WO2019100446A1 - 一种填埋热保护ic的cob封装及其封装方法 - Google Patents

一种填埋热保护ic的cob封装及其封装方法 Download PDF

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Publication number
WO2019100446A1
WO2019100446A1 PCT/CN2017/114920 CN2017114920W WO2019100446A1 WO 2019100446 A1 WO2019100446 A1 WO 2019100446A1 CN 2017114920 W CN2017114920 W CN 2017114920W WO 2019100446 A1 WO2019100446 A1 WO 2019100446A1
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thermal protection
conductive
temperature sensor
ceramic sheet
ltcc substrate
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PCT/CN2017/114920
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English (en)
French (fr)
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李立勉
李立群
李妙姿
陈育
卢伟斌
文尚胜
陈桦
文作义
周华辉
黄培雄
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广东金源照明科技股份有限公司
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Publication of WO2019100446A1 publication Critical patent/WO2019100446A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages

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  • the present invention relates to the field of LED packaging, and in particular to a COB package for filling a thermal protection IC and a packaging method thereof.
  • a light emitting diode can directly convert electrical energy into light energy, and has a series of advantages such as green environmental protection, short response time, low cost, high luminous brightness and long service life. Green lighting energy in the 21st century.
  • COB Chip On Board packaging
  • the COB packaged LED source is an integrated packaged surface source.
  • the COB package adheres the LED chip to the PCB substrate with conductive or non-conductive silver glue, and then performs wire bonding to realize electrical connection, eliminating the need for the process of the bracket and the wire, and does not need to face the technical problem of reflow soldering, and not only reduces the technical problem. Cost also increases reliability.
  • the existing COB package can divide one or two large chips into more than a dozen small chips, which fully improves the uniformity of light distribution, but at the same time requires higher heat dissipation.
  • the LED package with overheat protection function usually has a PCB copper foil circuit layer mounted on a metal substrate, an LED array in the center, a patch temperature sensor installed on the periphery, a temperature sensor sensing the substrate temperature, and when the temperature exceeds the limit temperature, the signal is transmitted to The thermal protection IC protects the LED chip from power failure and reduces the junction temperature.
  • the packaging method adopted by the above prior art can achieve the purpose of temperature control to some extent, there is a certain distance between the temperature sensor and the LED chip, and there is a protective adhesive with low thermal conductivity between the two, which is not conducive to sensor sensing. Temperature change. And when the substrate temperature is too high, taking power-off protection is not conducive to the application of LED light source in daily life.
  • the object of the present invention is to provide a COB package for filling a thermal protection IC and a packaging method thereof.
  • the thermal protection IC and the temperature sensor are buried in the substrate, and the thickness between the temperature sensor and the LED chip is only about 50 um.
  • the ceramic tile can sensitively and quickly sense the temperature change of the LED chip. When the temperature exceeds the limit temperature, the temperature sensor transmits the signal to the thermal protection IC, and the thermal protection IC performs the step-down control of the output current, thereby ensuring timely reduction of the LED light source.
  • the temperature avoids the excessively low output current, which causes the human eye to perceive the brightness change, produces a flickering feeling, and unwittingly achieves the purpose of overheat protection, further prolongs the life of the LED, reduces the light decay, and improves the reliability of the light source.
  • the present invention adopts the following technical solutions: including an LTCC substrate, a thermal protection IC, a temperature sensor, and an LED chip, wherein the LTCC substrate is formed by stacking two or more layers of green ceramic sheets, the thermal protection IC, and the temperature.
  • the sensor is disposed in the LTCC substrate, the LED chip is fixed on the LTCC substrate, and the temperature sensor and the LED chip are separated by a layer of green tiles, and the thermal protection IC is electrically connected to the LED chip and the temperature sensor respectively.
  • the LTCC substrate is printed with an electrical interconnection wire made of a conductive paste, and the LED chip is electrically connected to the electrical interconnection wire of the surface of the LTCC substrate through a gold wire.
  • the LTCC substrate is provided with a component placement via, a conductive via, and a conductive material is injected into the conductive via.
  • the top layer of green sheets has a thickness of 40-60 um.
  • the surface of the LED chip is covered with a protective glue and a phosphor glue.
  • the LTCC substrate comprises a top layer ceramic piece, a first functional green piece, and a second function green piece arranged in order from top to bottom, and the top layer ceramic piece is provided with at least one first conductive through hole, and the ceramic piece is placed.
  • the at least one second conductive via and the component placement via are disposed, and the second functional green ceramic is provided with at least one third conductive via, the component placement via accommodating the thermal protection IC and the temperature sensor.
  • first functional green ceramic sheet and the second functional green ceramic sheet further comprise a third functional green ceramic sheet, wherein the third functional green ceramic sheet is provided with at least four fourth conductive through holes, two The four conductive vias are electrically connected to the positive and negative terminals of the thermal protection IC and are matched with the position of the third conductive via, and the other two fourth conductive vias are thermally protected by the IC current output terminal, the input terminal and the second conductive via hole. match.
  • the upper and lower surfaces of the top layer ceramic sheet are printed with an electrical interconnection wire made of a conductive paste, and the thermal protection IC and the temperature sensor are placed on the lower surface of the top layer ceramic tile, fixed by the solid crystal glue, and electrically interconnected.
  • the wire is connected to the power input end of the thermal protection IC and the power output end, the first conductive via, and the second conductive via.
  • the second conductive via and the third conductive via are the same and the positions are matched.
  • the invention proposes a packaging method comprising:
  • the LTCC substrate mounts the peripheral optical components to obtain the COB package of the buried thermal protection IC.
  • the step of using the mechanical axial pressure or the liquid isostatic pressing to firmly bond the functional green sheets to obtain the prefabricated substrate comprises:
  • the step of mechanically pressing the functional green sheet to obtain a prefabricated substrate by mechanical axial pressure or liquid isostatic pressing includes:
  • the thermal protection IC and the temperature sensor are placed in the component placement through hole, and the thermal protection IC is electrically connected to the temperature sensor, wherein the temperature sensor is located around the thermal protection IC.
  • the invention has the advantages that: 1.
  • the encapsulation method by the landfill method is such that only one layer of raw ceramic sheets (thickness about 50 um) is interposed between the temperature sensor and the LED chip, which can sensitively change the temperature of the chip, and the temperature conduction of the chip.
  • the temperature sensor can sensitively respond to the substrate temperature.
  • the thermal protection IC regulates the output current step by step, ensuring timely reduction of the temperature of the LED light source. Moreover, it avoids the excessively low output current, which causes the brightness change of the human eye to be perceived, and unwittingly achieves the purpose of overheat protection, and fundamentally solves the problem of excessive temperature of the chip;
  • the LTCC substrate preparation process is mature, and the thermal protection IC, the temperature sensor and the filled metal wire are simultaneously installed in the manufacturing process, which can reduce the process difficulty and the production cost.
  • Figure 1 is a cross-sectional view showing the structure of Embodiment 1;
  • Figure 2 is an exploded view of the LTCC substrate of Embodiment 1;
  • 3a and 3b are a cross-sectional view and a plan view of a prefabricated substrate of the first embodiment
  • Figure 4 is a schematic view showing the mounting of components of Embodiment 1;
  • Figure 5 is a schematic view showing the electrical connection of the embodiment 1;
  • 6a, b, and c are a cross-sectional view of the LTCC substrate of the embodiment 1, the upper surface of the substrate, and the lower surface of the substrate;
  • FIG. 7 is a schematic view showing the upper surface printed circuit and the LED chip arrangement of the LTCC substrate of Embodiment 1;
  • Figure 8 is a cross-sectional view of the COB package of the LED light source of Embodiment 1;
  • Figure 9 is an exploded view of the LTCC substrate of Embodiment 2.
  • 10a, b are the upper surface and the lower surface of the top layer ceramic piece of Example 2;
  • Figure 11 is a schematic view showing the installation of the lower surface element of the top layer of the ceramic sheet of the embodiment 2;
  • Figure 12 is a cross-sectional view showing the structure of the second embodiment.
  • Embodiment 1 of the present invention is a COB package of a buried thermal protection IC 2 as shown in FIG. 1-8, including an LTCC substrate 1, a thermal protection IC 2, a temperature sensor 3, and an LED chip 4.
  • the LTCC substrate 1 includes from top to bottom.
  • the top layer of the green sheet 11, the first functional green sheet 12, the third functional green sheet 14, and the second functional green sheet 13 are sequentially disposed, and the upper and lower surfaces of the top layer ceramic sheet 11 are printed with conductive
  • the electrical interconnection wire 5 made of the slurry, the thermal protection IC 2 and the temperature sensor 3 are placed on the lower surface of the top layer green ceramic sheet 11, and are fixed by the solid crystal glue, and the electrical interconnection wire 5 sequentially connects the power input end of the thermal protection IC 2 and the power source.
  • the surface of the LED chip 4 is covered with a protective glue 6, a phosphor glue 7, and the temperature sensor 3
  • the third functional green ceramic sheet 14 is provided with four fourth conductive through holes 95 electrically connected to the positive and negative electrodes of the thermal protection IC 2 and aligned with the third conductive through holes 93, and the other two fourth conductive holes
  • the via 95 is electrically connected to the current output terminal and the input terminal of the thermal protection IC 2 and aligned with the second conductive via 92.
  • the component placement through hole 94 and the conductive via hole may be punched on the green ceramic sheet by a mechanical punching technique or a laser drilling technique, and the shape of the through hole may be one of a circular shape, a rectangular shape, a circular shape, or the like.
  • a variety of laser drilling technology can ensure the accuracy of the through hole of the green sheet, prevent the unevenness of the wall of the through hole, the residual slurry on the back surface and the hole blocking.
  • the temperature sensor 3 senses the temperature of the LTCC substrate 1. When the temperature of the LTCC substrate 1 exceeds the limit temperature, the signal is transmitted to the thermal protection IC 2, which may be a patch temperature sensor, a magnetic temperature sensor or a threaded temperature sensor.
  • the thermal protection IC 2 which may be a patch temperature sensor, a magnetic temperature sensor or a threaded temperature sensor.
  • the LTCC substrate 1 is printed with an electrical interconnection wire 5 made of a conductive paste.
  • the arrangement of the electrical interconnection wires 5 is specifically adjusted according to the arrangement of the LED chips 4, and the LED chip 4 passes through the positive and negative electrodes.
  • the gold wire 10 is electrically connected to the electrical interconnection wire 5 on the surface of the LTCC substrate 1; the LTCC substrate 1 is provided with a component placement through hole 94, a conductive via hole, and a conductive material 8 is injected into the conductive via hole; and a conductive material is injected into the conductive via hole.
  • Material 8, as a vertical path between the green tiles, the conductive material 8 is a copper, aluminum, gold or alloy metal liquid.
  • the thermal protection IC2 can perform step-down regulation on the output current, while ensuring timely reduction of the temperature of the LED chip 4, and avoiding excessively lowering the output current, causing a change in brightness that can be perceived by the human eye, and unwittingly reaching overheating. The purpose of protection.
  • the protective adhesive 6 is an epoxy resin or a silica gel
  • the phosphor rubber 7 is a composite material obtained by mixing a silica gel and a phosphor in a certain ratio, and the two are sequentially coated on the chip by spraying, spin coating or deposition. A phosphor layer away from the coating is obtained.
  • epoxy resin or silica gel as protective glue 6 has high refractive index and high light transmittance, can increase the luminous flux of LED, has small viscosity, easy to defoam, suitable for potting and compression molding, so that LED has better durability and reliability.
  • the method can be used to achieve the same effect of other phosphors away from the coating technology by spraying, spin coating or deposition, and achieve the illumination uniformity, high light output efficiency and color temperature. Optical requirements such as control and color uniformity control.
  • the top layer of the green ceramic sheet 11 has a thickness of 40-60 um, preferably 50 um, and is packaged by a landfill method, so that only a layer of 50 um of green ceramic sheets is interposed between the temperature sensor 3 and the LED chip 4, which is sensitive to the application.
  • the temperature of the LED chip 4 changes.
  • the temperature sensor 3 transmits the signal to the thermal protection IC2, and the thermal protection IC2 performs the step-down control of the output current, thereby ensuring timely reduction of the temperature of the LED light source and avoiding too fast. Reducing the output current causes the brightness of the human eye to be perceived, and unwittingly achieves the purpose of overheat protection, further extending the life of the LED, reducing the light decay, and improving the reliability of the light source.
  • the invention also discloses a method for packaging a COB package of a buried thermal protection IC2, comprising the following steps:
  • the component obtained by punching the green ceramic sheet by laser technology or mechanical punching technology is placed with a through hole 94 and a conductive through hole; the conductive through holes of the upper and lower adjacent two layers of the green ceramic sheet are aligned, and the conductive through hole is filled with the conductive material 8,
  • a metal liquid such as copper, aluminum, gold or alloy is formed to form a vertical conductive path after cooling, and a component placement through hole 94 is used for the thermal protection IC 2 and the temperature sensor 3, so that the through hole is not filled with the conductive material 8.
  • the first functional green ceramic sheet 12, the third functional green ceramic sheet 14, and the second functional green ceramic sheet 13 are adhered firmly by mechanical axial pressure or liquid isostatic pressing to obtain a prefabricated substrate, and the thermal protection IC 2 and the temperature sensor 3 are placed in the prefabricated manner.
  • the component of the substrate is placed in the through hole 94, wherein the thermal protection IC2 is located at the center of the component placement through hole 94, the temperature sensor 3 is located around, the position of the protection IC and the temperature sensor 3 can be adjusted according to requirements, and the number of the temperature sensor 3 can be One or more, the positive and negative electrodes of the thermal protection IC2 are electrically connected to the external power source through the conductive path, and the insulating and thermally conductive resin 121 is filled into the component placement through hole 94 of the prefabricated substrate and solidified by mechanical axial pressure or liquid isostatic pressing.
  • the top layer green sheet 11 is adhered to the prefabricated substrate to obtain the LTCC substrate 1.
  • the conductive paste is printed on the upper surface of the LTCC substrate 1 by screen printing or mask printing to form the electrical interconnection wires 5.
  • the arrangement manner of the electrical interconnection wires 5 is specifically adjusted according to the arrangement of the LED chips 4.
  • the positive and negative electrodes of the LED chip 4 are electrically connected to the electrical interconnection wire 5 through the gold wire 10.
  • the protective glue 6 and the phosphor glue 7 are sequentially coated on the surface of the LED chip 4 by spin coating, spraying or printing, and finally the peripheral optical element 9 is mounted to complete a COB package of the landfill thermal protection IC2.
  • the first embodiment is substantially the same as the first embodiment. The difference is that, as shown in FIG. 9-12, the LTCC substrate 1 includes a top layer ceramic sheet 11 and a first functional green sheet 12 disposed in order from top to bottom.
  • the second functional green sheet 13 the top ceramic sheet 11 is provided with at least one first conductive through hole 91, the ceramic sheet is disposed with at least one second conductive through hole 92, and the component placement through hole 94, the second functional green sheet 13 is provided with at least one third conductive via 93 for placing the thermal protection IC 2 and the temperature sensor 3 on the lower surface of the top layer green ceramic sheet 11, and the component placement via 94 can accommodate the thermal protection IC 2 and the temperature sensor 3.
  • an electrical interconnection wire 5 made of a conductive paste is printed on the upper and lower surfaces of the top layer green ceramic sheet 11, wherein the arrangement pattern of the upper surface electrical interconnection wires 5 of the top layer green ceramic sheet 11 is specifically according to the LED chip 4
  • the arrangement of the LED chips 4 is finally interconnected by the gold wire 10 and the electrical interconnection wires 5; the arrangement of the electrical interconnection wires 5 on the lower surface of the top ceramic plate 11 is specifically adjusted according to the position of the thermal protection IC 2
  • the thermal protection IC 2 and the temperature sensor 3 are placed on the lower surface of the top layer green ceramic sheet 11, and are fixed by a solid crystal glue, and the thermal protection IC 2 is interconnected with the temperature sensor 3 through the gold wire 10.
  • the thermal protection IC 2 and the temperature sensor 3 are placed on the lower surface of the top layer green ceramic sheet 11, there is no need to add a third functional green ceramic sheet 14, which saves production cost and manufacturing process; and the heat generated by the LED chip 4 is perpendicular to the wall surface.
  • the temperature sensor 3 installed on the lower surface of the top layer of the green sheet 11 can be more sensitive to the change of the temperature of the LED chip 4 by the heat conduction mode.
  • the temperature sensor 3 transmits the signal to the thermal protection IC 2,
  • the thermal protection IC2 regulates the output current in a step-down manner, which not only ensures the temperature of the LED light source is reduced in time, but also avoids the brightness change caused by the human eye to be detected by the eye current, and the brightness of the eye is unconsciously extended.
  • the life span reduces light decay and improves the reliability of the light source.
  • the encapsulation mode of this embodiment is basically the same as that of Embodiment 1, and the difference is:
  • the steps of using a mechanical axial pressure or a liquid isostatic pressing to firmly bond the functional green sheets to obtain a prefabricated substrate include:
  • the conductive paste is printed on the upper and lower surfaces of the top layer green sheet 11 by screen printing or mask printing to form the electrical interconnection wires 5; the thermal protection IC 2 and the temperature sensor 3 are placed under the top layer ceramic sheets 11 The surface is fixed by a solid crystal glue, and the thermal protection IC2 is electrically connected to the temperature sensor 3; the conductive through hole is filled with the conductive material 8 to form a conductive path; and the first functional green piece 12 and the second are made by mechanical axial pressure or liquid isostatic pressing.
  • the functional green sheet 13 is firmly attached to obtain a prefabricated substrate.

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Abstract

一种填埋热保护IC(2)的COB封装及其封装方法，采用如下技术方案：一种填埋热保护IC(2)的COB封装，包括LTCC基板(1)、热保护IC(2)、温度传感器(3)、LED芯片(4)，LTCC基板(1)由两层以上生瓷片叠压接而成，热保护IC(2)、温度传感器(3)设置在LTCC基板(1)中，LED芯片(4)固定于LTCC基板(1)上，温度传感器(3)与LED芯片(4)之间只隔一层生瓷片，热保护IC(2)、温度传感器(3)电连接，当LTCC基板(1)温度超过限定温度时，由温度传感器(3)将信息反馈给热保护IC(2)，热保护IC(2)对输出电流进行分级下降调控，既保证及时降低LED光源的温度，又避免过快降低输出电流导致人眼可察觉的亮度变化，在不知不觉中达到过热保护的目的，从根本上解决芯片温度过高的问题。

Description

一种填埋热保护IC的COB封装及其封装方法 技术领域
本发明涉及LED封装领域，尤其涉及一种填埋热保护IC的COB封装及其封装方法。
背景技术
发光二极管(Light emitting diode)作为一种电致发光器件，可直接将电能转化为光能，具有绿色环保、响应时间短、成本低、发光亮度高、使用寿命长等一系列优点，被誉为21世纪的绿色照明能源。
随着小间距LED的快速发展，COB(Chip On Board)封装受到LED行业越来越多的青睐。相比于传统的SMD封装，COB封装的LED光源是一种集成式封装的面光源。COB封装将LED芯片用导电或非导电银胶粘附于PCB基板上，然后进行引线键合实现电气连接，省去了支架和打线等工艺，无需面对回流焊的技术难题，不仅降低了成本，也提高了可靠性。现有的COB封装能够把一两个大的芯片分成十几个小芯片，充分提高光分布的均匀性，但与此同时对散热的要求也更高。
LED芯片用于发光的功率只有输入功率的一小部分，剩下大部分电功率会转化为热能。仅通过外部散热并不能从根本上解决LED芯片温度过高的问题。目前带过热保护功能的LED封装通常在金属基板上贴装PCB铜箔电路层，中央为LED阵列，外围安装贴片温度传感器，温度传感器感应基板温度，当温度超过限定温度时，将信号传递给热保护IC，从而对LED芯片实现断电保护，降低结温。
以上现有技术采用的封装方法，虽能一定程度上达到控温目的，但由于温度传感器与LED芯片之间存在一定距离，且二者之间存在热导率低的保护胶，不利于传感器感应温度的变化。且当基板温度过高时，采取断电保护不利于LED光源在日常生活中的应用。
发明内容
本发明的目的在于提供一种填埋热保护IC的COB封装及其封装方法，通过在基板中填埋热保护IC和温度传感器，温度传感器与LED芯片之间只隔一层厚度约为50um生瓷片，能够灵敏且迅速地感应LED芯片的温度变化，当温度超过限定温度时，温度传感器将信号传递给热保护IC，由热保护IC对输出电流进行分级下降调控，既保证及时降低LED光源的温度，又避免过快降低输出电流导致人眼可察觉的亮度变化，产生闪烁感，在不知不觉中达到过热保护的目的，进一步延长LED的寿命，减少光衰，提高光源的可靠性。
为达到上述目的，本发明采用如下技术方案：包括LTCC基板、热保护IC、温度传感器、LED芯片，所述LTCC基板由两层以上生瓷片叠压接而成，所述热保护IC、温度传感器设置在所述LTCC基板中，所述LED芯片固定于LTCC基板上，所述温度传感器与LED芯片之间只隔一层生瓷片，所述热保护IC分别与LED芯片和温度传感器电连接。
进一步的，所述LTCC基板印刷有由导电浆料制成的电气互联导线，所述LED芯片通过金线与LTCC基板表面的电气互联导线电连接。
进一步的，所述LTCC基板设置有元件放置通孔、导电通孔，导电通孔中注入导电材料。
优选的，所述顶层生瓷片厚度为40-60um。
进一步的，所述LED芯片表面覆盖保护胶、荧光粉胶。
进一步的，所述LTCC基板包括自上至下依次设置的顶层生瓷片、第一功能生瓷片、第二功能生瓷片，顶层生瓷片设置至少一个第一导电通孔，放置瓷片设置至少一个第二导电通孔和所述元件放置通孔、第二功能生瓷片设置至少一个第三导电通孔，所述元件放置通孔可容置所述热保护IC和温度传感器。
进一步的，所述第一功能生瓷片和第二功能生瓷片之间还包括第三功能生瓷片，所述第三功能生瓷片设置至少四个第四导电通孔，两个第四导电通孔与热保护IC正负极电连接并且与第三导电通孔位置匹配，另外两个第四导电通孔热保护IC电流输出端、输入端电连接并且与第二导电通孔位置匹配。
进一步的，所述顶层生瓷片的上、下面表面印刷有由导电浆料制成的电气互联导线，热保护IC、温度传感器放置在顶层生瓷片下表面，利用固晶胶固定，电气互联导线依次连通所述热保护IC的电源输入端和电源输出端、第一导电通孔连接、第二导电通孔，所述第二导电通孔和第三导电通孔个数相同且位置匹配。
本发明提出了一种封装方法，包括：
采用激光技术或机械冲孔技术对生瓷片进行打孔所得到元件放置通孔和导电通孔的步骤；
将上下相邻两层生瓷片的导电通孔对齐的步骤；
采用机械轴压或液体等静压使生瓷片粘贴牢固得到预制基板的步骤；
热保护IC电流输出端、输入端通过导电通路与电气互联导线电连接的步骤；
热保护IC正负极通过导电通路与外部电源电连接的步骤；
采用丝网印刷或掩膜印刷法，将导电浆料印刷在顶层生瓷片上和/或下表面，用以制作电气互联导线的步骤；
将绝缘导热填充到预制基板的元件放置通孔并进行固化的步骤；
采用机械轴压或液体等静压使预制基板和顶层生瓷片粘贴牢固得到LTCC基板的步骤；
LED芯片正负极通过金线与电气互联导线互连的步骤；
采用旋涂、喷涂或印刷等方法在LED芯片表面依次涂覆保护胶、荧光粉胶的步骤；
LTCC基板安装外围光学元件得到填埋热保护IC的COB封装的步骤。
进一步的，采用机械轴压或液体等静压使功能生瓷片粘贴牢固得到预制基板的步骤包括：
将热保护IC和温度传感器放置在顶层生瓷片下表面，利用固晶胶固定，将热保护IC与温度传感器电连接的步骤；
导电通孔填充导电材料形成导电通路的步骤；
采用机械轴压或液体等静压使第一功能生瓷片、第二功能生瓷片粘贴牢固得到预制基板的步骤。
作为一另实施例，采用机械轴压或液体等静压使功能生瓷片粘贴牢固得到预制基板的步骤包括：
将第一功能生瓷片、第三功能生瓷片、第二功能生瓷片的导电通孔两端对齐，填充导电材料形成导电通路的步骤；
采用机械轴压或液体等静压使第一功能生瓷片、第三功能生瓷片、第二功能生瓷片粘贴牢固的步骤；
将热保护IC和温度传感器放置在元件放置通孔中，热保护IC与温度传感器电连接，其中温度传感器位于热保护IC四周位置的步骤。
本发明的优点在于：1.采用填埋法的封装方式，使得温度传感器与LED芯片之间仅隔着一层生瓷片(厚度约50um)，能够灵敏感应芯片温度的变化，芯片的温度传导至基板中，温度传感器能够灵敏感应基板温度，当基板温度超过限定温度时，由温度传感器将信息反馈给热保护IC，热保护IC对输出电流进行分级下降调控，既保证及时降低LED光源的温度，又避免过快降低输出电流导致人眼可察觉的亮度变化，在不知不觉中达到过热保护的目的，从根本上解决芯片温度过高的问题；
2.LTCC基板制备工艺成熟，在其制作过程中同步安装热保护IC、温度传感器以及填充金属导线，能够降低工艺难度和生产成本。
附图说明
附图1为实施例1结构剖面图；
附图2为实施例1LTCC基板分解图；
附图3a、b为实施例1预制基板剖面图、俯视图；
附图4为实施例1元件安装示意图；
附图5为实施例1电气连接示意图；
附图6a、b、c为实施例1LTCC基板剖面图、基板上表面、基板下表面；
附图7为实施例1LTCC基板上表面印刷电路及LED芯片排布示意图；
附图8为实施例1LED光源COB封装整体剖面图；
附图9为实施例2的LTCC基板分解图；
附图10a、b为实施例2顶层生瓷片的上表面、下表面；
附图11为实施例2顶层生瓷片下表面元件安装示意图；
附图12为实施例2的结构剖面图。
1.LTCC基板，2.热保护IC，3.温度传感器，4.LED芯片，5.电气互联导线，6.保护胶，7.荧光粉胶，8.导电材料，9.光学元件，10.金线，11.顶层生瓷片，12.第一功能生瓷片，13.第二功能生瓷片，14.第三功能生瓷片，91.第一导电通孔，92.第二导电通孔，93.第三导电通孔，94.元件放置通孔，95.第四导电通孔，121.绝缘导热树脂。
具体实施方式
实施例1：
本发明实施例1如图1-8所示的一种填埋热保护IC2的COB封装，包括LTCC基板1、热保护IC2、温度传感器3、LED芯片4，所述LTCC基板1包括自上至下依次设置的顶层生瓷片11、第一功能生瓷片12、第三功能生瓷片14、第二功能生瓷片13，所述顶层生瓷片11的上、下面表面印刷有由导电浆料制成的电气互联导线5，热保护IC2、温度传感器3放置在顶层生瓷片11下表面，利用固晶胶固定，电气互联导线5依次连通所述热保护IC2的电源输入端和电源输出端、第一导电通孔91连接，第二导电通孔92，所述第二导电通孔92和第三导电通孔93个数相同且位置匹配所述热保护IC2、温度传感器3设置在所述LTCC基板1中，所述LED芯片4固定于LTCC基板1上，通过金线10与LTCC基板1表面线路连接，LED芯片4表面覆盖保护胶6、荧光粉胶7，所述温度传感器3与LED芯片4之间只隔一层生瓷片，所述热保护IC2分别与LED芯片4和温度传感器3电连接。
第三功能生瓷片14设置四个第四导电通孔95，两个第四导电通孔95与热保护IC2正负极电连接并且与第三导电通孔93对齐，另外两个第四导电通孔95与热保护IC2电流输出端、输入端电连接并且与第二导电通孔92对齐。
所述元件放置通孔94以及导电通孔可由机械冲孔技术或激光打孔技术在生瓷片上进行打孔得到，通孔的形状可为圆形、矩形、圆环形等中的一种或多种，通过激光技术打孔可以确保生瓷片的通孔精度，防止通孔孔壁挂浆不均、背面残留浆料以及堵孔等现象。
温度传感器3感知LTCC基板1温度，当LTCC基板1温度超过限定温度时候，便将信号传递给热保护IC2，所述温度传感器3可为贴片式温度传感器、磁性温度传感器或螺纹固定温度传感器等中的一种或多种
进一步的，所述LTCC基板1印刷有由导电浆料制成的电气互联导线5，电气互联导线5的排布方式具体根据LED芯片4的排列方式进行调整，所述LED芯片4正负极通过金线10与LTCC基板1表面的电气互联导线5电连接；所述LTCC基板1设置有元件放置通孔94、导电通孔，导电通孔中注入导电材料8；通过在导电通孔中注入导电材料8，作为各生瓷片之间的垂直通路，所述导电材料8为铜、铝、金或合金金属液。
进一步的，述热保护IC2可对输出电流进行分级下降调控，在保证及时降低LED芯片4温度的同时，又避免过快降低输出电流导致人眼可察觉的亮度变化，在不知不觉中达到过热保护的目的。
所述保护胶6为环氧树脂或硅胶，所述荧光粉胶7为硅胶和荧光粉按一定比例混合得到的复合材料，二者通过喷涂、旋涂或沉积等方式依次涂覆在芯片上，得到远离涂覆的荧光粉层。采用环氧树脂或硅胶作为保护胶6具有高折射率和高透光率，可以增加LED的光通量，粘度小，易脱泡，适合灌封及模压成型，使LED有较好的耐久性和可靠性，利用该方法可以通过喷涂、旋涂或沉积等简单的方式就能实现同其他复杂远离涂覆技术相同的荧光粉远离涂覆的效果，同时使LED达到照度均匀性、高出光效率、色温控制和颜色均匀性控制等光学要求。
优选的，所述顶层生瓷片11厚度为40-60um，优选50um，采用填埋法的封装方式，使得温度传感器3与LED芯片4之间仅隔着一层50um生瓷片，能够灵敏感应LED芯片4温度的变化，当温度超过限定温度时，温度传感器3将信号传递给热保护IC2，由热保护IC2对输出电流进行分级下降调控，既保证及时降低LED光源的温度，又避免过快降低输出电流导致人眼可察觉的亮度变化，在不知不觉中达到过热保护的目的，进一步延长LED的寿命，减少光衰，提高光源的可靠性。
本发明还公开一种填埋热保护IC2的COB封装的封装方法，包括如下步骤：
采用激光技术或机械冲孔技术对生瓷片进行打孔所得到元件放置通孔94和导电通孔；将上下相邻两层生瓷片的导电通孔对齐，导电通孔填充导电材料8，如铜、铝、金或合金等金属 液，待其冷却后形成垂直的导电通路，元件放置通孔94用于放置热保护IC2以及温度传感器3，因此不对该通孔进行导电材料8填充。
采用机械轴压或液体等静压使第一功能生瓷片12、第三功能生瓷片14、第二功能生瓷片13粘贴牢固得到预制基板，将热保护IC2、温度传感器3放置在预制基板的元件放置通孔94中，其中热保护IC2位于元件放置通孔94中央，温度传感器3位于四周，保护IC以及温度传感器3的位置可根据需求做相应调动，温度传感器3的个数可为1个或多个，热保护IC2正负极通过导电通路与外部电源电连接，将绝缘导热树脂121填充到预制基板的元件放置通孔94并进行固化，采用机械轴压或液体等静压使顶层生瓷片11与预制基板粘贴牢固得到LTCC基板1。
采用丝网印刷或掩膜印刷法，将导电浆料印刷在LTCC基板1上表面，用以制作电气互联导线5，其中，电气互联导线5的排布方式具体根据LED芯片4的排列方式进行调整，最后将LED芯片4正负极通过金线10与电气互联导线5电连接。
采用旋涂、喷涂或印刷等方法在LED芯片4表面依次涂覆保护胶6、荧光粉胶7，最后安装外围光学元件9，完成一种填埋热保护IC2的COB封装。
实施例2：
本实施例与实施例1基本相同，区别之处在于：如图9-12所示，所述LTCC基板1包括自上至下依次设置的顶层生瓷片11、第一功能生瓷片12、第二功能生瓷片13，顶层生瓷片11设置至少一个第一导电通孔91，放置瓷片设置至少一个第二导电通孔92和所述元件放置通孔94、第二功能生瓷片13设置至少一个第三导电通孔93，将热保护IC2和温度传感器3放置在顶层生瓷片11下表面，所述元件放置通孔94可容置所述热保护IC2和温度传感器3。
本实施例通过在顶层生瓷片11上、下表面印刷有由导电浆料制成的电气互联导线5，其中，顶层生瓷片11上表面电气互联导线5的排布方式具体根据LED芯片4的排列方式进行调整，最后将LED芯片4正负极通过金线10与电气互联导线5互连；顶层生瓷片11下表面电气互联导线5的排布方式具体根据热保护IC2的位置进行调整，热保护IC2、温度传感器3放置在顶层生瓷片11下表面，利用固晶胶固定，通过金线10将热保护IC2与温度传感器3互连。
由于热保护IC2与温度传感器3放置在顶层生瓷片11下表面，不需要增设第三功能生瓷片14，节省了生产成本和制作工序；同时LED芯片4发出的热量沿垂直于壁面的方向传递，安装在顶层生瓷片11下表面的温度传感器3直接通过热传导方式可以更灵敏感应到LED芯片4温度的变化，当温度超过限定温度时，温度传感器3将信号传递给热保护IC2， 由热保护IC2对输出电流进行分级下降调控，既保证及时降低LED光源的温度，又避免过快降低输出电流导致人眼可察觉的亮度变化，在不知不觉中达到过热保护的目的，进一步延长LED的寿命，减少光衰，提高光源的可靠性。
本实施例的封装方式与实施例1基本相同，区别之处在于：
采用机械轴压或液体等静压使功能生瓷片粘贴牢固得到预制基板的步骤包括：
采用丝网印刷或掩膜印刷法将导电浆料印刷在顶层生瓷片11的上、下面表面，用以制作电气互联导线5；将热保护IC2和温度传感器3放置在顶层生瓷片11下表面，利用固晶胶固定，将热保护IC2与温度传感器3电连接；导电通孔填充导电材料8形成导电通路；采用机械轴压或液体等静压使第一功能生瓷片12、第二功能生瓷片13粘贴牢固得到预制基板。
当然，以上仅为本发明较佳实施方式，并非以此限定本发明的使用范围，故，凡是在本发明原理上做等效改变均应包含在本发明的保护范围内。

Claims (10)

  1. 一种填埋热保护IC的COB封装，包括LTCC基板(1)、热保护IC(2)、温度传感器(3)、LED芯片(4)，其特征在于：所述LTCC基板(1)由两层以上生瓷片叠压接而成，所述热保护IC(2)、温度传感器(3)设置在所述LTCC基板(1)中，所述LED芯片(4)固定于LTCC基板(1)上，所述温度传感器(3)与LED芯片(4)之间只隔一层生瓷片，所述热保护IC(2)分别与LED芯片(4)和温度传感器(3)电连接。
  2. 根据权利要求1所述的一种填埋热保护IC的COB封装，其特征在于：所述LTCC基板(1)印刷有由导电浆料制成的电气互联导线(5)，所述LED芯片(4)与LTCC基板(1)表面的电气互联导线(5)电连接。
  3. 根据权利要求2所述的一种填埋热保护IC的COB封装，其特征在于：所述LTCC基板(1)设置有元件放置通孔(94)、导电通孔，导电通孔中注入导电材料(8)。
  4. 根据权利要求1-3任意所述的一种填埋热保护IC的COB封装，其特征在于：所述LTCC基板(1)包括自上至下依次设置的顶层生瓷片(11)、第一功能生瓷片(12)、第二功能生瓷片(13)，顶层生瓷片(11)设置至少一个第一导电通孔(91)，放置瓷片设置至少一个第二导电通孔(92)和所述元件放置通孔(94)、第二功能生瓷片(13)设置至少一个第三导电通孔(93)，所述元件放置通孔(94)可容置所述热保护IC(2)和温度传感器(3)。
  5. 根据权利要求4任意所述的一种填埋热保护IC的COB封装，其特征在于：所述第一功能生瓷片(12)和第二功能生瓷片(13)之间还包括第三功能生瓷片(14)，所述第三功能生瓷片(14)设置至少四个第四导电通孔(95)，两个第四导电通孔(95)与热保护IC(2)正负极电连接并且与第三导电通孔(93)位置匹配，另外两个第四导电通孔(95)热保护IC(2)电流输出端、输入端电连接并且与第二导电通孔(92)位置匹配。
  6. 根据权利要求4所述的一种填埋热保护IC的COB封装，其特征在于：所述顶层生瓷片(11)的上、下面表面印刷有由导电浆料制成的电气互联导线(5)，热保护IC(2)、温度传感器(3)放置在顶层生瓷片(11)下表面，利用固晶胶固定，电气互联导线(5)依次连通所述热保护IC(2)的电源输入端和电源输出端、第一导电通孔(91)连接、第二导电通孔(92)，所述第二导电通孔(92)和第三导电通孔(93)个数相同且位置匹配。
  7. 根据权利要求4所述的一种填埋热保护IC的COB封装，其特征在于：所述LED芯片(4)表面覆盖保护胶(6)、荧光粉胶(7)。
  8. 一种填埋热保护IC的COB封装的封装方法，其特征在于：包括以下步骤：
    ①采用激光技术或机械冲孔技术对生瓷片进行打孔所得到元件放置通孔(94)和导电通孔的步骤；
    ②将上下相邻两层生瓷片的导电通孔对齐的步骤；
    ③采用机械轴压或液体等静压使功能生瓷片粘贴牢固得到预制基板的步骤包括：
    热保护IC(2)电流输出端、输入端通过导电通路与电气互联导线(5)电连接的步骤；
    热保护IC(2)正负极通过导电通路与外部电源电连接的步骤；
    将绝缘导热填充到预制基板的元件放置通孔(94)并进行固化的步骤；
    采用丝网印刷或掩膜印刷法，将导电浆料印刷在顶层生瓷片(11)上和/或下表面，用以制作电气互联导线(5)的步骤；
    采用机械轴压或液体等静压使预制基板和顶层生瓷片(11)粘贴牢固得到LTCC基板(1)的步骤；
    ④LED芯片(4)正负极通过金线(10)与电气互联导线(5)互连的步骤；
    ⑤采用旋涂、喷涂或印刷等方法在LED芯片(4)表面依次涂覆保护胶(6)、荧光粉胶(7)的步骤；
    ⑥LTCC基板(1)安装外围光学元件(9)得到填埋热保护IC(2)的COB封装的步骤。
  9. 根据权利要求8所述的一种填埋热保护IC的COB封装的封装方法，其特征在于：采用机械轴压或液体等静压使功能生瓷片粘贴牢固得到预制基板的步骤包括：
    将热保护IC(2)和温度传感器(3)放置在顶层生瓷片(11)下表面，利用固晶胶固定，将热保护IC(2)与温度传感器(3)电连接的步骤；
    导电通孔填充导电材料(8)形成导电通路的步骤；
    采用机械轴压或液体等静压使第一功能生瓷片(12)、第二功能生瓷片(13)粘贴牢固的步骤。
  10. 根据权利要求8所述的一种填埋热保护IC的COB封装的封装方法，其特征在于：采用机械轴压或液体等静压使功能生瓷片粘贴牢固得到预制基板的步骤包括：
    将第一功能生瓷片(12)、第三功能生瓷片(14)、第二功能生瓷片(13)的导电通孔两端对齐，填充导电材料(8)形成导电通路的步骤；
    将热保护IC(2)和温度传感器(3)放置在元件放置通孔(94)中，热保护IC(2)与温度传感器(3)电连接，其中温度传感器(3)位于热保护IC(2)四周位置的步骤；
    采用机械轴压或液体等静压使第一功能生瓷片(12)、第三功能生瓷片(14)、第二功能生瓷片(13)粘贴牢固的步骤。
PCT/CN2017/114920 2017-11-23 2017-12-07 一种填埋热保护ic的cob封装及其封装方法 WO2019100446A1 (zh)

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