CN102738369B - 发光装置及图像显示装置 - Google Patents

发光装置及图像显示装置 Download PDF

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Publication number
CN102738369B
CN102738369B CN201210223577.XA CN201210223577A CN102738369B CN 102738369 B CN102738369 B CN 102738369B CN 201210223577 A CN201210223577 A CN 201210223577A CN 102738369 B CN102738369 B CN 102738369B
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CN
China
Prior art keywords
light
phosphor
emitting device
powder
fluorophor
Prior art date
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Application number
CN201210223577.XA
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English (en)
Chinese (zh)
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CN102738369A (zh
Inventor
高桥向星
原田昌道
广崎尚登
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
National Institute for Materials Science
Original Assignee
Kyushu University NUC
Sharp Corp
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Publication of CN102738369A publication Critical patent/CN102738369A/zh
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Publication of CN102738369B publication Critical patent/CN102738369B/zh
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Luminescent Compositions (AREA)
  • Led Device Packages (AREA)
CN201210223577.XA 2007-05-30 2008-05-30 发光装置及图像显示装置 Active CN102738369B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007143745 2007-05-30
JP143745/07 2007-05-30
JP318468/07 2007-12-10
JP2007318468A JP2009010315A (ja) 2007-05-30 2007-12-10 蛍光体の製造方法、発光装置および画像表示装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN200810098708.XA Division CN101315853A (zh) 2007-05-30 2008-05-30 荧光体的制造方法、发光装置及图像显示装置

Publications (2)

Publication Number Publication Date
CN102738369A CN102738369A (zh) 2012-10-17
CN102738369B true CN102738369B (zh) 2016-06-08

Family

ID=40106803

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201210223577.XA Active CN102738369B (zh) 2007-05-30 2008-05-30 发光装置及图像显示装置
CN200810098708.XA Pending CN101315853A (zh) 2007-05-30 2008-05-30 荧光体的制造方法、发光装置及图像显示装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN200810098708.XA Pending CN101315853A (zh) 2007-05-30 2008-05-30 荧光体的制造方法、发光装置及图像显示装置

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Country Link
JP (2) JP2009010315A (enExample)
CN (2) CN102738369B (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11294238B1 (en) 2020-10-29 2022-04-05 Lextar Electronics Corporation Low blue light backlight module
US11652193B2 (en) 2020-07-21 2023-05-16 Lextar Electronics Corporation Light-emitting diode device

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JP2009010315A (ja) * 2007-05-30 2009-01-15 Sharp Corp 蛍光体の製造方法、発光装置および画像表示装置
GB2474413B8 (en) * 2008-08-12 2013-02-13 Samsung Led Co Ltd Method for producing a ß-SiA1ON phosphor
US8158026B2 (en) 2008-08-12 2012-04-17 Samsung Led Co., Ltd. Method for preparing B-Sialon phosphor
JP5368557B2 (ja) * 2009-06-09 2013-12-18 電気化学工業株式会社 β型サイアロン蛍光体、その用途及びその製造方法
JP2011046780A (ja) * 2009-08-25 2011-03-10 Futaba Corp 蛍光体の製造方法及び蛍光体
US20120162573A1 (en) 2009-08-31 2012-06-28 Kohsei Takahashi Liquid crystal display
CN102959044B (zh) * 2010-09-16 2015-05-06 电气化学工业株式会社 β型赛隆及其制备方法和发光装置
WO2012046288A1 (ja) * 2010-10-04 2012-04-12 電気化学工業株式会社 β型サイアロン蛍光体とその製造方法、およびその用途
CN102456294A (zh) * 2010-11-02 2012-05-16 展晶科技(深圳)有限公司 Led显示装置
JP5866870B2 (ja) * 2011-08-26 2016-02-24 三菱化学株式会社 発光装置
CN102516998A (zh) * 2011-09-29 2012-06-27 宁波浩威尔新材料科技有限公司 一种超细荧光粉的制备方法
JP5727955B2 (ja) * 2012-03-08 2015-06-03 株式会社東芝 蛍光体およびその製造方法
US9793444B2 (en) * 2012-04-06 2017-10-17 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
TWI611215B (zh) * 2012-05-09 2018-01-11 半導體能源研究所股份有限公司 顯示裝置及電子裝置
TWI570219B (zh) * 2015-02-09 2017-02-11 合皓股份有限公司 製作最強吸收波長介於410奈米(nm)-470奈米(nm)的無稀土螢光材料的方法以及應用其進行光致發白光的方法
CN116293491A (zh) * 2016-04-25 2023-06-23 日本特殊陶业株式会社 波长转换构件、其制造方法及发光装置
JP6985704B2 (ja) * 2016-09-26 2021-12-22 三菱ケミカル株式会社 蛍光体、発光装置、照明装置及び画像表示装置
WO2018130750A1 (en) * 2017-01-13 2018-07-19 Juha Rantala A led structure and luminaire for continuous disinfection
WO2019045106A1 (ja) * 2017-09-04 2019-03-07 三菱ケミカル株式会社 蛍光体、発光装置、画像表示装置及び照明装置
JP6891797B2 (ja) * 2017-12-21 2021-06-18 日亜化学工業株式会社 ディスプレイ装置

Citations (5)

* Cited by examiner, † Cited by third party
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CN1195817C (zh) * 1999-11-30 2005-04-06 奥斯兰姆奥普托半导体有限责任公司 日光荧光颜料
CN1613028A (zh) * 2002-03-14 2005-05-04 日东电工株式会社 背光灯及使用它的液晶显示装置
CN1839192A (zh) * 2003-10-03 2006-09-27 独立行政法人物质·材料研究机构 氧氮化物荧光体和发光器具
CN1881629A (zh) * 2005-03-18 2006-12-20 株式会社藤仓 发光器件和照明装置
CN1922741A (zh) * 2004-02-18 2007-02-28 独立行政法人物质·材料研究机构 发光元件和照明器具

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Publication number Priority date Publication date Assignee Title
TWI359187B (en) * 2003-11-19 2012-03-01 Panasonic Corp Method for preparing nitridosilicate-based compoun
JP3921545B2 (ja) * 2004-03-12 2007-05-30 独立行政法人物質・材料研究機構 蛍光体とその製造方法
EP1788423A4 (en) * 2004-08-18 2008-02-27 Sony Corp REAR LIGHTING DEVICE AND DEVICE FOR COLORED LIQUID CRYSTAL DISPLAY
JP5134820B2 (ja) * 2004-12-24 2013-01-30 株式会社東芝 液晶表示装置
JP4574417B2 (ja) * 2005-03-31 2010-11-04 シャープ株式会社 光源モジュール、バックライトユニット、液晶表示装置
JP2007091960A (ja) * 2005-09-30 2007-04-12 Nitto Denko Corp 光半導体素子封止用樹脂組成物およびそれを用いて得られる光半導体装置
JP5206941B2 (ja) 2005-12-08 2013-06-12 独立行政法人物質・材料研究機構 蛍光体とその製造方法および発光器具
JP3975451B2 (ja) * 2006-12-19 2007-09-12 独立行政法人物質・材料研究機構 蛍光体を用いた照明器具および画像表示装置
JP2009010315A (ja) * 2007-05-30 2009-01-15 Sharp Corp 蛍光体の製造方法、発光装置および画像表示装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1195817C (zh) * 1999-11-30 2005-04-06 奥斯兰姆奥普托半导体有限责任公司 日光荧光颜料
CN1613028A (zh) * 2002-03-14 2005-05-04 日东电工株式会社 背光灯及使用它的液晶显示装置
CN1839192A (zh) * 2003-10-03 2006-09-27 独立行政法人物质·材料研究机构 氧氮化物荧光体和发光器具
CN1922741A (zh) * 2004-02-18 2007-02-28 独立行政法人物质·材料研究机构 发光元件和照明器具
CN1881629A (zh) * 2005-03-18 2006-12-20 株式会社藤仓 发光器件和照明装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11652193B2 (en) 2020-07-21 2023-05-16 Lextar Electronics Corporation Light-emitting diode device
US11294238B1 (en) 2020-10-29 2022-04-05 Lextar Electronics Corporation Low blue light backlight module

Also Published As

Publication number Publication date
JP2011140664A (ja) 2011-07-21
CN102738369A (zh) 2012-10-17
CN101315853A (zh) 2008-12-03
JP2009010315A (ja) 2009-01-15
JP5485218B2 (ja) 2014-05-07

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Address after: Osaka Japan

Applicant after: Sharp Corporation

Applicant after: NATIONAL UNIVERSITY CORPORATION KYUSHU UNIVERSITY

Address before: Osaka Japan

Applicant before: Sharp Corporation

Applicant before: Nat Inst For Materials Science (JP)

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Effective date of registration: 20200602

Address after: No.1, 1-1, 2-dingmu, Hashimoto, Central District, Tokyo, Japan

Co-patentee after: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Patentee after: DENKA Co.,Ltd.

Address before: Osaka Japan

Co-patentee before: NATIONAL INSTITUTE FOR MATERIALS SCIENCE

Patentee before: SHARP Kabushiki Kaisha

TR01 Transfer of patent right