CN1948955A - Substrate inspection apparatus - Google Patents
Substrate inspection apparatus Download PDFInfo
- Publication number
- CN1948955A CN1948955A CNA200610132214XA CN200610132214A CN1948955A CN 1948955 A CN1948955 A CN 1948955A CN A200610132214X A CNA200610132214X A CN A200610132214XA CN 200610132214 A CN200610132214 A CN 200610132214A CN 1948955 A CN1948955 A CN 1948955A
- Authority
- CN
- China
- Prior art keywords
- substrate
- worktable
- base board
- checking device
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/958—Inspecting transparent materials or objects, e.g. windscreens
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9513—Liquid crystal panels
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides an inspection device (1) of the substrate is constituted so that a flotation stage (4) for floating the substrate (W) by air is laid on a base main body (3), and an automatic macro-inspection part (21) and an automatic micro-inspection part (22) are successively arranged to the area from one end part of the base main body (3) to the other end part thereof. The automatic macro-inspection part (21) has an illumination part (24) for irradiating the substrate (W) with linear illumination light and the reflected light of the illumination light is folded back by a reflecting part (25) to be thrown on an imaging part (26).
Description
Technical field
The present invention relates to the base board checking device that in the inspecting substrate of flat-panel monitor of LCD etc., uses.
Background technology
In the manufacturing process of the flat-panel monitor (FPD) of LCD (LCD) etc., in the operation of checking exterior substrate, use base board checking device.This base board checking device has along the device (for example with reference to patent documentation 1) of a worktable configuration defects detection portion and defect review portion.Defects detection portion constitutes by detecting camera and transillumination, and defect review portion is made of color camera and transillumination.
In addition, base board checking device also has and with the macro check of visualization substrate integral body on a macro scale with use microexamination to have or not the micro of less defective etc., thus the base board checking device that carries out visual examination.This appearance inspection device of having known has: macro check is with shaking support, it is configured in the macro check portion, carrying is set at the angle that is fit to visualization with the glass substrate that robot moved into, and XY worktable, it shakes support from this and accepts glass substrate and be transplanted on the micro zone, and the position of departing from macroscopical field of illumination of macro check portion is provided with the microscope (for example with reference to patent documentation 2) that micro is used.
[patent documentation 1] TOHKEMY 2000-9661 communique
[patent documentation 2] TOHKEMY 2001-305064 communique
But in patent documentation 1 disclosed base board checking device, if bigger as the glass substrate volume of checking object, then visual examination is difficult to carry out, and the burden that brings the supervisory personnel increases.And if the substrate volume is bigger, then when positions such as registration defective, the distance that operating portions such as manipulation bar move on the defective of being found indicator increases, so the supervision time prolongs.In addition, shake, need bigger space of design and solid head motion, maximize so cause device to become in order to make large-scale substrate.
Summary of the invention
The present invention In view of the foregoing proposes, and its purpose is, prevents to carry out continuously the maximization of the base board checking device of macro check and micro, improves checking efficiency.
In order to address the above problem, base board checking device of the present invention is characterised in that this base board checking device has: worktable, its carrying flat-panel monitor substrate; The carrying unit, it keeps one side of described substrate and carries along the carrying direction of described worktable; The line illumination light source, it is configured in the upstream side of described worktable, penetrates in the upwardly extending wire illumination light in side of intersecting with described carrying direction; Macro check portion, it has shooting by the throw light on image pickup part of light-struck viewing area of described wire; Micro portion, it has the object lens that move along the direction with described carrying direction quadrature along the carrying direction configuration of described worktable; The defect coordinate operational part, it calculates the coordinate of the defective that is detected by described micro portion; Control part, it is according to the coordinate data of each defective of described defect coordinate operational part, described substrate is moved on the sweep trace consistent location of the X coordinate of described defective and described object lens, under the state that described substrate is stopped, the described object lens of described micro portion are moved on the Y coordinate consistent location with described defective; And precision floats piece, and it is configured in the inspection area corresponding with the sweep trace of described object lens, and described substrate is floated accurately, makes under the state of described substrate floating, utilizes described micro portion that described substrate is carried out micro.
In this base board checking device, macro check portion obtains the grand design of substrate surface to the illumination light of substrate irradiation wire from its reflected light.At this moment, move one side when obtaining image, can obtain the image of substrate surface automatically when mobile unit simultaneously makes substrate.And micro portion moves by making substrate and object lens respectively, obtains the intensified image (micro image) of the assigned position of substrate.
According to the present invention, mobile route along substrate is provided with macro check portion and micro portion, one side moves substrate, one side is taken into reflected light from substrate surface to obtain grand design automatically by macro check portion, and obtain the enlarged image of substrate by micro portion, so can carry out visual examination rapidly, and irrelevant with substrate size.By detecting automatically zero defect etc. is arranged, compare when manually checking, can obtain result accurately rapidly from the image that obtains by macro check portion.And, by the registration defective locations and according to this position micro portion is moved, can obtain the intensified image at necessary position, the precision of inspection improves.
Description of drawings
Fig. 1 is the vertical view of the base board checking device of the 1st embodiment of the present invention.
Fig. 2 is the side view of base board checking device shown in Figure 1.
Fig. 3 is the synoptic diagram of automatic macro check portion of the base board checking device of the 3rd embodiment of the present invention.
Embodiment
Below, illustrate to be used to implement best mode of the present invention.
(the 1st embodiment)
As depicted in figs. 1 and 2, base board checking device 1 has the Base body 3 that is provided with across vibration absorber 2 on the ground.On Base body 3, be equipped with and float worktable 4 as the board carrying unit, this worktable blow out air so that FPD float with glass substrate (glass substrate W).Float worktable 4 and move into the zone and the substrate of the other end side is taken out of the zone, float piece (carrying) 5,6 with floating piece along what the carrying direction (length direction) of glass substrate W separated that predetermined distance is provided with a plurality of elongated rectangular at the substrate of an end side of the length direction (directions X) of Base body 3.In the micro zone of floating between the piece 5,6, with the Width (Y direction) of carrying direction (directions X) quadrature of glass substrate W on separate specified gap 8 and dispose precision and float piece (inspection) 7,9 with floating piece, these float the levitation height that piece 7,9 can be controlled glass substrate W accurately. Float piece 5,6 and accurate float the gas hole 10 (part only is shown) that is provided with a plurality of upper surface open on the piece 7,9 with equal intervals in Fig. 1 at these.These gas holes 10 are connected by floating fluid supply sources 11 such as piece 5,6 and the accurate cushion space that floats piece 7,9 and air compressor.
Precision is floated piece 7,9 and is floated piece 5,6 and compare, as long as for more thickly disposing gas hole 10, vent port also is set except that gas hole 10, and the levitation height that can also utilize air ejection power (malleation) and air attractive force (negative pressure) to control glass substrate W accurately gets final product.
In addition, a side edge part parallel with length direction on Base body 3 is equipped with guide rail 12 abreast with the board carrying path of floating worktable 4.Sliding part 14 is installed on this guide rail 12 with can move freely.Guide rail 12 and sliding part 14 are made of the linear electric machine that sliding part 14 is advanced automatically along guide rail 12.Liftably be provided with substrate absorptive table 13 on sliding part 14, it has a plurality of adsorption sections 15 of absorption glass substrate W.Adsorption section 15 is provided with a plurality of at the upper surface of substrate absorptive table 13 along the length direction of Base body 3 with equal intervals.Front end in each adsorption section 15 is provided with the resinousness absorption layer of the concave shape of absorption glass substrate W, is formed with the through hole of up/down perforation on this absorption layer, and this through hole connects suction pump 17.In addition, the glass substrate W of Base body 3 move into the zone be provided with a plurality of as the reference pins 18 of detent mechanism with by pad 19, with clamping glass substrate W.Reference pins 18 is set to haunt the upper surface that floats worktable 4 and can moves by easy on and off, is used for glass substrate W is positioned at the reference position.Can move freely along the glass substrate direction by pad 19, be used for glass substrate W by being pressed on the reference pins 18 fitly to be arranged in the reference position.In addition, the glass substrate W of Base body 3 move into the zone float worktable 4 below be provided with substrate elevating portion, it can utilize substrate W jack-up carrying carry out substrate with robot and change.Substrate elevating portion is provided with a plurality of, so that the lifter pin 20 that moves up and down does not disturb with the mechanical arm generation of robot with carrying.
Wherein,,, from the upstream side to the downstream, be provided with successively between the other end in an end of Base body 3 as the automatic macro check portion 21 of the 1st inspection portion with as the micro portion 22 of the 2nd inspection portion along the board carrying direction of floating worktable 4.Automatically macro check portion 21 has the door type frame 23 on Base body of being installed in 3, and this type frame 23 is crossed over abreast with the Y direction and floated worktable 4.In the vertical frame portion of door type frame 23 with a parallel sided of horizontal pane portion Lighting Division 24 is installed.On the horizontal pane portion of door type frame 23, on the position higher, reflecting part 25 and image pickup part 26 are installed than Lighting Division 24.
Reflecting part 25 is configured in and is used to take by the shooting light path of line lighting source 27 by the glass substrate W of wire illumination, has the catoptron 28 that the reflected light that reflected by glass substrate W is turned back towards image pickup part 26.Image pickup part 26 has camera lens 29 and compares the line sensor camera 30 that is configured in the other end side with camera lens 29.
The configuration of Lighting Division 24, reflecting part 25 and image pickup part 26 is set to the line illumination light imaging on image pickup part 26 that makes in the viewing area reflection of substrate W.Reflecting part 25 is installed on the carriage so that the reflected light that is reflected by glass substrate W is towards image pickup part 26, with float worktable 4 float the ground bending of face almost parallel, described carriage from the horizontal arm section of door type frame 23 upstream side extend.Image pickup part 26 is installed on the carriage, this carriage on the reflected light path that the portion of being reflected 25 turns back from the horizontal arm section of door type frame 23 downstream side extend.The line illumination light source 27 of Lighting Division 24 is set to and can rotates, so that in order to obtain the interference image and the diffraction image on substrate W surface by image pickup part 26, can be set at incident angle arbitrarily with respect to the glass substrate face.This automatic macro check portion 21 is connected macroscopic view with on the control part 31.
Macroscopic view is carried out the light emitting control of line illumination light source 27 and being taken into from the view data of image pickup part 26 with control part 31, and comprise image processing part, this image processing part carries out Flame Image Process generating grand design to view data, and the adjacent relative method of utilization and neighbor or adjacent patterns etc. is carried out defects detection.Macroscopic view also has with control part 31: the result according to defects detection judges the detection unit that zero defect and type thereof are arranged; Calculate the defect coordinate operational part of defective locations according to the centre of gravity place of defective; And the storer of the registration unit of conduct registration defective locations.
This microscope 43 is configured in and is formed at the top that precision is floated the gap 8 between the piece 7,9.Below this gap 8, be provided with along guide rail 44 and follow the transillumination portion 45 that microscope 43 moves.Microscope 43 has object lens 43b and CCD (solid-state imager) 43a.Micro portion 22 and automatic macro check portion 21 are with the approaching configuration of non-interfering degree.For example, the microscope 43 of micro portion 22 is located at than on the low position of image pickup part 26, so that do not disturb the image pickup part 26 of automatic macro check portion 21.The output of the CCD 43a of microscope 43 is connected with control part 46 with microcosmic.
Microcosmic is with connecting worktable 42, Lighting Division 45 and macroscopic view control part 31 on the control part 46.
The integral body control of base board checking device 1 is by apparatus control portion 50 unified carrying out.Apparatus control portion 0 connect float worktable 4, substrate absorptive table 13, by pad 19, substrate elevating portion, macroscopic view with control part 31 and microcosmic with control part 46.
On apparatus control portion 50, connect the monitor 51 of display image and accepting the operating portion 52 of observer's operation.
Substrate W uses the planar substrates of glass, uses semiconductor technology to be manufactured with patterns such as wiring and wave filter on this substrate W.The part that the defective of said substrate W can be enumerated pattern disconnects, pattern short circuit or be attached with the microdefect of foreign matter each other, and the film of wave filter and in manufacture process the interim patterns such as etchant resist self that apply produce the uneven gross imperfection of film.Therefore, these patterns become the inspection object in the present embodiment.
Below, the effect of present embodiment is described.
At first, from each gas hole 10 of floating worktable 4 blow out air upwards, the glass substrate W that carrying is carried with robot is transported to and floats on the worktable 4.Specifically, make each reference pins 18, utilize carrying glass substrate W to be moved on the lifter pin 20 then with robot to rise from the outstanding mode of upper surface of floating worktable 4.Carrying descends a little with robot, and glass substrate W is relayed on the lifter pin 20, keeps out of the way substrate then and moves into outside the zone.Then, make the lifting of substrate elevating portion, utilize air that glass substrate W is floated to floating on the worktable 4.Under the state that glass substrate W is floated, each is moved along directions X or Y direction towards glass substrate W side by pad 19, make glass substrate W contact each reference pins 18 and position.Under the state that has carried out this location, make at substrate and move into the position that the substrate absorptive table of waiting in the zone 13 rises to the absorption layer 16 contact substrate W back sides.Under this state, drive suction pump 17, utilize absorption layer 16 absorption of substrate absorptive table 13 to keep glass substrate W.
After absorption keeps substrate W under positioning states, each reference pins 18 is not dropped to produce the retreating position that disturbs with substrate absorptive table 13 and glass substrate W, (directions X) constant speed moves towards the other end along guide rail 12 to make sliding part 14 then.Go up the illuminated line illumination light from line illumination light source 27 to this glass substrate W, the lip-deep reflected light of glass substrate W is made a video recording by image pickup part 26.The timing of moving along directions X with substrate W synchronously macroscopic view with in the image processing part of control part 31 according to each bar line cumulative data, form the grand design on the whole surface of substrate W thus.
Inspection object that macroscopic view relatively forms by Flame Image Process with control part 31 and adjacent pattern extract defective part according to their difference, calculate the centre of gravity place of defect part, as the coordinate with respect to the reference position of predefined substrate W.Its result is being judged to be when having a plurality of defective, and all defect coordinate of being judged is registered successively.Macroscopic view is registered in it in storer with control part 31, and the data forwarding of defect coordinate to microcosmic usefulness control part 46.And the sign of the grand design of substrate W and expression defective is exported to monitor 51.The supervisory personnel carries out micro to each defective of judging by automatic macro check, but this moment, operating operation portion 52 specifies this defective locations.As designation method, for example can enumerate the sign that utilizes on the click picture to obtain the method for defect coordinate, perhaps according to registration order or distance from closely being registered as the method for the coordinate of defective to far away calling over.
After finishing to check by automatic macro check portion 21 and micro portion 22, what substrate W was moved to the end side of floating worktable 4 by sliding part 14 delivers position (glass substrate W move into zone).Substrate absorptive table 13 is delivered under the state of position in that substrate W is stopped at, and the absorption of removing substrate W keeps.At this moment, the absorption layer that is configured in each adsorption section 15 on the substrate absorptive table 13 is outstanding to the top slightly of the benchmark levitation height of substrate W, and the back side of contact glass substrate W, utilizes the displacing force of the pneumatic glass substrate W that floats of friction force restriction of this absorption layer.Under this state, glass substrate W is handed to each lifter pin 20 of lifting unit under the state that is positioned, and moves in the substrate box with robot by carrying.When carrying out the inspection of other substrates W, utilize robot to change substrate W, next substrate W is carried out identical inspection.
According to this embodiment, under the online illumination light of one side substrate W is moved along directions X, one side utilizes image pickup part 26 to take whole of substrate W, so can carry out the macro check to whole base plate automatically.Therefore, even large substrate W also can check rapidly and effectively.And, owing to do not need jack-up shakily with substrate W, so the space that does not need large-scale head motion is set and shake usefulness.In addition, by carrying out determining defects automatically, can prevent the inspection deviation that causes because of the supervisory personnel, and can register the coordinate at the position that is judged as defective, so easily defect information is applied to other inspections.
And, in same device, can so do not need as in the past, to change substrate but also recalibrate, can shorten the supervision time at the glass substrate W that carrying is located by same substrate absorptive table 13 between macro check portion 21 and the micro portion 22 automatically.And, can make each defective and micro portion 22 position consistency that extract by macro check portion 21 accurately.At this moment, according to the coordinate information that obtains by automatic macro check portion 21, carry out substrate W directions X move and microscope 43 the moving of Y direction, so can utilize simple structure to carry out the micro of large substrate.
In addition, the height of the image pickup part 26 by making automatic macro check portion 21 is different with the height of the microscope 43 of micro portion 22, can make the position of two inspection portions 21,22 approaching, so can make base board checking device 1 miniaturization.
(the 2nd embodiment)
As other modes of base board checking device 1, can enumerate apparatus structure shown below.
The 2nd inspection portion as the inspection data of using automatic macro check portion 21 except that micro portion 22, also can be provided with automatic width measurement.Automatically width measurement utilizes microscope 43 to obtain the micro image of the pattern of registration in advance, as the object of measuring live width, and this micro image is carried out Flame Image Process, to calculate the live width of pattern.
And, on microscope 43, also can replace CCD the spectral photometry device is installed, the spectral photometry device perhaps also is installed on the basis of CCD.The spectral photometry unit is the optical splitter with visible light light-splitting, mainly installs for the spectral sensitivity of measuring color filter.The object that carries out spectral photometry can be defined as the position of registration in advance, also can be all color filters.
By automatic width measurement and spectral photometry device are set, except that macro check and micro, also can carry out live width mensuration and spectral sensitivity and measure.In addition, be registered in microcosmic control part 46 in advance if constitute the threshold value and the spectral sensitivity of the live width that will be used to judge that whether qualified pattern is, and compare, then can promptly check automatically without the supervisory personnel with measurement result.
(the 3rd embodiment)
The base board checking device 1 of the 3rd embodiment of the present invention has the automatic macro check portion 21 shown in the synoptic diagram of Fig. 3.This automatic macro check portion 21 is supported on line illumination light source 27 on the type frame 23 (with reference to Fig. 2) by driving mechanism 60, and can change the angle of line illumination light source 27.Image pickup part 26 can be configured in interference filter 61 on the light path of lens 29 fronts with freely plugging.
In this base board checking device 1, according to the inspection condition of setting by automatic macro check portion 21 substrate W is moved back and forth, for example in going journey, obtain interference image, in backhaul, obtain diffraction image.When obtaining interference image, drive driving mechanism 60, making line illumination light source 27 is that rotate at the center with the inspection position of being thrown light on by line on the substrate W so that the incident angle θ 1 of the relative substrate W of illumination light become with from the identical angle of the incident angle θ 2 of the relative image pickup part 26 of reflected light of substrate W.In addition, insert interference filter 61 from the light path in lens 29 dead aheads.Thus, with illustrate previously identical, can follow the mobile accumulative total view data of substrate W, and obtain interference image.And, when obtaining diffraction image, be to make incident angle θ 1 be n diffraction of light angle with the incident angle θ 2 of relative image pickup part 26 with the angle initialization of line illumination light source 27, interference filter 61 is kept out of the way from light path.Its result can follow the mobile accumulative total diffraction image data of substrate W, and obtain diffraction image.
In this embodiment, roughly side by side obtain interference image and diffraction image in the time of can finishing with moving back and forth of substrate W.Change micro over to according to predetermined conditions then, or implement the replacing of substrate W.In addition, when carrying out Flame Image Process, the processing of interference image is carried out in the backhaul of obtaining diffraction image, and the processing of diffraction image was carried out before changing subsequent processing over to.According to this embodiment, can detect from interference image and have or not the thickness inequality, can detect the unusual etc. of fine pattern from diffraction image, under the situation of carrying out macro check automatically, also can realize the precision of approximate visual examination.
In addition, the invention is not restricted to above-mentioned each embodiment, can widespread use.
For example, base board checking device 1 also can constitute and unpowered roller known worktable such as (Free roller) is set replaces and float worktable 4.And substrate absorptive table 13 not only is located at a side edge part, also can be located at another side edge part, adsorbs two lateral margins that keep substrate W.
Claims (6)
1. a base board checking device is characterized in that, this base board checking device has:
Worktable, its carrying flat-panel monitor substrate;
The carrying unit, it keeps one side of described substrate and carries along the carrying direction of described worktable;
The line illumination light source, it is configured in the upstream side of described worktable, penetrates in the upwardly extending wire illumination light in side of intersecting with described carrying direction;
Macro check portion, it has shooting by the throw light on image pickup part of light-struck viewing area of described wire;
Micro portion, it has the object lens that move along the direction with described carrying direction quadrature along the carrying direction configuration of described worktable;
The defect coordinate operational part, it calculates the coordinate of the defective that is detected by described micro portion;
Control part, it is according to the coordinate data of each defective of described defect coordinate operational part, described substrate is moved on the sweep trace consistent location of the X coordinate of described defective and described object lens, under the state that described substrate is stopped, the described object lens of described micro portion are moved on the Y coordinate consistent location with described defective; And
Precision is floated piece, and it is configured in the inspection area corresponding with the sweep trace of described object lens, and described substrate is floated accurately,
Make under the state of described substrate floating, utilize described micro portion that described substrate is carried out micro.
2. base board checking device according to claim 1 is characterized in that, described worktable separates predetermined distance in the mode that clips described precision and float piece along the carrying direction and disposes a plurality of elongated carryings with floating piece.
3. base board checking device according to claim 2 is characterized in that, described precision is floated piece and had gas hole and vent port, utilizes malleation and negative pressure to control the levitation height of described substrate accurately.
4. base board checking device according to claim 2, it is characterized in that, move into area configurations at the substrate of described worktable substrate positioning mechanism is arranged, a plurality of reference pins on four limits of the described substrate that this substrate positioning mechanism is carried by clamping and constitute by pad, utilizing described carrying, utilize described described substrate being pushed to be positioned on the described reference pins by pad with floating under the state that piece makes described substrate floating.
5. base board checking device according to claim 1 is characterized in that, described line illumination light source can be set at the incident angle of described relatively substrate and can utilize the line sensor camera to obtain the arbitrarily angled of interference image or diffraction image.
6. base board checking device according to claim 1, it is characterized in that, described line illumination light source is configured to and can rotates, so that can set the incident angle of described relatively substrate arbitrarily, described carrying unit is provided as described substrate is moved back and forth in the macro check zone of described macro check portion, utilize described control part to change go the incident angle in journey or backhaul of described line illumination light source, utilize the line sensor camera at described interference image or the diffraction image that goes in journey or the backhaul at described substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005297291A JP2007107945A (en) | 2005-10-12 | 2005-10-12 | Inspection device of substrate |
| JP2005297291 | 2005-10-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1948955A true CN1948955A (en) | 2007-04-18 |
Family
ID=38018533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA200610132214XA Pending CN1948955A (en) | 2005-10-12 | 2006-10-12 | Substrate inspection apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2007107945A (en) |
| KR (1) | KR101305262B1 (en) |
| CN (1) | CN1948955A (en) |
| TW (1) | TWI333544B (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102420154A (en) * | 2010-09-28 | 2012-04-18 | 东京毅力科创株式会社 | Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method |
| CN101718828B (en) * | 2008-12-24 | 2012-08-08 | 四川虹欧显示器件有限公司 | Defect confirmation device for flat-panel display and operation method thereof |
| CN102778460A (en) * | 2012-07-31 | 2012-11-14 | 法国圣戈班玻璃公司 | Method for detecting internal flaw of substrate |
| CN103896006A (en) * | 2012-12-27 | 2014-07-02 | 嘉兴市博宏新型建材有限公司 | Feeding belt conveyor with baffle mechanism |
| CN106403854A (en) * | 2016-11-16 | 2017-02-15 | 中国计量大学 | Friction driving type brake disc flatness detection mechanism |
| CN109192673A (en) * | 2018-08-27 | 2019-01-11 | 苏州精濑光电有限公司 | A kind of wafer detection method |
| CN109560011A (en) * | 2017-09-26 | 2019-04-02 | 三星电子株式会社 | Base plate inspection system and the method for using base plate inspection system manufacturing semiconductor devices |
| CN109597231A (en) * | 2019-01-29 | 2019-04-09 | 深圳市华星光电技术有限公司 | Liquid crystal display panel shows exception analysis method |
| CN109997049A (en) * | 2016-11-29 | 2019-07-09 | 精工爱普生株式会社 | Electronic component conveying device and electronic component inspection device |
| CN110231340A (en) * | 2018-03-02 | 2019-09-13 | 由田新技股份有限公司 | Equipment, method, deep learning method and the media of strengthening workpiece optical signature |
| CN110741464A (en) * | 2017-06-07 | 2020-01-31 | 佳能机械株式会社 | Defect detecting device, defect detecting method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method |
| CN110783223A (en) * | 2018-07-24 | 2020-02-11 | 泰克元有限公司 | Imaging device for electronic component handling equipment |
| CN114222909A (en) * | 2019-08-20 | 2022-03-22 | 东丽工程株式会社 | Wafer appearance inspection device and method |
| CN118549460A (en) * | 2024-07-29 | 2024-08-27 | 柯尔微电子装备(厦门)有限公司 | Full-automatic wafer surface inspection machine and wafer inspection method |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100932751B1 (en) * | 2007-09-28 | 2009-12-17 | 주식회사 탑 엔지니어링 | Array test device |
| TWI402497B (en) * | 2008-04-22 | 2013-07-21 | Shuz Tung Machinery Ind Co Ltd | Image capturing apparatus with gantry |
| JP5223615B2 (en) * | 2008-11-20 | 2013-06-26 | 株式会社Ｉｈｉ | Method and apparatus for detecting floating conveyance state of thin plate |
| JP4896236B2 (en) * | 2010-01-21 | 2012-03-14 | 東京エレクトロン株式会社 | Substrate transport apparatus and substrate transport method |
| JP5722049B2 (en) * | 2011-01-06 | 2015-05-20 | オリンパス株式会社 | Board inspection system |
| JP6004517B2 (en) * | 2011-04-19 | 2016-10-12 | 芝浦メカトロニクス株式会社 | Substrate inspection apparatus, substrate inspection method, and adjustment method of the substrate inspection apparatus |
| JP5707541B2 (en) * | 2012-09-28 | 2015-04-30 | Ｊｘ日鉱日石エネルギー株式会社 | Apparatus for inspecting substrate having irregular uneven surface and inspection method using the same |
| JP6347962B2 (en) * | 2014-02-10 | 2018-06-27 | Ｗｉｔ株式会社 | Appearance inspection apparatus, appearance inspection method, and program |
| CN109444157A (en) * | 2018-12-25 | 2019-03-08 | 苏州凡目视觉科技有限公司 | A kind of scratch detection apparatus and method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000009661A (en) * | 1998-06-26 | 2000-01-14 | Ntn Corp | Flat panel inspection device |
| JP2001091474A (en) * | 1999-09-22 | 2001-04-06 | Olympus Optical Co Ltd | Defect inspection system |
| JP2004239728A (en) * | 2003-02-05 | 2004-08-26 | Hitachi High-Technologies Corp | Pattern inspection method and device |
| JP4789399B2 (en) * | 2003-05-01 | 2011-10-12 | オリンパス株式会社 | Levitation unit |
| JP2005077109A (en) * | 2003-08-29 | 2005-03-24 | Olympus Corp | Flaw inspection device |
-
2005
- 2005-10-12 JP JP2005297291A patent/JP2007107945A/en active Pending
-
2006
- 2006-09-26 TW TW095135536A patent/TWI333544B/en not_active IP Right Cessation
- 2006-10-10 KR KR1020060098486A patent/KR101305262B1/en not_active IP Right Cessation
- 2006-10-12 CN CNA200610132214XA patent/CN1948955A/en active Pending
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101718828B (en) * | 2008-12-24 | 2012-08-08 | 四川虹欧显示器件有限公司 | Defect confirmation device for flat-panel display and operation method thereof |
| CN102420154A (en) * | 2010-09-28 | 2012-04-18 | 东京毅力科创株式会社 | Substrate position detection apparatus, film deposition apparatus equipped with the same, and substrate position detection method |
| CN102420154B (en) * | 2010-09-28 | 2016-01-06 | 东京毅力科创株式会社 | Substrate position detection apparatus, film formation device and substrate position detection method |
| CN102778460A (en) * | 2012-07-31 | 2012-11-14 | 法国圣戈班玻璃公司 | Method for detecting internal flaw of substrate |
| CN103896006A (en) * | 2012-12-27 | 2014-07-02 | 嘉兴市博宏新型建材有限公司 | Feeding belt conveyor with baffle mechanism |
| CN106403854A (en) * | 2016-11-16 | 2017-02-15 | 中国计量大学 | Friction driving type brake disc flatness detection mechanism |
| CN109997049A (en) * | 2016-11-29 | 2019-07-09 | 精工爱普生株式会社 | Electronic component conveying device and electronic component inspection device |
| CN110741464B (en) * | 2017-06-07 | 2021-03-19 | 佳能机械株式会社 | Defect detecting device, defect detecting method, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method |
| CN110741464A (en) * | 2017-06-07 | 2020-01-31 | 佳能机械株式会社 | Defect detecting device, defect detecting method, wafer, semiconductor chip, die bonder, semiconductor manufacturing method, and semiconductor device manufacturing method |
| CN109560011A (en) * | 2017-09-26 | 2019-04-02 | 三星电子株式会社 | Base plate inspection system and the method for using base plate inspection system manufacturing semiconductor devices |
| CN110231340B (en) * | 2018-03-02 | 2022-09-13 | 由田新技股份有限公司 | Apparatus, method, deep learning method and medium for enhancing optical characteristics of workpiece |
| CN110231340A (en) * | 2018-03-02 | 2019-09-13 | 由田新技股份有限公司 | Equipment, method, deep learning method and the media of strengthening workpiece optical signature |
| CN110783223A (en) * | 2018-07-24 | 2020-02-11 | 泰克元有限公司 | Imaging device for electronic component handling equipment |
| CN110783223B (en) * | 2018-07-24 | 2024-04-16 | 泰克元有限公司 | Imaging device for electronic component processing equipment |
| CN109192673B (en) * | 2018-08-27 | 2021-09-17 | 苏州精濑光电有限公司 | Wafer detection method |
| CN109192673A (en) * | 2018-08-27 | 2019-01-11 | 苏州精濑光电有限公司 | A kind of wafer detection method |
| CN109597231A (en) * | 2019-01-29 | 2019-04-09 | 深圳市华星光电技术有限公司 | Liquid crystal display panel shows exception analysis method |
| CN114222909A (en) * | 2019-08-20 | 2022-03-22 | 东丽工程株式会社 | Wafer appearance inspection device and method |
| CN118549460A (en) * | 2024-07-29 | 2024-08-27 | 柯尔微电子装备(厦门)有限公司 | Full-automatic wafer surface inspection machine and wafer inspection method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200716970A (en) | 2007-05-01 |
| JP2007107945A (en) | 2007-04-26 |
| TWI333544B (en) | 2010-11-21 |
| KR101305262B1 (en) | 2013-09-09 |
| KR20070040722A (en) | 2007-04-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1948955A (en) | Substrate inspection apparatus | |
| JP4842422B2 (en) | Sheet material inspection method | |
| KR100737084B1 (en) | Optical visual examination method and optical visual examination apparatus | |
| CN101339143A (en) | Appearance inspecting device for substrate | |
| JP5344545B2 (en) | Substrate holding device | |
| CN1808055A (en) | Coordinate inspecting gear and checking fixture for object for inspecting | |
| CN1621818A (en) | Cutting surface testing apparatus for glass substrate | |
| CN101038260A (en) | Base board checking device | |
| CN103038603A (en) | Apparatus and method for three dimensional inspection of wafer saw marks | |
| JP2008070237A (en) | Substrate inspection device | |
| CN1288435C (en) | Substrate checking apparatus | |
| JP4563847B2 (en) | Board inspection equipment | |
| CN101140245A (en) | Substrate holding device for appearance checking | |
| JP2007107884A (en) | Substrate inspection device and substrate inspection method | |
| JP4392557B2 (en) | Inspection device | |
| JP2007278715A (en) | Substrate inspection device | |
| JP2009229301A (en) | Substrate inspection apparatus | |
| KR100988691B1 (en) | Optical measurement apparatus | |
| JP2017053775A (en) | Apparatus for imaging inside of light-transmissive object, and inspection apparatus | |
| JP2006258632A (en) | Substrate inspection device | |
| TWM615970U (en) | Partition edge inspection device for specially-shaped cut glass substrate | |
| JP5004530B2 (en) | Board inspection equipment | |
| TWI712317B (en) | Open/short tester for inspecting glass substrate and inspecting method thereof | |
| JP4626975B2 (en) | Substrate inspection apparatus and substrate inspection method | |
| JP2004333356A (en) | Inspection apparatus of painted surface for vehicle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20070418 |