CN102738353A - Led封装结构 - Google Patents

Led封装结构 Download PDF

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Publication number
CN102738353A
CN102738353A CN2011100917623A CN201110091762A CN102738353A CN 102738353 A CN102738353 A CN 102738353A CN 2011100917623 A CN2011100917623 A CN 2011100917623A CN 201110091762 A CN201110091762 A CN 201110091762A CN 102738353 A CN102738353 A CN 102738353A
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China
Prior art keywords
groove
led
led element
substrate
metal level
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Pending
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CN2011100917623A
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杨俊�
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AMBIT ELECTRONICS (ZHONGSHAN) Co Ltd
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AMBIT ELECTRONICS (ZHONGSHAN) Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by AMBIT ELECTRONICS (ZHONGSHAN) Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical AMBIT ELECTRONICS (ZHONGSHAN) Co Ltd
Priority to CN2011100917623A priority Critical patent/CN102738353A/zh
Priority to TW100113065A priority patent/TW201242100A/zh
Priority to US13/149,940 priority patent/US8378370B2/en
Publication of CN102738353A publication Critical patent/CN102738353A/zh
Pending legal-status Critical Current

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Abstract

一种LED封装结构，包括基板、LED元件及胶体。基板包括第一表面，所述第一表面设有凹槽，所述凹槽的底部呈透明状并设有荧光粉层，所述基板还包括金属层，所述金属层自所述荧光粉层的两侧经过所述凹槽之侧壁延伸至所述第一表面。LED元件收容于所述凹槽内，并与所述荧光粉层层叠设置，所述LED元件包括一对导电部，所述导电部与所述金属层电连接。胶体灌注于所述LED元件与所述金属层之间，以将所述LED元件固定于所述凹槽内。本发明的LED封装结构通过将荧光粉层设于透明的基板的凹槽底部并将LED元件所述的光传导至基板外表面，从而，提高产品光效和良率。

Description

LED封装结构
技术领域
本发明涉及一种LED封装结构，尤其涉及大功率白光LED封装产品。
背景技术
现有的LED封装结构100主要包括基板101、LED元件103、金线104及荧光粉封胶105。如图1所示，基板101设有凹槽，LED元件103固定于所述凹槽内并与所述基板101通过金线104电连接，所述荧光粉封胶105灌入所述凹槽内以将所述LED元件103封装于所述基板101。上述现有技术中的LED封装结构100存在如下缺点：1、LED元件103为发热元件，但被基板101及荧光粉封胶105包裹，不利于热量散发，影响LED元件103寿命；2、荧光粉封胶105在生产过程中其均匀性和一致性难以控制，对LED封装结构100的光效和良率影响大。
发明内容
有鉴于此，需提供一种LED封装结构，以解决LED元件的散热问题，改善产品性能及寿命，改善荧光粉的均匀性及一致性，以提高光效和良率。
本发明实施方式中一种LED封装结构包括基板，LED元件及胶体。基板包括第一表面，所述第一表面设有凹槽，所述凹槽的底部呈透明状并设有荧光粉层，所述基板还包括金属层，所述金属层自所述荧光粉层的两侧经过所述凹槽之侧壁延伸至所述第一表面。LED元件收容于所述凹槽内，并与所述荧光粉层层叠设置，以通过所述荧光粉层将所述LED元件所发的光传导所述基板的外表面，所述LED元件包括一对导电部，所述导电部与所述金属层电连接。胶体灌注于所述LED元件与所述金属层之间，以将所述LED元件固定于所述凹槽内。
本发明的LED封装结构通过将荧光粉层设于透明的基板的凹槽底部并将LED元件所述的光传导至基板外表面，从而，提高产品光效和良率。
附图说明
图1所示为现有技术中LED封装结构示意图。
图2所示为本发明LED封装结构的剖面示意图。
图3所示为图2所示的LED封装结构的剖面示意图的俯视图。
图4所示为本发明LED封装结构之设有荧光粉层的基板的剖面示意图。
图5所示为图4所示的剖面示意图的俯视图。
图6所示为本发明LED封装结构之LED元件的示意图。
图7所示为导电胶结构示意图。
图8所示为导电胶应用于本发明LED封装结构示意图。
主要元件符号说明
LED封装结构                        100、200
基板                               101、20
LED元件                            103、40
金线                               104
荧光粉封胶                         105
第一表面                           201
凹槽                               22
底部                               221
侧壁                               223
荧光粉层                           24
金属层                             26
第一金属层                         261
第二金属层                         263
第三金属层                         265
导电部                             44
焊盘                               42
胶体                               50
导电粒子                           52
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图2及图3，本发明实施方式中的LED封装结构200包括基板20、LED元件40及胶体50。
请参阅图4及图5，所述基板20包括第一表面201，所述第一表面201设有凹槽22，所述凹槽22的底部221呈透明状并设有荧光粉层24。所述基板20还包括金属层26，所述金属层26自所述荧光粉层24的两侧经过所述凹槽22之侧壁223延伸至所述第一表面201。本实施方式中，所述金属层26包括第一金属层261、第二金属层263及第三金属层265。所述第一金属层261设于所述凹槽22的底部221并位于所述荧光粉层24的两侧。所述第三金属层265设于所述第一表面201，所述第二金属层263设于所述凹槽22的侧壁223并连接于所述第一金属层261及第三金属层265之间。
所述LED元件40收容于所述凹槽22内，并与所述荧光粉层24层叠设置，以通过所述荧光粉层24将所述LED元件40所发的光传导所述基板20的外表面。请参阅图6，所述LED元件40包括一对导电部44，所述导电部44与所述凹槽22的底部221相对并与所述金属层26之第一金属层261电连接。本实施方式中，所述导电部44为凸出设置的一对晶球，作为所述LED元件40的两个电极。
所述胶体50灌注于所述LED元件40与所述金属层26之间，以将所述LED元件40固定于所述凹槽22内。
本实施方式中，所述胶体50为导电胶，所述LED元件40之导电部44与所述第一金属层261通过所述导电胶50实现电连接。所述LED元件40的导电部44与所述第一金属层261相对，当将LED元件40安装至所述凹槽22内时，所述LED元件40施压于所述导电胶50，当所述导电部44靠近所述第一金属层261时，所述导电胶50电连接于导电部44与所述第一金属层261之间，从而产生电性导通的功能。因此，所述导电部44通过所述导电胶50与所述第一金属层261电连接。
图7所示为导电胶50结构示意图，导电胶50之胶体内包括多个导电粒子52，当导电胶50处于自然状态，导电粒子52分散于胶体内。如图8所示，当所述LED元件40施压于所述导电胶50至导电部44靠近第一金属层261时，导电部44与所述金属层26之第一金属层261之间通过导电粒子52实现电连接。
其它实施方式中，所述LED元件40之导电部44直接接触所述第一金属层261以实现二者之间的电连接。例如，所述导电部44通过焊接的方式直接接触所述第一金属层261。
所述第三金属层265具有可焊接的性能，因此，通过将第三金属层265焊接于电子产品的主板上来实现本发明之LED封装结构200的LED元件40的供电。所述LED元件40还包括焊盘42，所述焊盘42位于所述LED元件40之远离所述导电部44的一侧，并与所述第三金属层265齐平。所述焊盘42用于将LED封装结构200焊接至电子产品的主板。因此，当所述LED封装结构200固定至电子产品主板，所述LED元件40被稳固地固定于所述基板20的凹槽22内。所述LED元件40的焊盘42直接外露于所述导电胶50及所述基板20之外，从而降低了热阻，有效改善所述LED元件40的散热，改善产品性能及寿命。
所述基板20为玻璃材质。所述荧光粉层24通过涂布法均匀涂覆于所述基板20之凹槽22的底部221。其它实施方式中，所述荧光粉层24也可以通过网印法、转印法或者喷墨法涂覆于所述基板20之凹槽22的底部221。LED元件40的发光面与所述荧光粉层24接触，由于荧光粉层24被均匀涂覆于所述基板20之凹槽22，使得LED元件40所发的光更加有效地被传导至外界，从而，提高产品光效和良率。
本实施方式中，所述荧光粉层24为黄色荧光粉，LED元件40为蓝光LED，因此，所述LED封装结构200为大功率白光封装产品。

Claims (9)

1.一种LED封装结构，包括基板与LED元件，其特征在于：
所述基板包括第一表面，所述第一表面设有凹槽，所述凹槽的底部呈透明状并设有荧光粉层，所述基板还包括金属层，所述金属层自所述荧光粉层的两侧经过所述凹槽之侧壁延伸至所述第一表面；
所述LED元件收容于所述凹槽内，并与所述荧光粉层层叠设置，以通过所述荧光粉层将所述LED元件所发的光传导所述基板的外表面，所述LED元件包括一对导电部，所述导电部与所述金属层电连接；及
胶体，灌注于所述LED元件与所述金属层之间，以将所述LED元件固定于所述凹槽内。
2.如权利要求1所述的LED封装结构，其特征在于，所述金属层包括第一金属层、第二金属层及第三金属层，所述第一金属层成对设于所述凹槽的底部并位于所述荧光粉层的两侧，所述第三金属层设于所述第一表面，所述第二金属层设于所述凹槽的侧壁并连接于所述第一、第三金属层之间，所述LED元件的导电部与所述第一金属层相对设置，所述导电部所述第一金属层电连接。
3.如权利要求2所述的LED封装结构，其特征在于，所述胶体为导电胶，所述LED元件之导电部与所述第一金属层通过所述导电胶实现电连接。
4.如权利要求3所述的LED封装结构，其特征在于，所述导电胶包括多个导电粒子，所述导电部与所述第一金属层之间通过所述导电粒子实现电连接。
5.如权利要求2所述的LED封装结构，其特征在于，所述LED元件之导电部直接接触所述第一金属层以实现二者之间的电连接。
6.如权利要求5所述的LED封装结构，其特征在于，所述LED元件之导电部通过焊接的方式直接接触所述第一金属层。
7.如权利要求2所述的LED封装结构，其特征在于，所述LED元件还包括焊盘，所述焊盘位于所述LED元件之远离所述导电部的一侧，并与所述第三金属层齐平。
8.如权利要求1所述的LED封装结构，其特征在于，所述基板为玻璃材质。
9.如权利要求1所述的LED封装结构，其特征在于，所述荧光粉层通过涂布法均匀涂覆于所述基板之凹槽的底部。
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