CN102756457A - Die for pre-plastic package of sensor chip - Google Patents
Die for pre-plastic package of sensor chip Download PDFInfo
- Publication number
- CN102756457A CN102756457A CN2011101068489A CN201110106848A CN102756457A CN 102756457 A CN102756457 A CN 102756457A CN 2011101068489 A CN2011101068489 A CN 2011101068489A CN 201110106848 A CN201110106848 A CN 201110106848A CN 102756457 A CN102756457 A CN 102756457A
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- CN
- China
- Prior art keywords
- mould
- lead frame
- centre hole
- thimble
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Measuring Fluid Pressure (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention provides a die for pre-plastic package of a sensor chip. The die comprises an upper die body and a lower die body, wherein the upper die body is arranged at the first side of a lead frame for arranging the sensor chip when the lead frame is subjected to pre-plastic package; the lower die body is arranged at the second side opposite to the first side; the die also comprises a thimble; a thimble hole is arranged on the lower die body, and the thimble is inserted into the thimble hole to jack the surface of the second side of the lead frame. By using the die, the reliability of bonding a lead of an encapsulation structure formed by pre-plastic package of the lead frame is high.
Description
Technical field
The invention belongs to the encapsulation technology field of sensor chip, relate to a kind of mould that is used for preformed envelope sensor chip, relate in particular to a kind of mould that has thimble and respective top pin hole.
Background technology
In the IC encapsulation technology, need require to select packing forms and packaging technology according to the circuit function of different circuit chips.Wherein, generally include lead-in wire bonding process and plastic packaging process in the potting process.In traditional encapsulation process, generally be earlier lead-in wire bonding, chip and the part lead frame plastic packaging behind the para-linkage again, to realize the fixing of parcel mode.But for sensor chip (for example, the MEMS pressure sensor chip), its potting process is different with traditional encapsulation process, at first, plastic casing is made in advance with the mode of preformed envelope, and then the bonding that goes between.Like this, can avoid sensor chip influenced by the adverse circumstances in the plastic packaging process.
Encapsulating structure intention of sealing moulding formation later on for the lead frame that is used for the encapsulated sensor chip at preformed shown in Figure 1.Wherein, (a) being the bottom-up orientation sketch map of encapsulating structure 10, (b) is the bottom orientation sketch map down of encapsulating structure 10.Shown in Figure 2 is at the cross section structure sketch map at the B-B place of Fig. 1 (b) behind the encapsulating structure shown in Figure 1 lead-in wire bonding.Wherein " bottom " is for the orientation of the sensor chip of placing.In this embodiment, encapsulating structure 10 is PDIP (Plastic Double In-line Package, the in line encapsulation of a plastics biserial) packing forms, and it is used for encapsulated sensor chip 18.Combination is illustrated in figures 1 and 2, and wherein, 11 seal formed plastic-sealed body for preformed; Abbreviate preparatory plastic-sealed body as, 13 is the interior pin of lead frame, and 15 is the outer pin of lead frame; 17 is the island (Pad) of lead frame; 18 is packed sensor chip, 181 spun golds for the formation of lead-in wire bonding, and 19 is lid.Plastic-sealed body 11 is with protruding shell 111 in advance, the special construction requirement that this convexity shell 111 is sensor chips, and it is connected with the part contact of sensor chip.The size of protruding shell 111 relative plastic-sealed bodies 10 is bigger.The island 17 of lead frame is used to put sensor chip 18, in the lead-in wire bonding process, can will place sensor chip 18 and the interior pin 13 of lead frame on the island to realize types of attachment with spun gold 181 through wire bonder.Because needing the bonding zone of internal pin in the spun gold distribution process (bonding process also promptly goes between) heats to reach predetermined temperature.In this embodiment; In advance the below corresponding to the position of interior pin has bottoming hole 113 on the plastic-sealed body 11; It is used in lead-in wire bonding process para-linkage zone (being included in usually in pin field in) heats, and contacts with the well secured of interior pin with the realization spun gold.
Plastic-sealed body 11 normally forms through the mould injection molding in advance; For example; Upper and lower surfaces at lead frame is provided with mold and bed die respectively; Mold and bed die clamp lead frame, fill the die cavity of two moulds during plastic packaging with resin, thereby form preformed envelope body portion and the preformed envelope body portion under the lead frame on the lead frame.
But; When adopting existing mould structure to carry out the preformed envelope; The materials such as resin that are used to form preparatory plastic-sealed body are excessive to interior pin field from slit between mould (for example mold) and the leadframe surfaces; Possibly form the micro-structures such as plastics overlap that naked eyes are difficult to see, its para-linkage zone pollutes, and has a strong impact on the reliability of lead-in wire bonding.
In view of this, be necessary to design mould that a kind of novel being used to realize preformed envelope process to avoid the generation of above problem.
Summary of the invention
The technical problem that the present invention will solve is, prevents preformed envelope process cause the going between reliability decrease of bonding.
For solving above technical problem; The present invention provides a kind of mould that is used for preformed envelope sensor chip; It comprises upper die body and lower mold body; When lead frame being carried out the preformed envelope, said upper die body places first side that desire is placed said sensor chip on the said lead frame, and said lower mold body places second side opposite with said first side; Said mould also comprises thimble, and said lower mold body is provided with centre hole, and said thimble inserts the surface of said centre hole with second side of the said lead frame of roof pressure that makes progress.
According to an embodiment of mould provided by the invention, wherein, said lower mold body is provided with lower impressions, and said upper die body is provided with upper impression, through in said lower impressions and said upper impression, injecting resin to form the preparatory plastic-sealed body of said lead frame.
Said lower mold body is provided with the running channel that is communicated with said lower impressions.
Preferably, said centre hole is perpendicular to the upper surface of said lower mold body.
Preferably, said centre hole is set so that when preformed seals said centre hole aim at the interior pin of said lead frame.
According to the another embodiment of mould provided by the invention, wherein, be a plurality of corresponding to the said centre hole of each lead frame, correspondingly, said mould comprises the identical thimble of a plurality of and said centre hole quantity.
Preferably, the said upwards pressure limit of roof pressure is roughly 1 ton to 3 tons.
Preferably, said centre hole is cylindrical, and the shape of said thimble and said centre hole are complementary.
Technique effect of the present invention is; Through the centre hole that thimble is set in mould and is complementary with said thimble; Can be through the make progress surface (also being lower surface) of second side of roof pressure lead frame of thimble; Thereby when preformed seals, lead frame is closely contacted with the lower surface of upper die body, prevent the excessive generation overlap of resin or the bonding zone of lead frame produced to pollute, can improve the reliability of lead-in wire bonding greatly.
Description of drawings
From the following detailed description that combines accompanying drawing, will make above and other objects of the present invention and advantage clear more fully, wherein, same or analogous key element adopts identical label to represent.
Fig. 1 is used for the lead frame of encapsulated sensor chip in the encapsulating structure intention that the moulding of preformed envelope forms later on, wherein, (a) is the bottom-up orientation sketch map of encapsulating structure 10, (b) is the bottom orientation sketch map down of encapsulating structure 10.
Fig. 2 is at the cross section structure sketch map at the B-B place of Fig. 1 (b) behind the encapsulating structure shown in Figure 1 lead-in wire bonding.
Fig. 3 is the vertical view of the lower mold body of the mould that is used for preformed envelope sensor chip that provides according to one embodiment of the invention.
Fig. 4 is the A-A cross section structure sketch map of part shown in Figure 3.
Fig. 5 is the structural representation of the lower mold body of the mould that is used for preformed envelope sensor chip that provides according to one embodiment of the invention.
The specific embodiment
What introduce below is some among a plurality of possibility embodiment of the present invention, aims to provide basic understanding of the present invention, is not intended to confirm key of the present invention or conclusive key element or limits claimed scope.Understand easily, according to technical scheme of the present invention, do not changing under the connotation of the present invention, but one of ordinary skill in the art can propose other implementation of mutual alternative.Therefore, the following specific embodiment and accompanying drawing only are the exemplary illustrations to technical scheme of the present invention, and should not be regarded as qualification or the restriction to technical scheme of the present invention that all perhaps be regarded as of the present invention.
Among this paper; " on " and the directional terminology of D score be to define with the relative position between lead frame and the packed sensor chip; With respect to lead frame, the orientation that sensor chip is put be defined as " on " side, another opposite orientation then is defined as D score side.And, be to be understood that, the variation in the orientation of placing with respect to lead frame according to sensor chip, " on " and the orientation that referred to respectively of D score also change.
Among this paper, " preformed envelope " is meant the plastic packaging process before the lead-in wire bonding, and is defined as " plastic-sealed body in advance " by the plastic-sealed body on " preformed envelope " formed lead frame.
The vertical view of the lower mold body for the mould that is used for preformed envelope sensor chip that provides according to one embodiment of the invention shown in Figure 3, shown in Figure 4 is the A-A cross section structure sketch map of part shown in Figure 3.The mould of this embodiment is used to form structure illustrated in figures 1 and 2, also promptly lead frame preformed envelope is formed preparatory plastic-sealed body 11.Likewise, this mould also comprises upper die body and lower mold body, and lead frame places between upper die body and the lower mold body, and wherein, upper die body is positioned at a side of the placement sensor chip of lead frame, and lower mold body is positioned at the opposite side of lead frame.Through clamping each other between upper die body and the lower mold body, can the anchor leg frame, behind the material such as the injection of the die cavity in upper die body and lower mold body resin, can form preparatory plastic-sealed body then.Main improvements of the present invention mainly are the lower mold body part of mould, therefore, below describe the lower mold body 23 of the mould of present embodiment in detail.
Consult Fig. 3 and Fig. 4; A mould can carry out the preformed envelope to a plurality of lead frames (for example array of leadframes) simultaneously, and therefore, lower mold body 23 comprises a plurality of lower impressions 231; During the preformed envelope; The upper impression of lower impressions 231 and upper die body is used for materials such as potting resin jointly, and lead frame is folded between lower impressions and the upper impression, thereby forms preparatory plastic-sealed body.The concrete quantity of lower impressions 231 is not restrictive, has schematically provided wherein two pairing lower impressions of lead frame among the figure.Also be provided with running channel 232 in the lower mold body 23, each lower impressions 231 all is connected with running channel 232, injects resin through running channel 232 to lower impressions 232.The concrete setting that it will be appreciated by those skilled in the art that running channel 232 is not limited by the embodiment of the invention.
The structural representation of the thimble for the mould that is used for preformed envelope sensor chip that provides according to one embodiment of the invention shown in Figure 5.In conjunction with Fig. 5 and Fig. 3 and shown in Figure 4, this mould also comprises thimble 23, simultaneously, in lower mold body 23, is provided with centre hole 233, and centre hole 233 is basically perpendicular to the upper surface of lower mold body 23.Centre hole 233 is mainly used in and when preformed seals, inserts thimble 23; Therefore, centre hole 233 is complementary with the shape of thimble 23 basically, thereby; When preformed seals; Thimble 23 inserts centre holes 233, thereby, directly can the make progress lower surface of the lead frame of roof pressure between upper die body and lower mold body of the end face of thimble 23.Therefore, under the effect of thimble, the upper surface of lead frame can closely contact with the lower surface of upper die body, prevents the excessive bonding zone to interior pin of materials such as resin in the die cavity in the die body, has also stopped phenomenons such as plastics overlap simultaneously.This can make the bonding zone of the interior pin that preformed is honored as a queen do not polluted by plastic or other material or cover, the gold wire bonding when helping going between bonding, thus improve the reliability of the bonding between spun gold and the interior pin.Preferably, the make progress pressure limit of roof pressure lead frame of thimble is 1T to 3T (ton), can avoid the upper surface of the interior pin of lead frame to cross receiving greatly upper die body extruding (extruding can cause in silver coating on the pin impaired and influence bonding regional) like this.
Need to prove that in this embodiment, centre hole 233 is not the interior pin setting of aiming at lead frame; And the particular location of centre hole 233 is not restrictive, for example; In other instance, the interior pin setting of lead frame can be aimed in the position of centre hole 233, at this moment; Centre hole 233 also will be aimed at bottoming hole shown in Figure 1 113, and after thimble was inserted centre hole, the end face of thimble is the lower surface of the interior pin part of roof pressure lead frame upwards directly; Tight contact between the upper surface of interior pin part and the lower surface of upper die body is better, thereby helps more preventing that material such as resin is excessive.
Further; Need to prove that the concrete quantity of centre hole 233 is not limited by the embodiment of the invention, in same mould; Can a centre hole 233 and/or thimble 23 be set each lead frame correspondence; Also can a plurality of centre holes 233 and/or thimble 23 be set each lead frame correspondence, for example, the pin correspondence is provided with a centre hole 233 and thimble 23 in each of each lead frame.
The mould that it will be understood by those skilled in the art that this embodiment also comprises other conventional structure or parts, is not describing one by one at this.Thimble described above and centre hole; Can be applied to the mould of the sensor chip that needs the preformed envelope of different packing forms; OCDIP6 (Open Cavity Plastic Double In-line Package for example; The in line encapsulation of the plastics biserial of beginning to speak) packing forms, be applied to the preformed envelope mould of the encapsulation of medical MEMS (Micro-Electro-Mechanical System, MEMS) sensor chip.
Above example has mainly been explained the mould that is used for preformed envelope sensor chip of the present invention.Although only some of them embodiment of the present invention is described, those of ordinary skills should understand, and the present invention can be in not departing from its purport and scope implements with many other forms.Therefore, example of being showed and embodiment are regarded as schematic and nonrestrictive, are not breaking away under the situation of liking defined spirit of the present invention of each claim and scope enclosed, and the present invention possibly contained various modifications and replacement.
Claims (8)
1. one kind is used for the mould that preformed seals sensor chip; It comprises upper die body and lower mold body; When lead frame being carried out the preformed envelope, said upper die body places first side that desire is placed said sensor chip on the said lead frame, and said lower mold body places second side opposite with said first side; It is characterized in that said mould also comprises thimble, said lower mold body is provided with centre hole, and said thimble inserts the surface of said centre hole with second side of the said lead frame of roof pressure that makes progress.
2. mould as claimed in claim 1 is characterized in that said lower mold body is provided with lower impressions, and said upper die body is provided with upper impression, through in said lower impressions and said upper impression, injecting resin to form the preparatory plastic-sealed body of said lead frame.
3. mould as claimed in claim 2 is characterized in that said lower mold body is provided with the running channel that is communicated with said lower impressions.
4. mould as claimed in claim 1 is characterized in that said centre hole is perpendicular to the upper surface of said lower mold body.
5. mould as claimed in claim 1 is characterized in that, said centre hole is set so that when preformed seals said centre hole aim at the interior pin of said lead frame.
6. mould as claimed in claim 1 is characterized in that, in the said lower mold body, is a plurality of corresponding to the said centre hole of each lead frame, and correspondingly, said mould comprises the identical thimble of a plurality of and said centre hole quantity.
7. mould as claimed in claim 1 is characterized in that, the said upwards pressure limit of roof pressure is 1 ton to 3 tons basically.
8. mould as claimed in claim 1 is characterized in that, said centre hole is cylindrical, and the shape of said thimble and said centre hole are complementary.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110106848.9A CN102756457B (en) | 2011-04-27 | 2011-04-27 | Die for pre-plastic package of sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110106848.9A CN102756457B (en) | 2011-04-27 | 2011-04-27 | Die for pre-plastic package of sensor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102756457A true CN102756457A (en) | 2012-10-31 |
| CN102756457B CN102756457B (en) | 2015-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110106848.9A Active CN102756457B (en) | 2011-04-27 | 2011-04-27 | Die for pre-plastic package of sensor chip |
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| Country | Link |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05326587A (en) * | 1992-05-20 | 1993-12-10 | Sony Corp | Method and device for sealing resin-sealed-type semiconductor device |
| JPH0645383A (en) * | 1992-07-27 | 1994-02-18 | Nec Corp | Sealing method for resin and mold therefor |
| JP2003142510A (en) * | 2001-11-02 | 2003-05-16 | Mitsubishi Electric Corp | Method of manufacturing semiconductor device |
| JP2005216991A (en) * | 2004-01-28 | 2005-08-11 | Renesas Technology Corp | Lead frame, molding apparatus, and molding method |
| CN1893005A (en) * | 2005-07-06 | 2007-01-10 | 乾坤科技股份有限公司 | Method for preventing overflow of glue of package element |
-
2011
- 2011-04-27 CN CN201110106848.9A patent/CN102756457B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05326587A (en) * | 1992-05-20 | 1993-12-10 | Sony Corp | Method and device for sealing resin-sealed-type semiconductor device |
| JPH0645383A (en) * | 1992-07-27 | 1994-02-18 | Nec Corp | Sealing method for resin and mold therefor |
| JP2003142510A (en) * | 2001-11-02 | 2003-05-16 | Mitsubishi Electric Corp | Method of manufacturing semiconductor device |
| JP2005216991A (en) * | 2004-01-28 | 2005-08-11 | Renesas Technology Corp | Lead frame, molding apparatus, and molding method |
| CN1893005A (en) * | 2005-07-06 | 2007-01-10 | 乾坤科技股份有限公司 | Method for preventing overflow of glue of package element |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102756457B (en) | 2015-03-25 |
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