CN102683575B - 压电元件及包括压电元件的压电致动器和振动波马达 - Google Patents
压电元件及包括压电元件的压电致动器和振动波马达 Download PDFInfo
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- CN102683575B CN102683575B CN201210057521.1A CN201210057521A CN102683575B CN 102683575 B CN102683575 B CN 102683575B CN 201210057521 A CN201210057521 A CN 201210057521A CN 102683575 B CN102683575 B CN 102683575B
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 32
- 229910052709 silver Inorganic materials 0.000 claims description 32
- 239000004332 silver Substances 0.000 claims description 32
- 239000000654 additive Substances 0.000 claims description 14
- 239000012190 activator Substances 0.000 claims description 9
- 238000009766 low-temperature sintering Methods 0.000 claims description 9
- 230000000996 additive effect Effects 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 129
- 238000012360 testing method Methods 0.000 description 48
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 26
- 238000000280 densification Methods 0.000 description 22
- 230000010287 polarization Effects 0.000 description 21
- 239000000919 ceramic Substances 0.000 description 16
- 239000007772 electrode material Substances 0.000 description 14
- 229910052763 palladium Inorganic materials 0.000 description 13
- 238000001723 curing Methods 0.000 description 12
- 239000003795 chemical substances by application Substances 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000008878 coupling Effects 0.000 description 10
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- 238000005859 coupling reaction Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000005245 sintering Methods 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 5
- 229960004643 cupric oxide Drugs 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 4
- 229910000510 noble metal Inorganic materials 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 238000000227 grinding Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 230000000452 restraining effect Effects 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
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- 238000009413 insulation Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000005226 mechanical processes and functions Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
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- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
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- 230000009467 reduction Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- HCWZEPKLWVAEOV-UHFFFAOYSA-N 2,2',5,5'-tetrachlorobiphenyl Chemical compound ClC1=CC=C(Cl)C(C=2C(=CC=C(Cl)C=2)Cl)=C1 HCWZEPKLWVAEOV-UHFFFAOYSA-N 0.000 description 1
- 101100513612 Microdochium nivale MnCO gene Proteins 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000001354 calcination Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000001739 density measurement Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000004534 enameling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000013035 low temperature curing Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- 238000005549 size reduction Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N2/00—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction
- H02N2/10—Electric machines in general using piezoelectric effect, electrostriction or magnetostriction producing rotary motion, e.g. rotary motors
- H02N2/106—Langevin motors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
- H10N30/505—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view the cross-section being annular
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
Abstract
Description
Claims (8)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011052510A JP5786224B2 (ja) | 2011-03-10 | 2011-03-10 | 圧電素子、圧電素子を有する圧電アクチュエータおよび振動波モータ |
JP2011-052510 | 2011-03-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102683575A CN102683575A (zh) | 2012-09-19 |
CN102683575B true CN102683575B (zh) | 2014-12-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210057521.1A Active CN102683575B (zh) | 2011-03-10 | 2012-03-07 | 压电元件及包括压电元件的压电致动器和振动波马达 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8614536B2 (zh) |
JP (1) | JP5786224B2 (zh) |
CN (1) | CN102683575B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014170926A (ja) * | 2013-02-08 | 2014-09-18 | Canon Inc | 振動体、その製造方法、及び振動型駆動装置 |
JP6323863B2 (ja) * | 2013-12-24 | 2018-05-16 | 日本特殊陶業株式会社 | 圧電素子、圧電アクチュエータおよび圧電素子の製造方法 |
EP3480935B1 (en) * | 2016-06-30 | 2021-03-10 | Nikon Corporation | Vibration wave motor and optical device |
CN107070297B (zh) * | 2017-04-14 | 2019-03-29 | 哈尔滨工业大学 | 叠层式弯曲型压电陶瓷驱动器 |
USD1049063S1 (en) * | 2019-12-23 | 2024-10-29 | Tdk Corporation | Vibration element for an actuator |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5770916A (en) * | 1995-01-31 | 1998-06-23 | Canon Kabushiki Kaisha | Laminated piezoelectric element and vibration wave actuator |
CN1064940C (zh) * | 1995-12-20 | 2001-04-25 | 株式会社村田制作所 | 压电陶瓷组合物 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63156378A (ja) * | 1986-12-20 | 1988-06-29 | Toyota Motor Corp | 圧電積層体の製造方法 |
JP3103165B2 (ja) | 1991-10-15 | 2000-10-23 | 太平洋セメント株式会社 | 圧電体の製造方法 |
US5814919A (en) * | 1995-04-28 | 1998-09-29 | Canon Kabushiki Kaisha | Electro-mechanical energy conversion element and a vibration wave actuator using the electro-mechanical energy conversion element |
US6404104B1 (en) * | 1997-11-27 | 2002-06-11 | Canon Kabushiki Kaisha | Vibration type actuator and vibration type driving apparatus |
JP2001253772A (ja) * | 2000-03-10 | 2001-09-18 | Kyocera Corp | 圧電磁器組成物及びその製造方法 |
JP4854831B2 (ja) | 2000-03-17 | 2012-01-18 | 太平洋セメント株式会社 | 積層型圧電アクチュエータ |
JP2001352768A (ja) * | 2000-06-05 | 2001-12-21 | Canon Inc | 積層電気−機械エネルギー変換素子および振動波駆動装置 |
JP2003111450A (ja) | 2001-10-01 | 2003-04-11 | Canon Inc | 電気−機械エネルギー変換素子を振動源とする振動体、この振動体を駆動源とする振動波駆動装置、振動波駆動装置を有する駆動システムおよびこの振動体を搬送源とする搬送装置 |
JP2004002069A (ja) * | 2002-05-30 | 2004-01-08 | Tdk Corp | 圧電磁器の製造方法および圧電素子の製造方法 |
DE102005061528B8 (de) * | 2005-12-22 | 2010-06-10 | Siemens Ag | Piezokeramisches Bauteil mit Bleizirkonattitanat mit Eisen-Wolfram-Dotierung, Verfahren zum Herstellen des piezokeramischen Bauteils und seine Verwendung |
JP4942461B2 (ja) * | 2006-11-21 | 2012-05-30 | 京セラ株式会社 | セラミック電子部品及び噴射装置 |
-
2011
- 2011-03-10 JP JP2011052510A patent/JP5786224B2/ja active Active
-
2012
- 2012-02-29 US US13/408,564 patent/US8614536B2/en active Active
- 2012-03-07 CN CN201210057521.1A patent/CN102683575B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5770916A (en) * | 1995-01-31 | 1998-06-23 | Canon Kabushiki Kaisha | Laminated piezoelectric element and vibration wave actuator |
CN1064940C (zh) * | 1995-12-20 | 2001-04-25 | 株式会社村田制作所 | 压电陶瓷组合物 |
Non-Patent Citations (1)
Title |
---|
JP昭63-156378A 1988.06.29 * |
Also Published As
Publication number | Publication date |
---|---|
US20120228998A1 (en) | 2012-09-13 |
CN102683575A (zh) | 2012-09-19 |
JP2012191733A (ja) | 2012-10-04 |
JP5786224B2 (ja) | 2015-09-30 |
US8614536B2 (en) | 2013-12-24 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150910 Address after: Tokyo, Japan Patentee after: Canon K. K. Patentee after: Nihon Ceratec Co., Ltd. Address before: Tokyo, Japan Patentee before: Canon K. K. Patentee before: Taiheiyo Cement Corp. Patentee before: Nihon Ceratec Co., Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170313 Address after: Tokyo, Japan Patentee after: Canon K. K. Patentee after: Nippon Special Ceramic Co., Ltd. Address before: Tokyo, Japan Patentee before: Canon K. K. Patentee before: Nihon Ceratec Co., Ltd. |