detected has bubble defects at corresponding sampling point positions according to the thickness information of the materials.
In one embodiment, the coherent light source generates a coherent light beam having a wavelength of near infrared light.
In one embodiment, there is also provided an apparatus for detecting defects in a transparent/translucent material, as shown in fig. 9, the apparatus includes a scan mode setting module 102, a scan control module 104, a signal receiving module 106, and a signal processing module 108, wherein:
the scanning mode setting module 102 is configured to determine one or more sampling point positions according to a preset sampling configuration.
And the scanning control module 104 is used for controlling the coherent light source to generate a coherent light beam to irradiate the sampling point, and the coherent light beam irradiates the sampling point position of the layered material to be detected during detection.
And the signal receiving module 106 is configured to collect interference image information of the optical signal reflected after the coherent light beam irradiates the material to be tested, through a photosensitive element.
And the signal processing module 108 is configured to calculate material thickness information corresponding to the position of the sampling point according to the interference image information, and determine a defect of the layered inspection material according to the material thickness information.
In one embodiment, the scan mode setting module 102 is further configured to obtain one or more sampling point positions defined in the sampling configuration;
or acquiring a scanning direction and a scanning length defined in the sampling configuration, and determining one or more sampling point positions according to the scanning direction and the scanning length, and a preset sampling interval or the sampling interval read in the sampling configuration;
or acquiring the scanning area position and size defined in the sampling configuration, and determining one or more sampling point positions according to the scanning area position and size, and a preset sampling interval or the sampling interval read in the sampling configuration.
In an embodiment, the signal processing module 108 is further configured to obtain material thickness information corresponding to each of the one or more sampling point locations, calculate a variance of the material thickness information, and determine that the layered inspection material has a defect of uneven surface layer according to the material thickness information when the variance is greater than or equal to a first threshold.
In one embodiment, the signal processing module 108 is further configured to calculate a plurality of material thickness information for a plurality of interference image information collected by the photosensitive element in the presence of a plurality of interference image fringes; the determining the defect of the layered inspection material according to the material thickness information comprises: and determining the number of bubbles at the corresponding sampling point positions according to the plurality of pieces of material thickness information, or determining that the bubble defect exists at the corresponding sampling point positions of the layered material to be detected according to the plurality of pieces of material thickness information.
The embodiment of the invention has the following beneficial effects:
after the method and the device for detecting the defects of the transparent/semitransparent material and the defect detection system of the transparent/semitransparent material are adopted, the preset sampling points on the laminated detection material can be scanned by coherent light, after the laminated detection material is irradiated by the coherent light, reflected light can be generated on the gluing surface, the surface in contact with a substrate, impurities, bubbles, scattering phenomena and the like in gluing, the reflected light can generate interference phenomena due to the coherent light and is received by a photosensitive element, material thickness information (which can be a direct thickness value or a thickness reference value and can also be colloid section image information) corresponding to each sampling point is calculated by a processor according to the interference image information received by the photosensitive element, and whether the colloid at the sampling point has over-thickness, or over-thickness is judged by analyzing and comparing the material thickness information of each sampling point, Too thin, uneven, and the defects of adhesive leakage and the like. Compared with the laser ranging mode in the prior art, the method does not need to add a reference plane, and the detection accuracy is not affected by the precision of the reference plane, so that the accuracy is higher.
Meanwhile, the method and the device for detecting the defects of the transparent/semitransparent material and the system for detecting the defects of the transparent/semitransparent material can adopt a near-infrared coherent light source, and can also detect the opaque and semitransparent colloid through a photosensitive element aiming at a specific wavelength, so that the method has better applicability compared with a laser ranging mode in the prior art.
In addition, because the bubble exists at the sampling point, the interference phenomenon occurs for a plurality of times, the method and the device for detecting the defect of the transparent/semitransparent material and the defect detection system of the transparent/semitransparent material can simultaneously detect the bubble defect and the number of the bubbles in the layered material, and compared with the laser ranging mode in the prior art, the method has better applicability and more complete function.
In one embodiment, as shown in fig. 10, fig. 10 illustrates a von neumann-based computer system running the above-described method of detecting defects in transparent/translucent materials. Specifically, an external input interface 1001, a processor 1002, a memory 1003, and an output interface 1004 connected through a system bus may be included. The external input interface 1001 may optionally include at least a network interface 10012 and a USB interface 10014. Memory 1003 can include external memory 10032 (e.g., a hard disk, optical or floppy disk, etc.) and internal memory 10034. The output interface 1004 may include at least a display 10042 or the like.
In the present embodiment, the method is executed based on a computer program, program files of which are stored in the external memory 10032 of the computer system 10 based on the von neumann architecture, loaded into the internal memory 10034 at the time of execution, and then compiled into machine code and then transferred to the processor 1002 to be executed, so that the logical scan mode setting module 102, the scan control module 104, the signal receiving module 106, and the signal processing module 108 are formed in the computer system 10 based on the von neumann architecture. In the execution process of the method for detecting the gluing defects, all input parameters are received through the external input interface 1001 and are transmitted to the memory 1003 for buffering, then the input parameters are input into the processor 1002 for processing, and the processed result data is buffered in the memory 1003 for subsequent processing or is transmitted to the output interface 1004 for outputting.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention, and it is therefore to be understood that the invention is not limited by the scope of the appended claims.

Claims (16)

  1. A method of detecting defects in a transparent/translucent material, comprising:
    determining one or more sampling point positions according to a preset sampling configuration;
    controlling a coherent light source to generate a coherent light beam to irradiate a sampling point, wherein the coherent light beam irradiates the position of the sampling point of the layered material to be detected during detection;
    acquiring interference image information of a light signal reflected after the coherent light beam irradiates the layered detection material through a photosensitive element;
    and calculating material thickness information corresponding to the position of the sampling point according to the interference image information, and determining the defect of the layered material to be detected according to the material thickness information.
  2. The method of claim 1, wherein determining one or more sampling point locations according to a predetermined sampling configuration comprises:
    acquiring one or more sampling point positions defined in the sampling configuration;
    or acquiring a scanning direction and a scanning length defined in the sampling configuration, and determining one or more sampling point positions according to the scanning direction and the scanning length, and a preset sampling interval or the sampling interval read in the sampling configuration;
    or acquiring the scanning area position and size defined in the sampling configuration, and determining one or more sampling point positions according to the scanning area position and size, and a preset sampling interval or the sampling interval read in the sampling configuration.
  3. The method of claim 1, wherein determining the defect of the layered inspection material according to the material thickness information comprises:
    and acquiring material thickness information corresponding to the one or more sampling point positions respectively, calculating the variance of the material thickness information, and determining that the layered material to be detected has the defect of uneven surface layer according to the material thickness information under the condition that the variance is greater than or equal to a first threshold value.
  4. The method of detecting defects in a transparent/translucent material according to claim 3, further comprising:
    and under the condition that the variance is larger than or equal to a first threshold value, calculating the mean value of the material thickness information, searching the position of a sampling point of which the corresponding material thickness information deviates from the mean value and is larger than or equal to a second threshold value, and calibrating the position of the sampling point.
  5. The method for detecting the defect of the transparent/semitransparent material according to claim 1, wherein the calculating the material thickness information corresponding to the position of the sampling point according to the interference image information further comprises:
    calculating a plurality of material thickness information for a plurality of interference image information collected by the photosensitive element in the presence of a plurality of interference image fringes;
    the determining the defect of the layered inspection material according to the material thickness information comprises:
    determining the number of bubbles at corresponding sampling point positions according to the material thickness information,
    or determining that the layered material to be detected has bubble defects at corresponding sampling point positions according to the thickness information of the materials.
  6. The method for detecting the defects of the transparent/semitransparent material according to any one of claims 1 to 5, wherein the wavelength of the coherent light beam generated by the coherent light source is near infrared light.
  7. An apparatus for detecting defects in a transparent/translucent material, comprising:
    the scanning mode setting module is used for determining one or more sampling point positions according to preset sampling configuration;
    the scanning control module is used for controlling the coherent light source to generate a coherent light beam to irradiate the sampling point, and the coherent light beam irradiates the position of the sampling point of the layered material to be detected during detection;
    the signal receiving module is used for acquiring interference image information of the reflected optical signal after the coherent optical beam irradiates the layered detection material through a photosensitive element;
    and the signal processing module is used for calculating material thickness information corresponding to the position of the sampling point according to the interference image information and determining the defect of the layered material to be detected according to the material thickness information.
  8. The apparatus for detecting defects in transparent/translucent materials according to claim 7 wherein the scan pattern setting module is further adapted to set the scan pattern of the transparent/translucent materials
    Acquiring one or more sampling point positions defined in the sampling configuration;
    or acquiring a scanning direction and a scanning length defined in the sampling configuration, and determining one or more sampling point positions according to the scanning direction and the scanning length, and a preset sampling interval or the sampling interval read in the sampling configuration;
    or acquiring the scanning area position and size defined in the sampling configuration, and determining one or more sampling point positions according to the scanning area position and size, and a preset sampling interval or the sampling interval read in the sampling configuration.
  9. The apparatus of claim 7, wherein the signal processing module is further configured to obtain material thickness information corresponding to each of the one or more sampling points, calculate a variance of the material thickness information, and determine that the layered inspection material has a defect of uneven surface layer according to the material thickness information when the variance is greater than or equal to a first threshold.
  10. The apparatus of claim 7, wherein the signal processing module is further configured to calculate a plurality of material thickness information for the plurality of interference image information collected by the photosensitive element in the presence of a plurality of interference image fringes; the determining the defect of the layered inspection material according to the material thickness information comprises: and determining the number of bubbles at the corresponding sampling point positions according to the plurality of pieces of material thickness information, or determining that the bubble defect exists at the corresponding sampling point positions of the layered material to be detected according to the plurality of pieces of material thickness information.
  11. A transparent/translucent material defect detection system, comprising:
    a coherent light source for generating a coherent light beam;
    the scanning device is connected with the coherent light source and used for determining one or more sampling point positions according to a preset sampling configuration and controlling the light outgoing direction of the coherent light source to scan the one or more sampling point positions;
    the photosensitive element is used for collecting interference image information of a reflected optical signal after the coherent light beam irradiates the layered detection material;
    and the processor is connected with the scanning device and the photosensitive element and used for calculating material thickness information corresponding to the position of the sampling point according to the interference image information and determining the defect of the layered material to be detected according to the material thickness information.
  12. The transparent/translucent material defect detection system of claim 11, wherein the scanning device is further configured to:
    acquiring one or more sampling point positions defined in the sampling configuration;
    or acquiring a scanning direction and a scanning length defined in the sampling configuration, and determining one or more sampling point positions according to the scanning direction and the scanning length, and a preset sampling interval or the sampling interval read in the sampling configuration;
    or acquiring the scanning area position and size defined in the sampling configuration, and determining one or more sampling point positions according to the scanning area position and size, and a preset sampling interval or the sampling interval read in the sampling configuration.
  13. The system of claim 11, wherein the processor is further configured to obtain material thickness information corresponding to each of the one or more sampling points, calculate a variance of the material thickness information, and determine that the layered inspection material has a defect of uneven surface layer according to the material thickness information when the variance is greater than or equal to a first threshold.
  14. The system of claim 13, wherein the processor is further configured to calculate a mean value of the material thickness information if the variance is greater than or equal to a first threshold, find a sampling point position where the corresponding material thickness information deviates from the mean value by greater than or equal to a second threshold, and calibrate the sampling point position.
  15. The transparent/translucent material defect detection system of claim 11 wherein the processor is further configured to calculate a plurality of material thickness information for a plurality of interference image information collected by the photosensitive element in the presence of a plurality of interference image fringes; and determining the number of bubbles at the corresponding sampling point positions according to the plurality of pieces of material thickness information, or determining that the bubble defect exists at the corresponding sampling point positions of the layered material to be detected according to the plurality of pieces of material thickness information.
  16. The system of claim 1 to 15, wherein the coherent light source is a near infrared coherent light generator.
CN201880067020.7A 2018-09-27 2018-09-27 Method, device and system for detecting defects of transparent/semitransparent material Pending CN111213029A (en)

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CN104964982A (en) * 2015-06-30 2015-10-07 浙江大学 Glass surface authentic and false defect identification method and system based on OCT complex signal
CN107024488A (en) * 2017-02-27 2017-08-08 杭州电子科技大学 A kind of glass defect detection method
CN207779930U (en) * 2017-12-08 2018-08-28 湖南科创信息技术股份有限公司 Transparent material defect detecting system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114518072A (en) * 2022-02-22 2022-05-20 江苏铁锚玻璃股份有限公司 Device applied to transparent part thickness detection and using method thereof
CN114518072B (en) * 2022-02-22 2023-08-29 江苏铁锚玻璃股份有限公司 Device applied to thickness detection of transparent piece and application method thereof

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