WO2011025256A3 - 증착가스 공급장치 - Google Patents

증착가스 공급장치 Download PDF

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Publication number
WO2011025256A3
WO2011025256A3 PCT/KR2010/005695 KR2010005695W WO2011025256A3 WO 2011025256 A3 WO2011025256 A3 WO 2011025256A3 KR 2010005695 W KR2010005695 W KR 2010005695W WO 2011025256 A3 WO2011025256 A3 WO 2011025256A3
Authority
WO
WIPO (PCT)
Prior art keywords
deposition
deposition material
gas supply
unit
supply apparatus
Prior art date
Application number
PCT/KR2010/005695
Other languages
English (en)
French (fr)
Other versions
WO2011025256A2 (ko
Inventor
이병일
박경완
강호영
김철호
송종호
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090079432A external-priority patent/KR101117662B1/ko
Priority claimed from KR1020090093425A external-priority patent/KR101117668B1/ko
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to CN2010800375604A priority Critical patent/CN102576665A/zh
Priority to JP2012526650A priority patent/JP2013503256A/ja
Publication of WO2011025256A2 publication Critical patent/WO2011025256A2/ko
Publication of WO2011025256A3 publication Critical patent/WO2011025256A3/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
    • C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

반도체 소자나 평판 디스플레이 제조를 위한 박막 증착 공정 시에 매 증착 공정마다 균일한 양의 증착가스가 공급될 수 있도록 하는 증착가스 공급장치가 개시된다. 본 발명에 따른 증착가스 공급장치(100)는, 증착물질이 저장되는 증착물질 저장부(200), 증착물질에 열을 인가하여 증착가스를 발생시키는 증착물질 증발부(300) 및 운반가스를 공급하는 운반가스 공급부(400)를 포함하는 증착가스 공급장치(100)로서, 증착물질 저장부(200)와 증착물질 증발부(300) 사이에 배치되는 증착물질 공급부(500)를 더 포함하고, 증착물질 공급부(500)는 매 증착 공정 마다 증착물질 증발부(300)로 일정 양의 증착물질을 공급하는 것을 특징으로 한다.
PCT/KR2010/005695 2009-08-26 2010-08-25 증착가스 공급장치 WO2011025256A2 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010800375604A CN102576665A (zh) 2009-08-26 2010-08-25 蒸镀气体供给装置
JP2012526650A JP2013503256A (ja) 2009-08-26 2010-08-25 蒸着ガス供給装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2009-0079432 2009-08-26
KR1020090079432A KR101117662B1 (ko) 2009-08-26 2009-08-26 증착가스 공급장치
KR10-2009-0093425 2009-09-30
KR1020090093425A KR101117668B1 (ko) 2009-09-30 2009-09-30 증착가스 공급장치

Publications (2)

Publication Number Publication Date
WO2011025256A2 WO2011025256A2 (ko) 2011-03-03
WO2011025256A3 true WO2011025256A3 (ko) 2011-05-19

Family

ID=43628591

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/005695 WO2011025256A2 (ko) 2009-08-26 2010-08-25 증착가스 공급장치

Country Status (4)

Country Link
JP (1) JP2013503256A (ko)
CN (1) CN102576665A (ko)
TW (1) TW201118195A (ko)
WO (1) WO2011025256A2 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101406702B1 (ko) 2012-09-20 2014-06-11 한국에너지기술연구원 소스 잔류물 배출형 셔터를 구비한 진공 증발원 및 이를 포함하는 증착 장비

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20000000946A (ko) * 1998-06-05 2000-01-15 주재현 기화기 및 이를 사용한 화학 기상 증착장치
KR200173175Y1 (ko) * 1996-10-17 2000-03-02 김영환 액상반응원료의 기화장치
JP2007103801A (ja) * 2005-10-06 2007-04-19 Tokyo Electron Ltd 気化装置、成膜装置及び気化方法
KR20080098277A (ko) * 2007-05-04 2008-11-07 주식회사 테라세미콘 소스가스 공급장치 및 방법
JP2009170800A (ja) * 2008-01-18 2009-07-30 Tokyo Electron Ltd 気化原料供給装置、成膜装置及び気化原料供給方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2984085B2 (ja) * 1991-05-10 1999-11-29 日本電子株式会社 粉末供給装置
JP3380610B2 (ja) * 1993-11-30 2003-02-24 株式会社サムコインターナショナル研究所 液体原料ｃｖｄ装置
JPH10140334A (ja) * 1996-11-02 1998-05-26 Ricoh Co Ltd 蒸発材料供給装置
JPH10310863A (ja) * 1997-05-08 1998-11-24 Matsushita Electric Ind Co Ltd 機能性薄膜の形成方法及び形成装置
JPH11323557A (ja) * 1998-05-11 1999-11-26 Kansai Electric Power Co Inc:The 電気化学蒸着用原料気化装置、電気化学蒸着装置及びそれを用いた固体電解質成膜方法
KR100360494B1 (ko) * 1999-09-21 2002-11-13 삼성전자 주식회사 기화장치
US7993459B2 (en) * 2005-10-24 2011-08-09 Global Oled Technology Llc Delivering particulate material to a vaporization zone
US7638168B2 (en) * 2005-11-10 2009-12-29 Eastman Kodak Company Deposition system using sealed replenishment container

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200173175Y1 (ko) * 1996-10-17 2000-03-02 김영환 액상반응원료의 기화장치
KR20000000946A (ko) * 1998-06-05 2000-01-15 주재현 기화기 및 이를 사용한 화학 기상 증착장치
JP2007103801A (ja) * 2005-10-06 2007-04-19 Tokyo Electron Ltd 気化装置、成膜装置及び気化方法
KR20080098277A (ko) * 2007-05-04 2008-11-07 주식회사 테라세미콘 소스가스 공급장치 및 방법
JP2009170800A (ja) * 2008-01-18 2009-07-30 Tokyo Electron Ltd 気化原料供給装置、成膜装置及び気化原料供給方法

Also Published As

Publication number Publication date
CN102576665A (zh) 2012-07-11
WO2011025256A2 (ko) 2011-03-03
JP2013503256A (ja) 2013-01-31
TW201118195A (en) 2011-06-01

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