CN102938442B - Led封装单元及包括其的led封装系统 - Google Patents
Led封装单元及包括其的led封装系统 Download PDFInfo
- Publication number
- CN102938442B CN102938442B CN201210491072.1A CN201210491072A CN102938442B CN 102938442 B CN102938442 B CN 102938442B CN 201210491072 A CN201210491072 A CN 201210491072A CN 102938442 B CN102938442 B CN 102938442B
- Authority
- CN
- China
- Prior art keywords
- functional layer
- led package
- package unit
- additional
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000843 powder Substances 0.000 claims abstract description 35
- 238000009826 distribution Methods 0.000 claims abstract description 11
- 239000002346 layers by function Substances 0.000 claims description 160
- 239000010410 layer Substances 0.000 claims description 101
- 239000004020 conductor Substances 0.000 claims description 64
- 230000005611 electricity Effects 0.000 claims description 37
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 28
- 238000005538 encapsulation Methods 0.000 claims description 26
- 230000003287 optical effect Effects 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 21
- 238000013519 translation Methods 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 6
- 238000010438 heat treatment Methods 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 230000003993 interaction Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
Landscapes
- Led Device Packages (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210491072.1A CN102938442B (zh) | 2012-11-27 | 2012-11-27 | Led封装单元及包括其的led封装系统 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210491072.1A CN102938442B (zh) | 2012-11-27 | 2012-11-27 | Led封装单元及包括其的led封装系统 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102938442A CN102938442A (zh) | 2013-02-20 |
CN102938442B true CN102938442B (zh) | 2015-06-24 |
Family
ID=47697326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210491072.1A Expired - Fee Related CN102938442B (zh) | 2012-11-27 | 2012-11-27 | Led封装单元及包括其的led封装系统 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102938442B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103346243B (zh) * | 2013-07-12 | 2016-08-31 | 广东洲明节能科技有限公司 | 承载散热板和远程荧光粉结构的led光源及其生产方法 |
CN109064913B (zh) * | 2017-07-19 | 2022-05-20 | 广州超维光电科技有限责任公司 | 基于类舞台结构的内嵌集成式行单元 |
CN108666308B (zh) * | 2018-06-19 | 2019-06-18 | 清华大学 | 柔性集成封装系统 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202094175U (zh) * | 2011-06-14 | 2011-12-28 | 易美芯光(北京)科技有限公司 | 一种远荧光粉的led封装结构 |
CN102738367A (zh) * | 2011-03-30 | 2012-10-17 | 首尔半导体株式会社 | 发光设备 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5840377B2 (ja) * | 2011-04-14 | 2016-01-06 | 日東電工株式会社 | 反射樹脂シートおよび発光ダイオード装置の製造方法 |
-
2012
- 2012-11-27 CN CN201210491072.1A patent/CN102938442B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102738367A (zh) * | 2011-03-30 | 2012-10-17 | 首尔半导体株式会社 | 发光设备 |
CN202094175U (zh) * | 2011-06-14 | 2011-12-28 | 易美芯光(北京)科技有限公司 | 一种远荧光粉的led封装结构 |
Also Published As
Publication number | Publication date |
---|---|
CN102938442A (zh) | 2013-02-20 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Wei Jia Inventor after: Yuan Changan Inventor after: Hendrix.Wilhelmus.Fan.Caiji Inventor after: Dong Mingzhi Inventor after: Liang Runyuan Inventor before: Wei Jia Inventor before: Yuan Changan Inventor before: Hendrix.Wilhelmus.Fan.Caiji Inventor before: Dong Mingzhi Inventor before: Liang Runyuan Inventor before: Zhang Guoqi |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WEI JIA YUAN CHANGAN HENDRIKX WILHELMUS FAN CAIJI DONG MINGZHI LIANG RUNYUAN ZHANG GUOQI TO: WEI JIA YUAN CHANGAN HENDRIKX WILHELMUS FAN CAIJI DONG MINGZHI LIANG RUNYUAN |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C53 | Correction of patent of invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Wei Jia Inventor after: Yuan Changan Inventor after: Hendrix.Wilhelmus.Fan.Caiji Inventor after: Dong Mingzhi Inventor after: Liang Runyuan Inventor after: Zhang Guoqi Inventor before: Wei Jia Inventor before: Yuan Changan Inventor before: Hendrix.Wilhelmus.Fan.Caiji Inventor before: Dong Mingzhi Inventor before: Liang Runyuan |
|
COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WEI JIA YUAN CHANGAN HENDRIKX WILHELMUS FAN CAIJI DONG MINGZHI LIANG RUNYUAN TO: WEI JIA YUAN CHANGAN HENDRIKX WILHELMUS FAN CAIJI DONG MINGZHI LIANG RUNYUAN ZHANG GUOQI |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150624 |
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CF01 | Termination of patent right due to non-payment of annual fee |