CN102656952B - 组合式约束环装置及其方法 - Google Patents

组合式约束环装置及其方法 Download PDF

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Publication number
CN102656952B
CN102656952B CN201080042131.6A CN201080042131A CN102656952B CN 102656952 B CN102656952 B CN 102656952B CN 201080042131 A CN201080042131 A CN 201080042131A CN 102656952 B CN102656952 B CN 102656952B
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confinement
combined
confinement ring
region
conduction path
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Chinese (zh)
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CN102656952A (zh
Inventor
拉金德尔·德辛德萨
罗加罗马尼昂·卡利阿纳尔曼
萨斯安阿拉延安·玛尼
瓜塔姆·巴特查里亚
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Lam Research Corp
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Lam Research Corp
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32091—Radio frequency generated discharge the radio frequency energy being capacitively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H01J37/32449—Gas control, e.g. control of the gas flow
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • H01J37/32495—Means for protecting the vessel against plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
CN201080042131.6A 2009-09-28 2010-09-27 组合式约束环装置及其方法 Active CN102656952B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US24652609P 2009-09-28 2009-09-28
US61/246,526 2009-09-28
PCT/US2010/050401 WO2011038344A2 (en) 2009-09-28 2010-09-27 Unitized confinement ring arrangements and methods thereof

Publications (2)

Publication Number Publication Date
CN102656952A CN102656952A (zh) 2012-09-05
CN102656952B true CN102656952B (zh) 2016-10-12

Family

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Family Applications (1)

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CN201080042131.6A Active CN102656952B (zh) 2009-09-28 2010-09-27 组合式约束环装置及其方法

Country Status (8)

Country Link
US (2) US20110073257A1 (enExample)
EP (1) EP2484185A4 (enExample)
JP (2) JP5792174B2 (enExample)
KR (1) KR101711687B1 (enExample)
CN (1) CN102656952B (enExample)
SG (2) SG10201405469WA (enExample)
TW (1) TWI567818B (enExample)
WO (1) WO2011038344A2 (enExample)

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US20130059448A1 (en) * 2011-09-07 2013-03-07 Lam Research Corporation Pulsed Plasma Chamber in Dual Chamber Configuration
CN103854943B (zh) * 2012-11-30 2016-05-04 中微半导体设备(上海)有限公司 一种用于等离子体处理腔室的约束环及腔室清洁方法
CN103906336A (zh) * 2014-04-14 2014-07-02 中国科学院工程热物理研究所 压力温度可调的气体放电等离子体发生装置
CN105789008B (zh) * 2014-12-22 2017-12-19 中微半导体设备(上海)有限公司 等离子体处理装置及等离子体刻蚀方法
KR102552776B1 (ko) 2015-11-30 2023-07-10 (주)아모레퍼시픽 miRNA를 포함하는 흑색종 전이 억제용 조성물
US9953843B2 (en) * 2016-02-05 2018-04-24 Lam Research Corporation Chamber for patterning non-volatile metals
GB201603581D0 (en) * 2016-03-01 2016-04-13 Spts Technologies Ltd Plasma processing apparatus
JP7296829B2 (ja) * 2019-09-05 2023-06-23 東京エレクトロン株式会社 プラズマ処理装置、処理方法、上部電極構造
CN112713075B (zh) * 2019-10-25 2024-03-12 中微半导体设备(上海)股份有限公司 等离子体隔离环、等离子体处理装置与基片处理方法
CN113745081B (zh) * 2020-05-27 2024-03-12 中微半导体设备(上海)股份有限公司 一种隔离环组件、等离子体处理装置及处理方法
CN113808900B (zh) * 2020-06-17 2023-09-29 中微半导体设备(上海)股份有限公司 一种等离子体处理装置及其约束环组件与方法
CN114639585B (zh) * 2020-12-16 2025-02-14 中微半导体设备(上海)股份有限公司 约束环组件、等离子处理装置及其排气控制方法
CN115881506B (zh) * 2023-03-02 2023-06-27 深圳市新凯来技术有限公司 等离子体调节装置及半导体刻蚀设备

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US6602381B1 (en) * 2001-04-30 2003-08-05 Lam Research Corporation Plasma confinement by use of preferred RF return path
US20040108301A1 (en) * 1999-12-30 2004-06-10 Fangli Hao Linear drive system for use in a plasma processing system
JP2004311066A (ja) * 2003-04-02 2004-11-04 Sekisui Chem Co Ltd プラズマ処理装置
CN1675737A (zh) * 2002-06-27 2005-09-28 拉姆研究有限公司 电极同时响应于多频的等离子体处理器
US20060177600A1 (en) * 2005-02-08 2006-08-10 Applied Materials, Inc. Inductive plasma system with sidewall magnet
JP2007162131A (ja) * 2005-11-18 2007-06-28 Tokyo Electron Ltd 熱およびプラズマ増強蒸着のための装置および操作方法
US20080099120A1 (en) * 2006-10-16 2008-05-01 Lam Research Corporation, Fremont, California Usa. Quartz guard ring centering features

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JP3222859B2 (ja) * 1994-04-20 2001-10-29 東京エレクトロン株式会社 プラズマ処理装置
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JP3192370B2 (ja) * 1995-06-08 2001-07-23 東京エレクトロン株式会社 プラズマ処理装置
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JP3468446B2 (ja) * 1997-05-20 2003-11-17 東京エレクトロン株式会社 プラズマ処理装置
JP3972970B2 (ja) * 1998-08-06 2007-09-05 株式会社エフオーアイ プラズマリアクタ
KR19990036942U (ko) * 1999-05-01 1999-10-05 김시오 충격흡수를위한가이드레일
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JP2001185542A (ja) * 1999-12-27 2001-07-06 Hitachi Ltd プラズマ処理装置及びそれを用いたプラズマ処理方法
JP2002018276A (ja) * 2000-07-10 2002-01-22 Pearl Kogyo Kk 大気圧プラズマ処理装置
US6433484B1 (en) * 2000-08-11 2002-08-13 Lam Research Corporation Wafer area pressure control
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JP3660646B2 (ja) * 2002-04-25 2005-06-15 株式会社東芝 プラズマ処理装置
JP4286576B2 (ja) * 2003-04-25 2009-07-01 東京エレクトロン株式会社 プラズマ処理装置
US7276135B2 (en) * 2004-05-28 2007-10-02 Lam Research Corporation Vacuum plasma processor including control in response to DC bias voltage
JP5029041B2 (ja) * 2007-01-30 2012-09-19 Ｔｄｋ株式会社 プラズマｃｖｄ装置、及び、薄膜製造方法
CN102027574B (zh) * 2008-02-08 2014-09-10 朗姆研究公司 等离子体处理室部件的保护性涂层及其使用方法
TWI501704B (zh) * 2008-02-08 2015-09-21 Lam Res Corp 於電漿處理系統中用以改變面積比之方法與裝置

Patent Citations (7)

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Publication number Priority date Publication date Assignee Title
US20040108301A1 (en) * 1999-12-30 2004-06-10 Fangli Hao Linear drive system for use in a plasma processing system
US6602381B1 (en) * 2001-04-30 2003-08-05 Lam Research Corporation Plasma confinement by use of preferred RF return path
CN1675737A (zh) * 2002-06-27 2005-09-28 拉姆研究有限公司 电极同时响应于多频的等离子体处理器
JP2004311066A (ja) * 2003-04-02 2004-11-04 Sekisui Chem Co Ltd プラズマ処理装置
US20060177600A1 (en) * 2005-02-08 2006-08-10 Applied Materials, Inc. Inductive plasma system with sidewall magnet
JP2007162131A (ja) * 2005-11-18 2007-06-28 Tokyo Electron Ltd 熱およびプラズマ増強蒸着のための装置および操作方法
US20080099120A1 (en) * 2006-10-16 2008-05-01 Lam Research Corporation, Fremont, California Usa. Quartz guard ring centering features

Also Published As

Publication number Publication date
TW201133607A (en) 2011-10-01
SG10201405469WA (en) 2014-10-30
JP5792174B2 (ja) 2015-10-07
WO2011038344A3 (en) 2011-07-28
JP2015201653A (ja) 2015-11-12
KR101711687B1 (ko) 2017-03-02
KR20120088687A (ko) 2012-08-08
EP2484185A2 (en) 2012-08-08
WO2011038344A2 (en) 2011-03-31
TWI567818B (zh) 2017-01-21
CN102656952A (zh) 2012-09-05
JP2013506301A (ja) 2013-02-21
JP6204940B2 (ja) 2017-09-27
EP2484185A4 (en) 2014-07-23
US20110073257A1 (en) 2011-03-31
US20150325414A1 (en) 2015-11-12
SG178371A1 (en) 2012-03-29

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