CN102576665A - 蒸镀气体供给装置 - Google Patents

蒸镀气体供给装置 Download PDF

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Publication number
CN102576665A
CN102576665A CN2010800375604A CN201080037560A CN102576665A CN 102576665 A CN102576665 A CN 102576665A CN 2010800375604 A CN2010800375604 A CN 2010800375604A CN 201080037560 A CN201080037560 A CN 201080037560A CN 102576665 A CN102576665 A CN 102576665A
Authority
CN
China
Prior art keywords
evaporation material
mentioned
vapor deposition
evaporation
gas supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800375604A
Other languages
English (en)
Chinese (zh)
Inventor
李炳一
朴暻完
康浩荣
金彻镐
宋钟镐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tera Semicon Corp
Terra Semiconductor Inc
Original Assignee
Terra Semiconductor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090079432A external-priority patent/KR101117662B1/ko
Priority claimed from KR1020090093425A external-priority patent/KR101117668B1/ko
Application filed by Terra Semiconductor Inc filed Critical Terra Semiconductor Inc
Publication of CN102576665A publication Critical patent/CN102576665A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
CN2010800375604A 2009-08-26 2010-08-25 蒸镀气体供给装置 Pending CN102576665A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR1020090079432A KR101117662B1 (ko) 2009-08-26 2009-08-26 증착가스 공급장치
KR10-2009-0079432 2009-08-26
KR1020090093425A KR101117668B1 (ko) 2009-09-30 2009-09-30 증착가스 공급장치
KR10-2009-0093425 2009-09-30
PCT/KR2010/005695 WO2011025256A2 (ko) 2009-08-26 2010-08-25 증착가스 공급장치

Publications (1)

Publication Number Publication Date
CN102576665A true CN102576665A (zh) 2012-07-11

Family

ID=43628591

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800375604A Pending CN102576665A (zh) 2009-08-26 2010-08-25 蒸镀气体供给装置

Country Status (4)

Country Link
JP (1) JP2013503256A (ko)
CN (1) CN102576665A (ko)
TW (1) TW201118195A (ko)
WO (1) WO2011025256A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101406702B1 (ko) 2012-09-20 2014-06-11 한국에너지기술연구원 소스 잔류물 배출형 셔터를 구비한 진공 증발원 및 이를 포함하는 증착 장비

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000000946A (ko) * 1998-06-05 2000-01-15 주재현 기화기 및 이를 사용한 화학 기상 증착장치
KR200173175Y1 (ko) * 1996-10-17 2000-03-02 김영환 액상반응원료의 기화장치
US20070079760A1 (en) * 2005-10-06 2007-04-12 Tsuneyuki Okabe Vaporizer and semiconductor processing system
KR20080098277A (ko) * 2007-05-04 2008-11-07 주식회사 테라세미콘 소스가스 공급장치 및 방법
CN101488449A (zh) * 2008-01-18 2009-07-22 东京毅力科创株式会社 包括汽化器的半导体处理系统及其使用方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2984085B2 (ja) * 1991-05-10 1999-11-29 日本電子株式会社 粉末供給装置
JP3380610B2 (ja) * 1993-11-30 2003-02-24 株式会社サムコインターナショナル研究所 液体原料ｃｖｄ装置
JPH10140334A (ja) * 1996-11-02 1998-05-26 Ricoh Co Ltd 蒸発材料供給装置
JPH10310863A (ja) * 1997-05-08 1998-11-24 Matsushita Electric Ind Co Ltd 機能性薄膜の形成方法及び形成装置
JPH11323557A (ja) * 1998-05-11 1999-11-26 Kansai Electric Power Co Inc:The 電気化学蒸着用原料気化装置、電気化学蒸着装置及びそれを用いた固体電解質成膜方法
KR100360494B1 (ko) * 1999-09-21 2002-11-13 삼성전자 주식회사 기화장치
US7993459B2 (en) * 2005-10-24 2011-08-09 Global Oled Technology Llc Delivering particulate material to a vaporization zone
US7638168B2 (en) * 2005-11-10 2009-12-29 Eastman Kodak Company Deposition system using sealed replenishment container

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200173175Y1 (ko) * 1996-10-17 2000-03-02 김영환 액상반응원료의 기화장치
KR20000000946A (ko) * 1998-06-05 2000-01-15 주재현 기화기 및 이를 사용한 화학 기상 증착장치
US20070079760A1 (en) * 2005-10-06 2007-04-12 Tsuneyuki Okabe Vaporizer and semiconductor processing system
KR20080098277A (ko) * 2007-05-04 2008-11-07 주식회사 테라세미콘 소스가스 공급장치 및 방법
CN101488449A (zh) * 2008-01-18 2009-07-22 东京毅力科创株式会社 包括汽化器的半导体处理系统及其使用方法

Also Published As

Publication number Publication date
JP2013503256A (ja) 2013-01-31
WO2011025256A2 (ko) 2011-03-03
WO2011025256A3 (ko) 2011-05-19
TW201118195A (en) 2011-06-01

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120711