WO2020001633A1 - Defect inspection apparatus and defect inspection method - Google Patents

Defect inspection apparatus and defect inspection method Download PDF

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WO2020001633A1
WO2020001633A1 PCT/CN2019/093779 CN2019093779W WO2020001633A1 WO 2020001633 A1 WO2020001633 A1 WO 2020001633A1 CN 2019093779 W CN2019093779 W CN 2019093779W WO 2020001633 A1 WO2020001633 A1 WO 2020001633A1
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detection
imaging
product
defect
scattered
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PCT/CN2019/093779
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French (fr)
Chinese (zh)
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杨晓青
申永强
韩雪山
王帆
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上海微电子装备(集团)股份有限公司
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination

Abstract

A defect inspection apparatus and a defect inspection method. The defect inspection apparatus comprises an illumination module (20) and an imaging inspection module (30). The illumination module (20) is configured to generate a detection light beam (201), and to make the detection light beam (201) incident to the inspection surface of a product to be inspected (40). The imaging inspection module (30) is configured to detect whether the detection light beam (201) is scattered by the inspection surface of said product (40) so as to generate a scattered imaging light beam (301), and if detecting the scattered imaging light beam (301), to determine defect information of said product (40) according to the scattered imaging light beam (301). The illuminance of the detection light beam (201) satisfies: (U1×R)/(U2×L)≥S1, wherein S1 is a signal-to-noise ratio needing to be satisfied to suppress crosstalk on the non-inspection surface of said product (40), U1 is the central illuminance of the detection light beam (201), R is the scattering efficiency of light by the minimum inspectable defect at a receivable angle, U2 is the illuminance of the half-width edge of the detection light beam (201), and L is the scattering efficiency of light by the maximum crosstalk object on the non-detection surface at a receivable angle. The half width W of the detection light beam (201) satisfies: d×(tanα+tanβ)>FOV/2+W, wherein d is the thickness of said product (40), FOV is an effective field of view of the imaging inspection module (30), α is the angle of refraction of the detection light beam (201) in said product (40), and β is the angle of refraction of the scattered imaging light beam (301) in said product (40).

Description

一种缺陷检测装置及缺陷检测方法Defect detection device and method
本申请要求在2018年06月29日提交中国专利局、申请号为201810696844.2的中国专利申请的优先权,该申请的全部内容通过引用结合在本申请中。This application claims priority from a Chinese patent application filed with the Chinese Patent Office on June 29, 2018 with application number 201810696844.2, the entire contents of which are incorporated herein by reference.
技术领域Technical field
本申请实施例涉及缺陷检测技术领域,例如涉及一种缺陷检测装置及缺陷检测方法。The embodiments of the present application relate to the technical field of defect detection, for example, to a defect detection device and a defect detection method.
背景技术Background technique
在半导体集成电路或平板显示的制备工艺中,为使产品保持较高的良率,在对掩模版或玻璃基板等进行曝光前,都需要进行缺陷(包括外来颗粒、指纹、划痕、针孔等)检测,以达到控制污染的目的。In the manufacturing process of semiconductor integrated circuits or flat panel displays, in order to maintain a high yield of the product, defects (including foreign particles, fingerprints, scratches, pinholes, etc.) need to be performed before exposing the reticle or glass substrate. Etc.) to achieve the purpose of controlling pollution.
图1是相关技术中的一种缺陷检测装置的结构示意图,一般集成在光刻设备中的颗粒检测装置通常采用暗场散射测量技术,其检测原理如图1所示,从光源10发出的照明光线101经待测物体104上的缺陷114散射,散射光线102最终被探测器103所探测,然后根据探测器103检测到的散射光线确定缺陷的尺寸大小。FIG. 1 is a schematic structural diagram of a defect detection device in the related art. A particle detection device generally integrated in a lithographic apparatus generally adopts a dark field scattering measurement technology. The detection principle is shown in FIG. The light 101 is scattered by the defect 114 on the object to be measured 104, and the scattered light 102 is finally detected by the detector 103, and then the size of the defect is determined according to the scattered light detected by the detector 103.
但相关技术中的缺陷检测装置在缺陷检测的过程中,待测产品的下表面图案容易产生串扰信号,影响缺陷检测结果的准确性。However, during the defect detection process of the defect detection device in the related art, the lower surface pattern of the product to be tested is prone to generate crosstalk signals, which affects the accuracy of the defect detection result.
发明内容Summary of the invention
本申请提供一种缺陷检测装置及缺陷检测方法,以实现抑制缺陷检测过程中产生的串扰。The application provides a defect detection device and a defect detection method, so as to achieve the suppression of crosstalk generated during the defect detection process.
第一方面,本申请实施例提供了一种缺陷检测装置,包括照明模块和成像检测模块;In a first aspect, an embodiment of the present application provides a defect detection device, including an illumination module and an imaging detection module;
所述照明模块设置为产生探测光束;The lighting module is configured to generate a detection beam;
所述成像检测模块设置为检测所述探测光束是否经待测产品的检测面散射产生散射成像光束,并在检测到所述散射成像光束的情况下,根据所述散射成像光束确定所述待测产品的缺陷信息;The imaging detection module is configured to detect whether the detection beam is scattered by a detection surface of a product to be measured to generate a scattered imaging beam, and when the scattered imaging beam is detected, determine the to-be-measured according to the scattered imaging beam. Product defect information;
其中,所述探测光束的照度满足:
Figure PCTCN2019093779-appb-000001
其中,S1为抑制所述待测产品的非检测面的串扰需要满足的信噪比,U1为所述探测光束的中心照度,R为 最小可检测缺陷在可被接收角度内对光线的散射效率,U2为所述探测光束的半宽边缘的照度,L为所述非检测面上的最大串扰物在可被接收角度内对光线的散射效率;
The illuminance of the detection beam satisfies:
Figure PCTCN2019093779-appb-000001
Among them, S1 is the signal-to-noise ratio required to suppress crosstalk on the non-detection surface of the product under test, U1 is the central illuminance of the detection beam, and R is the scattering efficiency of light by the smallest detectable defect within the receivable angle. , U2 is the illuminance at the half-width edge of the detection beam, and L is the scattering efficiency of the maximum crosstalk on the non-detection surface to the light within a receivable angle;
所述探测光束的半宽W满足:
Figure PCTCN2019093779-appb-000002
The half-width W of the detection beam satisfies:
Figure PCTCN2019093779-appb-000002
其中,d为所述待测产品的厚度;FOV为所述成像检测模块的有效视场;α为探测光束在所述待测产品中的折射角,β为所述散射成像光束在所述待测产品中的折射角。Where d is the thickness of the product to be measured; FOV is the effective field of view of the imaging detection module; α is the refraction angle of the detection beam in the product to be measured; β is the scattering imaging beam in the object to be measured Measure the refraction angle in the product.
在一实施例中,所述探测光束的照度还满足:
Figure PCTCN2019093779-appb-000003
其中,S2为抑制镜像串扰需要满足的信噪比,M为所述探测光束在镜像串扰区域内沿镜像串扰方向的散射效率,N为所述照明视场光线在镜像串扰方向的散射光线在所述待测产品内的反射率;
In an embodiment, the illuminance of the detection beam further satisfies:
Figure PCTCN2019093779-appb-000003
Among them, S2 is the signal-to-noise ratio required for suppressing the image crosstalk, M is the scattering efficiency of the detection beam in the image crosstalk direction in the image crosstalk area, and N is the scattered light in the image crosstalk direction in the illumination field Describe the reflectivity in the product to be tested;
所述探测光束的半宽W还满足:
Figure PCTCN2019093779-appb-000004
其中,θ为所述探测光束在镜像串扰方向的散射光线在所述待测产品中的折射角。
The half-width W of the detection beam also satisfies:
Figure PCTCN2019093779-appb-000004
Where θ is the refraction angle of the scattered light of the detection beam in the direction of mirror crosstalk in the product to be measured.
在一实施例中,所述探测光束的主光线的角度偏差小于5°;所述散射成像光束的主光线的角度偏差小于5°。In an embodiment, the angular deviation of the main ray of the detection beam is less than 5 °; the angular deviation of the main ray of the scattered imaging beam is less than 5 °.
在一实施例中,上述缺陷检测装置还包括:水平运动模块;所述水平运动模块设置为承载所述待测产品沿平行于所述待测产品的检测面的方向运动。In an embodiment, the above-mentioned defect detection device further includes: a horizontal movement module; the horizontal movement module is configured to carry the product to be tested to move in a direction parallel to the detection surface of the product to be tested.
在一实施例中,上述缺陷检测装置还包括:焦面测量模块和垂直运动模块;In one embodiment, the defect detection device further includes: a focal plane measurement module and a vertical movement module;
所述焦面测量模块设置为检测所述待测产品的检测面的离焦量;The focal plane measurement module is configured to detect a defocus amount of a detection plane of the product to be measured;
所述垂直运动模块设置为根据所述离焦量控制所述待测产品沿垂直于所述检测面的方向运动。The vertical movement module is configured to control the product to be measured to move in a direction perpendicular to the detection surface according to the defocus amount.
在一实施例中,所述成像检测模块是设置为通过如下方式根据所述散射成像光束确定所述待测产品的缺陷信息:根据连续多次获取的散射成像光束确定多个成像信号,并对所述多个成像信号进行积分以确定所述缺陷信息。In an embodiment, the imaging detection module is configured to determine defect information of the product to be tested according to the scattered imaging beam by determining multiple imaging signals based on the scattered imaging beams obtained multiple times in succession, and The plurality of imaging signals are integrated to determine the defect information.
在一实施例中,所述成像检测模块包括积分相机;所述积分相机为时间延时积分相机(Time Delay Integration,TDI)、互补金属氧化物半导体(Complementary Metal Oxide Semiconductor,CMOS)相机或者电荷耦合元件(charge coupled device,CCD)相机。In one embodiment, the imaging detection module includes an integration camera; the integration camera is a Time Delay Integration (TDI), a Complementary Metal Oxide Semiconductor (CMOS) camera, or a charge coupled device Element (charge coupled device, CCD) camera.
在一实施例中,所述成像检测模块还包括聚光单元,所述聚光单元设置为会聚所述散射成像光束,使会聚后的所述散射成像光束入射到所述积分相机。In an embodiment, the imaging detection module further includes a light condensing unit, and the light condensing unit is configured to converge the scattered imaging light beam so that the converged scattered imaging light beam enters the integrating camera.
在一实施例中,所述探测光束满足高斯分布。In one embodiment, the detection beam satisfies a Gaussian distribution.
第二方面,本申请实施例还提供了一种光刻设备,包括上述第一方面所述 的缺陷检测装置。In a second aspect, an embodiment of the present application further provides a lithographic apparatus including the defect detection device described in the first aspect.
第三方面,本申请实施例还提供了一种缺陷检测方法,包括:In a third aspect, an embodiment of the present application further provides a defect detection method, including:
通过照明模块产生探测光束,并使所述探测光束入射至待测产品的检测面上;所述探测光束的照度和探测光束的半宽分别满足:
Figure PCTCN2019093779-appb-000005
Figure PCTCN2019093779-appb-000006
A detection beam is generated by the lighting module, and the detection beam is made incident on the detection surface of the product to be tested; the illuminance of the detection beam and the half-width of the detection beam satisfy:
Figure PCTCN2019093779-appb-000005
Figure PCTCN2019093779-appb-000006
通过成像检测模块检测所述探测光束是否经所述待测产品的检测面散射产生散射成像光束,并在检测到所述散射成像光束的情况下,根据所述成像光线确定缺陷信息;Detecting whether the detection beam is scattered by the detection surface of the product to be tested by the imaging detection module to generate a scattered imaging beam, and determining the defect information according to the imaging light when the scattered imaging beam is detected;
其中,S1为抑制所述待测产品的非检测面的串扰需要满足的信噪比,U1为所述探测光束的中心照度,R为最小可检测缺陷在可被接收角度内对光线的散射效率,U2为所述探测光束的半宽边缘的照度,L为所述非检测面上的最大串扰物在可被接收角度内对光线的散射效率,d为所述待测产品的厚度;FOV为所述成像检测模块的有效视场;α为探测光束在所述待测产品中的折射角,β为所述散射成像光束在所述待测产品中的折射角。Among them, S1 is the signal-to-noise ratio required to suppress crosstalk on the non-detection surface of the product under test, U1 is the central illuminance of the detection beam, and R is the scattering efficiency of light by the smallest detectable defect within the receivable angle. , U2 is the illuminance at the half-width edge of the detection beam, L is the scattering efficiency of the maximum crosstalk on the non-detecting surface within the receivable angle, and d is the thickness of the product under test; FOV is The effective field of view of the imaging detection module; α is the refraction angle of the detection beam in the product to be measured, and β is the refraction angle of the scattered imaging beam in the product to be measured.
在一实施例中,根据所述散射成像光束确定缺陷信息包括:In an embodiment, determining the defect information according to the scattered imaging beam includes:
根据连续多次获取的散射成像光束确定多个成像信号;Determining a plurality of imaging signals according to the scattered imaging beams obtained multiple times in succession;
对所述多个成像信号进行积分以确定所述缺陷信息。Integrating the plurality of imaging signals to determine the defect information.
本申请实施例通过最小可检测缺陷在可被接收角度内对光线的散射效率、非检测面上的最大串扰物在可被接收角度内对光线的散射效率,以及抑制待测产品的非检测面的串扰所需要的信噪比,得到探测光束的半宽边缘与探测光束的中心之间的相对照度;通过探测光束在待测产品中的折射角、散射成像光束在待测产品中的折射角、待测产品的厚度以及成像检测模块的有效视场,得到能够满足抑制待测产品的非检测面的串扰所需要的探测光束的半宽;根据相对照度和探测光束的半宽可以确定照明模块的具体参数,通过设置满足上述参数的照明模块,使得本申请实施例的缺陷检测装置在缺陷检测过程中可以抑制缺陷检测过程中产生的串扰,提高缺陷检测精度。The embodiment of the present application uses the minimum detectable defect to scatter the light in the receivable angle, the maximum crosstalk on the non-detection surface to scatter the light in the receivable angle, and suppresses the non-detection surface of the product to be tested. The required signal-to-noise ratio of the crosstalk is to obtain the contrast between the half-width edge of the detection beam and the center of the detection beam; the refraction angle of the detection beam in the product to be tested and the refraction angle of the scattered imaging beam in the product to be tested , The thickness of the product to be tested and the effective field of view of the imaging detection module to obtain the half-width of the detection beam that can satisfy the crosstalk of the non-detection surface of the product to be tested; the lighting module can be determined according to the contrast and the half-width of the detection beam By setting a lighting module that satisfies the above parameters, the defect detection device in the embodiment of the present application can suppress crosstalk generated during the defect detection process and improve the accuracy of defect detection.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是相关技术中的一种缺陷检测装置的结构示意图;1 is a schematic structural diagram of a defect detection device in the related art;
图2是本申请实施例提供的缺陷检测装置的结构示意图;2 is a schematic structural diagram of a defect detection device according to an embodiment of the present application;
图3是本申请实施例提供的探测光束的半宽的结构示意图;3 is a schematic structural diagram of a half width of a detection beam provided by an embodiment of the present application;
图4是本申请实施例提供的下层串扰原理图;4 is a schematic diagram of a lower-layer crosstalk provided by an embodiment of the present application;
图5是本申请实施例提供的镜像串扰原理图;5 is a schematic diagram of image crosstalk provided by an embodiment of the present application;
图6是本申请实施例提供的探测光束的结构示意图;6 is a schematic structural diagram of a detection beam provided by an embodiment of the present application;
图7是本申请实施例提供的散射成像光束和成像检测模块的结构示意图;7 is a schematic structural diagram of a scattered imaging beam and an imaging detection module according to an embodiment of the present application;
图8是本申请实施例提供的另一缺陷检测装置的结构示意图;8 is a schematic structural diagram of another defect detection device according to an embodiment of the present application;
图9是本申请实施例提供的探测光束与缺陷之间的位置关系示意图;FIG. 9 is a schematic diagram of a positional relationship between a detection beam and a defect according to an embodiment of the present application; FIG.
图10是本申请实施例提供的缺陷检测方法的流程图。FIG. 10 is a flowchart of a defect detection method according to an embodiment of the present application.
具体实施方式detailed description
下面结合附图和实施例对本申请进行说明。可以理解的是,此处所描述的具体实施例仅仅用于解释本申请,而非对本申请的限定。另外还需要说明的是,为了便于描述,附图中仅示出了与本申请相关的部分而非全部结构。The following describes the application with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limiting the present application. It should also be noted that, for convenience of description, the drawings only show a part of the structure related to the present application, but not the entire structure.
图2是本申请实施例提供的缺陷检测装置的结构示意图,请参考图2,该装置包括照明模块20和成像检测模块30;照明模块20设置为产生探测光束201,并使探测光束201入射至待测产品40的检测面上;成像检测模块30设置为检测探测光束201是否经待测产品40的检测面散射产生散射成像光束301,并在检测到散射成像光束301的情况下,根据散射成像光束301确定待测产品40的缺陷信息。FIG. 2 is a schematic structural diagram of a defect detection device according to an embodiment of the present application. Please refer to FIG. 2, the device includes an illumination module 20 and an imaging detection module 30; the illumination module 20 is configured to generate a detection beam 201 and make the detection beam 201 incident on The detection surface of the product to be tested 40; the imaging detection module 30 is configured to detect whether the detection beam 201 is scattered by the detection surface of the product 40 to generate a scattered imaging beam 301, and if the scattered imaging beam 301 is detected, the imaging is performed according to the scattering imaging The light beam 301 determines defect information of the product to be tested 40.
其中,探测光束201的照度满足:
Figure PCTCN2019093779-appb-000007
其中,S1为抑制待测产品40的非检测面的串扰需要满足的信噪比,U1为探测光束201的中心照度,R为最小可检测缺陷在可被接收角度内对光线的散射效率,U2为探测光束201的半宽边缘的照度,L为非检测面上的最大串扰物在可被接收角度内对光线的散射效率。探测光束201的半宽W满足
Figure PCTCN2019093779-appb-000008
其中,d为待测产品40的厚度;FOV为成像检测模块30的有效视场;α为探测光束201在待测产品40中的折射角,β为散射成像光束301在待测产品40中的折射角。
The illuminance of the detection beam 201 satisfies:
Figure PCTCN2019093779-appb-000007
Among them, S1 is the signal-to-noise ratio required to suppress crosstalk on the non-detection surface of the product 40 to be tested, U1 is the central illuminance of the detection beam 201, and R is the light scattering efficiency of the smallest detectable defect within the receivable angle, U2 In order to detect the illuminance at the half-width edge of the beam 201, L is the scattering efficiency of the largest crosstalk on the non-detection surface to the light within the receivable angle. The half-width W of the detection beam 201 satisfies
Figure PCTCN2019093779-appb-000008
Among them, d is the thickness of the product to be tested 40; FOV is the effective field of view of the imaging detection module 30; α is the refraction angle of the detection beam 201 in the product to be tested 40; β is the scattering imaging beam 301 in the product to be tested 40 Refraction angle.
在一实施例中,照明模块20产生的光线会在待测产品40上形成探测光束201。如果探测光束201在待测产品40的检测面上未遇见缺陷401,根据光的反射定律,探测光束201在待测产品40的检测面形成反射光束202,反射光束202通常不能进入成像检测模块30。如果探测光束201在待测产品40的检测面上遇见缺陷401,缺陷401会使光线发生散射效应,部分被散射后的光线能够进入成像检测模块30,例如散射成像光束301。成像检测模块30根据散射成像光束301可以确定出待测产品40上的缺陷信息,例如缺陷的尺寸等。其中,待测产品40的检测面是指待测产品40靠近照明模块20的面,缺陷401通常位于待测产品 40的检测面上;待测产品40的非检测面是指与待测产品40的检测面相对设置的面。In one embodiment, the light generated by the lighting module 20 forms a detection beam 201 on the product 40 to be tested. If the detection beam 201 does not meet the defect 401 on the detection surface of the product to be tested 40, according to the law of light reflection, the detection beam 201 forms a reflection beam 202 on the detection surface of the product 40 to be tested. The reflection beam 202 usually cannot enter the imaging detection module 30. . If the detection beam 201 encounters a defect 401 on the detection surface of the product to be tested 40, the defect 401 will cause a scattering effect of the light, and a part of the scattered light can enter the imaging detection module 30, such as a scattered imaging beam 301. The imaging detection module 30 can determine the defect information on the product 40 to be tested, such as the size of the defect, based on the scattered imaging beam 301. The testing surface of the product 40 to be tested refers to the surface of the product 40 to be tested close to the lighting module 20, and the defect 401 is usually located on the testing surface of the product 40 to be tested. The non-testing surface of the product 40 to be tested refers to the product 40 to be tested. The detection surface is opposite to the set surface.
图3是本申请实施例提供的探测光束的半宽的结构示意图。在一实施例中,请参考图2和图3,对于高斯光束,光束的中心在待测产品40的检测面上的照度较大,而光束的半宽边缘在待测产品40的检测面上形成的照度较小。其中,光束的半宽边缘一般可以根据需要进行设定,例如,可以把照度为光束中心区域的照度的1/100的位置设定为光束的半宽边缘,或者把照度为光束中心区域的照度的1/10000的位置设定为光束的半宽边缘,本实施例不作具体限制。FIG. 3 is a schematic structural diagram of a half width of a detection beam provided by an embodiment of the present application. In an embodiment, please refer to FIG. 2 and FIG. 3. For a Gaussian beam, the center of the beam is larger on the detection surface of the product 40 to be tested, and the half-width edge of the beam is on the detection surface of the product 40 to be tested. The resulting illumination is small. The half-width edge of the light beam can generally be set as required. For example, the position of the illuminance at 1 / 100th of the illuminance at the center of the beam can be set to the half-width edge of the beam, or the illuminance at the center of the beam. The position of 1/10000 is set to the half-width edge of the beam, which is not specifically limited in this embodiment.
图4是本申请实施例提供的下层串扰原理图。在一实施例中,请参考图2和图4,下层串扰是指由于待测产品40的非检测面上的串扰物402导致的串扰。待测产品40的非检测面可能包括串扰物402,当待测产品40为掩模版时,串扰物402可以是周期性结构的光栅等。探测光束201包括探测光束201中心的光线2011和探测光束201半宽边缘的光线2012,在检测缺陷的情况下,优先采用探测光束201中心的光线2011作为检测光线,对缺陷401进行检测。探测光束201的中心光线2011经过缺陷401的散射后,形成的散射成像光束301被成像检测模块30接收。此时,如果探测光束201的半宽边缘光线2012经过待测产品40折射后,刚好落在成像检测模块30的有效视场FOV的有效范围内,经串扰物402散射后,可以形成串扰信号并被成像检测模块30检测到。FIG. 4 is a schematic diagram of a lower-layer crosstalk provided by an embodiment of the present application. In an embodiment, please refer to FIG. 2 and FIG. 4. The lower layer crosstalk refers to the crosstalk caused by the crosstalk 402 on the non-detection surface of the product 40 to be tested. The non-detection surface of the product under test 40 may include a crosstalk 402. When the product under test 40 is a mask, the crosstalk 402 may be a grating with a periodic structure. The detection beam 201 includes a ray 2011 at the center of the detection beam 201 and a ray 2012 at the half-width edge of the detection beam 201. In the case of detecting a defect, the ray 2011 at the center of the detection beam 201 is preferentially used as the detection ray to detect the defect 401. After the central ray 2011 of the detection beam 201 is scattered by the defect 401, the scattered imaging beam 301 formed is received by the imaging detection module 30. At this time, if the half-width edge light 2012 of the detection beam 201 is refracted by the product to be measured 40 and falls within the effective range of the effective field of view FOV of the imaging detection module 30, after being scattered by the crosstalk 402, a crosstalk signal can be formed and Detected by the imaging detection module 30.
为了抑制待测产品40的非检测面的串扰信号,避免串扰信号影响缺陷的检测结果,探测光束201的照度需要控制在一定的范围内。探测光束201的照度可以满足
Figure PCTCN2019093779-appb-000009
在一实施例中,R可以根据最小可检测缺陷的尺寸、照明模块20以及成像检测模块30的位置等参数确定;L可以根据照明模块20和成像检测模块30的位置以及最大串扰物的尺寸等参数确定。据此,根据上述公式可以确定探测光束201的半宽边缘的照度U2和探测光束201的中心照度U1的比值
Figure PCTCN2019093779-appb-000010
即确定中心照度和半宽边缘的照度的相对照度。
In order to suppress the crosstalk signal on the non-detection surface of the product to be tested 40 and to prevent the crosstalk signal from affecting the defect detection result, the illuminance of the detection beam 201 needs to be controlled within a certain range. The illuminance of the detection beam 201 can satisfy
Figure PCTCN2019093779-appb-000009
In an embodiment, R may be determined according to the size of the smallest detectable defect, the position of the lighting module 20 and the imaging detection module 30; L may be determined according to the positions of the lighting module 20 and the imaging detection module 30, and the size of the maximum crosstalk, etc. Parameters are determined. According to this, the ratio of the illuminance U2 of the half-width edge of the detection beam 201 and the central illuminance U1 of the detection beam 201 can be determined according to the above formula.
Figure PCTCN2019093779-appb-000010
That is, determine the contrast between the central illuminance and the half-width edge illuminance.
另外,探测光束201的半宽W满足:
Figure PCTCN2019093779-appb-000011
对于确定的缺陷检测装置和待测产品40,成像检测模块30的有效视场FOV的数值是确定的,探测光束201在待测产品40中的折射角α和散射成像光束301在待测产品40中的折射角β可以根据照明模块20和成像检测模块30的位置确定,据此,可以根据上述公式确定探测光束201的半宽W。可以理解的是,当确定探测光束201的半宽W以及探测光束的半宽边缘的照度U2和探测光束201的中心照度U1的比值后,就可以唯一地确定探测光束201,通过调节照明模块20的工作参数,就可以得到能够抑制下层串扰的探测光束201。
In addition, the half-width W of the detection beam 201 satisfies:
Figure PCTCN2019093779-appb-000011
For the determined defect detection device and the product to be tested 40, the effective field of view FOV of the imaging detection module 30 is determined. The refraction angle α of the detection beam 201 in the product to be tested 40 and the scattered imaging beam 301 in the product to be tested 40 The refraction angle β in can be determined according to the positions of the illumination module 20 and the imaging detection module 30, and accordingly, the half-width W of the detection beam 201 can be determined according to the above formula. It can be understood that after determining the half-width W of the detection beam 201 and the ratio of the illuminance U2 of the half-width edge of the detection beam 201 to the central illuminance U1 of the detection beam 201, the detection beam 201 can be uniquely determined. By adjusting the lighting module 20 Can obtain a detection beam 201 capable of suppressing crosstalk of the lower layer.
本实施例通过最小可检测缺陷在可被接收角度内对光线的散射效率、非检 测面上的最大串扰物在可被接收角度内对光线的散射效率,以及抑制待测产品的非检测面的串扰所需要的信噪比,得到探测光束的半宽边缘与探测光束的中心之间的相对照度;通过探测光束在待测产品中的折射角、散射成像光束在待测产品中的折射角、待测产品的厚度以及成像检测模块的有效视场,得到能够满足抑制待测产品的非检测面的串扰所需要的探测光束的半宽;根据相对照度和探测光束的半宽可以确定照明模块的具体参数,通过设置满足上述参数的照明模块,使得本申请实施例的缺陷检测装置在缺陷检测过程中可以抑制缺陷检测过程中产生的串扰,提高缺陷检测精度。This embodiment uses the minimum detectable defect to scatter the light in the receivable angle, the maximum crosstalk on the non-detection surface to scatter the light in the receivable angle, and suppresses the non-detection surface of the product to be tested. The signal-to-noise ratio required for crosstalk to obtain the contrast between the half-width edge of the detection beam and the center of the detection beam; the refraction angle of the detection beam in the product under test, the refraction angle of the scattered imaging beam in the product under test, The thickness of the product to be tested and the effective field of view of the imaging detection module can be used to obtain the half-width of the detection beam required to suppress crosstalk on the non-detection surface of the product under test; For specific parameters, by setting a lighting module that meets the above parameters, the defect detection device in the embodiment of the present application can suppress crosstalk generated during the defect detection process and improve the accuracy of defect detection.
在一实施例中,为了提高检测灵敏度,本实施例的成像检测模块30通过接收缺陷散射光来确定缺陷信息,即采用暗场成像,探测光束201在待测产品40中的折射角α通常不等于散射成像光束301在待测产品40中的折射角β,即α≠β。示例性地,当待测产品40的厚度d为6.35毫米(mm)时,折射角α的取值满足30°<α<45°,且折射角β满足30°<β<45°。在一实施例中,为获得较好的检测结果,|α-β|>3.5°。示例性地,设FOV=1.5mm,α=42°,β=35°,d=6.35mm,则
Figure PCTCN2019093779-appb-000012
为了得到清晰的检测结果,S1=3,L=3333.3×R,则
Figure PCTCN2019093779-appb-000013
如果探测光束201满足理想高斯函数,在已知相对照度为最大值1/10000和探测光束201的半宽W=9.41mm的情况下,探测光束201可以唯一地确定。此时,探测光束201的半高的半宽(照明视场50%相对照度的半宽)为W1=2.97mm,探测光束201的半高的全宽W FWHM=2×W1=5.94mm。
In an embodiment, in order to improve the detection sensitivity, the imaging detection module 30 of this embodiment determines the defect information by receiving the scattered light of the defect, that is, using dark field imaging. The refraction angle α of the detection beam 201 in the product 40 to be measured is usually not It is equal to the refraction angle β of the scattered imaging light beam 301 in the product 40 to be measured, that is, α ≠ β. Exemplarily, when the thickness d of the product 40 to be measured is 6.35 millimeters (mm), the value of the refraction angle α satisfies 30 ° <α <45 °, and the refraction angle β satisfies 30 ° <β <45 °. In one embodiment, in order to obtain better detection results, | α-β |> 3.5 °. Exemplarily, if FOV = 1.5mm, α = 42 °, β = 35 °, and d = 6.35mm, then
Figure PCTCN2019093779-appb-000012
In order to obtain clear detection results, S1 = 3, L = 3333.3 × R, then
Figure PCTCN2019093779-appb-000013
If the detection beam 201 satisfies an ideal Gaussian function, the detection beam 201 can be uniquely determined if the relative contrast is known as a maximum value of 1/10000 and the half-width W of the detection beam 201 is 9.41 mm. At this time, the half-width and half-width of the detection beam 201 (the half-width of the illumination field of view of 50% contrast) is W1 = 2.97 mm, and the full-width at half height of the detection beam 201 is W FWHM = 2 × W1 = 5.94 mm.
在一实施例中,探测光束201的照度还满足:
Figure PCTCN2019093779-appb-000014
其中,S2为抑制镜像串扰需要满足的信噪比,M为探测光束201在镜像串扰区域内沿镜像串扰方向的散射效率,N为探测光束201沿镜像串扰方向的散射光线在待测产品40内的反射率;探测光束201的半宽W还满足:
Figure PCTCN2019093779-appb-000015
其中,θ为探测光束201沿镜像串扰方向的散射光线在待测产品40中的折射角。
In an embodiment, the illuminance of the detection beam 201 also satisfies:
Figure PCTCN2019093779-appb-000014
Among them, S2 is the signal-to-noise ratio required for suppressing the image crosstalk, M is the scattering efficiency of the detection beam 201 in the image crosstalk direction in the image crosstalk area, and N is the scattered light of the detection beam 201 in the image crosstalk direction in the product under test 40. Reflectivity; the half-width W of the detection beam 201 also satisfies:
Figure PCTCN2019093779-appb-000015
Where, θ is the refraction angle of the scattered light of the detection beam 201 along the direction of the image crosstalk in the product 40 to be measured.
图5是本申请实施例提供的镜像串扰原理图。在一实施例中,请参考图2和图5,探测光束201的中心光线2011在遇到第一缺陷4011后,形成散射成像光束301,成像检测模块30可以根据散射成像光束301确定待测产品40的缺陷信息。探测光束201的边缘光线2012经过待测产品40的检测面上的第二缺陷4012散射后,散射光线进入待测产品40中,并在待测产品40的非检测面反射后形成反射。可以理解的是,缺陷检测装置当前的正在检测的缺陷是第一缺陷4011,如果第二缺陷4012的反射产生的光线进入成像检测模块30的有效视场FOV,就会形成镜像串扰信号,并对第一缺陷4011的检测结果形成串扰,这种串扰称为镜像串扰。如果镜像串扰信号的强度较大,就会影响第一缺陷4011的检测的清晰度和准确度。FIG. 5 is a schematic diagram of image crosstalk provided by an embodiment of the present application. In an embodiment, please refer to FIG. 2 and FIG. 5. After the center ray 2011 of the detection beam 201 encounters the first defect 4011, it forms a scattered imaging beam 301. The imaging detection module 30 can determine the product to be tested according to the scattered imaging beam 301. 40 defect information. After the edge light 2012 of the detection beam 201 is scattered by the second defect 4012 on the detection surface of the product 40 to be tested, the scattered light enters the product 40 to be tested and forms a reflection after being reflected on the non-detection surface of the product 40 to be tested. It can be understood that the defect currently being detected by the defect detection device is the first defect 4011. If the light generated by the reflection of the second defect 4012 enters the effective field of view FOV of the imaging detection module 30, a mirror crosstalk signal will be formed. The detection result of the first defect 4011 forms crosstalk, which is called mirror crosstalk. If the intensity of the image crosstalk signal is large, the clarity and accuracy of the detection of the first defect 4011 will be affected.
为了抑制镜像串扰,需要使探测光束201的照度满足:
Figure PCTCN2019093779-appb-000016
以及使探测光束201的半宽W满足:
Figure PCTCN2019093779-appb-000017
一般来说,待测产品40的检测面上的镜像串扰区域内的缺陷颗粒的尺寸越大,M的值越大。对于确定的待测产品40,在照明模块20和成像检测模块30的位置和角度,以及最大缺陷的尺寸确定后,即可确定M值。探测光束在待测产品40内的反射率N与待测产品40的折射率有关。示例性地,探测光束从空气进入待测产品40,经折射和反射后,从待测产品40再次出射至空气中,由于空气的折射率n1通常为1,如果待测产品的折射率n2为1.5,那么反射率N=(n2-n1) 2/(n2+n1) 2=(1.5-1) 2/(1.5+1) 2=0.04。
In order to suppress image crosstalk, the illuminance of the detection beam 201 needs to satisfy:
Figure PCTCN2019093779-appb-000016
And make the half-width W of the detection beam 201 satisfy:
Figure PCTCN2019093779-appb-000017
Generally, the larger the size of the defective particles in the mirror crosstalk region on the detection surface of the product 40 to be tested, the larger the value of M is. For the determined product 40 to be tested, the M value can be determined after the positions and angles of the lighting module 20 and the imaging detection module 30 and the size of the largest defect are determined. The reflectance N of the detection beam in the product under test 40 is related to the refractive index of the product under test 40. Exemplarily, the detection beam enters the product under test 40 from the air, and is refracted and reflected, and then exits from the product under test 40 into the air again. Since the refractive index n1 of the air is usually 1, 1.5, then the reflectance N = (n2-n1) 2 / (n2 + n1) 2 = (1.5-1) 2 /(1.5+1) 2 = 0.04.
根据探测光束201在镜像串扰方向的散射光线在待测产品中的折射角θ,待测产品40的厚度d,以及成像检测模块30的有效视场FOV,即可确定出探测光束201的半宽W。可以理解的是,当确定探测光束201的半宽W以及探测光束201的半宽边缘的照度U2和探测光束201的中心照度U1的比值后,就可以唯一地确定探测光束201,通过调节照明模块20的工作参数,就可以得到能够抑制镜像串扰的探测光束201。The half-width of the detection beam 201 can be determined according to the refraction angle θ of the scattered light of the detection beam 201 in the image crosstalk direction in the product to be tested, the thickness d of the product 40 to be tested, and the effective field of view FOV of the imaging detection module 30. W. It can be understood that after determining the half-width W of the detection beam 201 and the ratio of the illuminance U2 of the half-width edge of the detection beam 201 to the central illuminance U1 of the detection beam 201, the detection beam 201 can be uniquely determined. By adjusting the lighting module, 20 working parameters, a detection beam 201 capable of suppressing image crosstalk can be obtained.
示例性地,已知250微米(μm)的标准缺陷颗粒的散射光照度为10μm的标准缺陷颗粒的625倍,设探测光束201满足理想高斯分布,为保证100um的标准缺陷颗粒不产生镜像串扰,设探测光束201在待测产品40的折射率n=1.5,则探测光束201在镜像串扰方向的散射光线在待测产品40中的反射率N=0.04,探测光束201在镜像串扰方向的散射光线在待测产品40中的折射率折射角θ=35°,抑制镜像串扰需要满足的信噪比S2=4,由此可知,
Figure PCTCN2019093779-appb-000018
设待测产品的厚度d=6.35mm,FOV=1.5mm,则探测光束201的半宽
Figure PCTCN2019093779-appb-000019
根据探测光束201的半宽边缘的照度U2和探测光束201的中心照度U1的比值U2/U1确定的相对照度,以及探测光束201的半宽W的值,即可唯一地确定探测光束201。
Exemplarily, it is known that the scattered light intensity of standard defect particles of 250 micrometers (μm) is 625 times of that of standard defect particles of 10 μm. Let the detection beam 201 satisfy the ideal Gaussian distribution. In order to ensure that 100 μm standard defect particles do not cause mirror crosstalk, The refractive index n of the detection beam 201 in the product under test 40 is 1.5, then the reflectance N of the scattered light of the detection beam 201 in the image crosstalk direction in the product under test 40 is 0.04, and the scattered light of the detection beam 201 in the image crosstalk direction is The refractive index refraction angle θ = 35 ° in the product to be tested 40, and the signal-to-noise ratio S2 = 4 that needs to be satisfied to suppress image crosstalk.
Figure PCTCN2019093779-appb-000018
Set the thickness of the product to be tested d = 6.35mm, FOV = 1.5mm, then the half-width of the detection beam 201
Figure PCTCN2019093779-appb-000019
The detection beam 201 can be uniquely determined according to the relative contrast determined by the ratio U2 / U1 of the illuminance U2 of the half-width edge of the detection beam 201 and the central illuminance U1 of the detection beam 201, and the value of the half-width W of the detection beam 201.
图6是本申请实施例提供的探测光束的结构示意图。在一实施例中,请参考图6,探测光束201的主光线的角度偏差小于5°;散射成像光束的主光线的角度偏差小于5°。在一实施例中,照明模块出射的探测光束201在待测产品40的检测面上形成照明视场103,为保证缺陷检测的准确度,探测光束201的出射方向需尽可能地相同。探测光束201的主光线是指照明视场的中心附近的光线;通常,当探测光束201的主光线角度偏差小于5°时,可以得到较为准确的缺陷检测结果;当探测光束201的主光线角度偏差小于1°时,可以得到更为精确的测量结果。示例性地,以波长为640纳米(nm)的光为探测光束201,对20um的标准缺陷颗粒进行检测时,当探测光束201的散射效率随探测光束201的角度的偏差为10°时,散射效率的差值高达61.3%,由于缺陷产生散射光可能为任 意方向,因此,该差异无法校正,导致缺陷检测结果不准确。FIG. 6 is a schematic structural diagram of a detection beam provided by an embodiment of the present application. In an embodiment, please refer to FIG. 6, the angular deviation of the main ray of the detection beam 201 is less than 5 °; the angular deviation of the main ray of the scattered imaging beam is less than 5 °. In an embodiment, the detection beam 201 emitted from the lighting module forms an illumination field of view 103 on the detection surface of the product 40 to be tested. To ensure the accuracy of defect detection, the emission directions of the detection beam 201 need to be the same as much as possible. The main ray of the detection beam 201 refers to the ray near the center of the field of view. Generally, when the angle deviation of the main ray of the detection beam 201 is less than 5 °, a more accurate defect detection result can be obtained. When the deviation is less than 1 °, more accurate measurement results can be obtained. Exemplarily, when a light beam with a wavelength of 640 nanometers (nm) is used as the detection beam 201 to detect a standard defect particle of 20um, when the deviation of the scattering efficiency of the detection beam 201 with the angle of the detection beam 201 is 10 °, the scattering The difference in efficiency is as high as 61.3%. Since the scattered light generated by defects may be in any direction, this difference cannot be corrected, resulting in inaccurate defect detection results.
图7是本申请实施例提供的散射成像光束和成像检测模块的结构示意图。在一实施例中,请参考图2和7,由于探测光束201被缺陷401散射后,形成的散射成像光束301的方向是任意的。能够进入成像检测模块30中的散射成像光束301包括不同方向的第一成像光线3010、第二成像光线3011和第三成像光线3012;其中,第一成像光线3010最接近垂直于成像检测模块30接收成像光线301的面,因此,第一成像光线3010为散射成像光束301的主光线。对于散射成像光束301的主光线,其角度偏差也应该小于5°,在一实施例中,散射成像光束301的主光线的角度偏差可以小于1°。FIG. 7 is a schematic structural diagram of a scattered imaging beam and an imaging detection module according to an embodiment of the present application. In an embodiment, please refer to FIGS. 2 and 7, since the probe imaging beam 201 is scattered by the defect 401, the direction of the scattered imaging beam 301 formed is arbitrary. The scattered imaging light beam 301 that can enter the imaging detection module 30 includes first imaging light 3010, second imaging light 3011, and third imaging light 3012 in different directions. Among them, the first imaging light 3010 is closest to being perpendicular to the imaging detection module 30. The surface of the imaging light 301. Therefore, the first imaging light 3010 is a main light that scatters the imaging light beam 301. The angular deviation of the main ray of the scattered imaging beam 301 should also be less than 5 °. In an embodiment, the angular deviation of the main ray of the scattered imaging beam 301 may be less than 1 °.
图8是本申请实施例提供的另一缺陷检测装置的结构示意图。在一实施例中,请参考图8,该缺陷检测装置还包括水平运动模块50;水平运动模块50设置为承载待测产品40沿平行于待测产品40的检测面的方向运动。在一实施例中,在缺陷检测过程中,水平运动模块50带动待测产品40沿平行于待测产品40的检测面的方向移动,实现对整个待测产品40的扫描检测。FIG. 8 is a schematic structural diagram of another defect detection device according to an embodiment of the present application. In an embodiment, please refer to FIG. 8, the defect detection device further includes a horizontal movement module 50; the horizontal movement module 50 is configured to carry the product to be tested 40 moving in a direction parallel to the detection surface of the product 40 to be tested. In an embodiment, during the defect detection process, the horizontal movement module 50 drives the product under test 40 to move in a direction parallel to the detection surface of the product under test 40 to realize the scanning detection of the entire product under test 40.
在一实施例中,本实施例提供的缺陷检测装置还包括:焦面测量模块70和垂直运动模块60;焦面测量模块70设置为检测待测产品40的检测面的离焦量;垂直运动模块60设置为根据离焦量控制待测产品40沿垂直于检测面的方向运动。在一实施例中,通过测量待测产品40的检测面与焦面测量模块70之间的距离,即得到待测产品40的检测面与成像检测模块30之间的离焦量。垂直运动模块60可以设置为调节待测产品40的高度,从而调节待测产品40与照明模块20和成像检测模块30的相对位置,保证缺陷检测结果的准确性。In an embodiment, the defect detection device provided in this embodiment further includes: a focal plane measurement module 70 and a vertical movement module 60; the focal plane measurement module 70 is configured to detect a defocus amount of a detection surface of the product 40 to be measured; and a vertical movement The module 60 is configured to control the product to be tested 40 to move in a direction perpendicular to the detection surface according to the defocus amount. In one embodiment, by measuring the distance between the detection surface of the product to be tested 40 and the focal plane measurement module 70, the defocus amount between the detection surface of the product 40 to be tested and the imaging detection module 30 is obtained. The vertical movement module 60 may be set to adjust the height of the product 40 to be tested, thereby adjusting the relative positions of the product 40 to be tested and the lighting module 20 and the imaging detection module 30 to ensure the accuracy of the defect detection result.
在一实施例中,成像检测模块30设置为通过如下方式根据散射成像光束确定待测产品40的缺陷信息:根据连续多次获取的成像光线301确定多个成像信号,并对多个成像信号进行积分以确定缺陷信息。为了保证对较小的缺陷颗粒的检测的准确性,需要成像检测模块30具有较高的空间分辨率。在一实施例中,通常要求缺陷检测装置的空间分辨率小于0.1mm。仍以探测光束201的半高半宽W1为2.97mm为例,当空间分辨率小于W1的0.2倍,即,空间分辨率小于0.2×2.97=0.594mm时,但是由于探测光束201难以达到理想的直线状态,探测光束201存在调焦误差,检测过程中出现的照明视场的焦面波动,待测产品的检测面并非完全水平,以及水平运动模块50的运动轴在运动过程中存在俯仰、翻滚或偏转等,导致缺陷在照明视场中的位置存在较大差异,从而使缺陷接收和散射的光线能量存在较大差异,使得缺陷检测的结果受上述偶然因素的影响较大。In one embodiment, the imaging detection module 30 is configured to determine the defect information of the product 40 to be tested according to the scattered imaging light beam in the following manner: determining a plurality of imaging signals according to the imaging light rays 301 obtained multiple times in succession, and performing Credits to determine defect information. In order to ensure the accuracy of detection of smaller defective particles, the imaging detection module 30 needs to have a higher spatial resolution. In one embodiment, the spatial resolution of the defect detection device is generally required to be less than 0.1 mm. Still taking the half-height, half-width W1 of the detection beam 201 as 2.97mm as an example, when the spatial resolution is less than 0.2 times of W1, that is, when the spatial resolution is less than 0.2 × 2.97 = 0.594mm, but the detection beam 201 is difficult to achieve the ideal Linear state, focus error of the detection beam 201, fluctuations in the focal plane of the illumination field of view during the detection process, the detection surface of the product to be tested is not completely horizontal, and the movement axis of the horizontal movement module 50 has pitch and roll during the movement Or deflection, etc., causing a large difference in the position of the defect in the illumination field of view, so that there is a large difference in the light energy received and scattered by the defect, so that the result of the defect detection is greatly affected by the aforementioned accidental factors.
图9是本申请实施例提供的探测光束与缺陷之间的位置关系示意图。在一 实施例中,请参考图9,从t1至t4时刻,由于缺陷与探测光束的相对位置发生变化,t1时刻缺陷位于第一位置P1,t2时刻缺陷位于第二位置P2,t3时刻缺陷位于第三位置P3,t4时刻缺陷位于第四位置P4,成像检测模块在不同时刻采集到的缺陷信息,其对应的信号强度差异很大,影响缺陷检测精度和检测的重复性,导致缺陷的检测结果不可靠。但是本实施例通过对从t1至t4时刻采集到的所有信号进行积分处理后,得到的总的缺陷检测信号相对稳定,检测精度和检测的重复性可以大幅度提高。需要说明的是,本实施例仅示例性的对连续四次采集的信号进行积分,并非对本申请的限定。FIG. 9 is a schematic diagram of a positional relationship between a detection beam and a defect according to an embodiment of the present application. In an embodiment, please refer to FIG. 9. From t1 to t4, due to the change in the relative position of the defect and the detection beam, the defect at t1 is located at the first position P1, the defect at t2 is located at the second position P2, and the defect is located at t3. The third position P3 and the defect at time t4 are located at the fourth position P4. The defect information collected by the imaging inspection module at different times has a large difference in signal strength, which affects the accuracy and repeatability of the defect detection, and results in defect detection. Unreliable. However, in this embodiment, after integral processing is performed on all signals collected from time t1 to time t4, the total defect detection signal obtained is relatively stable, and detection accuracy and repeatability of detection can be greatly improved. It should be noted that this embodiment only exemplarily integrates signals acquired four times in a row, and is not a limitation on the present application.
在一实施例中,请继续参考图8,成像检测模块30包括积分相机302;积分相机302可以为TDI相机、CMOS相机或者CCD相机。在一实施例中,TDI相机是一种时间延迟积分相机,可以对移动的物体进行连续拍照,记录采集物体移动过程中的位置变化。CMOS相机的核心结构是CMOS元件,分辨率高,能够用于记录移动中物体的位置信息。CCD相机的分辨率高,尤其在拍摄的位置或移动时,通过对CCD相机拍摄的画面进行处理后,可以得到详细的物体移动位置信息。可以理解的是,积分相机302还可以是其他类型的相机,本实施例对此不作具体限制。In an embodiment, please continue to refer to FIG. 8. The imaging detection module 30 includes an integration camera 302. The integration camera 302 may be a TDI camera, a CMOS camera, or a CCD camera. In one embodiment, the TDI camera is a time-delay integral camera, which can continuously take pictures of moving objects and record the position changes during the movement of the collected objects. The core structure of a CMOS camera is a CMOS element with high resolution, which can be used to record the position information of a moving object. The CCD camera has a high resolution, and in particular when shooting a position or moving, after processing a picture taken by the CCD camera, detailed object moving position information can be obtained. It can be understood that the integration camera 302 may also be another type of camera, which is not specifically limited in this embodiment.
在一实施例中,成像检测模块30还包括聚光单元303,聚光单元303设置为会聚成像光线301,使汇聚后的成像光线301入射到积分相机302。由于探测光束201被缺陷401散射后,形成的散射成像光束301可以沿任意方向传播,能够进入到成像检测模块30的光线为发散光。为了方便缺陷信息的检测,需要对发散的散射成像光束301进行汇聚。在一实施例中,聚光单元303可以为一组透镜,透镜的个数可以根据实际需要设置,本实施例不作具体限制。In one embodiment, the imaging detection module 30 further includes a light focusing unit 303. The light focusing unit 303 is configured to converge the imaging light 301 so that the converged imaging light 301 enters the integrating camera 302. After the detection beam 201 is scattered by the defect 401, the formed scattered imaging beam 301 can propagate in any direction, and the light that can enter the imaging detection module 30 is divergent light. In order to facilitate the detection of defect information, it is necessary to focus the divergent scattered imaging beam 301. In an embodiment, the light condensing unit 303 may be a group of lenses, and the number of lenses may be set according to actual needs, which is not specifically limited in this embodiment.
在一实施例中,探测光束201满足高斯分布。在一实施例中,照明模块20出射的探测光束201可以为高斯光束。高斯光束的振幅按照高斯函数的规律变化,光束中心的照度较大,从光束中心往光束边缘,高斯光束的振幅衰减较快,通过一定的光学调节手段,容易得到视场宽度较小的光束,从而可以更好的抑制缺陷检测过程中产生的串扰,提高缺陷检测的精度。In one embodiment, the detection beam 201 satisfies a Gaussian distribution. In an embodiment, the detection light beam 201 emitted by the lighting module 20 may be a Gaussian light beam. The amplitude of the Gaussian beam changes according to the law of the Gaussian function. The illuminance at the center of the beam is large. From the center of the beam to the edge of the beam, the amplitude of the Gaussian beam decays quickly. Through certain optical adjustment methods, it is easy to obtain a beam with a narrow field of view. Therefore, crosstalk generated during defect detection can be better suppressed, and the accuracy of defect detection can be improved.
本实施例还提供了一种光刻设备,该光刻设备可以本申请任意实施例所述的缺陷检测装置。This embodiment also provides a lithographic apparatus, which can be the defect detection device described in any embodiment of the present application.
本实施例提供的光刻设备,通过最小可检测缺陷在可被接收角度内对光线的散射效率、非检测面上的最大串扰物在可被接收角度内对光线的散射效率,以及抑制待测产品的非检测面的串扰所需要的信噪比,得到探测光束的半宽边缘与探测光束的中心之间的相对照度;通过探测光束在待测产品中的折射角、 散射成像光束在待测产品中的折射角、待测产品的厚度以及成像检测模块的有效视场,得到能够满足抑制待测产品的非检测面的串扰所需要的探测光束的半宽;根据相对照度和探测光束的半宽可以确定照明模块的具体参数,通过设置满足上述参数的照明模块,使得本申请实施例的缺陷检测装置在缺陷检测过程中可以抑制缺陷检测过程中产生的串扰,提高缺陷检测精度。The lithographic equipment provided by this embodiment uses the minimum detectable defect to scatter light in the receivable angle, the maximum crosstalk on the non-detection surface to scatter the light in the receivable angle, and suppresses the test. The signal-to-noise ratio required for crosstalk on the non-detection surface of the product, to obtain the contrast between the half-width edge of the detection beam and the center of the detection beam; the refraction angle of the detection beam in the product to be tested, and the scattered imaging beam in the test to be measured The refraction angle in the product, the thickness of the product to be tested, and the effective field of view of the imaging detection module, obtain the half-width of the detection beam that can meet the crosstalk of the non-detection surface of the product to be tested; The specific parameters of the lighting module can be determined by setting the lighting module that satisfies the above parameters, so that the defect detection device in the embodiment of the present application can suppress crosstalk generated during the defect detection process and improve the accuracy of defect detection.
在缺陷检测装置的基础上,本实施例还提供了一种缺陷检测方法。本实施例提供的缺陷检测方法可以由上述任意实施例所提供的缺陷检测装置来执行,缺陷方检测法具备与缺陷检测装置相应的有益效果。未在本实施例中详尽描述的技术细节,可参见本申请任意实施例所提供的缺陷检测装置。Based on the defect detection device, this embodiment also provides a defect detection method. The defect detection method provided in this embodiment may be executed by the defect detection device provided in any of the foregoing embodiments, and the defect side detection method has a beneficial effect corresponding to the defect detection device. For technical details not described in detail in this embodiment, reference may be made to a defect detection device provided in any embodiment of the present application.
图10是本申请实施例提供的缺陷检测方法的流程图。参见图10,本实施例提供的一种缺陷检测方法,包括:FIG. 10 is a flowchart of a defect detection method according to an embodiment of the present application. Referring to FIG. 10, a defect detection method provided in this embodiment includes:
步骤10、通过照明模块产生探测光束,并使探测光束入射至待测产品的检测面上;探测光束的照度和探测光束的半宽分别满足:
Figure PCTCN2019093779-appb-000020
Figure PCTCN2019093779-appb-000021
Step 10. Generate a detection beam through the lighting module, and make the detection beam incident on the detection surface of the product to be tested; the illuminance of the detection beam and the half-width of the detection beam satisfy:
Figure PCTCN2019093779-appb-000020
Figure PCTCN2019093779-appb-000021
步骤20、通过成像检测模块检测探测光束是否经待测产品的检测面散射产生散射成像光束,并在检测到散射成像光束的情况下,根据散射成像光束确定缺陷信息。Step 20: It is detected by the imaging detection module whether the detection beam is scattered by the detection surface of the product to be tested to generate a scattered imaging beam, and if the scattered imaging beam is detected, the defect information is determined according to the scattered imaging beam.
其中,S1为抑制待测产品的非检测面的串扰需要满足的信噪比,U1为探测光束的中心照度,R为最小可检测缺陷在可被接收角度内对光线的散射效率,U2为探测光束的半宽边缘的照度,L为非检测面上的最大串扰物在可被接收角度内对光线的散射效率,d为待测产品的厚度;FOV为成像检测模块的有效视场;α为探测光束在待测产品中的折射角,β为散射成像光束在待测产品中的折射角。Among them, S1 is the signal-to-noise ratio required to suppress crosstalk on the non-detection surface of the product under test, U1 is the central illuminance of the detection beam, R is the scattering efficiency of the smallest detectable defect within the receivable angle, and U2 is the detection The illuminance at the half-width edge of the beam, L is the scattering efficiency of the maximum crosstalk on the non-detection surface within the receivable angle, d is the thickness of the product to be measured; FOV is the effective field of view of the imaging detection module; α is The refraction angle of the detection beam in the product under test, β is the refraction angle of the scattered imaging beam in the product under test.
本实施例通过最小可检测缺陷在可被接收角度内对光线的散射效率、非检测面上的最大串扰物在可被接收角度内对光线的散射效率,以及抑制待测产品的非检测面的串扰所需要的信噪比,得到探测光束的半宽边缘与探测光束的中心之间的相对照度;通过探测光束在待测产品中的折射角、散射成像光束在待测产品中的折射角、待测产品的厚度以及成像检测模块的有效视场,得到能够满足抑制待测产品的非检测面的串扰所需要的探测光束的半宽;根据相对照度和探测光束的半宽可以确定照明模块的具体参数,通过设置满足上述参数的照明模块,使得本申请实施例的缺陷检测装置在缺陷检测过程中可以抑制缺陷检测过程中产生的串扰,提高缺陷检测精度This embodiment uses the minimum detectable defect to scatter the light in the receivable angle, the maximum crosstalk on the non-detection surface to scatter the light in the receivable angle, and suppresses the non-detection surface of the product to be tested. The signal-to-noise ratio required for crosstalk to obtain the contrast between the half-width edge of the detection beam and the center of the detection beam; the refraction angle of the detection beam in the product under test, the refraction angle of the scattered imaging beam in the product under test, The thickness of the product to be tested and the effective field of view of the imaging detection module can be used to obtain the half-width of the detection beam required to suppress crosstalk on the non-detection surface of the product under test; Specific parameters. By setting a lighting module that meets the above parameters, the defect detection device in the embodiment of the present application can suppress crosstalk generated during the defect detection process and improve the accuracy of defect detection.
在一实施例中,根据成像光线确定缺陷信息包括:根据连续多次获取的散射成像光束确定多个成像信号,对多个成像信号进行积分以确定缺陷信息。In an embodiment, determining the defect information according to the imaging light includes: determining a plurality of imaging signals according to the scattered imaging beams obtained multiple times in succession, and integrating the plurality of imaging signals to determine the defect information.
在一实施例中,为了提高缺陷检测的质量,可以连续多次获取散射成像光束,从而获得多个成像信号,对多个成像信号进行积分,进而提高缺陷检测的精度及检测的可重复性。In one embodiment, in order to improve the quality of defect detection, the scattered imaging beam can be acquired multiple times in succession to obtain multiple imaging signals and integrate the multiple imaging signals, thereby improving the accuracy of the defect detection and the repeatability of the detection.

Claims (12)

  1. 一种缺陷检测装置,包括照明模块和成像检测模块;A defect detection device including an illumination module and an imaging detection module;
    所述照明模块设置为产生探测光束;所述成像检测模块设置为检测所述探测光束是否经待测产品的检测面散射产生散射成像光束,并在检测到所述散射成像光束的情况下,根据所述散射成像光束确定所述待测产品的缺陷信息;The illumination module is configured to generate a detection beam; the imaging detection module is configured to detect whether the detection beam is scattered by a detection surface of a product to be tested to generate a scattered imaging beam, and when the scattered imaging beam is detected, according to Determining the defect information of the product to be tested by the scattered imaging beam;
    其中,所述探测光束的照度满足:
    Figure PCTCN2019093779-appb-100001
    其中,S1为抑制所述待测产品的非检测面的串扰需要满足的信噪比,U1为所述探测光束的中心照度,R为最小可检测缺陷在可被接收角度内对光线的散射效率,U2为所述探测光束的半宽边缘的照度,L为所述非检测面上的最大串扰物在可被接收角度内对光线的散射效率;
    The illuminance of the detection beam satisfies:
    Figure PCTCN2019093779-appb-100001
    Among them, S1 is the signal-to-noise ratio required to suppress crosstalk on the non-detection surface of the product under test, U1 is the central illuminance of the detection beam, and R is the scattering efficiency of light by the smallest detectable defect within the receivable angle. , U2 is the illuminance at the half-width edge of the detection beam, and L is the scattering efficiency of the maximum crosstalk on the non-detection surface to the light within a receivable angle;
    所述探测光束的半宽W满足:
    Figure PCTCN2019093779-appb-100002
    The half-width W of the detection beam satisfies:
    Figure PCTCN2019093779-appb-100002
    其中,d为所述待测产品的厚度;FOV为所述成像检测模块的有效视场;α为所述探测光束在所述待测产品中的折射角,β为所述散射成像光束在所述待测产品中的折射角。Where d is the thickness of the product to be measured; FOV is the effective field of view of the imaging detection module; α is the refraction angle of the detection beam in the product to be measured; β is the scattering imaging beam Describe the refraction angle in the product under test.
  2. 根据权利要求1所述的缺陷检测装置,其中,The defect detection device according to claim 1, wherein:
    所述探测光束的照度还满足:
    Figure PCTCN2019093779-appb-100003
    其中,S2为抑制镜像串扰需要满足的信噪比,M为所述探测光束在镜像串扰区域内沿镜像串扰方向的散射效率,N为所述探测光束在所述镜像串扰方向的散射光线在所述待测产品内的反射率;
    The illuminance of the detection beam also satisfies:
    Figure PCTCN2019093779-appb-100003
    Among them, S2 is the signal-to-noise ratio required for suppressing the image crosstalk, M is the scattering efficiency of the detection beam in the image crosstalk direction in the image crosstalk area, and N is the scattered light of the detection beam in the image crosstalk direction. Describe the reflectivity in the product to be tested;
    所述探测光束的半宽W还满足:
    Figure PCTCN2019093779-appb-100004
    其中,θ为所述探测光束沿所述镜像串扰方向的散射光线在所述待测产品中的折射角。
    The half-width W of the detection beam also satisfies:
    Figure PCTCN2019093779-appb-100004
    Wherein, θ is a refraction angle of the scattered light of the detection beam along the image crosstalk direction in the product to be measured.
  3. 根据权利要求1所述的缺陷检测装置,其中,所述探测光束的主光线的角度偏差小于5°;The defect detection device according to claim 1, wherein an angular deviation of a main ray of the detection beam is less than 5 °;
    所述散射成像光束的主光线的角度偏差小于5°。The angular deviation of the main ray of the scattered imaging beam is less than 5 °.
  4. 根据权利要求1所述的缺陷检测装置,还包括:水平运动模块;The defect detection device according to claim 1, further comprising: a horizontal movement module;
    所述水平运动模块设置为承载所述待测产品沿平行于所述待测产品的检测面的方向运动。The horizontal movement module is configured to carry the product to be tested to move in a direction parallel to the detection surface of the product to be tested.
  5. 根据权利要求1所述的缺陷检测装置,还包括:The defect detection device according to claim 1, further comprising:
    焦面测量模块和与所述焦面测量模块连接的垂直运动模块;A focal plane measurement module and a vertical movement module connected to the focal plane measurement module;
    所述焦面测量模块设置为检测所述待测产品的检测面的离焦量;The focal plane measurement module is configured to detect a defocus amount of a detection plane of the product to be measured;
    所述垂直运动模块设置为根据所述离焦量控制所述待测产品沿垂直于所述检测面的方向运动。The vertical movement module is configured to control the product to be measured to move in a direction perpendicular to the detection surface according to the defocus amount.
  6. 根据权利要求1所述的缺陷检测装置,其中,The defect detection device according to claim 1, wherein:
    所述成像检测模块设置为通过如下方式根据所述散射成像光束确定所述待测产品的缺陷信息:根据连续多次获取的散射成像光束确定多个成像信号,并对所述多个成像信号进行积分以确定所述缺陷信息。The imaging detection module is configured to determine the defect information of the product to be tested according to the scattered imaging beam by determining multiple imaging signals based on the scattered imaging beams acquired multiple times in succession, and performing Integrate to determine the defect information.
  7. 根据权利要求6所述的缺陷检测装置,其中,The defect detection device according to claim 6, wherein:
    所述成像检测模块包括积分相机;The imaging detection module includes an integration camera;
    所述积分相机为时间延时积分TDI相机、互补金属氧化物半导体CMOS相机或者电荷耦合元件CCD相机。The integration camera is a time-delay integration TDI camera, a complementary metal oxide semiconductor CMOS camera, or a charge-coupled element CCD camera.
  8. 根据权利要求7所述的缺陷检测装置,其中,The defect detection device according to claim 7, wherein:
    所述成像检测模块还包括聚光单元,所述聚光单元设置为会聚所述散射成像光束,使会聚后的所述散射成像光束入射到所述积分相机。The imaging detection module further includes a light condensing unit, and the light condensing unit is configured to converge the scattered imaging light beam, so that the converged scattered imaging light beam enters the integrating camera.
  9. 根据权利要求1所述的缺陷检测装置,其中,The defect detection device according to claim 1, wherein:
    所述探测光束满足高斯分布。The detection beam satisfies a Gaussian distribution.
  10. 一种光刻设备,包括权利要求1-9任一项所述的缺陷检测装置。A lithographic apparatus comprising the defect detection device according to any one of claims 1-9.
  11. 一种缺陷检测方法,包括:A defect detection method includes:
    通过照明模块产生探测光束,并使所述探测光束入射至待测产品的检测面上;所述探测光束的照度和探测光束的半宽分别分别满足:
    Figure PCTCN2019093779-appb-100005
    Figure PCTCN2019093779-appb-100006
    A detection beam is generated by the lighting module, and the detection beam is made incident on the detection surface of the product to be measured; the illuminance of the detection beam and the half width of the detection beam respectively satisfy:
    Figure PCTCN2019093779-appb-100005
    Figure PCTCN2019093779-appb-100006
    通过成像检测模块检测所述探测光束是否经所述待测产品的检测面散射产生散射成像光束,并在检测到所述散射成像光束的情况下,根据所述散射成像光束确定缺陷信息;Detecting whether the detection beam is scattered by the detection surface of the product to be tested by the imaging detection module to generate a scattered imaging beam, and determining the defect information according to the scattered imaging beam if the scattered imaging beam is detected;
    其中,S1为抑制所述待测产品的非检测面的串扰需要满足的信噪比,U1为所述探测光束的中心照度,R为最小可检测缺陷在可被接收角度内对光线的散射效率,U2为所述探测光束的半宽边缘的照度,L为所述非检测面上的最大串扰物在可被接收角度内对光线的散射效率,d为所述待测产品的厚度;FOV为所述成像检测模块的有效视场;α为探测光束在所述待测产品中的折射角,β为所述散射成像光束在所述待测产品中的折射角。Among them, S1 is the signal-to-noise ratio required to suppress crosstalk on the non-detection surface of the product under test, U1 is the central illuminance of the detection beam, and R is the scattering efficiency of light by the smallest detectable defect within the receivable angle. , U2 is the illuminance at the half-width edge of the detection beam, L is the scattering efficiency of the maximum crosstalk on the non-detecting surface within the receivable angle, and d is the thickness of the product under test; FOV is The effective field of view of the imaging detection module; α is the refraction angle of the detection beam in the product to be measured, and β is the refraction angle of the scattered imaging beam in the product to be measured.
  12. 根据权利要求11所述的缺陷检测方法,其中,根据所述散射成像光束确定缺陷信息包括:The defect detection method according to claim 11, wherein determining defect information according to the scattered imaging beam comprises:
    根据连续多次获取的散射成像光束确定多个成像信号;Determining a plurality of imaging signals according to the scattered imaging beams obtained multiple times in succession;
    对所述多个成像信号进行积分以确定所述缺陷信息。Integrating the plurality of imaging signals to determine the defect information.
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Publication number Priority date Publication date Assignee Title
CN113406086A (en) * 2020-03-16 2021-09-17 上海微电子装备(集团)股份有限公司 Detection device and lithographic apparatus
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2215211A (en) * 1937-12-22 1940-09-17 Pittsburgh Plate Glass Co Polish meter
CN1908638A (en) * 2006-08-24 2007-02-07 上海交通大学 Optical detecting instrument of defects in glass
JP2007107960A (en) * 2005-10-12 2007-04-26 Hitachi High-Technologies Corp Flaw inspection device
CN102778460A (en) * 2012-07-31 2012-11-14 法国圣戈班玻璃公司 Method for detecting internal flaw of substrate
CN107202799A (en) * 2017-07-25 2017-09-26 昆山国显光电有限公司 The detection method and detection device of a kind of transparent material
CN206725414U (en) * 2017-03-23 2017-12-08 华洋精机股份有限公司 Optical checking equipment
CN107884318A (en) * 2016-09-30 2018-04-06 上海微电子装备(集团)股份有限公司 A kind of flat board granule detecting method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223541A (en) * 1999-01-27 2000-08-11 Hitachi Ltd Apparatus and method for defect inspection
US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
TWI394946B (en) * 2008-09-02 2013-05-01 Univ Nat Formosa Method and device for measuring object defect
US8223327B2 (en) * 2009-01-26 2012-07-17 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
CN101871896B (en) * 2009-04-24 2012-11-14 湖南科创信息技术股份有限公司 On-line detection method and device for surface embossing glass blemishes
JP5295160B2 (en) * 2010-03-30 2013-09-18 株式会社日立ハイテクノロジーズ Surface inspection apparatus and surface inspection method
JP5520737B2 (en) * 2010-07-30 2014-06-11 株式会社日立ハイテクノロジーズ Defect inspection apparatus and defect inspection method
CN103175837B (en) * 2011-12-20 2015-06-03 法国圣戈班玻璃公司 Method and device for detecting defect in matrix
JP2014240766A (en) * 2013-06-11 2014-12-25 株式会社リケン Surface inspection method and device
CN106647194B (en) * 2015-07-15 2018-05-04 上海微电子装备(集团)股份有限公司 A kind of focal plane probe unit and automatic focusing to Barebone
US20170281102A1 (en) * 2016-03-31 2017-10-05 Weng-Dah Ken Non-contact angle measuring apparatus, mission critical inspection apparatus, non-invasive diagnosis/treatment apparatus, method for filtering matter wave from a composite particle beam, non-invasive measuring apparatus, apparatus for generating a virtual space-time lattice, and fine atomic clock

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2215211A (en) * 1937-12-22 1940-09-17 Pittsburgh Plate Glass Co Polish meter
JP2007107960A (en) * 2005-10-12 2007-04-26 Hitachi High-Technologies Corp Flaw inspection device
CN1908638A (en) * 2006-08-24 2007-02-07 上海交通大学 Optical detecting instrument of defects in glass
CN102778460A (en) * 2012-07-31 2012-11-14 法国圣戈班玻璃公司 Method for detecting internal flaw of substrate
CN107884318A (en) * 2016-09-30 2018-04-06 上海微电子装备(集团)股份有限公司 A kind of flat board granule detecting method
CN206725414U (en) * 2017-03-23 2017-12-08 华洋精机股份有限公司 Optical checking equipment
CN107202799A (en) * 2017-07-25 2017-09-26 昆山国显光电有限公司 The detection method and detection device of a kind of transparent material

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