CN102577635B - 光源模块和发光设备 - Google Patents

光源模块和发光设备 Download PDF

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CN102577635B
CN102577635B CN201080041630.3A CN201080041630A CN102577635B CN 102577635 B CN102577635 B CN 102577635B CN 201080041630 A CN201080041630 A CN 201080041630A CN 102577635 B CN102577635 B CN 102577635B
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light emitting
emitting module
light
light source
connector terminal
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CN102577635A (zh
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R.库尔特
C.斯洛布
M.A.德萨姆贝尔
Mj.F.M特拉克
G.库姆斯
E.伦德林克
M.J.J.范德卢贝
M.E.J.西普克斯
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Signify Holding BV
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Koninklijke Philips Electronics NV
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40Details of LED load circuits
    • H05B45/44Details of LED load circuits with an active control inside an LED matrix
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
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    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00Combination of light sources
    • F21Y2113/10Combination of light sources of different colours
    • F21Y2113/13Combination of light sources of different colours comprising an assembly of point-like light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133603Direct backlight with LEDs
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133602Direct backlight
    • G02F1/133612Electrical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
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    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L25/0753Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
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    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

一种发光模块(3a-c;23;26;33a-c)包括:多个光源(12a-e;27a-h),其设置在并排设置并且沿着发光模块(3a-c;23;26;33a-c)的第一延伸方向(X1)延伸的至少第一和第二列(18a-b;28a-c)中;以及多个连接器终端配对(13a-b,14a-b,15a-b,16a-b,17a-b),每个配对电连接到相应的光源(3a-c;23;26;33a-c)之一以便允许向其供应电力。每个连接器终端配对(13a-b,14a-b,15a-b,16a-b,17a-b)包括设置在发光模块(3a-c;23;26;33a-c)的相对侧的第一连接器终端(13a,14a,15a,16a,17a)和第二连接器终端(13b,14b,15b,16b,17b)。光源(12a-e;27a-h)以预定光源顺序沿着发光模块(3a-c;23;26;33a-c)的第一延伸方向(X1)设置,并且电连接到相应光源(12a-e;27a-h)的连接器终端配对(13a-b,14a-b,15a-b,16a-b,17a-b)以预定光源顺序沿着发光模块的第一延伸方向(X1)设置。

Description

光源模块和发光设备
技术领域
本发明涉及发光模块以及包括多个这样的发光模块的发光设备。 
背景技术
随着目前诸如发光二极管(LED)或固态激光器之类的小而紧凑的固态光源领域的进步,可以使用包括单独可控光源组的相对较大数量的小光源实现各种不同的光输出应用。这样的应用包括各种不同的光照应用,例如用于点光照(spot illumination)的系统、用于液晶面板的背光源等等。 
依照一种方法,可以将大量的光源设置在单个载体上。然而,由于这样的解决方案的内在的低成品率(yield)和差的可扩展性,因而提出了各种不同的模块概念。 
US7350937公开了一种用在LCD背光源中的照明模块,其是紧凑的并且具有高的组装密度。然而,看起来在依照US7350937的照明模块中包含的LED产生的热量驱散方面存在改进的空间。US2007/0080438公开了一种半导体发光设备,其包括在硅基板(submount)上的芯片LED。硅基板具有布线图案,该布线图案具有连接芯片LED的芯片连接终端部分、连接外部单元的外部连接终端部分以及多个连接相应芯片连接终端部分和相应外部连接终端部分的引线部分。依照US2007/0080438,芯片连接终端部分的面积制造得比其中芯片连接终端部分与芯片LED重叠的区域的面积更大,以便实现来自硅基板的上表面的热辐射。 
发明内容
鉴于以上所述,本发明的总体目的是提供一种改进的发光模块。 
依照本发明,提供了一种发光模块,该发光模块包括:多个光源,其设置在并排设置并且沿着发光模块的第一延伸方向延伸的至少第一和第二列中;以及多个连接器终端配对,每个配对电连接到相应的光源之一以便允许向其供应电力,每个连接器终端配对包括设置在发光模块的相对侧的第一连接器终端和第二连接器终端,其中光源以预定光源顺序沿着发光模块的第一延伸方向设置,其中电连接到相应光源的连接器终端配对以预定光源顺序沿着发光模块的第一延伸方向设置,并且其中光源被设置成使得发光模块的发光面积与总面积之比高于25%。 
应当理解的是,当在本申请中使用时,措词“列”涉及元件(尤其是光源)的直列式(in-line)排列,而不管该直列式排列的取向如何。“直列式”在本文中表示所有光源基本上沿着直线设置,离直线具有微小的偏差,例如相对于该直线具有小于一个光源的横向尺寸的移动。然而,在实践中,离直线的甚至更小的偏差可能是有利的,例如小于一个光源的横向尺寸的一半。 
本发明基于这样的认识,即可以通过以下方式提供用于可扩展发光系统的具有高组装密度和高可靠性的发光模块:至少在相对于彼此至少部分地偏移的列中设置发光模块中包含的光源,使得这些光源以给定顺序排列,并且以相同顺序设置连接器终端以便将光源连接到电源。 
因此,与通过将光源设置在单列中相比,可以实现高得多的组装密度。将光源设置在发光模块上,使得EPI相对覆盖区(footprint)之比高于25%。EPI相对覆盖区之比是发光模块的发光面积与总面积之比。通过依照本发明的不同实施例配置发光模块中的光源和连接器终端配对,可以使得光源产生的热量的驱散是如此高效,以至于EPI相对覆盖区之比的增大导致发光模块的亮度的相应增大。对于具有光源产生的热量的不充分驱散的现有技术发光模块而言,情况不是这样。 
此外,促进了若干相同发光模块的并排连接,因为不需要交叉连接。因此,无需用于处理交叉连接的连接器元件,这与需要邻近发光模块之间的交叉连接的发光模块相比,允许增大若干互连的发光模块的发光面积与总面积之比并且降低成本。 
而且,由于光源按顺序设置,因而光源与连接器终端之间的连接可以借助于设有用于将光源和连接器终端互连的单个导电层的衬底来实现。这允许使用高性能导热电路板,例如通过诸如印刷或薄膜技术之类的表面施加工艺由具有其上提供的导体图案的陶瓷衬底形成的电路板。 
依照本发明的不同实施例,发光模块中包含的光源可以是单独可控的。这意味着每个光源具有其自身的连接器终端配对,通过该连接器终端配对可单独地对其供电。发光模块可以进一步包括连接到一个或若干个其他的光源的附加光源,其因此可作为群组进行控制。 
单独可控光源可以有利地被配置成发射相互不同基色的光,这允许使用该发光模块或者彼此电连接的多个发光模块实现光的颜色可控输出。 
依照本发明的不同实施例,发光模块可以包括具有其上形成的导体图案的衬底,该导体图案被配置成将每个光源与和该光源相应的连接器终端配对的第一连接器终端和第二连接器终端中的至少一个互连。 
有利的是,导体图案的部分可以被配置成将每个光源与衬底互连以便形成光源与衬底之间的良好的热和机械接口。在一个优选的实施例中,将特定光源与衬底互连的导体图案的部分可以具有与该光源基本上相同的形状和尺寸。 
所述互连可以通过使用焊接连接实现,该焊接连接优选地包括Au和Sn,其优选地处于大约80%的Au和20%的Sn的比率,或者包括Sn、Au和Cu。 
此外,将设置在第一列中的光源之一与第一或第二连接器终端互连的导体图案的部分可以在设置在第二列中的两个相互邻近的光源之间穿过。 
而且,连接器终端配对可以被设置成在发光模块的每个相对侧沿着发光模块的第一延伸方向提供相应光源到正负电压的空间交替连接。 
连接器终端配对的这种设置提供了将光源的顶侧与连接器图案之间的所有互连设置成背离发光模块的边缘,这允许使用例如圆顶封装体(glob top)保护经常以灵敏接合线形式提供的来自光源顶侧的电连接,同时仍然允许完成的发光模块的功能测试。 
可替换地,连接器终端配对的这种设置提供了将光源的顶侧与连接器图案之间的所有互连设置成面向发光模块的边缘,这有利于使用例如拾放装备安装完成的发光模块。在这种情况下,可以拾取发光模块而不损坏经常以灵敏接合线形式提供的来自光源顶侧的连接。 
依照不同的实施例,发光模块中包含的光源可以有利地设置成使得存在被光源包围的未填充部分,其用于促进发光模块的自动安装。这样的自动安装可以例如使用适当的拾放装备而发生。依照一个实施例,所述未填充部分基本上位于模块的质心,这具有拾取期间力平衡的优点。因此,可以实现更加鲁棒和可靠的工艺。 
为了为用于执行上述自动安装的工具提供足够的空间,未填充部分可以具有直径为至少0.7mm、优选地直径为至少0.9mm的面积。依照一个实施例,所述未填充部分可以具有至少与发光模块中包含的光源之一占用的面积相应的面积。 
为了提供发光模块的发光面积与总面积之间的希望的高比率,发光模块可以有利地包括至少5个光源。所述至少5个光源可以设置在至少两列中。 
依照另一个实施例,所述发光模块可以包括至少8个光源,这些光源可以设置在至少3列中。 
此外,光源可以有利地为固态光源,例如发光二极管(LED)或固态激光器,由此可以实现非常紧凑而能量高效的发光模块。 
例如,发光模块可以包括一个或若干个来自包括直接发射器的光源组的光源,所述直接发射器例如基于InGaN和/或AlInGaP二极管的LED以及所谓的倒装芯片LED,优选地为薄膜倒装芯片LED。 
而且,发光模块可以包括将每个光源的至少一个电极与导体图案的适当部分电连接的接合线。有利的是,这些接合线中的至少一些可以直接附接到至少一个连接器终端。 
而且,发光模块可以有利地在第一延伸方向上比在与第一延伸方向垂直的第二延伸方向上具有更大的延伸。这种细长形状因子进一步对发光面积与总面积之间的高比率产生贡献。此外,该细长形状因子有利于以最小数量的导电层实现光源与连接器终端之间的电连接,这如上文中所讨论的允许实现对于光源产生的热量的改进的管理。 
依照一个示例性配置,发光模块可以基本上为矩形,具有沿着发光模块的长边缘设置的连接器终端。依照另一个实施例,发光模块可以基本上具有平行四边形形状。 
依照又一个实施例,可以向发光模块提供从衬底顶侧的导体图案经过衬底到达衬底底部的另一导体图案的电通孔。衬底底侧的导体图案可以有利地包括上述连接器终端配对,由此可以实现底部接触发光模块。此外,衬底底侧(背离光源的侧面)的导体图案可以有利地包括至少一个所谓的热垫,所述热垫基本上与光源相对地提供以便提供光源与散热结构之间的良好的热连接,热垫可以通过具有高热导率的诸如焊料之类的互连连接到所述散热结构。 
此外,可以在发光设备中包括多个依照本发明不同实施例的发光模块。这些发光模块可以有利地以平铺配置并排设置,并且经由连接器终端配对彼此电连接,由此提供电互连光源串。由于连接器终端配对以光源顺序设置,因而可以在没有任何交叉连接的情况下容易地并排设置和电互连发光模块。邻近发光模块之间的电互连可以例如通过接合线、带式接合(ribbon bond)、焊接、机械接触等等而实现。 
发光模块可以沿着直线并排设置,或者可以根据特定应用的要求相对于彼此稍微移动。 
适当地,这样的电互连光源串可以包括8-15个光源,优选地包括10-12个光源。 
此外,上述发光设备可以包括一个或若干个附加光源,例如各种不同类型的LED模块。可以有利地包含在发光设备中的一种这样的附加光源是磷光体转换LED。依照一个优选的实施例,所述附加光源可以有利地包括陶瓷上管芯(DoC)模块。 
而且,发光设备可以有利地包括至少两个相同颜色的上述电互连光源串以便提供充分的颜色混合。这可以通过使用具有相同颜色的适当设置的光源的发光模块或者通过使用若干组设置在一起的发光模块来实现。依照一个实施例,发光设备可以有利地包括至少3个相同颜色的上述电互连光源串以便提供进一步改进的颜色混合。 
通过由多个依照本发明不同实施例的发光模块形成发光设备,可以提供具有高成品率和有利的热管理特性的可扩展发光表面。 
为了导离光源产生的热量并且从而提供光源的改进的可靠性和寿命,发光设备可以进一步包括被设置成与发光模块热连接的散热结构。 
依照一个优选的实施例,散热结构可以至少部分地由铜制成,并且可以通过焊接界面直接附接到发光模块。 
而且,可以将发光模块装配到基于金属的IMS(绝缘金属衬底)或者包含Cu和/或Al的金属芯PCB上。在这种情况下,发光模块可以在其底侧具有金属化层。这使得将其焊接到所述IMS上更加容易。金属化层可以例如包含Au(经常也有Ti)。而且,优选地可以以这样的方式图案化金属化层,使得至少在光源之下的区域被覆盖以便提供光源与散热结构之间的良好的热接触。 
散热结构可以有利地在机械上结构化以便限定发光模块相对于彼此的位置。为此目的,可以例如向散热结构提供容纳发光模块的凹口和/或容纳电路板的凹口,其可以至少部分地包围发光模块以便提供外部电源到发光模块的连接。可替换地,可以向散热结构提供突起,这些突起具有与发光模块/设备相应的横向延伸和形状。当使用回流焊接或者适当的液体粘合剂将发光模块/设备附接到这些突起时,发光模块/设备通过毛细作用与突起对准,这允许实现发光模块/设备的非常精确的定位。 
而且,可以在光照设备中包括上述发光设备,所述光照设备进一步包括被设置成接收发光模块中包含的光源发射的光的管状反射器。 
附图说明
现在将参照示出本发明示例性实施例的附图更加详细地描述本发明的这些和其他方面,在附图中: 
图1为依照本发明实施例的光照系统的分解图;
图2为三个以平铺配置互连的依照本发明实施例的发光模块的透视图;
图3a-b示意性地示出了依照本发明的发光模块的两个另外的实施例;以及
图4示意性地示出了使用结构化散热结构定位发光模块。
具体实施方式
在以下描述中,参照包括发光设备的光照系统描述本发明,所述发光设备由多个并排设置且使用接合线电互连的发光模块形成,所述接合线将位于发光模块顶侧的接合垫形式的连接器终端互连。 
应当指出的是,这绝没有限制本发明的范围,本发明同样可适用于许多其他的发光模块配置以及发光设备中包含的发光模块之间的互连。例如,可以在发光模块的侧面或者在发光模块的底侧提供连接器终端。尤其是在当连接器终端位于发光模块的侧面时的情况下,可以通过形成焊接桥而实现邻近发光模块之间的电互连。这样的焊接桥可以与将发光模块附接到其载体同时地形成,所述载体可以是散热结构。 
图1为示意性地示出光照设备的分解图,该光照设备用于适合于诸如场景设置之类的气氛创建照明的点光照。光照设备1包括发光设备2、散热结构4、管状反射器5和漫射器6,所述发光设备包括多个发光模块3a-c(为了绘图清楚起见,仅仅给一些发光模块分配了附图标记)。 
发光设备2是由多个并排设置且互连的沿着其侧面没有交叉电连接的发光模块3a-c形成的可扩展系统。通过该配置,可以实现具有高生产成品率并结合发光面积与总面积之间的高比率的发光设备。 
发光设备的这些和另外的有利特性通过依照本发明不同实施例的发光模块3a-c而提供。 
转向图2,更详细地示出了图1中的发光模块3a-c(下面为了清楚起见将仅仅详细地讨论中心发光模块3b)。在图2示意性示出的示例性实施例中,发光模块3b包括衬底10、在衬底10上形成的导体图案11以及附接到衬底10并且电连接到导体图案11的五个单独可控LED 12a-e。LED 12a-e被配置成发射相互不同基色蓝色(B)(12a)、青色(C)(12b)、红色(R)(12c)、绿色(G)(12d)和深红色(dR)(12e)的光,并且导体图案11限定相应的连接器终端配对13a-b、14a-b、15a-b、16a-b和17a-b。在图2中可以看出,LED 12a-e设置在并排设置且沿着发光模块3b的第一延伸方向x1延伸的两列18a-b中。列18a-b以这样的方式相对于彼此偏移,使得LED 12a-e沿着发光模块的第一延伸方向x1以光源顺序12a/B、12b/C、12c/R、12d/G和12e/dR设置,并且相应的连接器终端配对13a-b、14a-b、15a-b、16a-b和17a-b以相同的顺序设置。 
通过研究图2可以理解的是,在两列18a-b中且处于LED 12a-e的顺序的这种设置以及将导体图案11配置成以相同的顺序限定连接器终端配对13a-b、14a-b、15a-b、16a-b和17a-b得到易于并排设置且电互连而无交叉连接导体的发光模块3a-c。此外,导体图案11的布线被简化并且允许实现发光模块3a-c的发光面积与总面积之间的高比率。而且,LED 12a-e与连接器终端配对13a-b、14a-b、15a-b、16a-b和17a-b之间的连接可以通过使用设置在衬底上的单个导电图案实现,这允许非常高效地通过衬底10将热量导离LED 12a-e到达散热结构4(图1)。 
在当前示出的实例中,衬底是陶瓷衬底并且LED作为裸露的管芯而被提供。此外,LED 11a-e通过底部连接器(图2中不可见)和接合线电连接到导体图案11,并且发光模块3a-c使用接合线而电互连。 
然而,应当指出的是,衬底可以是任何其他适当的衬底,例如由AlN、AlOx或Si制成的衬底,并且可以封装所述LED中的一个或若干个。 
图3a-b示意性地示出了依照本发明的发光模块的两个另外的实施例。 
首先转向图3a,其中示意性地示出的示例性发光模块23与图2中示出的发光模块3b的不同之处在于,LED 12a-e被设置成其顶侧连接背离发光模块23的侧面,并且导体图案11相应地被修改。因此,接合线连接与连接器终端13a-b、14a-b、15a-b、16a-b和17a-b相距一定距离,这有利于使用圆顶封装体或类似物(图3a中未示出)保护接合线,同时仍然允许在应用圆顶封装体之前以及之后通过探测连接器终端13a-b、14a-b、15a-b、16a-b和17a-b而测试发光模块23。 
图3b示意性地示出了另一个示例性发光模块26,在该发光模块上八个LED 27a-h设置在三列28a-c中。LED 27a-h在被配置成发射相互不同的基色的光的单独可控LED组中提供。如图3b中所示,这些LED中的四个27a、27c、27f和27h被配置成发射绿色(G)光,这些LED中的两个27b和27g被配置成发射蓝色(B)光,这些LED中的一个27d被配置成发射红色(R)光并且这些LED中的一个27e被配置成发射深红色(dR)光。 
在图3b中可以看出,被配置成发射具有相同颜色的光的一些LED彼此连接并且一起形成单独可控光源组。图3b的实施例中的单独可控光源组是绿色(G)LED 27a和27f、红色(R)LED 27d、蓝色(B)LED 27b和27g、深红色(dR)LED 27e以及绿色(G)LED 27c和27h。 
此外,图3b的示例性发光模块26中的LED 27a-h被设置成使得存在由LED 27a-h包围的未填充部分30,其用于促进发光模块26的安装。特别地,拾放工具可以在未填充部分30处拾取发光模块26。 
为了在诸如颜色混合和均匀性之类的因素方面获得图1中的光照设备1输出的光的最佳质量,其中包含的发光设备2应当至少相对于彼此并且有利地也相对于管状反射器5精确地定位。 
图4示意性地示出了依照本发明实施例的包括散热结构32的发光设备,该散热结构被结构化以便限定发光设备33a-c相对于彼此和相对于用于将发光设备33a-c连接到外部电源的印刷电路板(PCB)34的位置,每个发光设备包括多个互连发光模块。 
如图4中示意性地示出的,散热结构32设有一定数量的用于容纳发光设备32a-c的相对较浅的凹口35a-c以及用于容纳PCB 34的相对较深的凹口36,所述PCB在图4所示的示例性实施例中比发光设备32a-c厚得多。通过将发光设备32a-c和PCB 34装配到对应的凹口35a-c、36中,发光设备32a-c中包含的光源可以相对于彼此且相对于PCB 34精确而可靠地定位。 
此外,技术人员在实施要求保护的本发明时,根据对于所述附图、本公开以及所附权利要求书的研究,应当能够理解和实现所公开实施例的若干变型。在权利要求书中,措词“包括/包含”并没有排除其他的元件或步骤,并且不定冠词“一”并没有排除复数。单个处理器或其他单元可以实现权利要求中记载的若干项的功能。在相互不同的从属权利要求中记载特定技术措施这一事实并不意味着这些技术措施的组合不可以加以利用。 

Claims (15)

1.一种发光模块(3a-c;23;26;33a-c),包括:
多个光源(12a-e;27a-h),其设置在并排设置并且沿着所述发光模块(3a-c;23;26;33a-c)的第一延伸方向(x1)延伸的至少第一和第二列(18a-b;28a-c)中;以及
多个连接器终端配对(13a-b,14a-b,15a-b,16a-b,17a-b),每个配对电连接到相应的所述光源(3a-c;23;26;33a-c)之一以便允许向其供应电力,
每个连接器终端配对(13a-b,14a-b,15a-b,16a-b,17a-b)包括设置在所述发光模块(3a-c;23;26;33a-c)的相对侧的第一连接器终端(13a,14a,15a,16a,17a)和第二连接器终端(13b,14b,15b,16b,17b),
其中所述至少第一和第二列(18a-b;28a-c)相对于彼此至少部分地偏移,使得所述光源(12a-e;27a-h)以预定光源顺序沿着发光模块(3a-c;23;26;33a-c)的所述第一延伸方向(x1)设置并且促进若干个相同发光模块的并排连接,并且
其中电连接到所述相应光源(12a-e;27a-h)的所述连接器终端配对(13a-b,14a-b,15a-b,16a-b,17a-b)以所述预定光源顺序沿着发光模块的所述第一延伸方向(x1)设置。
2.如权利要求1所述的发光模块(3a-c;23;26;33a-c),其中所述光源(12a-e;27a-h)是单独可控的。
3.如权利要求1或2所述的发光模块(3a-c;23;26;33a-c),其中所述光源(12a-e;27a-h)被配置成发射相互不同基色的光。
4.如权利要求1所述的发光模块(3a-c;23;26;33a-c),包括具有其上形成的导体图案(11)的衬底(10),
该导体图案(11)被配置成将每个所述光源(12a-e;27a-h)与和该光源(12a-e;27a-h)相应的连接器终端配对(13a-b,14a-b,15a-b,16a-b,17a-b)的所述第一连接器终端(13a,14a,15a,16a,17a)和所述第二连接器终端(13b,14b,15b,16b,17b)中的至少一个互连。
5.如权利要求4所述的发光模块(3a-c;23;26;33a-c),其中将设置在所述第一列(18a;28b)中的所述光源之一与所述第一或第二连接器终端(13a-b,14a-b,15a-b,16a-b,17a-b)互连的所述导体图案(11)的部分在设置在所述第二列(18b;28c)中的两个相互邻近的光源之间穿过。
6.如权利要求1所述的发光模块(3a-c;23;26;33a-c),其中所述连接器终端配对(13a-b,14a-b,15a-b,16a-b,17a-b)被设置成在发光模块的每个所述相对侧沿着发光模块(3a-c;23;26;33a-c)的所述第一延伸方向(x1)提供相应光源(12a-e;27a-h)到正负电压的空间交替连接。
7.如权利要求1所述的发光模块(26),其中所述光源(27a-h)被设置成使得存在被光源(27a-h)包围的未填充部分(30),其用于促进发光模块(26)的自动安装。
8.如权利要求7所述的发光模块(26),其中所述未填充部分(30)具有至少与所述光源(27a-h)之一占用的面积的一半相应的面积。
9.如权利要求1所述的发光模块(3a-c;23;26;33a-c),包括至少5个光源(12a-e;27a-h)。
10.如权利要求1所述的发光模块(3a-c;23;26;33a-c),其中该发光模块在所述第一延伸方向(x1)上比在与所述第一延伸方向垂直的第二延伸方向上具有更大的延伸。
11.如权利要求10所述的发光模块(3a-c;23;26;33a-c),其中该发光模块为矩形。
12.一种发光设备(2;33a-c),包括多个如权利要求1-11中任何一项所述的发光模块(3a-c;23;26;33a-c),这些发光模块以平铺配置设置并且经由所述连接器终端配对(13a-b,14a-b,15a-b,16a-b,17a-b)彼此电连接。
13.如权利要求12所述的发光设备(2;33a-c),进一步包括被设置成与所述发光模块(3a-c;23;26;33a-c)热连接的散热结构(4;32)。
14.如权利要求13所述的发光设备(33a-c),其中所述散热结构(32)在机械上结构化以便限定发光模块(33a-c)相对于彼此的位置。
15.一种光照设备(1),包括:
如权利要求12-14中任何一项所述的发光设备(2);以及
被设置成接收光源发射的光的管状反射器(5)。
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