WO2010056057A2 - Deposition material supply apparatus and substrate treatment apparatus having the same - Google Patents
Deposition material supply apparatus and substrate treatment apparatus having the same Download PDFInfo
- Publication number
- WO2010056057A2 WO2010056057A2 PCT/KR2009/006671 KR2009006671W WO2010056057A2 WO 2010056057 A2 WO2010056057 A2 WO 2010056057A2 KR 2009006671 W KR2009006671 W KR 2009006671W WO 2010056057 A2 WO2010056057 A2 WO 2010056057A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- raw material
- pot
- supplying device
- space
- storage space
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 111
- 230000008021 deposition Effects 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 title claims abstract description 43
- 239000002994 raw material Substances 0.000 claims abstract description 91
- 239000011368 organic material Substances 0.000 claims abstract description 55
- 230000008016 vaporization Effects 0.000 claims abstract description 55
- 238000009834 vaporization Methods 0.000 claims abstract description 47
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 238000001816 cooling Methods 0.000 claims abstract description 24
- 238000002347 injection Methods 0.000 claims description 16
- 239000007924 injection Substances 0.000 claims description 16
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000002826 coolant Substances 0.000 claims description 3
- 230000002542 deteriorative effect Effects 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 description 35
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 14
- 230000032258 transport Effects 0.000 description 11
- 230000003028 elevating effect Effects 0.000 description 7
- 230000003247 decreasing effect Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 230000009466 transformation Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 235000012489 doughnuts Nutrition 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/544—Controlling the film thickness or evaporation rate using measurement in the gas phase
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
Definitions
- the present disclosure relates to a deposition material supply apparatus and a substrate treatment apparatus having the deposition material supply apparatus, and more particularly, to a deposition material supply apparatus and a substrate treatment apparatus including the deposition material supply apparatus, which store a large amount of organic material without deteriorating the organic material and vaporize a desired amount of the organic material to a substrate.
- OLEDs organic light emitting devices
- LCDs organic light emitting devices
- organic material used in an organic thin layer depositing process for fabricating OLEDs do not require a high vapor pressure, and is easily transformed and decomposed at a high temperature. Because of such characteristics of organic material, a related art organic thin layer is formed by loading organic material in a pot formed of tungsten, heating the pot to vaporize the organic material and deposit the organic material on a substrate. However, since the amount of deposition material stored in a pot is limited, deposition material should be frequently loaded in the pot, so that an organic thin layer depositing device should be frequently stopped. To extend an operation stop period of an organic thin layer depositing device, a load amount of raw material is increased. In this case, the amount of heat generated from a heating member is increased to heat a large pot for storing the raw material and vaporizing the raw material, so that the raw material to be deposited is deteriorated.
- the present disclosure provides a deposition material supplying device and a substrate processing apparatus including the deposition material supplying device, which store a large amount of organic material to extend an operation stop period of a depositing device, and prevent the organic material from being deteriorated.
- the present disclosure also provides a deposition material supplying device and a substrate processing apparatus including the deposition material supplying device, which vaporize a desired amount of stored organic material at a desired speed to prevent uneven diffusion of the vaporized organic material.
- a deposition material supplying device includes: a pot in which a storage space filled with raw material communicates with a vaporization space where the raw material is vaporized; a transporting unit configured to continuously or periodically transport the raw material filling the storage space to the vaporization space; and a heating unit disposed on an outside of the vaporization space of the pot to supply heat vaporizing the raw material.
- the deposition material supplying device may further include a cooling unit that is disposed on an outside of the storage space of the pot to prevent the raw material stored in the storage space from being thermally deteriorated.
- the cooling unit may include a cooling jacket that includes a cooling passage surrounding an outer surface of the pot, and a coolant flows in the cooling passage.
- the deposition material supplying device may further include a connecting pipe having a first side connected to the vaporization space of the pot to form a passage where the vaporized raw material flows; and an injector connected to a second side of the connecting pipe to inject the vaporized raw material.
- the deposition material supplying device may further include a supporting part integrally supporting the pot, the transporting unit, and the injector, wherein the supporting part is installed on a rail extending in a direction in which the injector is oriented, and movable along the rail.
- the first side of the connecting pipe may be connected with a coupling member that is screw-coupled to the pot.
- the connecting pipe may have a diameter ranging from approximately 20 mm to approximately 200 mm.
- the deposition material supplying device may further include an injection amount measuring sensor configured to measure an injection amount of the raw material injected from the injector, wherein the deposition material supplying device controls an operation of the transporting unit according to the injection amount of the raw material measured by the injection amount measuring sensor, so as to adjust the injection amount of the raw material.
- An inner wall of the vaporization space of the pot may be provided with a metal sheet.
- the transporting unit may include: a head disposed in the pot to push the raw material; a rod having a first side connected to the head and a second side disposed on an outside of the pot, the rod moving integrally with the head; and a driving part connected to the second side of the rod to move the rod.
- the driving part may include one of a motor and a hydraulic cylinder.
- the heating unit may include one of a core heater and a lamp heater.
- a substrate processing apparatus includes: a chamber having a reaction space; an organic material supplying part disposed in the reaction space to supply raw material to be vaporized; and a substrate holder supporting a substrate, wherein the organic material supplying part includes: a pot in which a storage space filled with the raw material communicates with a vaporization space where the raw material is vaporized; a transporting unit configured to continuously or periodically transport the raw material filling the storage space to the vaporization space; a heating unit disposed on an outside of the vaporization space of the pot to supply heat, vaporizing the raw material, to the vaporization space; a connecting pipe having a first side connected to the vaporization space of the pot to form a passage where the vaporized raw material flows; and an injector connected to a second side of the connecting pipe and facing the substrate holder, the injector being configured to inject the vaporized raw material to the substrate.
- the substrate processing apparatus may further include a cooling unit that is disposed on an outside of the storage space of the pot to prevent the raw material stored in the storage space from being thermally deteriorated.
- the chamber may be divided into a plurality of reaction spaces, the organic material supplying part may be provided in plurality to be respectively disposed in the reaction spaces of the chamber, and the substrate holder may be transported to face each of the organic material supplying parts.
- the cooling unit prevents organic material filling the storage space from being deteriorated by heat, a large amount of organic material can be stored in the deposition material supplying device, so as to extend an operation stop period of the device. As such, process efficiency of organic thin film deposition can be improved.
- FIG. 1 is a schematic view illustrating a system including a substrate processing apparatus in accordance with an exemplary embodiment
- FIG. 2 is a cross-sectional view illustrating a substrate processing apparatus in accordance with an exemplary embodiment
- FIG. 3 is a cross-sectional view illustrating a deposition material supplying device in accordance with an exemplary embodiment
- FIGS. 4 and 5 are cross-sectional views illustrating a deposition material supplying device in use in accordance with an exemplary embodiment. Mode for the Invention
- FIG. 1 is a schematic view illustrating a substrate processing system including a substrate processing apparatus in accordance with an exemplary embodiment.
- FIG. 2 is a cross-sectional view illustrating the substrate processing apparatus.
- the substrate processing system is used in an in-line manner to rapidly process a large number of substrates 10.
- the substrate processing system includes a loading section 1000 to which the substrate 10 is loaded, an unloading section 5000 spaced apart from the loading section 1000, and a plurality of substrate processing sections 3000a, 3000b, and 3000c disposed in line between the loading section 1000 and the unloading section 5000 to process the substrates 10.
- the substrate 10 is unloaded from the unloading section 5000 after a process.
- the substrate processing system further includes a process preparing section 2000 and an unloading preparing section 4000.
- the process preparing section 2000 is disposed at the front end of the substrate processing sections 3000a, 3000b, and 3000c to place and align the substrate 10 to be loaded to the substrate processing sections 3000a, 3000b, and 3000c, on a substrate holder 200.
- the unloading preparing section 4000 is disposed at the rear end of the substrate processing sections 3000a, 3000b, and 3000c to remove the substrate 10 from the substrate holder 200 to transport the substrate 10 to the unloading section 5000 after a process.
- the loading section 1000 disposed at a first end of the substrate processing system is a space where the substrates 10 on which organic thin layers are deposited wait.
- a substrate cassette on which the substrates 10 are loaded, and a buffer stage where the substrate 10 unloaded from the cassette waits for a depositing process are installed in the loading section 1000.
- the substrate processing sections 3000a, 3000b, and 3000c disposed between the loading section 1000 and the unloading section 5000 are spaces where organic thin layers are deposited, and include a chamber 400 having one or more reaction spaces, one or more organic material supplying parts 100 corresponding to the reaction spaces in the chamber 400, and the substrate holder 200 transported and facing the organic material supplying parts 100 to support and transport the substrate 10.
- a discrete transporting rail for transporting the substrate holder 200 is unnecessary.
- the substrate holder 200 may be transported along a transporting rail 300 such that the substrate 10 faces each of the organic material supplying parts 100.
- a method of transporting the substrate holder 200 is not limited to a method using a transporting rail, and thus various methods can be used.
- the chamber 400 has at least one reaction space, and includes a gate (not shown) through one of the substrate 10 and the substrate holder 200 is put in and taken out.
- An exhausting line forming a vacuum state in the chamber 400 or exhausting unreacted gas from the chamber 400 is provided to the chamber 400.
- the substrate holder 200 may be any holder that transports the substrate 10 in a state of being horizontally or vertically supported.
- the substrate holder 200 clamps the edge of the substrate 10 and supports the substrate 10 in a vertical state.
- the substrate holder 200 is transported with being supported and guided by the transporting rail 300 disposed in the chamber 400.
- the organic material supplying part 100 is disposed at a position facing the substrate holder 200 to supply organic material to be deposited on the substrate 10.
- FIG. 3 is a cross-sectional view illustrating a deposition material supplying device in accordance with an exemplary embodiment.
- the organic material supplying part 100 includes a pot 110, a transporting unit 120, a heating unit 130, a cooling unit 140, a connecting pipe 150, and an injector 160.
- a vaporization space 110b where raw material is vaporized communicates in a straight line with a storage space 110a filled with raw material in the pot 110.
- the transporting unit 120 continuously or periodically transports raw material filling the pot 110 from the storage space 110a to the vaporization space 110b.
- the heating unit 130 is disposed on the outside of the vaporization space 110b of the pot 110 to supply heat vaporizing raw material to the vaporization space 110b.
- the cooling unit 140 is disposed on the outside of the storage space 110a of the pot 110 to prevent thermal deterioration of raw material stored in the storage space 110a.
- the connecting pipe 150 has a first side connected to the vaporization space 110b of the pot 110 to form a passage where vaporized raw material flows.
- the injector 160 is connected to a second side of the connecting pipe 150 to inject vaporized raw material.
- an apparatus fabricating an organic light emitting device is provided.
- organic material may be used as raw material in accordance with the present disclosure.
- the pot 110 has a cylindrical pipe shape with an open side.
- the storage space 110a filled with raw material is disposed on the inner lower side of the pot 110, and the vaporization space 110b where raw material is vaporized is disposed on the inner upper side thereof.
- the storage space 110a and the vaporization space 110b are not separated by a predetermined separating member, but are separated according to the states of raw material.
- a space where raw material is in a liquid state or a solid state is defined as the storage space 110a
- a space where liquid or solid raw material is vaporized by heat is defined as the vaporization space 110b.
- a vacuum line may be connected to the pot 110 to maintain the pot 110 under a super vacuum circumstance during a depositing process.
- the transporting unit 120 gradually transports raw material filling the storage space
- the transporting unit 120 includes a head 121 disposed in the pot 110 to push raw material, a rod 122 having a first side connected to the head 121 and a second side disposed on the outside of the pot 110 and moved integrally with the head 121, and a driving part connected to the second side of the rod 122 to move the rod 122.
- the driving part is any member, such as a motor 123 or a hydraulic cylinder, which vertically moves the rod 122.
- the motor 123 is used.
- the transporting unit 120 further includes the motor 123 driven by power, a ball screw 124 rotated according to the rotation of the motor 123, an elevating body 125 vertically moved on the ball screw 124 by the rotation of the ball screw 124, and a supporting body 126 having a side fixed to the elevating body 125 to move integrally with the elevating body 125 and another side supporting the rod 122.
- the supporting body 126 is moved integrally with the elevating body 125, so as to vertically move the rod 122. Accordingly, the head 121 disposed at the upper end of the rod 122 transports raw material from the storage space 110a of the pot 110 to the vaporization space 110b.
- the heating unit 130 supplies thermal energy that heats and vaporizes raw material transported from the storage space 110a of the pot 110 to the vaporization space 110b.
- the heating unit 130 may be any member supplying thermal energy vaporizing raw material.
- a core heater or a lamp heater may be used.
- a core heater is exemplified.
- the heating unit 130 includes a resistance heat wire 131 that is wound around the outer surface of the pot 110 in a portion where the vaporization space 110b is disposed.
- the resistance heat wire 131 is formed of one of Ta, W, Mo, and a combination thereof.
- a metal sheet 111 having high thermal conductivity may be disposed on an inner wall of the pot 110 in a portion where the vaporization space 110b is disposed.
- the metal sheet 111 may have a donut or pipe shape.
- the cooling unit 140 prevents raw material, filling the storage space 110a of the pot 110, from being deteriorated by heat of the heating unit 130, and may be any member configured to cool the storage space 110a storing raw material.
- a cooling jacket is exemplified in the current embodiment.
- the cooling unit 140 surrounds the outer surface of the pot 110 in a portion where the storage space 110a is disposed, e.g., surrounds a portion adjacent to the portion where the heating unit 130 is installed.
- the cooling unit 140 includes a cooling passage 141 where a coolant flows.
- the cooling passage 141 surrounds the outer surface of the pot 110 in the portion where the storage space 110a is disposed.
- the connecting pipe 150 is connected to the upper portion of the pot 110 to transport raw material gas vaporized by the heating unit 130 to the injector 160.
- the connecting pipe 150 may have a predetermined bent shape for connecting to the injector 160.
- the outer portion of the connecting pipe 150 is provided with a heating line 151 that prevents vaporized raw material from returning to the liquid or solid state.
- the diameter and length of the connecting pipe 150 greatly affect transformation of raw material. Particularly, raw material is transformed by high temperature and high pressure in the pot 110. Thus, temperature and pressure in the pot 110 should be maintained at low levels to prevent transformation of raw material. A vaporization temperature of raw material is greatly affected by a vacuum level. As a vacuum level is decreased, a vaporization temperature is decreased. Thus, a vacuum level in the pot 110 is decreased to efficiently prevent transformation of raw material.
- a vacuum level in the pot 110 may be explained with the concept of conductance that greatly depends on the length and diameter of a pipe. Conductance may be expressed by Equation 1.
- D denotes the diameter of a pipe
- L denotes the length of a pipe
- T denotes a temperature
- M denotes the molecular weight of raw material
- the connecting pipe 150 has a diameter ranging from approximately 20 mm to approximately 200 mm, considering organic material used as raw material, and temperature in the pot 110.
- the connecting pipe 150 may have a diameter of approximately 70 mm, considering deterioration preventing efficiency for raw material, and compatibility with other devices.
- the first side of the connecting pipe 150 is connected with a coupling member 170 that is provided with a thread to be screw-coupled to the upper end of the pot 110.
- the storage space 110a and the vaporization space 110b of the pot 110, the inside of the coupling member 170, and the inside of the connecting pipe 150 communicate with one another.
- the coupling member 170 is screw-coupled to the pot 110 to facilitate coupling and decoupling of the coupling member 170 and the pot 110. Accordingly, when raw material is filled, the coupling member 170 is removed from the pot 110, and then the storage space 110a of the pot 110 is conveniently filled with the raw material.
- the injector 160 is connected to the second side of the connecting pipe 150.
- Gas injecting openings 161, through which vaporized raw material is injected, are disposed in an end of the passage. Since the injector 160 has a line shape, the gas injecting openings 161 are arrayed in a straight line to face the substrate 10. The outer portion of the injector 160 is provided with a heating line 162 to prevent vaporized raw material from returning to a liquid or solid state.
- the injector 160 communicates with the connecting pipe 150 to affect a vacuum level of the pot 110.
- the injector 160 may have a diameter ranging from approximately 20 mm to approximately 200 mm.
- the injector 160 may have a diameter of approximately 70 mm to correspond to the connecting pipe 150.
- the gas injecting opening 161 of the injector 160 may have a diameter of approximately 8 mm or greater.
- the transporting unit 120, and the injector 160 in the chamber 400 are integrally supported by a supporting part 180.
- the supporting part 180 is installed on a rail 185 that is used to move the injector 160 to the substrate 10, thus adjusting the distance between the injector 160 and the substrate 10.
- the supporting part 180 includes a moving body 181 moving along the rail 185, a supporting frame 182 fixed to the moving body 181 to integrally support the pot 110 and the transporting unit 120, and a supporting plate 183 supporting the injector 160.
- the shapes and structures of the moving body 181, the supporting frame 182, and the supporting plate 183 are not limited, provided that the pot 110, the transporting unit 120, and the injector 160 are integrally supported.
- the moving body 181 may be any member movable on the rail 185.
- the moving body 181 may be driven through a ball screw or a linear motion (LM) guide.
- LM linear motion
- the front side of the injector 160 is provided with an injection amount measuring sensor 184 measuring an injection amount of vaporized raw material injected through the injector 160.
- a heating temperature of the heating unit 130 and a speed of the head 121 of the transporting unit 120 are controlled according to an injection amount of raw material measured by the injection amount measuring sensor 184, so as to adjust the injection amount of raw material.
- a shutter 190 selectively limiting a flow of raw material injected through the injector 160, is installed on the front side of the injector 160, e.g., between the injector 160 and the substrate holder 200.
- the shutter 190 has a surface that covers the front side of the gas injecting openings 161 of the injector 160, and operates in sliding or rotating manner. In the current embodiment, the shutter 190 is rotated by the driving of a motor 191, so as to selectively open or close the front side of the injector 160.
- the shape and operation of the shutter 190 is not limited to the embodiment, provided that a flow of raw material injected from the injector 160 to the substrate 10 is selectively limited.
- the unloading section 5000 disposed at a second end of the substrate processing system, is a space where the substrates 10 on which organic thin layers are deposited wait before they are taken out to the outside.
- An unloader is installed at the unloading section 5000 to reload the substrates 10 to the substrate cassette after the depositing process, and the substrates 10 are taken out to the outside.
- FIGS. 4 and 5 are cross-sectional views illustrating the deposition material supplying device in use in accordance with an exemplary embodiment.
- the pot 110 of the deposition material supplying device is removed from the coupling member 170, and then, the storage space 110a is filled with raw material to be deposited on the substrates 10, that is, with organic material. Then, the pot 110 is coupled to the coupling member 170.
- the substrate processing sections 3000a, 3000b, and 3000c are disposed to correspond to the organic thin layers
- the organic material supplying parts 100 are respectively installed in the substrate processing sections 3000a, 3000b, and 3000c to fill the pots 110 with organic material to be deposited.
- the storage space 110a of the pot 110 is filled with a sufficient amount of organic material to continuously or periodically perform an organic thin layer depositing process.
- the organic material filling the storage space 110a is cooled by the cooling unit 140, and thus stored without deterioration for a long time.
- the moving body 181 to which the pot 110 and the injector 160 are fixed is moved to set the distance between the injector 160 and the substrate 10 to be processed.
- the substrate 10 prepared in the loading section 1000 is loaded to the process preparing section 2000, and the substrate 10 is placed and aligned on the substrate holder 200. Then, the substrate 10 is transported by the substrate holder 200, and put in the substrate processing sections 3000a, 3000b, and 3000c at positions facing the organic material supplying parts 100 installed in the substrate processing sections 3000a, 3000b, and 3000c.
- the transporting unit 120 of the organic material supplying part 100 operates to transport the organic material filling the storage space 110a of the pot 110 to the vaporization space 110b, as illustrating in FIG. 5.
- the motor 123 rotates
- the ball screw 124 rotates to vertically move the elevating body 125.
- the supporting body 126 moves integrally with the elevating body 125, and vertically moves the rod 122.
- the head 121 disposed at the upper end of the rod 122 transports the raw material to the storage space 110a of the pot 110 to the vaporization space 110b.
- the heating unit 130 installed around the vaporization space HOb vaporizes the organic material.
- the amount of the vaporized organic material is determined through controlling of the heating temperature of the heating unit 130 and controlling of the speed of the head 121.
- Organic material stored in the storage space 110a, which does not transported to the vaporization space 110b, is cooled by the cooling unit 140 installed around the storage space 110a, and thus is prevented from being deteriorated.
- the shutter 190 is opened to efficiently inject the organic material that is deposited on the substrate 10 to form an organic thin layer on the substrate 10.
- the amount of the organic material injected from the injector 160 is measured through the injection amount measuring sensor 184 disposed on the front side of the injector 160, and the measured amount is calculated to control the heating temperature of the heating unit 130, and the speed of the head 121 of the transporting unit 120.
- the shutter 190 installed on the front side of the injector 160 may be always maintained in an open state.
- the shutter 190 may be selectively opened or closed.
- the substrate 10 is transported to the unloading preparing section 4000, and is removed from the substrate holder 200.
- the removed substrate 10 is transported to the unloading section 5000.
- the substrates 10 are loaded on the cassette, and are taken out of the substrate processing system.
- an organic thin layer may be deposited in various manners within the scope of the present disclosure.
- an organic thin layer is deposited in the state where a substrate and the injector are disposed perpendicularly to the ground in the embodiment, a substrate holder and an organic material supplying part may be horizontally installed to dispose a substrate and an injector in a direction parallel to the ground.
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- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Mechanical Engineering (AREA)
- Metallurgy (AREA)
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- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (15)
- A deposition material supplying device comprising:a pot in which a storage space filled with raw material communicates with a vaporization space where the raw material is vaporized;a transporting unit configured to continuously or periodically transport the raw material filled in the storage space to the vaporization space; anda heating unit disposed on an outside of the vaporization space of the pot to supply heat for vaporizing the raw material.
- The deposition material supplying device of claim 1, further comprising a cooling unit that is disposed on an outside of the storage space of the pot to prevent the raw material stored in the storage space from being thermally deteriorated.
- The deposition material supplying device of claim 2, wherein the cooling unit comprises a cooling jacket that comprises a cooling passage surrounding an outer surface of the pot, and a coolant flows in the cooling passage.
- The deposition material supplying device of claim 1 or 2, further comprising:a connecting pipe a first side of which is connected to the vaporization space of the pot to form a passage where the vaporized raw material flows; andan injector connected to a second side of the connecting pipe to inject the vaporized raw material.
- The deposition material supplying device of claim 4, further comprising a supporting part integrally supporting the pot, the transporting unit, and the injector,wherein the supporting part is installed on a rail extending in a direction in which the injector is oriented, and movable along the rail.
- The deposition material supplying device of claim 4, wherein the first side of the connecting pipe is connected with a coupling member that is screw-coupled to the pot.
- The deposition material supplying device of claim 4, wherein the connecting pipe has a diameter ranging from approximately 20 mm to approximately 200 mm.
- The deposition material supplying device of claim 4, further comprising an injection amount measuring sensor configured to measure an injection amount of the raw material injected from the injector,wherein the deposition material supplying device controls an operation of the transporting unit according to the injection amount of the raw material measured by the injection amount measuring sensor, so as to adjust the injection amount of the raw material.
- The deposition material supplying device of claim 1 or 2, wherein a metal sheet is provided at an inner wall of the vaporization space of the pot.
- The deposition material supplying device of claim 1 or 2, wherein the transporting unit comprises:a head disposed in the pot to push the raw material;a rod having a first side connected to the head and a second side disposed on an outside of the pot, the rod moving integrally with the head; anda driving part connected to the second side of the rod to move the rod.
- The deposition material supplying device of claim 10, wherein the driving part comprises one of a motor and a hydraulic cylinder.
- The deposition material supplying device of claim 1 or 2, wherein the heating unit comprises one of a core heater and a lamp heater.
- A substrate processing apparatus comprising:a chamber having a reaction space;an organic material supplying part disposed in the reaction space to supply raw material to be vaporized; anda substrate holder supporting a substrate,wherein the organic material supplying part comprises:a pot in which a storage space filled with the raw material communicates with a vaporization space where the raw material is vaporized;a transporting unit configured to continuously or periodically transport the raw material filled in the storage space to the vaporization space;a heating unit disposed on an outside of the vaporization space of the pot to supply heat for vaporizing the raw material to the vaporization space;a connecting pipe a first side of which is connected to the vaporization space of the pot to form a passage where the vaporized raw material flows; andan injector connected to a second side of the connecting pipe and facing the substrate holder, the injector being configured to inject the vaporized raw material to the substrate.
- The substrate processing apparatus of claim 13, further comprising a cooling unit that is disposed on an outside of the storage space of the pot to prevent the raw material stored in the storage space from being thermally deteriorated.
- The substrate processing apparatus of claim 13 or 14, wherein the chamber is divided into a plurality of reaction spaces,the organic material supplying part is provided in plurality to be respectively disposed in the reaction spaces of the chamber, andthe substrate holder is transported to face the organic material supplying parts.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801464693A CN102216488A (en) | 2008-11-17 | 2009-11-13 | Deposition material supply apparatus and substrate treatment apparatus having the same |
JP2011536246A JP5406304B2 (en) | 2008-11-17 | 2009-11-13 | Vapor deposition material supply apparatus and substrate processing apparatus provided with the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0113866 | 2008-11-17 | ||
KR1020080113866A KR100926437B1 (en) | 2008-11-17 | 2008-11-17 | Deposition material supply apparatus and Equipment for treating substrate having the same |
Publications (2)
Publication Number | Publication Date |
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WO2010056057A2 true WO2010056057A2 (en) | 2010-05-20 |
WO2010056057A3 WO2010056057A3 (en) | 2010-07-08 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/KR2009/006671 WO2010056057A2 (en) | 2008-11-17 | 2009-11-13 | Deposition material supply apparatus and substrate treatment apparatus having the same |
Country Status (5)
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JP (1) | JP5406304B2 (en) |
KR (1) | KR100926437B1 (en) |
CN (1) | CN102216488A (en) |
TW (1) | TWI397202B (en) |
WO (1) | WO2010056057A2 (en) |
Cited By (5)
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JP2012107287A (en) * | 2010-11-17 | 2012-06-07 | Ulvac Japan Ltd | Thin film deposition apparatus |
CN102732843A (en) * | 2011-04-13 | 2012-10-17 | 韩商Snu精密股份有限公司 | High-capacity deposition device for forming a thin film |
CN102732841A (en) * | 2011-04-13 | 2012-10-17 | 韩商Snu精密股份有限公司 | Device for supplying materials |
EP2511395A3 (en) * | 2011-04-13 | 2015-02-18 | SNU Precision Co., Ltd. | Depositing apparatus for forming thin film |
US9267203B2 (en) | 2010-12-13 | 2016-02-23 | Posco | Continuous coating apparatus |
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KR101084234B1 (en) * | 2009-11-30 | 2011-11-16 | 삼성모바일디스플레이주식회사 | Deposition source, Deposition apparatus using the same and method for forming thin film |
KR101172275B1 (en) * | 2009-12-31 | 2012-08-08 | 에스엔유 프리시젼 주식회사 | Vaporizing apparatus and control method for the same |
WO2011126132A1 (en) * | 2010-04-09 | 2011-10-13 | 株式会社ニコン | Substrate processing device |
KR101320434B1 (en) * | 2011-05-12 | 2013-10-23 | 에스엔유 프리시젼 주식회사 | Apparatus for controlling supply of materials |
KR101174633B1 (en) | 2011-05-12 | 2012-08-17 | 에스엔유 프리시젼 주식회사 | Apparatus for supplying materials |
KR101754356B1 (en) * | 2011-12-15 | 2017-07-07 | 주식회사 원익아이피에스 | Evaporating source, deposition material supply apparatus and deposition apparatus comprising the same |
KR101418714B1 (en) * | 2012-09-13 | 2014-07-10 | 주식회사 선익시스템 | Evaporation source and Apparatus for deposition having the same |
KR101418712B1 (en) | 2012-09-14 | 2014-07-10 | 주식회사 선익시스템 | Evaporation source and Apparatus for deposition having the same |
KR101422533B1 (en) * | 2012-12-04 | 2014-07-24 | 주식회사 선익시스템 | A Linear Type Evaporator with a Mixing Zone |
JP6328766B2 (en) * | 2013-12-10 | 2018-05-23 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | Evaporation source for organic material, deposition apparatus for depositing organic material in vacuum chamber, and method for evaporating organic material |
KR102313597B1 (en) * | 2014-12-30 | 2021-10-18 | (주)선익시스템 | A Deposition Source Having Cooling Device |
CN106906445B (en) * | 2017-03-29 | 2019-02-12 | 武汉华星光电技术有限公司 | A kind of evaporation source |
KR102203725B1 (en) * | 2018-11-29 | 2021-01-15 | 주식회사 선익시스템 | Apparatus for thin film deposition |
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Also Published As
Publication number | Publication date |
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KR100926437B1 (en) | 2009-11-13 |
WO2010056057A3 (en) | 2010-07-08 |
TW201036227A (en) | 2010-10-01 |
JP2012508815A (en) | 2012-04-12 |
CN102216488A (en) | 2011-10-12 |
TWI397202B (en) | 2013-05-21 |
JP5406304B2 (en) | 2014-02-05 |
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