WO2010056057A3 - Deposition material supply apparatus and substrate treatment apparatus having the same - Google Patents

Deposition material supply apparatus and substrate treatment apparatus having the same Download PDF

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Publication number
WO2010056057A3
WO2010056057A3 PCT/KR2009/006671 KR2009006671W WO2010056057A3 WO 2010056057 A3 WO2010056057 A3 WO 2010056057A3 KR 2009006671 W KR2009006671 W KR 2009006671W WO 2010056057 A3 WO2010056057 A3 WO 2010056057A3
Authority
WO
WIPO (PCT)
Prior art keywords
raw material
storage space
deposition material
supplying device
space
Prior art date
Application number
PCT/KR2009/006671
Other languages
French (fr)
Other versions
WO2010056057A2 (en
Inventor
Hyung Seok Yoon
Sang Hwa Choi
Sung Kwan Son
Chang Ho Kang
Hyun Goo Kwon
Sung Tae Namgoong
Kyung Rok Han
Original Assignee
Snu Precision Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Snu Precision Co., Ltd. filed Critical Snu Precision Co., Ltd.
Priority to CN2009801464693A priority Critical patent/CN102216488A/en
Priority to JP2011536246A priority patent/JP5406304B2/en
Publication of WO2010056057A2 publication Critical patent/WO2010056057A2/en
Publication of WO2010056057A3 publication Critical patent/WO2010056057A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/544—Controlling the film thickness or evaporation rate using measurement in the gas phase
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Provided are a deposition material supplying device and a substrate processing apparatus including the deposition material supplying device, which store a large amount of organic material without deteriorating the organic material and vaporize a desired amount of the organic material to a substrate. The deposition material supplying device includes: a pot in which a storage space filled with raw material communicates with a vaporization space where the raw material is vaporized; a transporting unit configured to continuously or periodically transport the raw material filling the storage space to the vaporization space; a heating unit disposed on an outside of the vaporization space of the pot to supply heat vaporizing the raw material; and a cooling unit disposed on an outside of the storage space to prevent the raw material stored in the storage space from being thermally deteriorated.
PCT/KR2009/006671 2008-11-17 2009-11-13 Deposition material supply apparatus and substrate treatment apparatus having the same WO2010056057A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2009801464693A CN102216488A (en) 2008-11-17 2009-11-13 Deposition material supply apparatus and substrate treatment apparatus having the same
JP2011536246A JP5406304B2 (en) 2008-11-17 2009-11-13 Vapor deposition material supply apparatus and substrate processing apparatus provided with the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080113866A KR100926437B1 (en) 2008-11-17 2008-11-17 Deposition material supply apparatus and Equipment for treating substrate having the same
KR10-2008-0113866 2008-11-17

Publications (2)

Publication Number Publication Date
WO2010056057A2 WO2010056057A2 (en) 2010-05-20
WO2010056057A3 true WO2010056057A3 (en) 2010-07-08

Family

ID=41561614

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/006671 WO2010056057A2 (en) 2008-11-17 2009-11-13 Deposition material supply apparatus and substrate treatment apparatus having the same

Country Status (5)

Country Link
JP (1) JP5406304B2 (en)
KR (1) KR100926437B1 (en)
CN (1) CN102216488A (en)
TW (1) TWI397202B (en)
WO (1) WO2010056057A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101084234B1 (en) 2009-11-30 2011-11-16 삼성모바일디스플레이주식회사 Deposition source, Deposition apparatus using the same and method for forming thin film
KR101172275B1 (en) * 2009-12-31 2012-08-08 에스엔유 프리시젼 주식회사 Vaporizing apparatus and control method for the same
WO2011126132A1 (en) * 2010-04-09 2011-10-13 株式会社ニコン Substrate processing device
JP5674431B2 (en) * 2010-11-17 2015-02-25 株式会社アルバック Thin film forming equipment
WO2012081738A1 (en) * 2010-12-13 2012-06-21 Posco Continuous coating apparatus
KR20120116720A (en) * 2011-04-13 2012-10-23 에스엔유 프리시젼 주식회사 Apparatus for supplying materials
KR101233629B1 (en) * 2011-04-13 2013-02-15 에스엔유 프리시젼 주식회사 Large capacity depositing apparatus for forming thin film
KR101052435B1 (en) * 2011-04-13 2011-07-28 에스엔유 프리시젼 주식회사 Depositing apparatus for forming thin film
KR101174633B1 (en) 2011-05-12 2012-08-17 에스엔유 프리시젼 주식회사 Apparatus for supplying materials
KR101320434B1 (en) * 2011-05-12 2013-10-23 에스엔유 프리시젼 주식회사 Apparatus for controlling supply of materials
KR101754356B1 (en) * 2011-12-15 2017-07-07 주식회사 원익아이피에스 Evaporating source, deposition material supply apparatus and deposition apparatus comprising the same
KR101418714B1 (en) * 2012-09-13 2014-07-10 주식회사 선익시스템 Evaporation source and Apparatus for deposition having the same
KR101418712B1 (en) 2012-09-14 2014-07-10 주식회사 선익시스템 Evaporation source and Apparatus for deposition having the same
KR101422533B1 (en) * 2012-12-04 2014-07-24 주식회사 선익시스템 A Linear Type Evaporator with a Mixing Zone
CN105814231B (en) * 2013-12-10 2020-03-06 应用材料公司 Evaporation source for organic material, deposition apparatus for depositing organic material in vacuum chamber, and method of evaporating organic material
KR102313597B1 (en) * 2014-12-30 2021-10-18 (주)선익시스템 A Deposition Source Having Cooling Device
CN106906445B (en) * 2017-03-29 2019-02-12 武汉华星光电技术有限公司 A kind of evaporation source
KR102203725B1 (en) * 2018-11-29 2021-01-15 주식회사 선익시스템 Apparatus for thin film deposition

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100397196B1 (en) * 2002-08-27 2003-09-13 에이엔 에스 주식회사 Organic material point source feeding unit in organic semiconductor device and method thereof
KR100647585B1 (en) * 2003-10-15 2006-11-17 삼성에스디아이 주식회사 Effusion cell and method for depositing substrate with the effusion cell
KR100659762B1 (en) * 2005-01-17 2006-12-19 삼성에스디아이 주식회사 Vapor deposition source and evaporating apparatus and method for deposition using the same
KR20080007110A (en) * 2006-07-13 2008-01-17 캐논 가부시끼가이샤 Deposition apparatus
JP2008007858A (en) * 2006-06-03 2008-01-17 Applied Materials Gmbh & Co Kg Organic evaporator, coating installation, and method for use thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000007858A (en) * 1998-06-18 2000-01-11 Showa Electric Wire & Cable Co Ltd Thermoplastic elastomer composition
JP4494126B2 (en) * 2003-08-15 2010-06-30 株式会社半導体エネルギー研究所 Film forming apparatus and manufacturing apparatus
JP4462989B2 (en) * 2004-04-14 2010-05-12 日立造船株式会社 Vapor deposition equipment
DE502006001507D1 (en) * 2006-06-03 2008-10-16 Applied Materials Gmbh & Co Kg Apparatus for vaporizing materials with an evaporator tube

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100397196B1 (en) * 2002-08-27 2003-09-13 에이엔 에스 주식회사 Organic material point source feeding unit in organic semiconductor device and method thereof
KR100647585B1 (en) * 2003-10-15 2006-11-17 삼성에스디아이 주식회사 Effusion cell and method for depositing substrate with the effusion cell
KR100659762B1 (en) * 2005-01-17 2006-12-19 삼성에스디아이 주식회사 Vapor deposition source and evaporating apparatus and method for deposition using the same
JP2008007858A (en) * 2006-06-03 2008-01-17 Applied Materials Gmbh & Co Kg Organic evaporator, coating installation, and method for use thereof
KR20080007110A (en) * 2006-07-13 2008-01-17 캐논 가부시끼가이샤 Deposition apparatus

Also Published As

Publication number Publication date
CN102216488A (en) 2011-10-12
KR100926437B1 (en) 2009-11-13
TWI397202B (en) 2013-05-21
JP5406304B2 (en) 2014-02-05
WO2010056057A2 (en) 2010-05-20
JP2012508815A (en) 2012-04-12
TW201036227A (en) 2010-10-01

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