CN102714212B - 固态图像拾取装置和图像拾取系统 - Google Patents
固态图像拾取装置和图像拾取系统 Download PDFInfo
- Publication number
- CN102714212B CN102714212B CN201080058034.6A CN201080058034A CN102714212B CN 102714212 B CN102714212 B CN 102714212B CN 201080058034 A CN201080058034 A CN 201080058034A CN 102714212 B CN102714212 B CN 102714212B
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- Prior art keywords
- substrate
- image pickup
- copper
- interconnection
- chip
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/026—Wafer-level processing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/184—Infrared image sensors
- H10F39/1843—Infrared image sensors of the hybrid type
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009296522A JP5489705B2 (ja) | 2009-12-26 | 2009-12-26 | 固体撮像装置および撮像システム |
| JP2009-296522 | 2009-12-26 | ||
| PCT/JP2010/007414 WO2011077709A1 (en) | 2009-12-26 | 2010-12-22 | Solid-state image pickup device and image pickup system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102714212A CN102714212A (zh) | 2012-10-03 |
| CN102714212B true CN102714212B (zh) | 2015-06-24 |
Family
ID=43650059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080058034.6A Active CN102714212B (zh) | 2009-12-26 | 2010-12-22 | 固态图像拾取装置和图像拾取系统 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8912578B2 (enExample) |
| EP (1) | EP2517248B1 (enExample) |
| JP (1) | JP5489705B2 (enExample) |
| CN (1) | CN102714212B (enExample) |
| WO (1) | WO2011077709A1 (enExample) |
Families Citing this family (41)
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| JP2011009645A (ja) * | 2009-06-29 | 2011-01-13 | Toshiba Corp | 半導体装置及びその製造方法 |
| WO2011077580A1 (ja) | 2009-12-26 | 2011-06-30 | キヤノン株式会社 | 固体撮像装置および撮像システム |
| JP2012015274A (ja) * | 2010-06-30 | 2012-01-19 | Canon Inc | 固体撮像装置、及び固体撮像装置の製造方法。 |
| JP2012124318A (ja) * | 2010-12-08 | 2012-06-28 | Sony Corp | 固体撮像素子の製造方法、固体撮像素子、および電子機器 |
| US9153490B2 (en) * | 2011-07-19 | 2015-10-06 | Sony Corporation | Solid-state imaging device, manufacturing method of solid-state imaging device, manufacturing method of semiconductor device, semiconductor device, and electronic device |
| JP2013077711A (ja) | 2011-09-30 | 2013-04-25 | Sony Corp | 半導体装置および半導体装置の製造方法 |
| JP5981711B2 (ja) | 2011-12-16 | 2016-08-31 | ルネサスエレクトロニクス株式会社 | 半導体装置および半導体装置の製造方法 |
| JP5970826B2 (ja) * | 2012-01-18 | 2016-08-17 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、固体撮像装置および電子機器 |
| JP6128787B2 (ja) | 2012-09-28 | 2017-05-17 | キヤノン株式会社 | 半導体装置 |
| JP2014099582A (ja) | 2012-10-18 | 2014-05-29 | Sony Corp | 固体撮像装置 |
| CN107359172B (zh) * | 2013-01-16 | 2021-01-19 | 索尼半导体解决方案公司 | 摄像装置 |
| JP2014199898A (ja) * | 2013-03-11 | 2014-10-23 | ソニー株式会社 | 固体撮像素子および製造方法、並びに、電子機器 |
| JP2015041677A (ja) * | 2013-08-21 | 2015-03-02 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP6217458B2 (ja) * | 2014-03-03 | 2017-10-25 | ソニー株式会社 | 半導体装置およびその製造方法、並びに電子機器 |
| JP6215246B2 (ja) * | 2014-05-16 | 2017-10-18 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および固体撮像素子の製造方法、並びに電子機器 |
| JP2016151523A (ja) * | 2015-02-18 | 2016-08-22 | 浜松ホトニクス株式会社 | 赤外線検出装置 |
| US12087629B2 (en) * | 2015-05-18 | 2024-09-10 | Adeia Semiconductor Technologies Llc | Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon |
| US9978791B2 (en) * | 2015-07-31 | 2018-05-22 | Taiwan Semiconductor Manufacturing Co., Ltd | Image sensor and method for manufacturing the same |
| JP2017204510A (ja) * | 2016-05-09 | 2017-11-16 | キヤノン株式会社 | 光電変換装置の製造方法 |
| CN109478578B (zh) * | 2016-07-27 | 2022-01-25 | 浜松光子学株式会社 | 光检测装置 |
| FR3059143B1 (fr) | 2016-11-24 | 2019-05-31 | Stmicroelectronics (Crolles 2) Sas | Puce de capteur d'image |
| US10431614B2 (en) * | 2017-02-01 | 2019-10-01 | Semiconductor Components Industries, Llc | Edge seals for semiconductor packages |
| US9929203B1 (en) * | 2017-04-27 | 2018-03-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device and method for fabricating thereof |
| JP7038494B2 (ja) * | 2017-06-15 | 2022-03-18 | ルネサスエレクトロニクス株式会社 | 固体撮像素子 |
| US10825854B2 (en) * | 2017-08-16 | 2020-11-03 | Facebook Technologies, Llc | Stacked photo sensor assembly with pixel level interconnect |
| US10522580B2 (en) * | 2017-08-23 | 2019-12-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Structure and formation method of light-sensing device |
| JP2017216480A (ja) * | 2017-09-01 | 2017-12-07 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| US11902696B2 (en) * | 2017-10-03 | 2024-02-13 | Sony Semiconductor Solutions Corporation | Infrared imaging device including drive and signal lines configured to electrically connect first and second substrates |
| JP6954337B2 (ja) * | 2017-11-10 | 2021-10-27 | 株式会社ニコン | 撮像装置及びカメラ |
| TWI886830B (zh) * | 2018-10-17 | 2025-06-11 | 日商索尼半導體解決方案公司 | 攝像元件及電子機器 |
| US11079282B2 (en) * | 2018-11-28 | 2021-08-03 | Semiconductor Components Industries, Llc | Flexible interconnect sensing devices and related methods |
| WO2020262559A1 (ja) * | 2019-06-26 | 2020-12-30 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| TWI867000B (zh) * | 2019-06-26 | 2024-12-21 | 日商索尼半導體解決方案公司 | 攝像裝置 |
| TWI888385B (zh) * | 2019-06-26 | 2025-07-01 | 日商索尼半導體解決方案公司 | 攝像裝置 |
| TWI861140B (zh) * | 2019-06-26 | 2024-11-11 | 日商索尼半導體解決方案公司 | 攝像裝置 |
| WO2021026865A1 (zh) * | 2019-08-15 | 2021-02-18 | 深圳市汇顶科技股份有限公司 | 一种芯片互连结构、芯片及芯片互连方法 |
| JP2021068758A (ja) * | 2019-10-18 | 2021-04-30 | ブリルニクス インク | 固体撮像装置、固体撮像装置の製造方法、および電子機器 |
| JP7283511B2 (ja) * | 2019-10-31 | 2023-05-30 | 株式会社ニコン | 撮像装置及びカメラ |
| JP7603382B2 (ja) * | 2019-11-18 | 2024-12-20 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子および撮像素子の製造方法 |
| CN110824328B (zh) * | 2019-11-21 | 2022-02-01 | 京东方科技集团股份有限公司 | 一种光电转换电路、其驱动方法及探测基板 |
| CN116711078A (zh) * | 2021-01-26 | 2023-09-05 | 索尼半导体解决方案公司 | 固态成像装置和电子设备 |
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| CN1728397A (zh) * | 2004-07-30 | 2006-02-01 | 索尼株式会社 | 半导体模块、固态图像拾取器件、摄像机及其制造方法 |
| CN1828918A (zh) * | 2005-01-27 | 2006-09-06 | 松下电器产业株式会社 | 固体摄像装置及其制造方法 |
| US20080224181A1 (en) * | 2007-03-14 | 2008-09-18 | Shinji Uya | Back irradiating type solid state imaging device |
| US20090224345A1 (en) * | 2006-06-19 | 2009-09-10 | Siliconfile Technologies Inc. | Image sensor using back-illuminated photodiode and method of manufacturing the same |
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| JPH069240B2 (ja) * | 1987-07-17 | 1994-02-02 | 三菱電機株式会社 | 半導体受光装置 |
| JPH07176688A (ja) * | 1993-12-20 | 1995-07-14 | Mitsubishi Electric Corp | 半導体集積回路 |
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-
2009
- 2009-12-26 JP JP2009296522A patent/JP5489705B2/ja active Active
-
2010
- 2010-12-22 WO PCT/JP2010/007414 patent/WO2011077709A1/en not_active Ceased
- 2010-12-22 EP EP10807492.3A patent/EP2517248B1/en active Active
- 2010-12-22 US US13/517,357 patent/US8912578B2/en active Active
- 2010-12-22 CN CN201080058034.6A patent/CN102714212B/zh active Active
-
2014
- 2014-11-17 US US14/543,237 patent/US9385152B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1728397A (zh) * | 2004-07-30 | 2006-02-01 | 索尼株式会社 | 半导体模块、固态图像拾取器件、摄像机及其制造方法 |
| CN1828918A (zh) * | 2005-01-27 | 2006-09-06 | 松下电器产业株式会社 | 固体摄像装置及其制造方法 |
| US20090224345A1 (en) * | 2006-06-19 | 2009-09-10 | Siliconfile Technologies Inc. | Image sensor using back-illuminated photodiode and method of manufacturing the same |
| US20080224181A1 (en) * | 2007-03-14 | 2008-09-18 | Shinji Uya | Back irradiating type solid state imaging device |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2517248A1 (en) | 2012-10-31 |
| US20120267690A1 (en) | 2012-10-25 |
| WO2011077709A1 (en) | 2011-06-30 |
| US20150138388A1 (en) | 2015-05-21 |
| JP2011138841A (ja) | 2011-07-14 |
| US9385152B2 (en) | 2016-07-05 |
| JP5489705B2 (ja) | 2014-05-14 |
| US8912578B2 (en) | 2014-12-16 |
| EP2517248B1 (en) | 2015-02-25 |
| CN102714212A (zh) | 2012-10-03 |
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