CN102666660B - 用于高温磨耗应用的聚酰亚胺树脂 - Google Patents

用于高温磨耗应用的聚酰亚胺树脂 Download PDF

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Publication number
CN102666660B
CN102666660B CN201080048378.9A CN201080048378A CN102666660B CN 102666660 B CN102666660 B CN 102666660B CN 201080048378 A CN201080048378 A CN 201080048378A CN 102666660 B CN102666660 B CN 102666660B
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China
Prior art keywords
polyimide
weight
parts
aromatic
less
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Expired - Fee Related
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CN201080048378.9A
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English (en)
Chinese (zh)
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CN102666660A (zh
Inventor
J·G·莫拉莱斯
R·R·伯奇
L·阿布拉姆斯
T·D·克里赞
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EIDP Inc
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EI Du Pont de Nemours and Co
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Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1014—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)anhydrid
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CN201080048378.9A 2009-10-27 2010-10-27 用于高温磨耗应用的聚酰亚胺树脂 Expired - Fee Related CN102666660B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US25514509P 2009-10-27 2009-10-27
US61/255145 2009-10-27
US61/255,145 2009-10-27
PCT/US2010/054226 WO2011056634A2 (en) 2009-10-27 2010-10-27 Polyimide resins for high temperature wear applications

Publications (2)

Publication Number Publication Date
CN102666660A CN102666660A (zh) 2012-09-12
CN102666660B true CN102666660B (zh) 2015-01-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080048378.9A Expired - Fee Related CN102666660B (zh) 2009-10-27 2010-10-27 用于高温磨耗应用的聚酰亚胺树脂

Country Status (6)

Country Link
US (1) US8507615B2 (https=)
EP (1) EP2493961A4 (https=)
JP (1) JP5604524B2 (https=)
KR (1) KR20120113718A (https=)
CN (1) CN102666660B (https=)
WO (1) WO2011056634A2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8824945B2 (en) * 2011-02-09 2014-09-02 Xerox Corporation Metallic nanoparticle reinforced polyimide for fuser belt with high thermal conductivity
CN113685441B (zh) * 2013-12-31 2023-08-15 美国圣戈班性能塑料公司 具有聚酰亚胺基质的复合轴承
CA3059467A1 (en) 2017-04-26 2018-11-01 Henkel IP & Holding GmbH Silane modified polymers with improved properties
PL3619254T3 (pl) 2017-05-03 2023-10-02 Henkel Ag & Co. Kgaa Polimery zmodyfikowane silanem o udoskonalonej charakterystyce do kompozycji klejących
JP6938837B2 (ja) 2017-09-04 2021-09-22 エルジー・ケム・リミテッド フレキシブルディスプレイ素子基板用ポリイミドフィルム
KR102202054B1 (ko) 2018-01-22 2021-01-11 주식회사 엘지화학 액정 배향제 조성물, 이를 이용한 액정 배향막의 제조 방법, 및 이를 이용한 액정 배향막
CN112601917B (zh) * 2018-08-20 2025-05-27 大金工业株式会社 冷冻循环装置
CN112223131A (zh) * 2020-11-02 2021-01-15 惠州市新科磨具有限公司 耐磨薄片树脂切割片及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516837A (en) * 1989-11-30 1996-05-14 Mitsui Toatsu Chemicals, Inc. Polyimide based resin composition
CN1261382A (zh) * 1997-07-01 2000-07-26 纳幕尔杜邦公司 氧化稳定的刚性芳族聚酰亚胺组合物及其制备方法
CN1898753A (zh) * 2003-09-30 2007-01-17 通用电气公司 导电组合物、其制造方法以及由此种组合物衍生的制品

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179614A (en) * 1961-03-13 1965-04-20 Du Pont Polyamide-acids, compositions thereof, and process for their preparation
US3998786A (en) * 1973-05-25 1976-12-21 University Of Notre Dame Du Lac Process for preparing aromatic polyimides, polyimides prepared thereby
US4107125A (en) * 1976-07-01 1978-08-15 E. I. Du Pont De Nemours And Company Crosslinked aromatic polyimides and articles made therefrom
US4552931A (en) * 1984-09-11 1985-11-12 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Process of end-capping a polyimide system
US5116939A (en) * 1987-08-11 1992-05-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimide processing additives
US5055116A (en) * 1989-05-22 1991-10-08 Hoechst Celanese Corp. Gas separation membranes comprising miscible blends of polyimide polymers
JPH03215581A (ja) * 1990-01-19 1991-09-20 Daicel Chem Ind Ltd ポリイミド塗膜の密着性改良方法
US5115090A (en) * 1990-03-30 1992-05-19 Sachdev Krishna G Viscosity stable, essentially gel-free polyamic acid compositions
US6501934B1 (en) * 2000-10-26 2002-12-31 Xerox Corporation Transfer/transfuse member having increased durability
JP2004123857A (ja) * 2002-10-01 2004-04-22 Teijin Ltd ポリアミド酸組成物およびポリアミド酸の製造方法
US7265181B2 (en) * 2004-07-09 2007-09-04 E.I. Du Pont De Nemours And Company Polyimide cross-linked polymer and shaped article thereof
JP5343561B2 (ja) * 2006-07-23 2013-11-13 宇部興産株式会社 多成分ポリイミドからなるポリイミドフィルムの製造方法
US20080119616A1 (en) * 2006-11-22 2008-05-22 General Electric Company Polyimide resin compositions
JP4853534B2 (ja) * 2009-03-13 2012-01-11 富士ゼロックス株式会社 ポリアミック酸組成物、ポリイミド無端ベルト、定着装置および画像形成装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5516837A (en) * 1989-11-30 1996-05-14 Mitsui Toatsu Chemicals, Inc. Polyimide based resin composition
CN1261382A (zh) * 1997-07-01 2000-07-26 纳幕尔杜邦公司 氧化稳定的刚性芳族聚酰亚胺组合物及其制备方法
CN1898753A (zh) * 2003-09-30 2007-01-17 通用电气公司 导电组合物、其制造方法以及由此种组合物衍生的制品

Also Published As

Publication number Publication date
KR20120113718A (ko) 2012-10-15
EP2493961A4 (en) 2013-03-13
WO2011056634A2 (en) 2011-05-12
US8507615B2 (en) 2013-08-13
CN102666660A (zh) 2012-09-12
JP5604524B2 (ja) 2014-10-08
EP2493961A2 (en) 2012-09-05
WO2011056634A3 (en) 2011-09-22
US20120273731A1 (en) 2012-11-01
JP2013508534A (ja) 2013-03-07

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Granted publication date: 20150128

Termination date: 20161027

CF01 Termination of patent right due to non-payment of annual fee